CN103035987A - Vertical filter and manufacture method thereof - Google Patents
Vertical filter and manufacture method thereof Download PDFInfo
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- CN103035987A CN103035987A CN2011103023552A CN201110302355A CN103035987A CN 103035987 A CN103035987 A CN 103035987A CN 2011103023552 A CN2011103023552 A CN 2011103023552A CN 201110302355 A CN201110302355 A CN 201110302355A CN 103035987 A CN103035987 A CN 103035987A
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Abstract
The invention discloses a vertical filter and a manufacture method thereof. The top face and the bottom face of an insulating plate are respectively provided with a metal layer, the two metal layers are connected with each other in an electrical mode through a plurality of through holes penetrating through the insulating plate, and the two metal layers and the plurality of the through holes form a plurality of resonant bodies and a frame around the plurality of the resonant bodies. Resonant cavities are formed between each two adjacent resonant bodies and between each resonant body and the frame. By means of the design, the vertical filter can be easy to manufacture, the Q value of the vertical filter can be improved without need of a large thickness, and therefore the vertical filter is high in side wave restriction and low in pass band consumption.
Description
Technical field
The present invention relates to a kind of filter, particularly a kind of three-dimensional filter and preparation method thereof.
Background technology
In order to improve the quality of wireless telecommunications, usually can process the high-frequency signal receive by a band pass filter (bandpass filter), not only can the unnecessary interference signal of filtering, can allow high-frequency signal have the good quality of reception simultaneously.High efficiency band pass filter then is the factor of major decision communication quality, also is high selectivity (selectivity) and is inserted into the filter of loss (insertion loss); Wherein, high selectivity means the inhibition ability of other wavestrip (side band) fairly good, can dwindle the buffer zone (guard band) between adjacent channel, the situation that frequency is used is more efficient, for judging filter quality factor (Quality factor, Q) key, and insertion loss means signal through the attenuation degree of filtering, the conductor that is caused by the surface impedance of conductor own consumes, dielectric consume and the factors such as radiation consume of signal electromagnet ripple on the space that conductor periphery dielectric material causes determine attenuation degree, and the filter that is inserted into loss can make the better high frequency receiving gain of signal acquisition.
With regard to the mechanical filter of high Q value (such as comb filter), it mainly is the multistage three-dimensional resonator that the metal with the tool specific thicknesses is made, so just can utilize the high-quality factor (Quality factor) of the low dielectric consume of the low surface impedance of metal itself and ambient air medium, suppress ability and be inserted into loss and make the signal filtering process obtain good other ripple; But the filter of all-metal material needs a large amount of metal materials to cooperate complicated mould to mold multistage resonant body in manufacturing, thereby except expending higher cost, also can have sizable volume because thickness itself is too thick, be as good as sizable circuit space that to account in the application for integrated circuit module.
In order to reduce manufacturing cost and to reduce volume, the microstrip line flat filter (microstrip filter) made from Copper Foil on printed circuit board (PCB) is arranged then, such as fourchette type microstripline filter (Inter-digital filter), edge manifold type microstripline filter (Edge coupled micro-strip filter) and hairpin-line bandpass filter (Hairpin filter) etc., yet the metal resonant body thickness of the filter that forms with this planar metal manufacturing is excessively thin, make signals transmission cause the conductor consume by the high surface resistance factor of conductor, and be subject to the dielectric consume impact of printed circuit board (PCB) in the signal transmission, cause filter itself to be difficult to obtain high Q value, thereby can cause filter the problems such as other ripple inhibition ability variation and insertion loss raising to occur.
Summary of the invention
Main purpose of the present invention is to provide a kind of three-dimensional filter, and it has suitable thickness and cheap manufacturing cost, and the Q value of energy raising itself.
Of the present invention time a purpose is to provide a kind of three-dimensional filter, and it can reduce the dielectric consume.
In order to achieve the above object, three-dimensional filter of the present invention includes an insulation board and two metal levels, this two metal level is located at respectively the top of this insulation board, two sides, the end and run through the perforation of this insulation board and mutually electrically conduct via a plurality of, and form a plurality of resonant bodies with these a plurality of perforations and be looped around a frame around these a plurality of resonant bodies, between adjacent two these resonant bodies and respectively form respectively one first resonant cavity and one second resonant cavity between this resonant body and this frame, and, this frame has two openings in wherein at least one mask of this insulation board, be positioned at outermost two these resonant bodies and extend an input end and an output end towards this two opening respectively, use for signal input and output.
By this, three-dimensional filter of the present invention is made quite easily and is not needed the Q value that too many thickness just can raising itself, and then can access higher other ripple inhibition ability and lower insertion consume; In addition, the dielectric loss that brings in order to reduce this insulation board, the resonant cavity between adjacent two these resonant bodies can be Openworks shape, and respectively the resonant cavity between this resonant body and this frame also can be Openworks shape.
In the three-dimensional filter that one embodiment of the invention provides, these a plurality of resonant bodies are the array-like setting and have 2 first adjacent resonant bodies and 2 second adjacent resonant bodies, wherein reach wherein this second resonant body and this frame among formation two these second resonant cavitys between this first resonant body and this frame; This input end and this output end are extended towards this two opening respectively by another this first resonant body and another this second resonant body.
The preferably, the first resonant cavity between this 2 first resonant body and this 2 second resonant body is Openworks shape, and respectively this second resonant cavity between this resonant body and this frame has this local insulation board.
Another preferably, formed the first resonant cavity has this local insulation board between this 2 first resonant body and this 2 second resonant body, and respectively this second resonant cavity between this resonant body and this frame is Openworks shape.
Another preferably, this input end and this output end are extended towards this two opening respectively in the opposite direction by two these resonant bodies.
In the three-dimensional filter that one embodiment of the invention provides, wherein these a plurality of resonant bodies present to be parallel to each other and are set up in parallel and perpendicular to two relative sides of this frame, respectively a wherein side of this resonant body and this frame is electrically connected, and is separated by a preset distance and forms respectively this second resonant cavity with another side of this frame.
The preferably, a wherein side of this frame is provided with this two opening simultaneously.
Another preferably, wherein two relative sides of this frame are parallel to each other with these a plurality of resonant bodies and are respectively equipped with this two opening.
Another preferably, this input end and this output end are extended towards this two opening respectively in the opposite direction by two these resonant bodies.
Another preferably, wherein respectively this first resonant cavity is Openworks shape, and respectively formed the second resonant cavity has this local insulation board between two relative sides of the end of this resonant body and this frame.More preferably, wherein in addition parallel these a plurality of resonant bodies of two relative sides of this frame and and outermost two these resonant bodies between form respectively second resonant cavity that is Openworks shape.
In the three-dimensional filter that one embodiment of the invention provides, wherein this input end and output section are positioned at the same face of this frame, and the another side of this frame is continuously extension along the periphery of insulation board.
In the three-dimensional filter that one embodiment of the invention provides, wherein this insulation board is made with glass fibre or ceramic material, and respectively this metal level and this a plurality of perforations are made with identical conductive material.
The preferably, wherein this insulation board is that the compound glass fiber board is made, respectively this metal level and this a plurality of perforations are made with the material of copper or copper alloy.
Another purpose of the present invention is to provide a kind of manufacture method of aforementioned three-dimensional filter, and it can save manufacturing cost.
In order to achieve the above object, the manufacture method of three-dimensional filter of the present invention includes the following step: an insulation board a) at first is provided, b) then on the top of this insulation board, two sides, the end arranges respectively a metal level, c) remove subsequently the part metals layer, to form a plurality of resonance patterns in this metal level respectively and to be looped around a frame pattern around these a plurality of resonance patterns, and the resonance pattern of this two metal level is identical, have two openings on arbitrary or two these frame patterns, two this resonance patterns adjacent with this two opening extend an input end and an output end towards this two opening respectively, d) follow in the machining mode respectively this resonance pattern and frame pattern form a plurality of perforation that run through this insulation board, e) the last a plurality of perforations that on the hole wall of these a plurality of perforation, form tool conductivity, make this resonance pattern respectively and the corresponding perforation that arranges thereof form a resonant body, and this two frame pattern and the corresponding perforation that arranges thereof are formed be looped around the frame around these a plurality of resonant bodies.
By this, the present invention utilizes the method for making printed circuit board (PCB) to make this three-dimensional filter, can effectively reduce manufacturing cost.
In the manufacture method of the three-dimensional filter that one embodiment of the invention provides, wherein at step c) in, these a plurality of resonance patterns are the array-like setting and have 2 first adjacent resonant bodies and 2 second adjacent resonant bodies, and this input end and this output end are extended towards this two opening respectively by two adjacent the first resonant body and the second resonant bodies wherein.
The preferably, wherein in steps d) in or at step e) afterwards, remove again the SI semi-insulation plate, so that be Openworks shape between this 2 first resonant body and this 2 second resonant body, and respectively between this first resonant body and this frame and respectively remain with the insulation board of part between this second resonant body and this frame.
Another preferably, wherein in steps d) in or at step e) afterwards, remove again the SI semi-insulation plate, so that remain with local insulation board between this 2 first resonant body and this 2 second resonant body, and respectively reach between a side and this frame of this first resonant body between a side of this second resonant body respectively and this frame and be Openworks shape.
In the manufacture method of the three-dimensional filter that one embodiment of the invention provides, wherein at step c) in, these a plurality of resonance patterns are parallel to each other side by side, in steps d) in or at step e) afterwards, remove the SI semi-insulation plate in the machining mode again, so that be Openworks shape between adjacent two these resonant bodies.
The preferably is wherein in steps d) in or at step e) the SI semi-insulation plate removed afterwards more is Openworks shape so that outermost two these resonant bodies have respectively between a side and this frame.
In the manufacture method of the three-dimensional filter that one embodiment of the invention provides, wherein at step c) in, these a plurality of resonance patterns are parallel to each other side by side, and should input end and the bearing of trend of output end parallel or vertical these a plurality of resonance patterns simultaneously.
In the manufacture method of the three-dimensional filter that one embodiment of the invention provides, wherein at step c) in, this two opening is positioned on same this frame pattern, and another this frame pattern is continuously extension along the periphery of insulation board.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the top plan view of the present invention's the first preferred embodiment;
Fig. 2 is the bottom plan view of above-mentioned the first preferred embodiment;
Fig. 3 is another top plan view of the present invention's the first preferred embodiment, and the state behind the SI semi-insulation plate is removed in main demonstration;
Fig. 4 is that Fig. 3 is along the cutaway view of 4-4 hatching line;
Fig. 5 is the top plan view of the second preferred embodiment, and shows the state behind the removal SI semi-insulation plate;
Fig. 6 is another top plan view of the present invention's the second preferred embodiment, and shows the state vertical view behind the removal SI semi-insulation plate;
Fig. 7 is the flow chart of manufacture method of the present invention.
Wherein, Reference numeral
" the first embodiment "
10 three-dimensional filter 20 insulation boards
30 metal levels, 31 perforations
32 resonant bodies, 33 frames
332 openings, 34 first resonant cavitys
35 second resonant cavitys, 36 input ends
37 output ends, 38 resonance patterns
39 frame patterns
" the second embodiment "
40 three-dimensional filter 50 insulation boards
60 metal level 61a, 61a ' the first resonant body
61b, 61b ' the second resonant body 62 frames
63 first resonant cavitys, 64 second resonant cavitys
66 output ends, 65 input ends
67 openings
Embodiment
In order to describe structure of the present invention, feature and effect place in detail, hereby enumerate a plurality of preferred embodiments and cooperate following description of drawings as follows.
See also Fig. 1, the three-dimensional filter 10 that provides for the present invention's the first preferred embodiment, include an insulation board 20 and two metal levels 30, the material of insulation board 20 can be glass fibre or the ceramic material of single or multiple lift, wherein take the compound glass fiber board as the best aspect of implementing, each metal level 30 is made and take the material of copper or copper alloy as the best aspect of implementing by conductive material.
This two metal level 30 is located at respectively top, the two sides, the end of insulation board 20, each metal level 30 has a plurality of resonance patterns 38 and is looped around these a plurality of resonance patterns 38 frame pattern 39 on every side, each corresponding resonance pattern 38 of this two metal level 30 runs through the perforation 31 of insulation board 20 and mutually electrically conducts via a plurality of, and form resonant bodies 32 with these a plurality of perforations 31, each frame pattern 39 of this two metal level 30 electrically conducts mutually via a plurality of perforations 31, and forms a frame 33 with these a plurality of perforations 31.In the present embodiment, these a plurality of resonant bodies 32 present to be parallel to each other and are set up in parallel, and perpendicular to two long sides of frame 33 and two short sides of parallel frame 33, so that form one first resonant cavity 34 between adjacent two resonant bodies 32, each resonant body 32 is to be electrically connected with the wherein long side of frame 33, and is separated by a preset distance and forms respectively one second resonant cavity 35 with another long side of frame 33; In addition, the frame pattern 39 that is positioned at insulation board 20 bottom surfaces is continuously along the periphery of insulation board 20 and extends, as shown in Figure 2, a wherein long side that is positioned at the frame pattern 39 of insulation board 20 end faces has two openings 332 simultaneously, be positioned at outermost two resonant bodies 32 and extend an input end 36 and an output end 37 towards this two opening 332 respectively, use for signal input and output.
By this, when high-frequency signal after the input of input end 36, just can be via the coupled resonance between these a plurality of resonant bodies 32, cooperate the second resonant cavity 35 that consists of with frame 33, obtain best signal gain and other ripple and suppress frequency range, to filter out unnecessary signal, at last again by 37 outputs of output end.Because three-dimensional filter 10 provided by the present invention utilizes these a plurality of resonance patterns 38 of single insulating plate 20 both sides and the setting of these a plurality of perforations 31, the three-dimensional resonant body 32 that is equal to the high Q value that existing machinery formula filter provides can be arranged, make quite easily and do not need the Q value that too many thickness just can raising itself, and then can access higher other ripple inhibition ability and lower insertion consume, have the high-frequency signal of good communication quality.
What this need to remark additionally be, the design of this two opening 332 mainly is to consider this filter 10 applied forward and backward level circuit structures, not necessarily to be located at the same side of the same face of frame 33, also can be arranged on the different sides of the same face of frame 33, this input end and this output end are extended respectively in the opposite direction by outermost two these resonant bodies, for example this two opening 332 is located at respectively on this two long side or this two short side; If perhaps the forward and backward level circuit that connects of this filter 10 lays respectively on the circuit layer structure of Different Plane height, this two opening also can be separately positioned on the not coplanar of frame 33.
More than be the structure of the present invention's the first preferred embodiment, below cooperate again Fig. 1 and Fig. 7 to describe with regard to manufacture method of the present invention.
A): provide by the made insulation board 20 of glass fibre material.
B): layer of copper or copper alloy are set respectively as metal level 30 on top, the two sides, the end of insulation board 20.
C): remove part metals layer 30, to form a plurality of resonance patterns 38 in this metal level 30 respectively and to be looped around a frame pattern 39 around these a plurality of resonance patterns 38, and the resonance pattern 38 of this two metal level 30 is identical, wherein a frame pattern 39 has this two opening 332, and wherein a metal level 30 arranges respectively an input end 36 and an output end 37 in this two opening 332.
D): in the machining mode each resonance pattern 38 and each frame pattern 39 are formed a plurality of perforation that run through this insulation board 20.
E) a plurality of perforations 31 of formation tool conductivity on the hole wall of these a plurality of perforation, make each resonance pattern 38 and the corresponding perforation that arranges 31 thereof form resonant body 32, this two frame pattern 39 and the corresponding perforation that arranges 31 thereof form frame 33, so just finish the making of three-dimensional filter 10 of the present invention.
The dielectric consume and the whole Q value of raising that produce in order to reduce insulation board 20, can be in steps d) or step e) rear with the machining mode will part insulation board 20 get rid of, allow formed the first resonant cavity 34 is Openworks shape between adjacent two resonant bodies 32, keep local insulation board 20 between the end of each resonant body 32 and the frame 33 and allow the second resonant cavity 35 keep non-Openworks shape and allow, as shown in Figures 3 and 4, and, form respectively the second resonant cavity 35 that is Openworks shape between two short sides of frame 31 and outermost two resonant bodies 32.
Please consult again Fig. 5, the three-dimensional filter 40 that provides for the present invention's the second preferred embodiment, include equally an insulation board 50 and two metal levels 60, the place different from above-described embodiment is that this three-dimensional filter 40 is for having electric coupling, the multistage coupled resonance form of magnetic coupling and electromagnetic coupled, take multistage serial connection C shape transmission line structure as example, the multistage coupling filter of four string datas that namely exemplifies just like present embodiment, be the array-like setting by these two metal levels, 60 formed four resonant bodies, and divide into 2 first resonant body 61a, 61a ' and 2 second resonant body 61b, 61b ', between each first resonant body 61a and the 61a ', form respectively one first resonant cavity 63 between each second resonant body 61b and the 61b ' and between the first adjacent resonant body 61a or 61a ' and the second resonant body 61b or the 61b ', form respectively one second resonant cavity, 64, the first resonant body 61a ' and the second resonant body 61b ' between the first resonant body 61a and the second resonant body 61b and the frame 62 and form 2 second resonant cavitys 64 with frame 62 amongs; More cooperate and lower in the dielectric consume consideration, make each first resonant cavity 63 between this 2 first resonant body 61a, 61a ' and this 2 second resonant body 61b, the 61b ' be Openworks shape, and reaching this second resonant body 61b ' between this first resonant body 61a ' and this frame 62 is Openworks shape with wherein one second resonant cavity 64 that this frame 62 amongs form, as shown in Figure 5.In addition, input end 65 and output end 66 are extended towards this two opening 67 in the opposite direction by the first wherein adjacent resonant body 61a and the second resonant body 61b.By this, when signal is inputted from input end 65, can be by multistage electricity, magnetic coupling resonance, to reach the purpose of trap signal between these a plurality of resonant body 61a～61b.
On the other hand, manufacture method and above-described embodiment of present embodiment are roughly the same, repeat no more in this appearance, both difference only is steps d) or step e) afterwards available machining mode remove SI semi-insulation plate 50, use as fixing these a plurality of resonant body 61a～61b with the insulation board 50 perpendicular to these two openings, 67 bearing of trends, can be so that be Openworks shape perpendicular to each first resonant cavitys 63 of this two openings, 67 bearing of trends, and be Openworks shape in abutting connection with the second resonant cavity 64 of this two opening 67.What this need to add a supplementary explanation equally be, each first resonant cavity 63 can be changed with the hollow out form of each the second resonant cavity, can change to be parallel to the insulation board 50 of these two openings, 67 bearing of trends as fixing these a plurality of resonant body 61a～61b usefulness, each first resonant cavity 63 that for example makes between each first resonant body 61a and the 61a ' and form between each second resonant body 61b and the 61b ' is Openworks shape, and each second resonant cavity 64 that is parallel on these two openings, 67 bearing of trends also is Openworks shape, as shown in Figure 6.
Comprehensive as can be known above-mentioned, three-dimensional filter of the present invention is that insulation board and two metal layers is made with printed circuit technique, not only technique easily and have suitable thickness after manufacturing is finished, reduce manufacturing cost and the purpose that improves the Q value to reach, can reduce according to the part that it is unnecessary that actual needs is removed insulation board simultaneously the dielectric consume, and then allow three-dimensional filter of the present invention can obtain higher other ripple inhibition ability and lower insertion consume.
Certainly; the present invention also can have other various embodiments; in the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (21)
1. a three-dimensional filter is characterized in that, includes:
One insulation board; And
Two metal levels, be located at respectively the top of this insulation board, two sides, the end and run through the perforation of this insulation board and mutually electrically conduct via a plurality of, this two metal level and this a plurality of perforations form a plurality ofly to have the resonant body of identical patterns and is looped around a frame around these a plurality of resonant bodies, form one first resonant cavity and formation one second resonant cavity between at least one side and this frame of this resonant body respectively between adjacent two these resonant bodies, this frame has two openings in wherein at least one mask of this insulation board, is positioned at outermost two these resonant bodies and extends an input end and an output end towards this two opening respectively.
2. three-dimensional filter according to claim 1, it is characterized in that, these a plurality of resonant bodies are the array-like setting and have 2 first adjacent resonant bodies and 2 second adjacent resonant bodies, wherein reach wherein this second resonant body and this frame among formation two these second resonant cavitys between this first resonant body and this frame; This input end and this output end are extended towards this two opening respectively by another this first resonant body and another this second resonant body.
3. three-dimensional filter according to claim 2 is characterized in that, the first resonant cavity between this 2 first resonant body and this 2 second resonant body is Openworks shape, and respectively this second resonant cavity between this resonant body and this frame has this local insulation board.
4. three-dimensional filter according to claim 2, it is characterized in that, formed the first resonant cavity has this local insulation board between this 2 first resonant body and this 2 second resonant body, and respectively this second resonant cavity between this resonant body and this frame is Openworks shape.
5. three-dimensional filter according to claim 1, it is characterized in that, these a plurality of resonant bodies present to be parallel to each other and are set up in parallel and perpendicular to two relative sides of this frame, respectively a wherein side of this resonant body and this frame is electrically connected, and is separated by a preset distance and forms respectively this second resonant cavity with another side of this frame.
6. three-dimensional filter according to claim 5 is characterized in that, a wherein side of this frame is provided with this two opening simultaneously.
7. three-dimensional filter according to claim 5 is characterized in that, wherein two relative sides of this frame are parallel to each other with these a plurality of resonant bodies and are respectively equipped with this two opening.
8. according to claim 2 or 5 described three-dimensional filters, it is characterized in that this input end and this output end are extended towards this two opening respectively in the opposite direction by two these resonant bodies.
9. three-dimensional filter according to claim 5 is characterized in that, respectively this first resonant cavity is Openworks shape, and respectively formed the second resonant cavity has this local insulation board between two relative sides of the end of this resonant body and this frame.
10. three-dimensional filter according to claim 9 is characterized in that, in addition parallel these a plurality of resonant bodies of two relative sides of this frame and and outermost two these resonant bodies between form respectively second resonant cavity that is Openworks shape.
11. three-dimensional filter according to claim 1 is characterized in that, this input end and output section are positioned at the same face of this frame, and the another side of this frame is continuously extension along the periphery of insulation board.
12. three-dimensional filter according to claim 1 is characterized in that, this insulation board is made with glass fibre or ceramic material, and respectively this metal level and this a plurality of perforations are made with identical conductive material.
13. three-dimensional filter according to claim 12 is characterized in that, this insulation board is that the compound glass fiber board is made, and respectively this metal level and this a plurality of perforations are made with the material of copper or copper alloy.
14. the manufacture method of a three-dimensional filter is characterized in that, includes the following step:
A) provide an insulation board;
B) on top, the two sides, the end of this insulation board one metal level is set respectively;
C) remove the part metals layer, to form a plurality of resonance patterns in this metal level respectively and to be looped around a frame pattern around these a plurality of resonance patterns, and the resonance pattern of this two metal level is identical, have two openings on arbitrary or wantonly two these frame patterns, two this resonance patterns adjacent with this two opening extend an input end and an output end towards this two opening respectively;
D) in the machining mode to respectively this resonance pattern and frame pattern form a plurality of perforation that run through this insulation board; And
E) form a plurality of perforations of tool conductivity on the hole wall of these a plurality of perforation, make respectively this resonance pattern and the corresponding perforation that arranges thereof form a resonant body, this two frame pattern and the corresponding perforation that arranges thereof form a frame.
15. the manufacture method of three-dimensional filter according to claim 14, it is characterized in that, at step c) in, these a plurality of resonance patterns are the array-like setting and have 2 first adjacent resonant bodies and 2 second adjacent resonant bodies, and this input end and this output end are extended towards this two opening respectively by two adjacent the first resonant body and the second resonant bodies wherein.
16. the manufacture method of three-dimensional filter according to claim 15, it is characterized in that, in steps d) in or at step e) afterwards, remove again the SI semi-insulation plate, so that be Openworks shape between this 2 first resonant body and this 2 second resonant body, and respectively between this first resonant body and this frame and respectively remain with the insulation board of part between this second resonant body and this frame.
17. the manufacture method of three-dimensional filter according to claim 15, it is characterized in that, in steps d) in or at step e) afterwards, remove again the SI semi-insulation plate, so that remain with local insulation board between this 2 first resonant body and this 2 second resonant body, and respectively reach between a side and this frame of this first resonant body between a side of this second resonant body respectively and this frame and be Openworks shape.
18. the manufacture method of three-dimensional filter according to claim 14, it is characterized in that, at step c) in, these a plurality of resonance patterns are parallel to each other side by side, in steps d) in or at step e) afterwards, remove the SI semi-insulation plate in the machining mode again, so that be Openworks shape between adjacent two these resonant bodies.
19. the manufacture method of three-dimensional filter according to claim 18, it is characterized in that, in steps d) in or at step e) the SI semi-insulation plate removed afterwards also is Openworks shape so that outermost two these resonant bodies have respectively between a side and this frame.
20. the manufacture method of three-dimensional filter according to claim 14 is characterized in that, at step c) in, these a plurality of resonance patterns are parallel to each other side by side, and should input end and the bearing of trend of output end parallel or vertical these a plurality of resonance patterns simultaneously.
21. the three-dimensional filter of three-dimensional filter according to claim 14 is characterized in that, at step c) in, this two opening is positioned on same this frame pattern, and another this frame pattern is continuously extension along the periphery of insulation board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103023552A CN103035987A (en) | 2011-09-28 | 2011-09-28 | Vertical filter and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103023552A CN103035987A (en) | 2011-09-28 | 2011-09-28 | Vertical filter and manufacture method thereof |
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| CN103035987A true CN103035987A (en) | 2013-04-10 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06125201A (en) * | 1992-10-12 | 1994-05-06 | Sanyo Electric Co Ltd | Strip line filter |
| CN1363125A (en) * | 1999-06-15 | 2002-08-07 | Cts公司 | Ablative method for forming RF ceramic block filters |
| CN2881985Y (en) * | 2006-01-20 | 2007-03-21 | 百一电子股份有限公司 | LNB high frequency filter |
| CN101420056A (en) * | 2007-10-24 | 2009-04-29 | 华为技术有限公司 | Microstrip linear filter, duplexer and radio-frequency device |
-
2011
- 2011-09-28 CN CN2011103023552A patent/CN103035987A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06125201A (en) * | 1992-10-12 | 1994-05-06 | Sanyo Electric Co Ltd | Strip line filter |
| CN1363125A (en) * | 1999-06-15 | 2002-08-07 | Cts公司 | Ablative method for forming RF ceramic block filters |
| CN2881985Y (en) * | 2006-01-20 | 2007-03-21 | 百一电子股份有限公司 | LNB high frequency filter |
| CN101420056A (en) * | 2007-10-24 | 2009-04-29 | 华为技术有限公司 | Microstrip linear filter, duplexer and radio-frequency device |
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Application publication date: 20130410 |