CN103056556B - Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces - Google Patents
Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces Download PDFInfo
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- CN103056556B CN103056556B CN201210075257.4A CN201210075257A CN103056556B CN 103056556 B CN103056556 B CN 103056556B CN 201210075257 A CN201210075257 A CN 201210075257A CN 103056556 B CN103056556 B CN 103056556B
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Abstract
The invention provides a preformed soldering terminal with halogen-free soldering fluxes coated on the surfaces, and the performed soldering terminal is good in soldering performance, and the quantity of the soldering fluxes can be controlled easily. A soldering flux coating is formed by the method that the preformed soldering terminal is wetted by halogen-free liquid soldering fluxes and then dried, the halogen-free liquid soldering fluxes are composed of the following components by weight: 35-42% of carrier, 1.0-1.4% of surface wetting agent, 0.5-1.2% of leveling agent, 0.3-0.5% of active agent, 0.1-1.0% of resin film-forming agent, 0.15-1.2% of thickening agent, and the balance is organic solvents. The carrier is rosin, the surface wetting agent is T-80, TX-100 and Span60, the leveling agent is OP-10, the active agent is oxalic acid, salicylic acid and malic acid, the resin film-forming agent is polybutadiene and polyurethane, the thickening agent is hydrogenated castor oil, and the organic solvent is alcohol or ketone which is lower than 110 DEG C in boiling point. The weight of the preformed soldering terminal with the halogen-free soldering fluxes coated on the surfaces is regarded as a standard, the content of the soldering flux coating is 0.2-5.0%, and the preformed soldering terminal with the halogen-free soldering fluxes coated on the surfaces is suitable for soldering of packaging of electronic components.
Description
Technical field
The present invention relates to welding material, particularly surface has the preformed soldering of soldering flux coating.
Background technology
At present, in Electronic Packaging, most widely used welding material is solder(ing) paste.But large for scolding tin consumption and the method for printing can not meet the demands when, replace solder(ing) paste to be then a kind of very good and effective way with the preformed soldering of surface application scaling powder.
Preformed soldering has specific machining shape, is a kind of staple in current solder, and it has welding registration, uses quantitatively feature accurately, is generally used for the occasion had higher requirements to shape and the quality of solder.This weld tabs stock size little (mm level), quality light (mg level), particularly for specific plug-in mounting welding and model calling, control weld size has extraordinary effect.This weld tabs, with precalculated tenor, ensureing quality and the uniformity of welding, by accurately controlling braze metal content in Electronic Packaging process, realizing high-precision soldering.Use this weld tabs can also avoid using the such as printing that brings of tin cream uneven, bite, tin cream slump, hole, solder balling-up, base component are fixing loosely, incompletely filling, interrupted wetting, residue is more, gap, stained, skew and the number of drawbacks such as cleaning is not thorough.
At present, like product scaling powder percentage composition scope involved by domestic patent CN201020299304.X and patent CN201010258783.5 is 0.2% ~ 0.4%, coating and weld tabs label Thickness Ratio are 1:30, but in product manufacturing, these indexs cannot fixing quantity, then cannot meet welding requirements under some occasion.Producer is not also had to produce for the preformed soldering that scaling powder percentage composition is high.
Summary of the invention
The present invention is in order to comply with the trend advocated in the world with carrying out halogen solder flux, solve the uncontrollable problem of content shared by soldering flux coating when weld tabs is produced simultaneously, a kind of preformed soldering of surface coating halogen-free flux is provided, this weld tabs has environmental protection, adhesion, depot good, welding uniformity is good, the feature that welding precision is high, and in weld tabs production, content shared by soldering flux coating easily controls.
For solving the problem, the technical solution used in the present invention is coated with soldering flux coating on preformed soldering surface, its special character is described soldering flux coating is formed through drying after described preformed soldering infiltrates halogen-free liquid soldering flux, described halogen-free liquid soldering flux forms with the component of its weighing scale by following content: carrier 35 ~ 42%, surface active agent 1.0 ~ 1.4%, homogenizing agent 0.5 ~ 1.2%, activating agent 0.3 ~ 0.5%, resin film former 0.1 ~ 1.0%, thickener 0.15 ~ 1.2%, organic solvent surplus;
Described carrier is rosin, and surface active agent is T-80, TX-100 and Span60, and homogenizing agent is OP-10, activating agent is ethanedioic acid, salicylic acid and malic acid, resin film former is polybutadiene and polyurethane, and thickener is rilanit special, and organic solvent is alcohol or the ketone of boiling point less than 110 DEG C;
With the preformed soldering weight of described surface coating halogen-free flux for benchmark, described soldering flux coating content is 0.2 ~ 5.0%.
Organic solvent of the present invention is methyl alcohol, ethanol, isobutanol or acetone.
The shape of preformed soldering of the present invention is rectangular pieces, square sheets, circular piece, ring segment or irregularly shaped.
First manufacture of the present invention prepares certain density liquid halogen-free flux according to the requirement of weld tabs surface welding-assistant coating levels, and the basis of this scaling powder is activating agent, rosin carrier and solvent.Brazing metal is prefabricated into the effigurate weld tabs of tool, infiltrates the halogen-free liquid soldering flux of one deck on the surface of preformed soldering as requested, then by drying, the flux in surface liquid coating is volatilized completely, make weld tabs of the present invention.The surface of this weld tabs is coated with equally distributed halogen-free flux coating.The manufacture of weld tabs of the present invention can control soldering flux coating mass fraction shared in weld tabs by the change of carrier in liquid soldering flux and thickener equal size.Weld tabs of the present invention can by the prefabricated product obtaining any specification, size, shape, with the requirement of the electronic devices and components of satisfied welding difformity, specification.
In liquid soldering flux, add film forming agent when the present invention manufactures can make scaling powder adhere at preformed soldering surface uniform, adds adhesion agent energy control surface soldering flux coating shared percentage composition in the present invention.
Carrier of the present invention preferred rosin based material, particularly Foral.
Surface active agent in the present invention can select Span-60 (sorbitan monostearate), T-80 (tween T-80, polyoxyethylene sorbitan fatty acid ester), TX-100 (octyl phenyl polyoxyethylene ether), be non-ionic surface active agent.
Homogenizing agent OP-10 (APES) of the present invention also belongs to non-ionic surface active agent, it have emulsification, evenly, the function such as wetting, diffusion.
Activating agent in the present invention can be aliphatic acid, aromatic acid or amino acid, except described hexanedioic acid, salicylic acid, malic acid, can also be acetic acid, propionic acid, succinic acid, ethanedioic acid, glutaric acid, benzoic acid etc., optional one or more mixing wherein.This type of activating agent has and enough helps weldering performance, and it can decompose under welding temperature, and distillation or volatilization, make the noresidue of object postwelding, corrosion-free.
Described resin film former chooses polybutadiene, one or both in polyurethane, adds liquid soldering flux rapid film formation in heating process that film forming agent then can make weld tabs surface infiltrate, the mutual adhesion of finished product weld tabs, convenient storage and using.
Rilanit special chosen by thickener of the present invention.Add thickener to contribute to liquid soldering flux and stick to preformed soldering surface.How much control the content of soldering flux coating in whole weld tabs by the content of added thickener when the present invention manufactures, amount of thickener can not be too high, otherwise can affect wettability.
Organic solvent then will choose low-boiling point liquid solvent, and as volatile materials such as methyl alcohol, ethanol, isobutanol, acetone, the preferred acetone of the present invention is as organic solvent.
Weld tabs surface welding-assistant coating processes step of the present invention: corresponding liquid soldering flux is prepared in the requirement according to weld tabs surface welding-assistant content, preformed soldering is infiltrated in liquid soldering flux the equally distributed liquid soldering flux liquid film of one deck, then utilize heating, drying equipment to heat at the corresponding temperature and the organic solvent in liquid soldering flux is volatilized rapidly, leave the equally distributed solid soldering flux of one deck on weld tabs surface.
The beneficial effect of the present invention compared with existing product:
1, because the present invention adopts the technique that disposable infiltration is dried to make weld tabs surface adhesion one deck solid soldering flux, make metal weld tabs and air insulated, be conducive to the preservation of solder sheet, do not need storage at a constant temperature;
2, the preformed soldering of coating scaling powder in surface of the present invention is compared with tin cream, without the need to hand-printing, reduces the skill set requirements to operating personnel, improves the uniformity of welding;
3, the scaling powder content of preformed soldering surface coating of the present invention according to welding requirements fixing quantity, can avoid too much welding assisted agent residuals while effectively removing face of weld oxide layer, improves welding quality, ensures the uniformity of welding, improve welding efficiency;
4, the scaling powder of preformed soldering surface coating of the present invention is halogen-free flux, complies with non-halogen international trend, does not threaten, more environmental protection to health and environment.
Detailed description of the invention
Embodiment one
Under normal temperature, following mixing of materials is stirred and is mixed with liquid soldering flux, then adopt the method for infiltration to attach one deck scaling powder liquid film on preformed soldering surface, within one minute, make product through 100 DEG C of oven dry.In product, scaling powder mass content is 0.2%.
Foral: 35%
T-80：1.0％
TX-100：0.2
Span60：0.2
OP-10：0.5％
Adipic acid: 0.15%
Salicylic acid: 0.1%
Malic acid: 0.05%
Polybutadiene film forming agent: 0.05%
Polyurethane finishing agent: 0.05%
Rilanit special: 0.15%
Acetone: surplus
Embodiment two
Preparation method is with example 1.
Foral: 36%
T-80：0.8％
TX-100：0.2％
Span60：0.2％
OP-10：0.6％
Adipic acid: 0.25%
Salicylic acid: 0.05%
Malic acid: 0.1%
Polybutadiene film forming agent: 0.15%
Polyurethane finishing agent: 0.25%
Rilanit special: 0.3%
Acetone: surplus
Method of preparation and use is shown in embodiment 1, and scaling powder content is 1%.
Embodiment three
Preparation method is with example 1.
Foral: 38%
T-80：0.75％
TX-100：0.2％
Span60：0.25％
OP-10：0.8％
Adipic acid: 0.3%
Salicylic acid: 0.05%
Malic acid: 0.05%
Polybutadiene film forming agent: 0.25%
Polyurethane finishing agent: 0.25%
Rilanit special: 0.7%
Acetone: surplus
Method of preparation and use is shown in embodiment 1, and scaling powder content is 2.5%.
Embodiment four
Preparation method is with example 1.
Foral: 40%
T-80：0.6％
TX-100：0.25％
Span60：0.55％
OP-10：1.05％
Adipic acid: 0.25%
Salicylic acid: 0.05%
Malic acid: 0.15%
Polybutadiene film forming agent: 0.5%
Polyurethane finishing agent: 0.25%
Rilanit special: 1.0%
Acetone: surplus
Method of preparation and use is shown in embodiment 1, and scaling powder content is 4%.
Embodiment five
Preparation method is with example 1.
Foral: 42%
T-80：0.5％
TX-100：0.25％
Span60：0.25％
OP-10：1.2％
Adipic acid: 0.25%
Salicylic acid: 0.1%
Malic acid: 0.15%
Polybutadiene film forming agent: 0.5%
Polyurethane finishing agent: 0.5%
Rilanit special: 1.2%
Acetone: surplus
Method of preparation and use is shown in embodiment 1, and scaling powder content is 5%.
Claims (4)
1. the preformed soldering of surface coating halogen-free flux, soldering flux coating is coated with on preformed soldering surface, it is characterized in that described soldering flux coating is formed through drying after described preformed soldering infiltrates halogen-free liquid soldering flux, described halogen-free liquid soldering flux forms with the component of its weighing scale by following content: carrier 35 ~ 42%, surface active agent 1.0 ~ 1.4%, homogenizing agent 0.5 ~ 1.2%, activating agent 0.3 ~ 0.5%, resin film former 0.1 ~ 1.0%, thickener 0.15 ~ 1.2%, organic solvent surplus;
Described carrier is rosin, and surface active agent is T-80, TX-100 and Span60, and homogenizing agent is OP-10, activating agent is adipic acid, salicylic acid and malic acid, resin film former is polybutadiene and polyurethane, and thickener is rilanit special, and organic solvent is alcohol or the ketone of boiling point less than 110 DEG C;
With the preformed soldering weight of described surface coating halogen-free flux for benchmark, described soldering flux coating content is 0.2 ~ 5.0%.
2. weld tabs as claimed in claim 1, is characterized in that described organic solvent is methyl alcohol, ethanol, isobutanol or acetone.
3. weld tabs as claimed in claim 1, is characterized in that the shape of described preformed soldering is rectangular pieces, square sheets, circular piece, ring segment or irregularly shaped.
4. weld tabs as claimed in claim 1, is characterized in that described preformed soldering composition includes the solder of any composition of lead and lead-free solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210075257.4A CN103056556B (en) | 2012-03-20 | 2012-03-20 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
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| CN201210075257.4A CN103056556B (en) | 2012-03-20 | 2012-03-20 | Preformed soldering terminal with halogen-free soldering fluxes coated on surfaces |
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| CN103056556A CN103056556A (en) | 2013-04-24 |
| CN103056556B true CN103056556B (en) | 2015-03-04 |
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| CN103521953B (en) * | 2013-10-25 | 2017-09-01 | 广州汉源新材料股份有限公司 | A kind of coating processes of preformed soldering scaling powder |
| CN103817062B (en) * | 2013-12-28 | 2015-07-08 | 深圳市福摩索金属制品有限公司 | Method for coating preformed welding piece with coating |
| CN104191108B (en) * | 2014-08-28 | 2016-03-02 | 华南理工大学 | A kind of Halogen high activity low spatter solder stick scaling powder and preparation method thereof |
| CN104625288A (en) * | 2014-12-23 | 2015-05-20 | 常熟高嘉能源科技有限公司 | Solar cell welding process |
| CN104646865A (en) * | 2014-12-26 | 2015-05-27 | 苏州龙腾万里化工科技有限公司 | Novel, environment-friendly, high-temperature resistant and hot-air-leveled soldering flux |
| CN105921911B (en) * | 2016-05-31 | 2018-08-24 | 深圳市唯特偶新材料股份有限公司 | A kind of preformed soldering scaling powder in the few cavity of postwelding |
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| CN108247239B (en) * | 2018-01-12 | 2021-01-22 | 吉安谊盛电子材料有限公司 | Oily scaling powder for cast welding of lead-acid storage battery plate group |
| CN108747090B (en) * | 2018-06-21 | 2020-12-08 | 上海华庆焊材技术有限公司 | Welding-aid adhesive and preparation method and application thereof |
| CN110116247A (en) * | 2019-05-15 | 2019-08-13 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding of radar electric product connector |
| CN113441873B (en) * | 2020-03-25 | 2022-11-15 | 深圳市华石电子有限公司 | Soldering-assistant sheet and preparation method thereof |
| CN112122825B (en) * | 2020-08-17 | 2022-03-18 | 深圳市兴鸿泰锡业有限公司 | Preparation method of 5G communication tin base band coating halogen-free preformed soldering lug |
| JP6992243B1 (en) | 2021-03-31 | 2022-02-03 | 千住金属工業株式会社 | Flux for flux-coated solder preforms, flux-coated solder preforms, and methods for mounting electronic components on electronic boards |
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Inventor after: Hu Lanwei Inventor after: Liu Ping Inventor after: Yang Changjin Inventor after: Gu Xiaolong Inventor after: Zhong Haifeng Inventor after: Xu Baisheng Inventor before: Hu Weilan Inventor before: Liu Ping Inventor before: Yang Changjin Inventor before: Gu Xiaolong Inventor before: Zhong Haifeng Inventor before: Xu Baisheng |
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Free format text: CORRECT: INVENTOR; FROM: HU WEILAN LIU PING YANG CHANGJIN GU XIAOLONG ZHONG HAIFENG XU BAISHENG TO: HU LANWEI LIU PING YANG CHANGJIN GU XIAOLONG ZHONG HAIFENG XU BAISHENG |
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Address after: No. 372, Jinpeng Street, Sandun Town, Xihu District, Hangzhou, Zhejiang 310030 Patentee after: Zhejiang Yatong New Materials Co.,Ltd. Address before: 310030 north of Xiyuan 8th Road, Sandun Xihu Science Park, Xihu District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd. |