CN103014678A

CN103014678A - Silicon film plating by using unique transmission mechanism sheet transmission technology

Info

Publication number: CN103014678A
Application number: CN201110279821XA
Authority: CN
Inventors: 戴嘉男; 刘幼海; 刘吉人
Original assignee: Jifu New Energy Technology Shanghai Co Ltd
Current assignee: Jifu New Energy Technology Shanghai Co Ltd
Priority date: 2011-09-20
Filing date: 2011-09-20
Publication date: 2013-04-03

Abstract

The present invention relates to silicon film plating by using a unique transmission mechanism sheet transmission technology. The system mainly comprises an inlet end, a transmission mechanism, a vacuum pumping chamber, a P.I.N-type process chamber, and an outlet end, wherein each chamber has a transmission wheel shaft and a vacuum Pump, and a heating device, a Showerhead airflow hole and a RF electrode are arranged inside the process chamber. According to the present invention, a transmission mechanism transmission sheet is arranged on the inlet end and the outlet end; the main body is a platform; and the transmission mechanism transmission sheet is provided with a linear motor and shoe. With the present invention, the linear motor and the shoe are adopted to drive the platform to act, sheet taking of glasses on a trolley can be performed by the platform according to a certain sequence, the platform moves into the trolley through rollers on the platform, the platform performs lifting operation, the glasses are lifted and placed on the platform, then the platform returns to the transmission mechanism, the glasses are transmitted to the vacuum pumping chamber by using the rollers through the platform, then vacuum pumping and a P.I.N-type process are performed, and actions are completed in an opposite direction after completing the process, such that film plating integrity can be increased, dirt and damage on the glass are not easily generated, and solar silicon film efficiency can be improved.

Description

Unique transmission rig passes chip technology and carries out the silicon film plated film

Affiliated technical field

Present method is the biography chip technology with the technological core PECVD in the thin film solar, when TCO glass is positioned on the chassis, can begin to utilize transmission rig to pass sheet, glass can be passed in the PECVD cavity from chassis, and transmission rig need to pass through special design, it wants to enter into chassis inside, the characteristic that also will can do lifting and move forward and backward, so just TCO glass can be passed to inlet end smoothly, and can enter into that inside cavity vacuumizes and processing procedure, also need see through such transmission rig after finishing, be passed to smoothly the glass behind the plated film in the chassis, such design is not except needing a dead lift glass to cause the fragmentation, also can remove the face of TCO glass own and may be subject to human factor or environmental factors and cause face dirty and cause the incomplete situation of plated film, so design can improve the stability of solar power silicon film and the integrity of plated film.

Background technology

At present; industry is for existing many research in the thin-film solar cells; special design is also arranged when making core PECVD; mainly be horizontal and vertical type is main; in the middle of in the industry cycle with the normal board module that uses of academia; in the majority with horizontal design; and in the middle of horizontal design; the problem that more often runs into then is that glass passes the sheet problem; horizontal in the industry at present all is to use Robot to pass sheet; but the cost of Robot own is high; and often have the problem that causes glass fragmentation or Robot to injure personnel at the biography sheet; so that dangerous raising when plated film; another kind of mode then is to pass sheet with manpower; but manpower biography sheet often can cause the glass face to be subject to personnel's touch and dirty situation is arranged; its face has obvious impression of the hand in the time of can causing plated film; and outward appearance is not attractive in appearance yet; therefore the present invention mainly designs one group of transmission rig; allow glass from chassis to the process that enters the PECVD cavity; do not need personnel to touch; do not need the generation of the dangerous property of picture Robot transmission yet; it mainly is that the design transmission rig is vertical framework always; one platform is arranged in its framework; its platform can see through the action that linear motor and transmission shaft are done lifting and front and back; then be provided with many group rollers on the platform; its roller also has elevating function; its action enters into chassis inside for platform is utilized lifting and moves forward and backward; with rear roller rising contact glass; be moved out on the platform glass is complete with rear roller; drop on the platform with rear roller; do lifting by platform again and the mode that moves forward and backward is passed to glass and vacuumizes cavity; namely finish and pass the sheet action; and can carry out subsequently the actions such as film-plating process; this mode is except avoiding glass Robot passes the danger of sheet; also can avoid face to be subject to personnel and touch dirty possibility, stability and the integrity of whole plated film can be provided.

Summary of the invention

Main purpose of the present invention is that unique transmission rig biography chip technology carries out the silicon film plated film.Its system mainly comprises inlet end, inlet end transmission rig, vacuumizes the chamber, P.I.N N-type semiconductorN processing procedure chamber, exit end.In each cavity, be provided with power axle and vacuum Pump, and heating unit, Showerhead airflow hole and RF electrode are then arranged in the processing procedure chamber, to carry out processing procedure.And transmission rig of the present invention passes sheet, then be arranged on inlet end and exit end place, its main body is a platform, pass sheet at transmission rig and be provided with linear motor and shoe, can allow platform can do to rise and decline work, also be provided with in addition roller bearing on platform, this roller bearing can be got sheet from chassis with glass and out is positioned on the platform.Therefore its invention is to utilize linear motor and shoe to do to rise and down maneuver on platform, this invention can allow platform get sheet to the glass on the chassis according to order, and can not cause platform to bump against the possibility of glass, then the roller on the platform can move to platform on the chassis, then make platform make lifting action, with glass jack-up, and be placed on the platform, then platform can be back on the transmission rig, platform rises to the appropriate location and can glass be passed to the roller mode and vacuumize in the chamber, vacuumize subsequently and carry out P.I.N N-type semiconductorN processing procedure, after finishing processing procedure, its glass can recycle roller and pass to exit end and be positioned on the platform, and then platform utilizes crawler lifting equally, drops to and glass can be moved on to the chassis position, roller bearing extend out to chassis inside with platform subsequently, and glass is positioned on the chassis, return on the transmission rig with rear platform, namely finish this action.So can improve rete plated film integrity degree, and be difficult for allowing glass be subject to dirty and damage, can improve solar power silicon film efficient.

Description of drawings

The below is that the present invention is further described in conjunction with the accompanying drawings and embodiments: Fig. 1 is the present invention's motion flow synoptic diagram, Fig. 2 is that the present invention's transmission rig passes sheet and inlet end synoptic diagram, Fig. 3 be the present invention vacuumize the cavity synoptic diagram, Fig. 4 is the present invention's P.I.N N-type semiconductorN thin film manufacture process chamber synoptic diagram, Fig. 5 is the present invention's cooling vacuum breaker chamber synoptic diagram, Fig. 6 is that the present invention's transmission rig passes sheet and exit end synoptic diagram, main element nomenclature: 1 ... chassis 2 ... glass 3 ... inlet end and exit end 4 ... linear motor 5 ... shoe 6 ... power axle 7 ... roller 8 ... Slit valve9 ... Sensor10 ... Pump11 bleeds ... Showerhead12 ... airflow hole 13 ... RF power supply14 ... the electricity slurry.

Embodiment

Hereby the present invention is cooperated accompanying drawing, shown in being described in detail as follows: see also the first figure, for passing chip technology, the unique transmission rig of the present invention carries out the silicon film plated film, by among the figure as can be known, TCO is positioned over first in the chassis, transmission rig biography sheet drops to first and can transmit glass position subsequently, subsequently glass is sent on the platform, passing sheet by transmission rig again rises in the inlet end, reached by inlet end again and vacuumize the chamber, and carry out P.I.N manufacture of semiconductor chamber, and arriving again in the vacuum breaker chamber after finishing processing procedure, its transmission rig passes sector-meeting and drops to and can place position in the chassis in the exit end position after finishing, driven on the chassis by roller again, namely finish this motion flow.

See also the second figure, this carries out the silicon film plated film for the unique transmission rig of the present invention passes chip technology, by learning among the figure, can carry the TCO glass 2 of wanting plated film on its chassis 1, the subsequently biography of the piece sending mechanism above the inlet end 3 sector-meeting begins to rotate its linear motor 4, and can drive shoe 5 and platform is begun to drop to enter the position that chassis is got glass, its power axle 6 can begin the platform translation is entered into chassis inside subsequently, subsequently chassis rising makes its roller 7 can push up glass, and be positioned on the platform glass is smooth, power axle moves to inlet end with platform subsequently, risen to enter by shoe again and vacuumize the position, chamber, its Slit valve 8 opens subsequently, glass can be passed to and vacuumize inside cavity.

See also the 3rd figure, this carries out the silicon film plated film for unique transmission rig passes chip technology, by learning among the figure, after Slit valve 8 opened, its glass 2 was passed to by roller 7 and vacuumizes the chamber, proofreaies and correct the location by sensor 9 subsequently, and close Slit valve, can be begun to vacuumize by Pump 10, when vacuum values reached base pressure, its glass can be passed in the P.I.N N-type semiconductorN processing procedure chamber and carry out plated film.

See also the 4th figure, this carries out the silicon film plated film for unique transmission rig passes chip technology, by learning among the figure, when Slit valve 8 unlatchings are passed to processing procedure chamber in by roller 7 TCO glass 2, can locate first, gas can be passed in the Showerhead 11 from airflow hole 12 subsequently, and can be diffused into whole cavity, carry out pressure control by computer interface, after pressure-stabilisation, then opened by RF power supply 13 and carry out processing procedure, after processing procedure finished, its glass was opened by Slit valve 8 and is passed in the vacuum breaker chamber.

See also the 5th figure, this carries out the silicon film plated film for using unique transmission rig to pass chip technology, by learning among the figure, glass can after Slit valve 8 open, be passed in the vacuum breaker chamber by the processing procedure chamber, and can be positioned by Sensor 9 behind the plated film, vacuum breaker is to atmosphere subsequently, and finishes this processing procedure.

See also the 6th figure, this carries out the silicon film plated film for using unique transmission rig to pass chip technology, by learning among the figure, when the glass 2 behind the plated film can be sent on the platform of exit end 3 by roller 7, dropped to by linear motor 4 and shoe 5 with rear platform and glass can be put into chassis 1 position, 6 of power axles are sent to chassis inside with platform subsequently, and press down placing glass, again platform is retracted subsequently and deliver to exit end, and complete this processing procedure, this invention can keep the integrity of full wafer glass coating on transmission rig, make it not be subject to outside pollution effect, and can promote yield and solar power silicon hull cell efficient.

More than explanation is just illustrative, nonrestrictive for the purpose of the present invention; those of ordinary skills understand; in the situation that does not break away from the spirit and scope that claim limits, can make many corrections, variation or equivalence, but all will fall within protection scope of the present invention.

Claims

1. a unique transmission rig biography chip technology carries out the silicon film plated film, its system mainly comprises inlet end, inlet end transmission rig, vacuumizes the chamber, P.I.N N-type semiconductorN processing procedure chamber, exit end, in each cavity, be provided with power axle and vacuum Pump, and heating unit, Showerhead airflow hole and RF electrode are then arranged, to carry out processing procedure in the processing procedure chamber; And transmission rig of the present invention passes sheet, then be arranged on inlet end and exit end place, its main body is a platform, pass sheet at transmission rig and be provided with linear motor and shoe, can allow platform can do to rise and decline work, also be provided with in addition roller bearing on platform, this roller bearing can be got sheet from chassis with glass and out is positioned on the platform; Therefore its invention is to utilize linear motor and shoe to do to rise and down maneuver on platform, this invention can allow platform get sheet to the glass on the chassis according to order, and can not cause platform to bump against the possibility of glass, then the roller on the platform can move to platform on the chassis, then make platform make lifting action, with glass jack-up, and be placed on the platform, then platform can be back on the transmission rig, platform rises to the appropriate location and can glass be passed to the roller mode and vacuumize in the chamber, vacuumize subsequently and carry out P.I.N N-type semiconductorN processing procedure, after finishing processing procedure, its glass can recycle roller and pass to exit end and be positioned on the platform, and then platform utilizes crawler lifting equally, drops to and glass can be moved on to the chassis position, roller bearing extend out to chassis inside with platform subsequently, and glass is positioned on the chassis, return on the transmission rig with rear platform, namely finish this action; So can improve rete plated film integrity degree, and be difficult for allowing glass be subject to dirty and damage, can improve solar power silicon film efficient.

2. a kind of unique transmission rig biography chip technology according to claim 1 carries out the silicon film plated film, wherein its transmission rig biography sheet can be under the transmission of linear motor and shoe, platform is done the action of rise and fall, and it is dirty to avoid the glass face to be subject to that this can allow glass do rise and fall in the situation that does not need a dead lift.

3. a kind of unique transmission rig biography chip technology according to claim 1 carries out the silicon film plated film, wherein set up power axle on the platform, this power axle can be made translation motion with platform, platform can be moved to the inner action of getting sheet or film releasing of chassis, this design can allow glass deliver to stably in the chassis, does not have damaged possibility and occurs.

4. unique transmission rig biography chip technology according to claim 1 carries out the silicon film plated film, its heating and vacuum breaker cavity all are provided with the Sensor positioning correcting, can allow glass proofread and correct first the location, can not be subject to the switch of Slit valve and cause having the possibility of pushing glass, and cavity all is provided with the switch of vacuum Pump and Vent, the situation of its cavity be can observe by computer interface, can vacuumizing of glass and vacuum breaker action be done according to on-the-spot actual state.

5. the unique transmission rig biography of use according to claim 1 chip technology carries out the silicon film plated film, its processing procedure P.I.N N-type semiconductorN, equally also there is Sensor to position correction, and its gas can be taken advantage of a situation and lower shunts to Showerhead from airflow hole, when reaching processing procedure pressure in the cavity, its RF can open and carry out plated film, passing sheet to exit end behind its plated film makes transmission rig and passes the sheet action and finished processing procedure again, can not cause glass to have fragmentation or the impaired possibility of face to occur, to improve overall process integrity and yield.