CN103094153B - Wafer reception device and aumospheric pressure cvd device - Google Patents
Wafer reception device and aumospheric pressure cvd device Download PDFInfo
- Publication number
- CN103094153B CN103094153B CN201110341983.1A CN201110341983A CN103094153B CN 103094153 B CN103094153 B CN 103094153B CN 201110341983 A CN201110341983 A CN 201110341983A CN 103094153 B CN103094153 B CN 103094153B
- Authority
- CN
- China
- Prior art keywords
- wafer
- bearing platform
- pressure cvd
- dropped
- reception device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of wafer reception device for aumospheric pressure cvd device and aumospheric pressure cvd device use.This wafer reception device comprises: bearing platform, and described bearing platform exports from the wafer of described aumospheric pressure cvd device the wafer dropped for accepting; Driver, described in described driver drives, bearing platform moves in horizontal plane; Controller, described controller, when described aumospheric pressure cvd device breaks down, controls bearing platform described in described driver drives and moves, to accept the wafer dropped.Wafer reception device for aumospheric pressure cvd device of the present invention can when aumospheric pressure cvd device breaks down, timely startup exports from wafer the wafer dropped to accept, and prevent multiple wafers of subsequent delivery from superposing by mobile in horizontal plane, thus avoid wafer damaging repercussions, reduce process costs.
Description
Technical field
The present invention relates to field of semiconductor technology, particularly relate to a kind of wafer reception device for aumospheric pressure cvd device and aumospheric pressure cvd device.
Background technology
When manufacturing semiconductor device, aumospheric pressure cvd (PACVD) technology usually can be used to carry out depositing multiple materials layer, comprise insulation material layer and metal material layer.In order to realize automated production, in deposition process, wafer is all loaded by transfer system, transmit, unload and playback.
For WJ type aumospheric pressure cvd device, first wafer is taken out by operating personnel and is placed on to load and come and go on device from wafer case, loads round device and wafer is sent to the wafer portal being positioned at aumospheric pressure cvd device one end; The wafer arriving wafer portal is taken out by charging manipulator to be placed on a moving belt, and the round device of loading then returns to and loads next wafer; Be placed wafer on the belt and be conveyed through deposition chambers to after completing a series of chemical reaction by driving-belt, arrive the wafer outlet being positioned at the aumospheric pressure cvd device other end; Wafer after process is exported to take off from wafer by unloading machinery hand and is placed on unloading and comes and goes device, and unloading comes and goes device and this wafer transferring gone to unload next wafer after returning round device; Return round device and this wafer is returned to entrance one end from exit end, and taken off by operating personnel and be returned to wafer case, so namely complete the transport process of aumospheric pressure cvd reaction.
But, the transfer system that comes and goes device, charging manipulator, conveyer belt, unloading machinery hand, unloading come and go device and return round device etc. other fault due to inevitable communication failure or aumospheric pressure cvd device is loaded in above-mentioned comprising, cause unloading machinery hand malfunctioning, cannot take off from conveyer belt the wafer arriving wafer outlet.Even and if now operating personnel stop coming and going on device to loading placing wafer, also have tens wafers in this aumospheric pressure cvd device in transport process, these wafers still can be sent to wafer outlet successively.Existing aumospheric pressure cvd device places contact pin case, to receive the wafer dropped in wafer outlet below.On the one hand, drop and probably cause wafer breakage; On the other hand, the wafer meeting in contact pin case superposes mutually and occurs " lamination ", and " lamination " can make directly contact also relative motion between wafer and cause scratching.In order to avoid wasting and affecting subsequent handling, need first to detect defect to be confirmed whether to affect performance, only have the unaffected wafer of performance just can be admitted to down one treatment process.As can be seen here, such communication failure often causes decrease in yield or production efficiency to reduce.
So, also need a kind of wafer reception device for aumospheric pressure cvd device and aumospheric pressure cvd device, to solve the problem.
Summary of the invention
In summary of the invention part, introduce the concept of a series of reduced form, this will further describe in embodiment part.Summary of the invention part of the present invention does not also mean that the key feature and essential features that will attempt to limit technical scheme required for protection, does not more mean that the protection range attempting to determine technical scheme required for protection.
There are the problems referred to above to solve in prior art, the invention provides a kind of wafer reception device for aumospheric pressure cvd device, it is characterized in that, described wafer reception device comprises: bearing platform, and described bearing platform exports from the wafer of described aumospheric pressure cvd device the wafer dropped for accepting; Driver, described in described driver drives, bearing platform moves in horizontal plane; Controller, described controller, when described aumospheric pressure cvd device breaks down, controls bearing platform described in described driver drives and moves, to accept the wafer dropped.
Preferably, bearing platform described in described driver drives moves along the first direction of the wafer outbound course being parallel to described aumospheric pressure cvd device in horizontal plane.
Preferably, described bearing platform is when the wafer dropped described in accepting, and described in described driver drives, bearing platform moves the first distance along described first direction.
Preferably, described first distance be more than or equal to described in the diameter of wafer that drops.
Preferably, described first distance be more than or equal to described in drop 1.1 times of the diameter of wafer and 1.2 times of the diameter of the wafer dropped described in being less than or equal to.
Preferably, described bearing platform is identical with the output speed of wafer along the rate travel of described first direction when the wafer dropped described in accepting.
Preferably, bearing platform described in described driver drives moves described first distance afterwards along described first direction, drives described bearing platform to move second distance along the second direction vertical with described first direction in horizontal plane.
Preferably, described second distance be more than or equal to described in the diameter of wafer that drops.
Preferably, described second distance be more than or equal to described in drop 1.1 times of the diameter of wafer and 1.2 times of the diameter of the wafer dropped described in being less than or equal to.
Preferably, described bearing platform is positioned under the outlet of described wafer, and the distance of lower end in the vertical direction that the upper surface of described bearing platform and described wafer export be less than or equal to described in the radius of wafer that drops.
Preferably, described wafer reception device also comprises signal projector and signal receiver, described signal projector and described signal receiver are arranged near the outlet of described wafer, described signal projector sends signal continuously to described signal receiver, the path of described signal is crossing with the path of dropping of the described wafer dropped, to send to described controller alarm of dropping when described signal receiver fails to receive signal.
The present invention also provides a kind of aumospheric pressure cvd device, and described aumospheric pressure cvd device comprises wafer reception device as above.
Wafer reception device for aumospheric pressure cvd device of the present invention can when aumospheric pressure cvd device breaks down, timely startup exports from wafer the wafer dropped to accept, and prevent multiple wafers of subsequent delivery from superposing by mobile in horizontal plane, thus avoid wafer damaging repercussions, reduce process costs.
Accompanying drawing explanation
Following accompanying drawing of the present invention in this as a part of the present invention for understanding the present invention.Shown in the drawings of embodiments of the invention and description thereof, be used for explaining principle of the present invention.In the accompanying drawings,
Figure 1A is the vertical view with the aumospheric pressure cvd device of wafer reception device according to one embodiment of the present invention;
Figure 1B is the end view with the aumospheric pressure cvd device of wafer reception device according to one embodiment of the present invention; And
Fig. 1 C is the end view with the aumospheric pressure cvd device of wafer reception device according to another execution mode of the present invention.
Embodiment
In the following description, a large amount of concrete details is given to provide more thorough understanding of the invention.But, it will be apparent to one skilled in the art that the present invention can be implemented without the need to these details one or more.In other example, in order to avoid obscuring with the present invention, technical characteristics more well known in the art are not described.
It should be noted that used term is only to describe specific embodiment here, and be not intended to restricted root according to exemplary embodiment of the present invention.As used herein, unless the context clearly indicates otherwise, otherwise singulative be also intended to comprise plural form.In addition, it is to be further understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates exists described feature, entirety, step, operation, element and/or assembly, but does not get rid of existence or additional other features one or more, entirety, step, operation, element, assembly and/or their combination.
The invention provides a kind of aumospheric pressure cvd device.In order to avoid malfunctioning due to unloading machinery hand and that cause sheet and lamination phenomenon occur, aumospheric pressure cvd device of the present invention comprises wafer reception device.Figure 1A and 1B is the vertical view with the aumospheric pressure cvd device of wafer reception device according to one embodiment of the present invention and end view respectively.First, composition graphs 1A-1B is described in detail the wafer reception device according to one embodiment of the present invention.
As seen in figs. 1 a-1b, wafer reception device 100 comprises bearing platform 101, controller 102 and controller 103.
Bearing platform 101 is for accepting the wafer dropped from the wafer outlet 110 of aumospheric pressure cvd device.The top of bearing platform 101 can be planar structure, and its underpart can export the arbitrary structures of 110 ends for the wafer adapting to this aumospheric pressure cvd device, as long as can be unrestricted when bearing platform 101 accepts the wafer and movement that drop.In addition, the upper surface of bearing platform 101 can be rectangle, circle or other irregular figure, as long as can accept the wafer dropped.
Driver 103 drives bearing platform 101 to move in horizontal plane.Driver 103 may be embodied as servomotor, is furnished with the common electric machine of decoder, cylinder, hydraulic cylinder or their combination etc., as long as can complete this function.It is multiple that bearing platform 101 drives the move mode in horizontal plane to have by driver 103, as long as can accept the wafer that drops and prevent its lamination, such as, bearing platform 101 can along arrow B in Figure 1A
1or arrow B
2shown direction is moved, and bearing platform 101 also can along arrow A in Figure 1A
1or arrow A
2shown direction is moved, and bearing platform 101 can also along arrow A in Figure 1A
1and arrow B
1between direction, arrow A
1and arrow B
2between direction, arrow A
2and arrow B
1between direction or arrow A
2and arrow B
2between direction move, etc.
Controller 102 is when aumospheric pressure cvd device breaks down, and control and drive system 103 drives bearing platform 101 to move, to accept the wafer dropped.For WJ type aumospheric pressure cvd device, described fault can be comprise loading the transfer system that comes and goes device, charging manipulator, conveyer belt, unloading machinery hand, unloading come and go device and return round device etc. other fault due to inevitable communication failure or aumospheric pressure cvd device, causes unloading machinery hand malfunctioning and cannot unloading wafer.Under normal circumstances, the malfunctioning fault of the unloading machinery hand of aumospheric pressure cvd device may be caused to have multiple, as long as any one fault sends alarm signal, controller 102 control and drive system 103 just can be made to work.
According to one embodiment of the present invention, driver 103 drives bearing platform 101 to move along first direction in horizontal plane.Wherein, first direction is parallel to the wafer outbound course (that is, the direction shown in arrow M in Figure 1A) of aumospheric pressure cvd device.In other words, first direction is arrow A
1shown direction (as shown in Figure 1A and 1B).The wafer that driver 103 drives bearing platform 101 to move along first direction in horizontal plane and bearing platform 101 can be made to drop brings out from wafer outlet 110, effectively to protect the wafer dropped from damage.Be understandable that, driver 103 can drive bearing platform 101 at the uniform velocity to move along first direction, and driver 103 can also drive bearing platform 101 to move along first direction speed change, etc.Speed change moves and can move for pulsed, that is, bearing platform 101 (that is, when accepting the wafer dropped) when taking the wafer that will drop out of from wafer outlet 110 moves along first direction, when this wafer drops completely on bearing platform 101, bearing platform 101 stops mobile.
Preferably, bearing platform 101 is when accepting the wafer dropped, and driver 103 drives bearing platform 101 to move the first distance along first direction.In other words, bearing platform 101 moves along first direction when taking the wafer that will drop out of from wafer outlet 110, or bearing platform 101 when taking the wafer that will drop out of from wafer outlet 110 and before or after a period of time in move along first direction; When this wafer drops completely on bearing platform 101, bearing platform 101 stops mobile.The displacement that can reduce carrying platform is set like this, and when bearing platform 101 will carry more wafer, the size of carrying platform 101 can be reduced.
Further, the first distance is more than or equal to the diameter of the wafer dropped, and to avoid multiple wafer generation lamination dropped, and then protects the wafer dropped from damage.Consider the dimensional requirement of carrying platform 101 and the requirement effectively avoiding lamination, preferably, the first distance is more than or equal to 1.1 times of the diameter of the wafer dropped and is less than or equal to 1.2 times of the diameter of the wafer dropped.
Preferably, bearing platform 101 is identical with the output speed of wafer along the rate travel of first direction when accepting the wafer dropped, to be transferred to carrying platform 101 from wafer outlet 110 by this wafer reposefully.
According to another execution mode of the present invention, driver 103 drives bearing platform 101 to move second distance along the second direction vertical with first direction in horizontal plane after driving bearing platform 101 to move the first distance along first direction.Particularly, second direction can be arrow B
1or arrow B
2shown direction (as shown in Figure 1A), second direction can also be arrow B
1and arrow B
2shown direction, namely the moving direction of carrying platform 101 is in arrow B
1and arrow B
2change between shown direction, such as, first along arrow B
1shown direction is moved, then along arrow B
2shown direction is moved, then again along arrow B
1shown direction is moved, so repeatedly.
Further, second distance is more than or equal to the diameter of the wafer dropped, and to avoid multiple wafer generation lamination dropped, and then protects the wafer dropped from damage.Consider the dimensional requirement of carrying platform 101 and the requirement effectively avoiding lamination, preferably, second distance is more than or equal to 1.1 times of the diameter of the wafer dropped and is less than or equal to 1.2 times of the diameter of the wafer dropped.
Preferably, bearing platform 101 is positioned under wafer outlet 110, and the distance (h) that the upper surface of bearing platform 101 and wafer export the lower end in the vertical direction of 110 is less than or equal to the radius of the wafer dropped.Also be provided with other parts (such as, unloading machinery hand etc.) owing to exporting on 110 contour positions with wafer, prevent other component working when carrying platform 101 does not work, therefore, bearing platform 101 is positioned under wafer outlet 110.The distance (h) upper surface of bearing platform 101 and wafer being exported the lower end in the vertical direction of 110 is set to the radius being less than or equal to the wafer dropped, in order to avoid wafer turns down laterally when dropping on carrying platform 101, namely avoid the face down of wafer to contact with carrying platform 101, and cause wafer damaging repercussions.
The size of bearing platform 101 it should be noted that, if when operating personnel can take the wafer that bearing platform 101 is accepted in time away, can arrange less; If can not take wafer away in time, what bearing platform 101 should be arranged is enough large, still exports from wafer all wafers sent out, to avoid the phenomenon of sheet and lamination can hold between age at failure.In addition, those skilled in the art rationally can arrange the shape of its bearing platform 101 upper surface according to the move mode of this platform, can hold the wafer that drops and reduction is of a size of suitable as far as possible.
For existing aumospheric pressure cvd device, if carry out start-up connector according to its fault-signal, then need to adjust whole control system.In order to simplify the transformation to existing aumospheric pressure cvd device, the invention provides another execution mode.Fig. 1 C is the end view with the aumospheric pressure cvd device of wafer reception device according to another execution mode of the present invention.Below parts identical or close with above-mentioned execution mode in this execution mode are no longer described in detail.
As shown in Figure 1 C, wafer reception device 100 also comprises signal projector 104 and signal receiver 105.Signal projector 104 and signal receiver 105 are arranged near wafer outlet 110, and signal projector 104 and signal receiver 105 can be separately positioned on wafer and to drop the both sides in path, as long as its signal path is not intercepted when there not being wafer to drop.Such as, as shown in Figure 1 C, signal projector 104 is arranged on the top of wafer outlet 110, signal receiver 105 is arranged on the below of wafer outlet 110 corresponding thereto.Signal projector 104 sends signal continuously to signal receiver 105, and described signal is preferably the good signal of directivity, such as infrared, radio frequency, laser signal etc.Further, the path of signal is crossing with the path of dropping of the wafer dropped, and to send to controller 102 alarm of dropping when signal receiver 105 fails to receive signal, controller 102 works according to this alarm control driver 103 that drops.Specifically, when signal receiver 105 fails to receive signal, when also namely signal path is blocked by the wafer dropped, immediately by sending to controller 102 alarm of dropping.
It should be noted that, the connection between signal receiver 105 and controller 102, between controller 102 and driver 103 and between driver 103 and bearing platform 101 can be wired connection, also can be wireless connections, therefore all represented by dashed line in the drawings.
Wafer reception device for aumospheric pressure cvd device of the present invention can when aumospheric pressure cvd device breaks down, timely startup exports from wafer the wafer dropped to accept, and prevent multiple wafers of subsequent delivery from superposing by mobile in horizontal plane, thus avoid wafer damaging repercussions, reduce process costs.
The present invention is illustrated by above-described embodiment, but should be understood that, above-described embodiment just for the object of illustrating and illustrate, and is not intended to the present invention to be limited in described scope of embodiments.In addition it will be appreciated by persons skilled in the art that the present invention is not limited to above-described embodiment, more kinds of variants and modifications can also be made according to instruction of the present invention, within these variants and modifications all drop on the present invention's scope required for protection.Protection scope of the present invention defined by the appended claims and equivalent scope thereof.
Claims (10)
1. for a wafer reception device for aumospheric pressure cvd device, it is characterized in that, described wafer reception device comprises:
Bearing platform, the top of described bearing platform is planar structure, described bearing platform exports from the wafer of described aumospheric pressure cvd device the wafer dropped for accepting, described bearing platform is positioned under the outlet of described wafer, and the distance of lower end in the vertical direction that the upper surface of described bearing platform and described wafer export be less than or equal to described in the radius of wafer that drops;
Driver, described in described driver drives, bearing platform moves in horizontal plane;
Controller, described controller, when described aumospheric pressure cvd device breaks down, controls bearing platform described in described driver drives and moves, to accept the wafer dropped;
Signal projector and signal receiver, described signal projector and described signal receiver are arranged near the outlet of described wafer, described signal projector sends signal continuously to described signal receiver, the path of described signal is crossing with the path of dropping of the described wafer dropped, to send to described controller alarm of dropping when described signal receiver fails to receive signal.
2. wafer reception device as claimed in claim 1, is characterized in that, bearing platform described in described driver drives moves along the first direction of the wafer outbound course being parallel to described aumospheric pressure cvd device in horizontal plane.
3. wafer reception device as claimed in claim 2, is characterized in that, described bearing platform is when the wafer dropped described in accepting, and described in described driver drives, bearing platform moves the first distance along described first direction.
4. wafer reception device as claimed in claim 3, is characterized in that, the diameter of the wafer dropped described in described first distance is more than or equal to.
5. wafer reception device as claimed in claim 4, is characterized in that, 1.1 times of the diameter of the wafer dropped described in described first distance is more than or equal to and 1.2 times of the diameter of the wafer dropped described in being less than or equal to.
6. wafer reception device as claimed in claim 2, is characterized in that, described bearing platform is identical with the output speed of wafer along the rate travel of described first direction when the wafer dropped described in accepting.
7. wafer reception device as claimed in claim 3, it is characterized in that, bearing platform described in described driver drives moves described first distance afterwards along described first direction, drives described bearing platform to move second distance along the second direction vertical with described first direction in horizontal plane.
8. wafer reception device as claimed in claim 7, is characterized in that, the diameter of the wafer dropped described in described second distance is more than or equal to.
9. wafer reception device as claimed in claim 8, is characterized in that, 1.1 times of the diameter of the wafer dropped described in described second distance is more than or equal to and 1.2 times of the diameter of the wafer dropped described in being less than or equal to.
10. an aumospheric pressure cvd device, is characterized in that, described aumospheric pressure cvd device comprises wafer reception device as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110341983.1A CN103094153B (en) | 2011-11-03 | 2011-11-03 | Wafer reception device and aumospheric pressure cvd device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110341983.1A CN103094153B (en) | 2011-11-03 | 2011-11-03 | Wafer reception device and aumospheric pressure cvd device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103094153A CN103094153A (en) | 2013-05-08 |
| CN103094153B true CN103094153B (en) | 2016-02-24 |
Family
ID=48206575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110341983.1A Active CN103094153B (en) | 2011-11-03 | 2011-11-03 | Wafer reception device and aumospheric pressure cvd device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103094153B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030050646A (en) * | 2001-12-19 | 2003-06-25 | 삼성전자주식회사 | unloading supporter of atmospherical CVD equipment for semiconductor device fabricating |
| JP2004074359A (en) * | 2002-08-20 | 2004-03-11 | Towa Corp | X-y table |
| CN101971317A (en) * | 2008-03-14 | 2011-02-09 | 应用材料股份有限公司 | Method for measuring dopant concentration during plasma ion implantation |
-
2011
- 2011-11-03 CN CN201110341983.1A patent/CN103094153B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030050646A (en) * | 2001-12-19 | 2003-06-25 | 삼성전자주식회사 | unloading supporter of atmospherical CVD equipment for semiconductor device fabricating |
| JP2004074359A (en) * | 2002-08-20 | 2004-03-11 | Towa Corp | X-y table |
| CN101971317A (en) * | 2008-03-14 | 2011-02-09 | 应用材料股份有限公司 | Method for measuring dopant concentration during plasma ion implantation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103094153A (en) | 2013-05-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101453828B1 (en) | Transfer system | |
| US9117865B2 (en) | Robot systems, apparatus, and methods having independently rotatable waists | |
| KR102096074B1 (en) | Substrate Processing Apparatus | |
| KR101363836B1 (en) | Stocker | |
| CN104787569B (en) | Automatic panel production line | |
| EP2433300B1 (en) | Integrated systems for interfacing with substrate container storage systems | |
| KR101632518B1 (en) | Work transfer system | |
| JP2007314262A (en) | Article processing equipment | |
| TWI385111B (en) | Stocker | |
| US20080240892A1 (en) | Storage buffer device for automated material handling systems | |
| TWI463286B (en) | High-efficiency workpiece transportation system for a clean manufacturing environment and method of improving the usage efficiency of a vehicle operating in conjunction with a rail-based transportation pathway in a clean manufacturing environment | |
| CN101071760A (en) | High efficiency buffer stocker | |
| US20070081879A1 (en) | Discontinuous conveyor system | |
| US8788088B2 (en) | Production system, processed object manufacturing method, and container transferring method | |
| CN103094153B (en) | Wafer reception device and aumospheric pressure cvd device | |
| CN101567308A (en) | Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using same | |
| KR101991889B1 (en) | Substrate horizontal rotation module, and substrate transfer method | |
| KR20100056777A (en) | Transfer loading apparatus of tire | |
| CN217983295U (en) | Conveying device for wafer box | |
| WO2019114371A1 (en) | Material delivery system and material delivery method | |
| CN113451186A (en) | Transfer robot and substrate processing system including the same | |
| CN115175842A (en) | Overhead transport vehicle and overhead transport system | |
| CN1532129A (en) | Equivalent multiple rail type antomatic transfer system and method | |
| CN114981947A (en) | FOUP transfer device | |
| KR20070040706A (en) | Hierachical in/out stocker device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |