CN1030708C - 酰亚胺类预聚物的制法 - Google Patents
酰亚胺类预聚物的制法 Download PDFInfo
- Publication number
- CN1030708C CN1030708C CN90108588A CN90108588A CN1030708C CN 1030708 C CN1030708 C CN 1030708C CN 90108588 A CN90108588 A CN 90108588A CN 90108588 A CN90108588 A CN 90108588A CN 1030708 C CN1030708 C CN 1030708C
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- Prior art keywords
- formula
- diamines
- prepolymer
- unsaturated double
- imide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 150000003949 imides Chemical class 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims description 11
- 150000004985 diamines Chemical class 0.000 claims abstract description 24
- BGDJDKLGGAQCNA-UHFFFAOYSA-N 3-(2,3,4-tribromophenyl)pyrrole-2,5-dione Chemical compound BrC1=C(Br)C(Br)=CC=C1C1=CC(=O)NC1=O BGDJDKLGGAQCNA-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000178 monomer Substances 0.000 claims abstract 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 28
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- 150000003254 radicals Chemical class 0.000 claims description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 11
- 101000648997 Homo sapiens Tripartite motif-containing protein 44 Proteins 0.000 claims description 9
- 102100028017 Tripartite motif-containing protein 44 Human genes 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 14
- 239000003566 sealing material Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- 239000002966 varnish Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 125000001118 alkylidene group Chemical group 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000004922 lacquer Substances 0.000 description 5
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 4
- 238000002485 combustion reaction Methods 0.000 description 4
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052573 porcelain Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- -1 cyclohexane bismaleimides Chemical class 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
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- 150000002672 m-cresols Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002931 p-cresols Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000002203 pretreatment Methods 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- KXEPRLUGFAULQX-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=C(C(C)C)C(C=2C=CC(N)=CC=2)=C1 KXEPRLUGFAULQX-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- 229920013649 Paracril Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- DTELGZIOMXYLGQ-UHFFFAOYSA-N NCCCO[Si](OC)(OC)C(CC)N Chemical compound NCCCO[Si](OC)(OC)C(CC)N DTELGZIOMXYLGQ-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- HSCPDMJPJJSHDA-UHFFFAOYSA-N benzylbenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1CC1=CC=CC=C1 HSCPDMJPJJSHDA-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- OYOFUEDXAMRQBB-UHFFFAOYSA-N cyclohexylmethanediamine Chemical compound NC(N)C1CCCCC1 OYOFUEDXAMRQBB-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical class O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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Abstract
本发明涉及一种新型酰亚胺类预聚物的制法,它包括将一种单体进行熔融聚合或溶液聚合。该单体含有不饱和双酰亚胺,二胺和三溴苯基马来酰亚胺。其固化物具有优良的耐热性,特别是对焊剂的耐热性,以及难燃性,且吸水率低。它适用于印刷线路底板用的层压材料,IC密封材料、粘合剂、绝缘漆等用途。
Description
本发明涉及一种新的酰亚胺类预聚物的制法,具体而言是涉及一种具有高耐热性,特别是对焊剂的耐热性,难燃性,且吸水性低的新的酰亚胺类预聚物的制法。
通过将N,N′-4,4′-二苯甲烷双马来酰亚胺等不饱和双酰亚胺,和二氨基二苯甲烷等二胺类混合加热,或者将它们放在N-甲基吡咯烷酮这类高沸点溶液中加热使之反应得到酰亚胺类预聚物,然后将它加热固化,从而得到耐热性优良且热膨胀系数小的固化物。
由于具有这些特性,这种酰亚胺类预聚物以前就用作多层印刷电路配线底板用树脂。
然而,这种酰亚胺类预聚物的固化物的难燃性低,例如,采用这种预聚物的层压板,根据UL-94进行燃烧试验时,不具有相当V-O的难燃性。
而且,近年来为防火灾确保安全,特别是对适用于电子部件、汽车部件等以及其它生活用品的材料全都要求有难燃性。进而,作为该领域的一部分,它们所使用的树脂在法律上也规定难燃性方面的要求。
给予这种酰亚胺类预聚物难燃性的方法,一般是用溴化环氧树脂使酰亚胺类预聚物改性。然而,用这种方法往往是在给予难燃性的方面是成功的,但改性预聚物其高温特性。特别是作为层压板时的焊剂耐热性显著降低。
因此,希望发明一种难燃性高,而且作为层压板时的高温特性也优良的耐热难燃性树脂。
本发明在于提供一种解决了上述技术问题,而且难燃性高,耐热性特别是作为层压板时对焊剂耐热性优良,而且吸水性低的酰亚胺类预聚物。
为了达到上述目的,本发明者反复进行了研究,发现通过使不饱和双酰亚胺和二胺以及三溴苯基马来酰亚胺一起共聚合,得到的固化物其耐热性,特别是作为层压板时对焊剂耐热性不降低,而且能给予优良的难燃性。
也就是说,本发明提供一种酰亚胺类预聚物及其固化物,该预聚物的特征是它至少具有(ⅰ)下式(I)表示的不饱和双酰亚胺,(ⅱ)下式(II)表示的二胺,以及(ⅲ)三溴苯基马来酰亚胺。式(I)
(式(I)中,D表示含有「碳-碳」双键的二价基,A表示至少含2个碳原子的二价基。)
式(II)
H2N-B-NH2(II)
(式(II)中,B表示含有不足30个碳原子的二价基。)
而且,还提供以不饱和双酰亚胺,二胺和三溴苯基马来酰亚胺作为必要成分,将它们加热而制得的酰亚胺类预聚物及其固化物。
酰亚胺预聚物中,上述三溴苯基马来酰亚胺,相对于上述(式(I)表示的)不饱和双酰亚胺和上述(式(II)表示的)二胺的总计100重量份,最好是3-30重量份。
上述(式(I)表示的)不饱和双酰亚胺对上述(式(II)表示的)二胺的摩尔比最好是1.2-10。
上述不饱和双酰亚胺最好是N,N′-4,4′-二苯基甲烷双马来酰亚胺,而上述二胺最好是α,α′-双(4-氨苯基)-m-二异丙苯,4,4′-二氨基二苯基甲烷。
以下详细说明本发明之酰亚胺类预聚物。
本发明之酰亚胺类预聚物是以(ⅰ)不饱和双酰亚胺、(ⅱ)二胺,和(ⅲ)三溴苯基马来酰亚胺作为必要成分。
适用于本发明之酰亚胺类预聚物的(ⅰ)是下式(I)表示的不饱和双酰亚胺。
(式(I)中,D表示含有「碳-碳」双键的二价基,而A表示至少含2个碳原子的二价基。)
A表示的基,只要是至少含2个碳原子的二价基就行,没有特别的限定,具体可例示碳数为2-13的直键或支链亚烷基,5或6元环的亚烷基,至少含一个O、N和S原子的杂环、亚苯基或稠环类芳香族烃基。而且,这些的基也可以具有在反应条件下不会带来不必要副反应的一个或更多的取代基。
还可以是两个或更多的亚苯基,直接或者用二价原子或选自以下组中示出的基键合的脂环状基。
上述各式中R3、R4和Y各自选自C原子1-4的烷基,5或6元环的烷基,苯基和稠环类芳香族烃基,X选自碳数为13以下的直链和支链的亚烷基,5或6元环的亚烷基,单环和多环状亚芳基。
式中,n是0-2,Q和T各自选自二价键和选自-O-,-S-,含碳原子1-3的亚烷基,
上述式中,R3,R4和Y各自选自碳原子数1-4的烷基,5或6元环的烷基,苯基和稠环类芳香族烃基,X选自碳原子数为13以下的直链和支链的亚烷基,5或6元环的亚烷基,以及单环和多环状亚芳基。
在式(I)中,D表示含有碳-碳双键的二价基。
式(I)之不饱和双酰亚胺的非限制性例子,一般是N,N′-亚乙基双马来酰亚胺、N,N′-六亚甲基双马来酰亚胺,N,N′-m-亚苯基双马来酰亚胺、N,N′-p-亚苯基双马来酰亚胺、N,N′-4,4′-二苯基甲烷双马来酰亚胺、N,N′-4,4′-二苯基醚双马来酰亚胺、N,N′-3,4′-二苯基醚双马来酰亚胺、N,N′-双马来相互理解亚胺、N,N′-4,4′-二苯基砜双马来酰亚胺、N,N′-m-二甲苯双马来酰亚胺、α、α′-双(N-4-马来酰亚胺苯基)-m-二异丙苯,α,α′-双(N-4-马来酰亚胺苯基)-p-二异丙苯、N,N′-4,4′-环已烷双马来酰亚胺、N,N,′-4,4′-二苯基甲烷双柠康酰亚胺及其混合物等。
其中,N,N′-4,4′-二苯基甲烷双马来酰亚胺、N,N′-m-亚苯基双马来酰亚胺、N,N′-3,4′-二苯基醚双马来酰亚胺等尤其适用。
本发明之酰亚胺类预聚物的组分(ⅱ)是下式之二胺。
式(II)
H2N-B-NH2
〔式(II)中,B表示含不足30个碳原子最好是6-24个碳原子的二价基。〕
B的实例与上述A的实例相同,A和B可相同,也可不同。
式(II)之二胺的非限定性例子,一般可例举4,4′-二氨基环己基甲烷,1,4′-二氨基环己烷、m-苯二胺、p-苯二胺、4,4′-二氨基二苯基甲烷、4,4′-二氨基二苯基醚、3,4′-二氨基二苯基醚、4,4′-二氨基二苯砜、4,4′二氨基二苯硫醚、m-苯二甲胺、p-苯二甲胺、α、α′-双(4-氨基苯基)-m-二异丙苯、α、α′-双(4-氨基苯基)-p-二异丙苯,1,3-双(4-氨基苯氧基)苯,1,4-双(4-氨基苯氧基)苯,2,2′-双〔4-(4-氨基苯氧基)苯基〕丙烷,六亚甲基二胺及其混合物。其中最好是4,4′-二氨基二苯基甲烷,α,α′-双(4-氨基苯基)-m-二异丙苯,α,α′-双(4-氨基苯基)-p-二异丙苯,及其混合物。
本发明之酰亚胺类预聚物中,上述式(I)之不饱和双酰亚胺对式(II)之二胺的摩尔比,根据适用的二胺和不饱和双酰亚胺的特殊组合(按两者的化学结构)而异,通常,从耐热性和机械特性来看,I/II的摩尔比是1.2-10为好,最好是2-5的范围,由此可得到兼顾耐热性和机械特性都好的固化物。
本发明之酰亚胺类预聚物除了这种二胺和不饱和双酰亚胺外,作为必要成分还含有下式(III)表示的(ⅲ)三溴苯基马来酰亚胺。
由于作为必要成分含有上述(ⅰ)、(ⅱ)和(ⅲ)各成分,因此由本发明酰亚胺类预聚物所得之固化物的耐热性,特别是作层压板时对焊剂耐热性不会变差,并可以提高难燃性。
本发明之酰亚胺类预聚物中,三溴苯基马来酰亚胺的添加量,相对于上述式(I)表示的不饱和双酰亚胺和上述式(II)表示的二胺总计为100重量份,最好为3-30重量份。
三溴苯基马来酰亚胺的添加量规定在3重量份以上,因而可得到难燃性等方面所希望的增加效果;由于添加量规定在30重量份以下,因此能很好地防止玻璃转移温度降低和对焊剂耐热性降低。
这种三溴苯基马来酰亚胺的添加量,相对于式(I)不饱和双酰亚胺和式(II)二胺总计为100重量份,以5-15重量份为好,而5-10重量份为更好,这种情况,按UL-94进行试验可得到相当V-O的难燃性,而且可获得焊剂耐热性好,玻璃转移温度也高的优良效果。
具有以上(ⅰ)、(ⅱ)和(ⅲ)这些必要成分的本发明之酰亚胺类预聚物,是将这些成份溶融聚合,或者是在N-甲基吡咯烷酮、二甲基乙酰胺、二甲基甲酰胺、m-甲酚和p-甲酚,或它们的混合物等非质子极性溶剂中进行溶液聚合从而合成(成为预聚物)。这种情况下,聚合温度在60-180℃左右为好。聚合时这三种成分的添加顺序没有特别的限制。
由此得到的预聚物,溶解在N-甲基吡咯烷酮、二甲基乙酰胺、甲基甲酰胺、m-甲酚和p-甲酚、或它们的混合物等溶剂中作成漆,使之固化,或进一步粉碎成可组合使用的形式。
除上述方法,还可以是将不饱和双酰亚胺和二胺溶融聚合或溶解聚合而合成预聚物,然后当预聚物溶解在上述溶剂中形成漆时再往预聚物中添加三溴苯基马来酰亚胺。
将上述这种预聚物进行合成时,还可根据需要使用各种聚合触煤。
最好是使用阴离子聚合触媒。
阴离子聚合触媒的例子包括:诸如2-甲基咪唑,2-乙基-4-甲基咪唑,2-十一烷基咪唑,2-苯基咪唑,1-苄基-2-甲基咪唑,和1-氰乙基-2-乙基-4-甲基咪唑之类的咪唑类,以及三乙基胺和苄基二甲基胺之类的叔胺类。咪唑类是最好的触媒。
触媒的使用量为不饱和双酰亚胺和二胺总计重量的0.001-5%,最好是0.01-1%。
将所得之本发明耐热性难燃聚酰亚胺类预聚物进行固化时,是在170-250℃、最好是在180-220℃温度范围内加热10-180分钟,并根据需要进行加压。
由此获得的固化产品是难熔的,不溶的且吸水性最低,而且具有很高的玻璃转移温度。当形成层压板时,固化物具有优良的焊剂耐热性。
本发明之酰亚胺类预聚物可利用它们的耐热性和难燃性,用作IC密封材料、粘合剂等各种用途,从焊剂耐热性,难燃性及低吸水性等方面来看,特别适用于印刷电路配线底板等所用的层压板。
使用本发明之酰亚胺类预聚物制作层压板时,将上述方法制得的预聚物,用N-甲基吡咯烷酮,二甲基乙酰胺,二甲基甲酰胺,m-甲酚、p-甲酚,或它们的混合物等溶剂使之漆化,然后含浸在玻璃纤维中。
随后,将它在100-200℃温度下干燥2-20分钟作成预浸渍物。
将如此制得的预浸渍物按需要的张数重叠,并在100-250℃温度下以10-50Kgf/cm2加压10-120分钟,压缩成形从而得到层压板。
可以将所得之层压板不经任何处理原样使用,但最好是在180-250℃温度下经过2-48小时使之固化后使用。
上述得到的本发明之酰亚胺类预聚物中,还可根据需要添加润滑剂、脱模剂、耦合剂等添加剂,也可以作为组合物使用。
合适的润滑剂、脱模剂,可例举巴西棕榈蜡、蜂蜡、米蜡、亚乙基双十八烷酰胺等脂肪族酰胺类、二十九烷酸、硬脂酸等脂肪酸及其金属盐、石油蜡、聚乙烯蜡、聚丙烯蜡等等及其氧化生成物,聚甲基硅氧烷、聚甲基苯基硅氧烷等硅油等。
合适的耦合剂,可例举γ-环氧丙氧基丙基三甲氧基硅烷,N-β(氨乙基)-α-氨丙基三甲氧基硅烷等。
这类润滑剂、脱模剂及耦合剂、相对于上述不饱和双酰亚胺、二胺及三溴苯基马来酰亚胺总计100重量份,其添加量为0.1-5重量份。
本发明之酰亚胺预聚物中,还可根据需要添加端基为酰胺的丁腈橡胶(ATBN)、端基为羧基的丁腈橡胶(CTBN)等反应性橡胶成分、特氟隆_(DuPont)硅树脂、苯酚树脂、苯胺树脂等氟化树脂。它们的添加量,相对于以上不饱和双酰亚胺、二胺以及三溴苯基马来酰亚胺总计100重量份,最好是在10-200重量份范围内。
本发明之酰亚胺类预聚物中,还可根据需要,作为填充剂成分配合以下无机物或有机物。
例如,氧化硅粉、氧化铝粉、玻璃粉,云母,滑石、硫酸钡、氧化钛、二硫化钼、铝粉、铁粉、铜粉或氢氧化铝、氢氧化镁等金属氢氧化物、氧化硅、氧化铝、玻璃、苯酚树脂等中空体,以及强化纤维,如玻璃纤维、氧化铝纤维、碳纤维、碳化硅纤维等无机纤维等以及Kevlar(Du Pont)等芳酰胺纤维。
这些填充剂的添加量,相对于上述不饱和双酰亚胺、二胺以及三溴苯基马来酰亚胺的总计100重量份,最好是在50-200重量份的范围内。
以下根据实施例具体说明本发明,但本发明并不受这些实施例的限定。其中的百分数均指重量百分率。
实施例1
将55.5gα,α′-双(4-氨基苯基)-m-二异丙苯放入500ml的可拆式烧瓶中,浸渍在150℃的油浴中溶融之。
随后,在搅拌下2分钟内,往该可拆式烧瓶中添加144.5gN,N′-4,4′-二苯基甲烷双马来酰亚胺和22.0g三溴苯基马来酰亚胺,再继续搅拌。
开始添加N,N′-4,4′-二苯基甲烷双马来酰亚胺经过20分钟后,将该反应混合物抽到瓷盘中。
将该瓷盘放入170℃的空气烘箱里,加热20分钟使之进一步反应。
反应终了后,将所得之预聚物冷却至室温后粉碎之,将它溶解在N-甲基吡咯烷酮中,制得树脂浓度为50%的漆。
将该漆含浸在玻璃纤维布中,在160℃的烘箱中干燥7分钟,制得预浸渍物。
将所得之预浸渍物9张重叠在一起,在其上下放置28.3克的铜箔,用压缩成型法在180℃、成型压10Kgf/cm时,经过60分钟的加压成型,制成附铜层压板。将所得之附铜层压板继续放入200℃的空气烘箱中经过24小时固化,制得样品。
对比例1
用18.1g的溴化环氧树脂(日本化药(株)制、ETBA-100、Br含量48.1%)代替三溴苯基马来酰亚胺,以完全同于实施例1的方法制作附铜层压板从而制得样品。
实施例2
将36.2g二氨基二苯基甲烷放入500ml的可拆式烧瓶中,浸渍在150℃的油浴中使之熔融。
随后在搅拌下2分钟内,往该可拆式烧瓶中添加163.8gN,N′-4,4′-二苯基甲烷双马来酰亚胺和15g的三溴苯基马来酰亚胺,继续搅拌之。
开始添加N,N′-4,4′-二苯基甲烷双马来酰亚胺经过15分钟后,将该反应混合物抽到瓷盘中。将该瓷盘放入170℃的空气烘箱中,加热16分钟使之进一步反应。
反应终了后,将所得之预聚物冷却至室温后粉碎之,将它溶解在N-甲基吡咯烷酮中,制得树脂浓度为50%的漆。
将该漆含浸在玻璃纤维布中,在160℃的烘箱中干燥7分钟,制得预浸渍物。
将所得之预浸渍物9张重叠在一起,在其上下放置28.3克的铜箔,用压缩成型法在180℃、成型压为10Kgf/cm时,经过60分钟的加压成型,制成附铜层压板。将所得之附铜层压板继续放入200℃的空气烘箱中经过24小时固化,制得样品。
对各实例的附铜层压板样品进行下列试验。
(1)对焊剂的耐热试验
将样品放在300℃烘箱中加热5分钟,由目视观察层压板表面上有无起泡或其它损坏现象。
(2)吸水率(D-1/100)
将样品放在100℃的沸腾蒸馏水中浸渍1小时,测出吸水率。
(3)Tg
用セ亻コ一电子(株)社制的测定装置(TMA-100),测定玻璃转移温度Tg。以10℃/分的速度从室温升至300℃,加热样品,测定并求出试样品的热膨胀行为。
(4)难燃性试验
按照UL-94进行燃烧试验,并评价难燃性。评价基准如下。
难燃性的评定基准
94V-0 94V-1 94V-2 94HB平均消火时间(秒) ≤5 ≤25 ≤25 可不消火最大消火时间(秒) ≤30 ≤30 ≤30 燃烧速度
≤65mm/分5块样品 ≤50 ≤250 ≤250的合计燃烧时间
(秒)
纱网
着火* 不可 不可 可 -
燃烧距离(mm) — — — —
样品
的方向 竖向 竖向 竖向 横向
*在试验片下方30cm处放置纱网,判断是否它有火落下从而着火。试验结果示于表1。所谓前处理,是表示试验前样品放置的环境,并表示为符合JIS,符号A表示不进行前处理。符号D-1/100表示样品已在100℃沸腾蒸馏水中浸1小时。
表1评价项 前处理 实施例1 对比例1 实施例2对焊剂的耐热性 A 无异常 产生起泡 无异常(300℃,5分钟 D-1/100 无异常 产生起泡 无异常吸水率
D-1/100 0.12 0.16 0.14(%)Tg(℃) A 231 235 240难燃性
V-0 V-0 V-0(UL-94)
由表1所示结果可看出,本发明之酰亚胺类预聚物(实施例1和2)具有用溴化环氧树脂变性的酰亚胺预聚物同样优良的难燃性,而其耐热性和吸水性却很优良。而且,与以前的聚酰亚胺(对比例1)相比较,还具有非常好的焊剂耐热性。
以上结果清楚地说明了本发明的效果。
本发明之酰亚胺类预聚物,具有优良的热耐性,特别是用作层压板时具有焊剂耐热性和机械特性,而且还有很高的难燃性。
因此,本发明之酰亚胺类预聚物可适用于多层印刷线路配线底板用的层压材料、IC密封材料、粘合剂、绝缘漆等各种用途。
尽管描述了若干最佳实施方案,但根据上述指导还可做出许多修改和变化方案。因此,很容易理解,除了所述具体实例外,本发明还可在所附的权利要求范围内实践。
Claims (2)
1. 一种制备酰亚胺类预聚物的方法,它包括将一种单体进行熔融聚合或溶液聚合,所述单体包含有通式(I)表示的不饱和双酰亚胺,
式(I)中,D表示含有碳-碳双键的二价基,A表示至少含2个碳原子的二价基;
通式(II)表示的二胺,
H2N-B-NH2(II)
式(II)中,B表示含有不足30个碳原子的二价基,以及
三溴苯基马来酰亚胺,
其中,
式(I)所示不饱和双酰亚胺和上述式(II)
所示二胺之摩尔比范围为1.2-10,
所述三溴苯基马来酰亚胺,相对于式(I)所示不饱和双酰亚胺和式(II)所示二胺之总计100重量份,为3-30重量份。
2. 根据权利要求1所述的方法,其中,所述不饱和双酰亚胺是N,N′-4,4′-二苯基甲烷双马来酰亚胺,所述二胺是选自α,α′-双(4-氨基苯基)-间-二异丙苯和4,4′-二氨基二苯基甲烷中的至少一种。
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Application Number | Priority Date | Filing Date | Title |
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JP1271084A JPH03131629A (ja) | 1989-10-18 | 1989-10-18 | イミド系プレポリマーおよびその硬化物 |
JP271084/89 | 1989-10-18 |
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Publication Number | Publication Date |
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CN1051037A CN1051037A (zh) | 1991-05-01 |
CN1030708C true CN1030708C (zh) | 1996-01-17 |
Family
ID=17495147
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CN90108588A Expired - Fee Related CN1030708C (zh) | 1989-10-18 | 1990-10-18 | 酰亚胺类预聚物的制法 |
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US (1) | US5102981A (zh) |
EP (1) | EP0424135B1 (zh) |
JP (1) | JPH03131629A (zh) |
KR (1) | KR0179655B1 (zh) |
CN (1) | CN1030708C (zh) |
AT (1) | ATE115159T1 (zh) |
CA (1) | CA2027811A1 (zh) |
DE (1) | DE69014824T2 (zh) |
TW (1) | TW197452B (zh) |
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US5240981A (en) * | 1991-06-03 | 1993-08-31 | Ciba-Geigy Corporation | Flame retardant polyimide system |
US5334696A (en) * | 1992-12-18 | 1994-08-02 | Allied Signal Inc. | Polyimide resin laminates |
KR100509512B1 (ko) * | 1997-12-31 | 2005-11-08 | 삼성전자주식회사 | 비스(트리알킬트리멜리트산 무수물) 유도체 및 이로부터 형성된 광통신용 폴리에스테르이미드 |
CN1955222B (zh) * | 2005-10-28 | 2011-02-02 | 胜技高分子株式会社 | 无铅焊锡用阻燃性聚对苯二甲酸丁二醇酯树脂组合物 |
CN115925742B (zh) * | 2022-10-26 | 2024-09-17 | 山东科技大学 | 一种双官能团无卤阻燃剂及其制备方法与应用 |
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JPH01123831A (ja) * | 1987-11-09 | 1989-05-16 | Toshiba Chem Corp | 耐熱性樹脂組成物 |
JP2511480B2 (ja) * | 1987-11-13 | 1996-06-26 | 三井石油化学工業株式会社 | ポリアミノビスイミド系樹脂組成物 |
JPH0253316A (ja) * | 1988-08-18 | 1990-02-22 | Nec Corp | 位相ジツタキヤンセラ |
-
1989
- 1989-10-18 JP JP1271084A patent/JPH03131629A/ja active Pending
-
1990
- 1990-10-16 US US07/598,281 patent/US5102981A/en not_active Expired - Fee Related
- 1990-10-17 CA CA002027811A patent/CA2027811A1/en not_active Abandoned
- 1990-10-18 EP EP90311421A patent/EP0424135B1/en not_active Expired - Lifetime
- 1990-10-18 DE DE69014824T patent/DE69014824T2/de not_active Expired - Fee Related
- 1990-10-18 CN CN90108588A patent/CN1030708C/zh not_active Expired - Fee Related
- 1990-10-18 KR KR1019900016598A patent/KR0179655B1/ko not_active IP Right Cessation
- 1990-10-18 AT AT90311421T patent/ATE115159T1/de not_active IP Right Cessation
- 1990-10-20 TW TW079108890A patent/TW197452B/zh active
Also Published As
Publication number | Publication date |
---|---|
CA2027811A1 (en) | 1991-04-19 |
ATE115159T1 (de) | 1994-12-15 |
DE69014824D1 (de) | 1995-01-19 |
US5102981A (en) | 1992-04-07 |
CN1051037A (zh) | 1991-05-01 |
TW197452B (zh) | 1993-01-01 |
DE69014824T2 (de) | 1995-04-27 |
EP0424135A1 (en) | 1991-04-24 |
KR0179655B1 (ko) | 1999-05-15 |
JPH03131629A (ja) | 1991-06-05 |
KR910008021A (ko) | 1991-05-30 |
EP0424135B1 (en) | 1994-12-07 |
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