Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.The element described in an accompanying drawing of the present invention or a kind of embodiment and feature can combine with the element shown in one or more other accompanying drawing or embodiment and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of unrelated to the invention, parts known to persons of ordinary skill in the art and process in illustrating.Based on the embodiment in the present invention, those of ordinary skill in the art, not paying the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Numerical portion such as the logic control end that the isolated data acquisition that the embodiment of the present invention provides is stuck in signal introduces electrical isolation module, measuring system side is treated and electrical isolation is carried out in host computer (as main frame) side by electrical isolation module, not only avoid the interference such as the common mode voltage introducing measured system, and avoid the loss of signal caused is isolated to simulating signal, cost is also lower simultaneously.
For ease of describing, in the embodiment of the present invention: be called " from Logic control module " by the Logic control module near system side to be measured in isolated data collecting card, and be called " main logic control module " near the Logic control module of upper pusher side; Be called " the first data " by from system lateral host computer side to be measured to the information such as data, instruction of transmission, and be called from host computer side to the information such as data, instruction to system side direction to be measured transmission " the second data ".It should be noted that the differentiation name that above-mentioned title is only convenient to describe and is carried out should not be construed as the restriction to embodiment of the present invention technical scheme essence.
The structural representation of the isolated data collecting card that Fig. 1 provides for the embodiment of the present invention one.As shown in Figure 1, isolated data collecting card comprises: data acquisition module 11, from Logic control module 12, main logic control module 13, electrical isolation module 14 and bus bridge module 15.
Data acquisition module 11 carries out data acquisition and/or output for treating measuring system.Such as: data acquisition module can carry out digital signal acquiring and/or output, or carry out collection of simulant signal and convert simulating signal to digital signal being input to from Logic control module etc.
Be connected from Logic control module 12 with data acquisition module 11, for carrying out logic control to data acquisition module.Main logic control module 13 is for communicating with from Logic control module and host computer bus.Electrical isolation module 14 is arranged at and connects between Logic control module 12 and main logic control module 13, for carrying out electrical isolation, opens as carried out electrical isolation between system side to be measured and host computer side.Main logic control module 13 is also connected with bus bridge module 15, and bus bridge module 15 is for realizing the communication between main logic control module 13 and host computer bus.Such as: can carry out data acquisition module from Logic control module but be not limited to following logic control: acquisition logic control, data-out logic control etc.; Or, coordinate main logic control module to carry out data acquisition module from Logic control module but be not limited to above-mentioned logic control.Main logic control module and transmitting through electrical isolation module from the data between Logic control module, main logic control module receives through electrical isolation module the first Data Concurrent exported from Logic control module and delivers to host computer bus and the second data received through host computer bus sent to from Logic control module through electrical isolation module.
In the isolated data collecting card that the present embodiment provides, be digital signal from the data transmitted between Logic control module and main logic control module, electrical isolation module installation is arranged at the numerical portion of signal in the part of data collecting card transmission of digital signals and signal isolation link, not only avoid the interference such as the common mode voltage introducing measured system, and avoid the loss of signal caused is isolated to simulating signal, achieve the isolated collection of data at lower cost.
The structural representation of the isolated data collecting card that Fig. 2 provides for the embodiment of the present invention two.As shown in Figure 2, the present embodiment is on the basis of above-described embodiment technical scheme, for meeting diversified measurement demand, optionally, data acquisition module can include but not limited to following one or more: digital I/O (DigitalInput/Output, be called for short DIO) module 111, digital-to-analog conversion (Digital-to-AnalogConverter, be called for short DAC) module 112, analog to digital conversion (AnalogtoDigitalConverter is called for short ADC) module 113.In following optional implementation, for improving the convenience measured: digital input/output module can comprise multichannel (as 16 tunnels etc.) digital input channel and multichannel (as 16 tunnels etc.) digital output channel; And/or D/A converter module can comprise multichannel (as 4 tunnels) synchronously simulating output channel; And/or the figure place of described analog-to-digital conversion module is 24 bits, sampling rate is 400 ten thousand samplings per second, to meet the data acquisition demand of high speed magnanimity, realizes high speed, high-precision data acquisition.
Such as, in the optional implementation of one: digital input/output module 111 can be configured to 16 to enter/16 go out or 8 to enter/8 to go out, numeral input can compatible 5V and 3.3VTTL(Transistor-TransistorLogic) level, numeral output level is 5VTTL level, maximum rate is 5MHz, and single channel current driving force is 50mA; And/or, D/A converter module 112 can comprise 4 road synchronously simulating output channels, figure place is 16bit(bit), refresh rate is 250KSPS(per second thousand samplings to the maximum), output range is ± 10V, single channel current driving force is 30mA, and maximum output current is 50mA, can the small-sized adaptive polarizing memory voltage time constant of Direct driver.
Optionally, analog-to-digital conversion module has multichannel (as 16 tunnels etc.) simulating signal input channel, analog-to-digital conversion module 113 can comprise input selection unit 1131, programmable gain amplifier (ProgrammableGainAmplifier is called for short PGA) unit 1132 and AD conversion unit 1133.Input selection unit 1131 is for carrying out gating control to multichannel analog signals input channel, programmable gain amplifier unit 1132 is for amplifying the simulating signal inputted by described analog signal input channel, and AD conversion unit 1133 exports for the simulating signal after amplification is converted to digital signal.Design like this can improve the convenience of data acquisition.Optionally, also can set up digital input/output module, communication connection successively between D/A converter module and analog-to-digital conversion module (as input selection module), three's communication connection to set up mode unrestricted, such as can adopt but be not limited to the modes such as aerial lug and set up between above-mentioned three communication connection successively, design like this by above-mentioned digital input/output module and/or D/A converter module to host computer side input signal, this signal can be used as but is not limited to data collecting card self calibration test signal and uses, which thereby enhance the dirigibility of data collecting card application.In technique scheme, the specific implementation of electrical isolation is unrestricted.For the ease of realizing isolated from power and the signal isolation of system side to be measured and host computer side, optionally, electrical isolation module 14 comprises: power isolation module 141 and signal isolation module 142.Power isolation module 141 is connected respectively with from Logic control module and main logic control module, for carrying out isolated from power, as carrying out isolated from power between system side to be measured and host computer side.Signal isolation module 142 is connected, for carrying out signal isolation from Logic control module and described main logic control module with described respectively, as for carrying out signal isolation between system side to be measured and host computer side, to avoid introducing as interference such as the common mode voltages of system to be measured.The mode of above-mentioned signal isolation can based on but the means such as Magnetic isolation, light-coupled isolation, Phototube Coupling that are not limited to carry out, such as: signal isolation module can be but is not limited to: isolating chip, Magnetic isolation device, optical coupling isolator or photoisolator.
Optionally, above-mentioned can based on field-programmable logic gate array (Field-ProgrammableGateArray from Logic control module and main logic control module, FPGA) realize, as can be from FPGA module from Logic control module, main logic control module can be main FPGA module, reduces the cost that logic control realizes thus.
Optionally, described bus bridge module can be but is not limited to Peripheral Component Interconnect standard (PeripheralComponentInterconnect, be called for short PCI) bridge chip, host computer bus can be but is not limited to interconnection bus of peripheral devices and expands (PCIextensionforinstrument in the function of instrument field, be called for short PXI) bus, to realize the communication between isolated data collecting card and PXI main frame, meet the application demand of the industrial tests such as Aeronautics and Astronautics.
The structural representation of the isolated data collecting card that Fig. 3 provides for the embodiment of the present invention three.As shown in Figure 3, in the isolated data collecting card that the present embodiment provides, comprise from data encapsulation module 121 from Logic control module 12, main logic control module 13 comprises master data decapsulation module 131.Be connected with data acquisition module 11 and electrical isolation module 14 respectively from data encapsulation module 121, the first data for gathering data acquisition module 11 encapsulate and are transferred to main logic control module 13 through electrical isolation module 14, as being transferred to master data decapsulation module 131.Master data decapsulation module 131 is connected with electrical isolation module 14 and bus bridge module 15 respectively, for carrying out decapsulation process to the first data received through electrical isolation module 14 and sending to host computer bus through bus bridge module 15.
The present embodiment is introducing data encapsulation (or being called that data are packed) mechanism from the process transmitting the first data between Logic control module and main logic control module, namely by carrying out encapsulation process from data encapsulation module to the first data, master data decapsulation module carries out decapsulation process to the first data through electrical isolation module transfer, to improve between main logic control module through the convenience of electrical isolation module transfer first data and to reduce the error probability through electrical isolation module transfer first data.
Optionally, in each isolated data collecting card that technique scheme provides, can comprise from data decapsulation module 122 from Logic control module 12, main logic control module 13 can comprise master data package module 132.Be connected from data decapsulation module 122 with electrical isolation module 14, for carrying out decapsulation process to the second data received through electrical isolation module 14 and exporting to system side to be measured (as data acquisition module 11 etc.).Master data package module 132 is connected with bus bridge module 15 and electrical isolation module 14 respectively, for carrying out encapsulation process to the second data received through bus bridge module 15 and sending to from Logic control module (as sending to from data decapsulation module 122) through electrical isolation module 14.Design like this, data encapsulation (or being called that data are packed) mechanism can be introduced in main logic control module with from transmitting the process of the second data between Logic control module, namely by master data package module, the second data are carried out to encapsulation process, carried out decapsulation process from data decapsulation module to the second data through electrical isolation module transfer, to improve between principal and subordinate's Logic control module through the convenience of electrical isolation module transfer second data and to reduce the error probability through electrical isolation module transfer second data.
On the basis of technique scheme, optionally, main logic control module 13 also can comprise: the first memory controller 133 and first memory 134.First memory controller 133 is connected with master data decapsulation module 131, first memory 134 and bus bridge module 15 respectively, the first data for master data decapsulation module is exported be stored to first memory and by first memory store the first data through bus bridge module gradation Batch sending to host computer bus.First memory can be but is not limited to synchronous DRAM (SynchronousDynamicRandomAccessMemory, be called for short SDRAM).A kind of optional working method is such as: the first data are stored to first memory by the first memory controller, and monitor the current data storage condition of first memory, reach default storage depth (or data-quantity threshold) in the data volume of the current storage of first memory, then the batch data of current for first memory storage is sent to host computer bus through bus bridge module by the first memory controller.Design like this, that can avoid in the process of storage first data between first memory and bus bridge module is frequent mutual, is conducive to raising first data rate memory.
Optionally, main logic control module 13 also can comprise: the second memory controller 135 and second memory 136.Second memory controller 135 is connected with master data package module 132, second memory 136 and bus bridge module 15 respectively, for the receive through bus bridge module 15 second data are stored to second memory 136 and the second data gradation Batch sending that second memory 136 is stored to master data package module 132.Second memory can be but is not limited to SDRAM.A kind of optional working method is such as: the second data are stored to second memory by the second memory controller, and monitor the current data storage condition of second memory, reach default storage depth (or data-quantity threshold) in the data volume of the current storage of second memory, then the second batch data of current for second memory storage is sent to master data package module by the second memory controller.Design like this, that can avoid in the process of storage second data between second memory and master data package module is frequent mutual, is conducive to raising second data rate memory.
Optionally, main logic control module also can comprise: the first buffer 137 be connected with the first memory controller 133.The first data that first buffer 137 exports for buffer memory master data decapsulation module 122 under the control of the first memory controller and by the first data of the first buffer 137 buffer memory through the first memory controller 133 gradation Batch sending to first memory 134.A kind of optional working method is such as: the first memory controller is by the first data buffer storage to the first buffer, and monitor the current data storage condition of the first buffer, reach default storage depth (or data-quantity threshold) in the data volume of the current storage of the first buffer, then the batch data of the current storage of the first buffer is sent to first memory by the first memory controller.Design like this, that can avoid in the process of storage first data between the first memory controller and first memory and between first memory and bus bridge module is frequent mutual, is conducive to improving the first data rate memory further.
Optionally, main logic control module also can comprise: the second buffer 138 be connected with the second memory controller 135.The second data that second buffer 138 receives from bus bridge module 15 for buffer memory under the control of the second memory controller 135 and by the second data of the second buffer 138 buffer memory through the second memory controller gradation Batch sending to from Logic control module.A kind of optional working method is such as: the second memory controller is by the second data buffer storage to the second buffer, and monitor the current data storage condition of the second buffer, reach default storage depth (or data-quantity threshold) in the data volume of the current storage of the second buffer, then the batch data of the current storage of the second buffer is sent to second memory by the second memory controller.Design like this, that can avoid in the process of storage second data between the second memory controller and second memory and between second memory and bus bridge module is frequent mutual, is conducive to improving the second data rate memory further.
Be appreciated that in technique scheme, the first memory controller and the second memory controller or, first memory and second memory, or the module such as the first buffer and the second buffer, can be arranged separately or integrated setting according to actual needs.The implementation that embodiment of the present invention word and accompanying drawing thereof provide is only schematic description, should not be construed as the restriction to technical solution of the present invention essence.
State in each embodiment on the invention, the sequence number of embodiment is only convenient to describe, and does not represent the quality of embodiment.The description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiments.
One of ordinary skill in the art will appreciate that: all or part of step realizing said method embodiment can have been come by the hardware that programmed instruction is relevant, aforesaid program can be stored in a computer read/write memory medium, this program, when performing, performs the step comprising said method embodiment; And aforesaid storage medium comprises: ROM (read-only memory) (Read-OnlyMemory, be called for short ROM), random access memory (RandomAccessMemory is called for short RAM), magnetic disc or CD etc. various can be program code stored medium.
In the embodiments such as apparatus and method of the present invention, obviously, each parts or each step reconfigure after can decomposing, combine and/or decomposing.These decompose and/or reconfigure and should be considered as equivalents of the present invention.Simultaneously, above in the description of the specific embodiment of the invention, the feature described for a kind of embodiment and/or illustrate can use in one or more other embodiment in same or similar mode, combined with the feature in other embodiment, or substitute the feature in other embodiment.
Should emphasize, term " comprises/comprises " existence referring to feature, key element, step or assembly when using herein, but does not get rid of the existence or additional of one or more further feature, key element, step or assembly.
Although last it is noted that described the present invention and advantage thereof in detail above, be to be understood that and can carry out various change when not exceeding the spirit and scope of the present invention limited by appended claim, substituting and converting.And scope of the present invention is not limited only to the specific embodiment of process, equipment, means, method and step described by instructions.One of ordinary skilled in the art will readily appreciate that from disclosure of the present invention, can use perform the function substantially identical with corresponding embodiment described herein or obtain and its substantially identical result, existing and that will be developed in the future process, equipment, means, method or step according to the present invention.Therefore, appended claim is intended to comprise such process, equipment, means, method or step in their scope.