CN102982744A - Display module of LED (light emitting diode) - Google Patents

Abstract

The embodiment of the invention discloses a display module of an LED (light emitting diode), which is used for realizing seamless splicing of LED display screens. The display module provided by the embodiment of the invention comprises a circuit board formed by multiple layers of circuit boards, LED chips and IC (integrated circuit) plate chips, wherein the circuit board comprises an LED chip plate distribution region, a flexible printed circuit board bending region and an IC plate distribution region, wherein the length of the LED chip plate distribution region is an integral multiple of the distance of an LED dot matrix; two branches are formed at one end of the LED chip plate distribution plate region by the circuit board; one branch horizontally extends to a tail end; the other branch extends downwards into the flexible printed circuit board bending region; and the flexible printed circuit board bending region is completely covered by the LED chip plate distribution region, so that the flexible printed circuit board bending region is hidden below the LED chip plate distribution region.

Description

A light-emitting diode LED display module

technical field

The invention relates to the technical field of light emitting diode (LED, Light Emitting Diode) display, in particular to a light emitting diode (LED) display module.

Background technique

In recent years, with the rapid development of LED display technology, LED display screens have gradually entered indoors from the outdoors. The display dot matrix density is getting higher and higher, the dot pitch is getting smaller and smaller, and the display resolution is getting higher and higher. Indicates that the system initiates a challenge.

Generally speaking, a large LED display screen is usually composed of multiple small display modules. According to different manufacturing processes and materials, LED modules are divided into various types. Among them, the LED module (also known as flexible LED display module) combined with the flexible circuit board (FPC, Flexible Printed Circuit) has the characteristics of small size, thin thickness, light weight, flexibility, and bendability. (PCB, Printed Circuit Board) compared with hard board modules, flexible LED display modules have higher wiring density, especially suitable for high-density dot matrix LED display screens. At present, an existing LED display module structure (take the flexible LED display module structure as an example) can be shown in Figure 1a, including LED chip layout area A, bending area B, integrated circuit board (IC, Integrated Circuit) forbidden area C, IC layout area D. When the flexible circuit board is unfolded, each area is sequentially arranged along the horizontal direction, as shown in Figure 1b, the bending area B is located between the LED chip layout area A and the IC forbidden area C. However, when two flexible LED display modules are spliced, the bending area B will exist between adjacent splicing modules, and the bending radius of the flexible circuit board (generally 3-10 times the board thickness, about 0.5-2 mm) will become the splicing gap between the two modules. When the pixel pitch of the LED display screen is 3 mm or less, the splicing gap cannot be ignored and visually forms a lack of image display, thereby affecting the final display effect.

Contents of the invention

An embodiment of the present invention provides a light-emitting diode (LED) display module, which is used to realize seamless splicing of LED display screens.

In view of this, the present invention provides a light-emitting diode LED display module on the one hand, which may include a circuit board, an LED chip, and an integrated circuit board IC chip, wherein:

The circuit board is a multilayer circuit board, and the circuit board includes an LED chip layout area, a soft board bending area and an IC layout area, wherein the length of the LED chip layout area is an integer of the LED dot matrix pitch times;

The circuit board forms a branch at one end of the LED chip layout area, one of which extends horizontally to the end, and the other branch extends downwards to become the bending area of the flexible board, and the LED chip layout area completely covers the The bending area of the flexible board is such that the bending area of the flexible board is hidden under the layout area of the LED chip.

In a first possible implementation manner, the circuit board is a flexible circuit board FPC or a rigid-flex board combined with a printed circuit board PCB, wherein the circuit board on the LED chip layout area is an FPC or the printed circuit board PCB. For the rigid-flexible board, the circuit board on the bending area of the flexible board is FPC, and the circuit board on the IC layout area is FPC or the rigid-flexible board.

In a second possible implementation manner, the LED chip is disposed in the LED chip layout area and electrically connected to the circuit board; the IC chip is disposed in the IC layout area and connected to the circuit board Electrical connections.

In combination with the first aspect or the first aspect or the second possible implementation manner of the first aspect, in the third possible implementation manner, the circuit board is 1- Branches arranged in a Y shape are formed at 2 mm.

In combination with the first aspect or the first aspect or the second possible implementation manner of the first aspect, in the fourth possible implementation manner, the circuit board on the bending area of the flexible board is 1-2 layers FPC.

In a fifth possible implementation manner, the LED display module further includes an IC forbidden area, and the circuit board on the IC forbidden area is a multi-layer circuit board, which is located between the flexible board bending area and the between IC layout areas.

It can be seen from the above technical solutions that in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area, and one of the branches is bent downward as the bending area of the flexible board, so that the flexible board The bending area is completely hidden under the LED chip layout area. Therefore, when the LED display module is spliced, the hidden flexible board bending area is beneficial to eliminate the influence of the bending radius of the flexible board and solve the problem of splicing images. The problem of complete discontinuity, plus the fact that the length of the LED chip layout area is an integer multiple of the LED dot pitch, can realize the seamless splicing of the LED display screen and optimize the viewing effect of the screen.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that are required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

Figure 1a is a schematic structural diagram of an existing flexible LED display module;

Fig. 1b is a schematic structural diagram of a horizontally deployed existing flexible LED display module shown in Fig. 1a;

Fig. 2a is a schematic structural diagram of an LED display module provided by an embodiment of the present invention;

Fig. 2b is a schematic structural diagram of a horizontally deployed LED display module provided by an embodiment of the present invention;

Fig. 2c is a schematic splicing diagram of an LED display module provided by an embodiment of the present invention;

Fig. 2d is another splicing diagram of an LED display module provided by an embodiment of the present invention;

Fig. 3a is another structural schematic diagram of an LED display module provided by an embodiment of the present invention;

Fig. 3b is another splicing diagram of an LED display module provided by an embodiment of the present invention;

Fig. 4a is another structural schematic diagram of an LED display module provided by an embodiment of the present invention;

Fig. 4b is another splicing diagram of an LED display module provided by an embodiment of the present invention;

Fig. 5a is another structural schematic diagram of an LED display module provided by an embodiment of the present invention;

Fig. 5b is another splicing diagram of an LED display module provided by an embodiment of the present invention.

Detailed ways

An embodiment of the present invention provides a light-emitting diode (LED) display module, which is used to realize seamless splicing of LED display screens.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

An embodiment of the present invention provides a light-emitting diode LED display module, which may include a circuit board, an LED chip, and an integrated circuit board IC chip, wherein the circuit board is a multilayer circuit board, and the circuit board includes an LED chip layout area . The flexible board bending area and the IC layout area, wherein the length of the LED chip layout area is an integer multiple of the LED dot pitch; the circuit board forms a branch at one end of the LED chip layout area, one of which The branch extends horizontally to the end, and the other branch extends downwards to become the bending area of the flexible board, and the LED chip layout area completely covers the bending area of the flexible board, so that the bending area of the flexible board is hidden in the Under the LED chip layout area.

It can be understood that, in the embodiments of the present invention, a multilayer circuit board refers to a circuit board that has 3 or more circuit boards pressed together;

Wherein, the LED chip is disposed in the LED chip layout area and is electrically connected to the circuit board; the IC chip is disposed in the IC layout area and is electrically connected to the circuit board.

In some embodiments, the circuit board is a flexible circuit board FPC or a rigid-flexible board combined with a printed circuit board PCB, wherein the circuit board on the LED chip layout area is an FPC or the rigid-flexible circuit board. Combining boards, the circuit board on the bending area of the flexible board is FPC, and the circuit board on the IC layout area is FPC or the rigid-flexible board.

It can be seen from the above that in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area, and one of the branches is bent downward as the bending area of the flexible board, so that the bending area of the flexible board is completely It is hidden under the LED chip layout area. Therefore, when LED display modules are spliced, the hidden flexible board bending area is conducive to eliminating the influence of the bending radius of the flexible board and solving the problem of incomplete and discontinuous splicing images. In addition, the length of the LED chip layout area is an integer multiple of the LED dot pitch, which can realize the seamless splicing of the LED display screen and optimize the viewing effect of the screen.

The following is a detailed introduction to the provided LED display modules according to the different materials of the circuit boards in the LED display modules and the different settings of the circuit position structure in each area:

In one embodiment, refer to FIG. 2a, which is a schematic structural diagram of an LED display module provided in this embodiment, wherein the LED display module may include:

A flexible circuit board 1 (that is, the circuit board is an FPC), an LED chip 2, and an IC chip 3 . The flexible circuit board 1 includes an LED chip layout area A', a soft board bending area B', an IC forbidden area C' and an IC layout area D', and the IC forbidden area C' is located at the bending area of the flexible board. Between area B' and the IC layout area D'; wherein, the flexible circuit board 1 in the LED chip layout area A' is electrically connected to the LED chip 2, and the flexible circuit board in the IC layout area D' 1. The board body is electrically connected to components such as the IC chip 3, and no electronic components are arranged on the flexible board bending area B' and the IC forbidden area C'.

The flexible circuit board 1 is a multilayer circuit board, and the multilayer conductive layer is electrically connected through the plated through hole on the cross section of the circuit board; as shown in Figure 2a, in the flexible circuit board 1 (multilayer circuit board), The circuit boards on the flexible board bending area B' are 1-2 layers of FPC, and the circuit boards on the remaining areas (A', C', D') are all multi-layer FPCs (such as the number of layers is 3 layers or 3 layer above);

Among them, at the junction of the edge of the LED chip layout area A' and the flexible board bending area B', the flexible circuit board 1 (multilayer circuit board) forms a branch, and the 1-2 layer base board near the bottom layer is connected from the multilayer circuit board. The board is branched out as the soft board bending area B' of the flexible circuit board 1, and the branched upper multilayer board extends a short section as the end of the LED chip layout area A', so that the length of the LED chip layout area A' is just right It is an integer multiple of the LED dot pitch; it is also easy to think that the extended multilayer board branch is still electrically connected to the LED chip 2 and plays a role of supporting the LED chip 2 .

Further, at the junction of the edge of the LED chip layout area A' and the flexible board bending area B', the (flexible circuit board 1) multilayer circuit board forms a branch, which can specifically be that the multilayer circuit board is connected to the LED chip layout area One end of area A' is 1-2 mm away from the edge (that is, the junction with the flexible board bending area B') to form a Y-shaped branch, that is, the soft board bending area B' (1-2 layers of FPC) is in the The end away from the LED chip layout area A' is separated from the upper multilayer board by 1-2 mm from the edge, so that the flexible board bending area B' is hidden under the LED chip layout area A', as shown in Figure 2a ; The soft board bending area B' continues to extend to the IC forbidden area C', and the flexible circuit board 1 returns to the wiring layout of the multi-layer board, and remains until the end of the IC layout area D'.

In this embodiment, when the flexible circuit board 1 is unfolded horizontally, the bending area B' of the flexible board is located below the edge of the LED chip layout area A'. Please refer to FIG. 2b together. FIG. 2b is the LED display module shown in FIG. Schematic diagram of the group's horizontally expanded structure; when using an LED display module, the IC layout area D' is generally bent downward or backward to expose only the LED chip layout area A', as shown in Figure 2c and Figure 2d, It is a schematic diagram of the splicing of the LED display module shown in Figure 2a and Figure 2b, as shown in Figure 2c, when the LED display module is spliced, the IC layout area D' is bent down and fixed to the LED chip layout area A' On the vertical surface, it is possible to splice the bending area B' of the flexible board opposite to the bending area B' of the soft board of another LED display module. As shown in Figure 2d, the bending area B' of the flexible board can be connected to another LED display module The non-flexible board bending area of the display module is relatively spliced; as shown in Figure 2c and Figure 2d, when the LED display module is spliced, it is only necessary to ensure that the LED chip layout area A' of the splicing module shown is the LED dot matrix point Integer multiples of the distance can realize seamless splicing of LED display screens.

It can be seen from the above that, in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area A', and one of the branches is bent downward as the flexible board bending area B', so that the flexible board The bending area B' is completely hidden under the LED chip layout area A'. Therefore, when the LED display modules are spliced, the hidden flexible board bending area B' is beneficial to eliminate the problem caused by the bending radius of the flexible board. Influence, to solve the problem of incomplete and discontinuous splicing images, and the length of the LED chip layout area A' is an integer multiple of the LED dot pitch, which can realize the seamless splicing of the LED display screen and optimize the viewing effect of the screen.

In another embodiment, refer to FIG. 3a, which is a schematic structural diagram of an LED display module provided in this embodiment, wherein the LED display module may include:

A flexible circuit board 1 (that is, the circuit board is an FPC), an LED chip 2, and an IC chip 3 . The flexible circuit board 1 includes an LED chip layout area A', a soft board bending area B', an IC forbidden area C' and an IC layout area D', and the IC forbidden area C' is located at the bending area of the flexible board. Between the area B' and the IC layout area D'; wherein, the multilayer circuit board (FPC) on the LED chip layout area A' forms a Y-shaped branch at a distance of 1-2 mm from the edge, One of the branches continues to extend as the end of the LED chip layout area A', and the other branch is bent downwards as the flexible board bending area B', so that the flexible board bending area B' is hidden behind the LED chip layout area A' Down.

In this embodiment, the IC chip 3 is arranged outside the IC layout area D', as shown in Figure 3a, the flexible circuit board 1 can be fixed on the support plate 4 by U-shaped bending, and the upper surface of the support plate 4 is used for Fix and support the LED chip layout area A', the side of the support plate 4 fixes the flexible board bending area B' and the IC forbidden area C', and the bottom surface of the support plate 4 fixes the IC layout area D';

Please refer to Figure 3b together. Figure 3b is a schematic diagram of the splicing of the LED display module shown in Figure 3a, where the bending area B' of the flexible board is opposite to the bending area B' of the soft board of another LED display module. It is also easy to imagine that the bending area B' of the flexible board can be spliced relative to the non-flexible bending area of another LED display module, which is not limited here; as shown in Figure 3b, two When splicing LED display modules, as long as the LED chip layout area A' of the splicing module is an integer multiple of the LED dot pitch, the seamless splicing of the LED display screen can be realized.

It can be understood that, in the LED display module, the structural arrangement between the LED chip layout area A' and the flexible board bending area B' can be implemented with reference to the previous embodiment, and will not be repeated here.

It can be seen from the above that, in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area A', and one of the branches is bent downward as the flexible board bending area B', so that the flexible board The bending area B' is completely hidden under the LED chip layout area A'. Therefore, when the LED display modules are spliced, the hidden flexible board bending area B' is beneficial to eliminate the problem caused by the bending radius of the flexible board. Influence, to solve the problem of incomplete and discontinuous splicing images, and the length of the LED chip layout area A' is an integer multiple of the LED dot pitch, which can realize the seamless splicing of the LED display screen and optimize the viewing effect of the screen.

In another embodiment, refer to FIG. 4a, which is a schematic structural diagram of an LED display module provided in this embodiment, wherein the LED display module may include:

A circuit board, an LED chip 2 , and an IC chip 3 , wherein the circuit board includes a multilayer flexible circuit board (FPC) 1 and a hard PCB 5 . The flexible circuit board 1 includes the LED chip layout area A", the flexible board bending area B", and the PCB hard board 5 includes the IC layout area D"; wherein, the multi-layer on the LED chip layout area A" The circuit board forms a Y-shaped branch at a distance of 1-2mm from the edge, one branch continues to extend as the end of the LED chip layout area A", and the other branch is bent downward as the soft board bending area B" , so that the flexible board bending area B" is hidden under the LED chip layout area A".

In this embodiment, the LED display module adopts the combination of soft and hard boards, wherein the flexible circuit board 1 is fixed on the PCB hard board 5 by U-shaped bending, and the PCB hard board 5 is placed upside down to fix and support the back The LED chip layout area A" and the soft board bending area B" are bent along the side of the PCB hard board 5 to the PCB board interface 51 to connect with the PCB hard board 5 .

Please refer to Figure 4b together. Figure 4b is a schematic diagram of the splicing of the LED display module shown in Figure 4a, which can be performed in the bending area B" of the flexible board opposite to the bending area B" of the soft board of another LED display module. It is also easy to imagine that the bending area B" of the flexible board can also be spliced relative to the non-flexible bending area of another LED display module, which is not limited here; as shown in Figure 4b, two When splicing LED display modules, as long as the LED chip layout area A" of the splicing module is an integer multiple of the LED dot pitch, the seamless splicing of the LED display screen can be realized.

It can be understood that, in the LED display module, the structural arrangement between the LED chip layout area A" and the flexible board bending area B" can be implemented with reference to the first embodiment, and will not be repeated here.

It can be known from the above that in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area A", one of which is bent downwards as the flexible board bending area B", so that the flexible board The bending area B" is completely hidden under the LED chip layout area A". Therefore, when the LED display modules are spliced, the hidden flexible board bending area B" is conducive to eliminating the problem caused by the bending radius of the flexible board. Influence, to solve the problem of incomplete and discontinuous splicing images, and the length of the LED chip layout area A" is an integer multiple of the LED dot pitch, which can realize the seamless splicing of the LED display screen and optimize the viewing effect of the screen.

In another embodiment, refer to FIG. 5a, which is a schematic structural diagram of an LED display module provided in this embodiment, wherein the LED display module may include:

A circuit board, an LED chip 2, and an IC chip 3, wherein the circuit board is a multi-layer rigid-flexible circuit board 6 combining FPC and PCB, and the rigid-flexible circuit board 6 includes an LED chip layout area A"', FPC bending area B"', IC forbidden area C"' and IC layout area D"'. The multi-layer circuit board on the LED chip layout area A"' includes a PCB hard board 61 and an FPC soft board 62. At 1-2 mm from the edge of the LED chip layout area A"', the soft and hard boards are formed in a Y shape The set branches, in which the PCB hard board 61 branch continues to extend as the end of the LED chip layout area A"', and the FPC soft board 62 branch is bent downward as the soft board bending area B"', hidden in the LED chip layout area A'".

Please refer to Fig. 5b together. Fig. 5b is a splicing schematic diagram of the LED display module shown in Fig. 5a, which can be performed in the bending area B"' of the soft board and the bending area B" of the soft board of another LED display module. ' Relative splicing, it is also easy to imagine that the flexible board bending area B"' can also be spliced relative to the non-flexible board bending area B"' of another LED display module, which is not limited here; as shown in the figure As shown in 5b, when splicing two LED display modules, as long as the LED chip layout area A"' of the splicing modules is an integer multiple of the LED dot pitch, the seamless splicing of the LED display screen can be realized.

It can be understood that in the LED display module, the structural arrangement between the LED chip layout area A'" and the flexible board bending area B"' can be implemented with reference to the first embodiment, and will not be repeated here.

It can be seen from the above that, in the LED display module provided by the embodiment of the present invention, the circuit board forms a branch at one end of the LED chip layout area A'", and one of the branches is bent downward as the flexible board bending area B"', so that the The flexible board bending area B"' is completely hidden under the LED chip layout area A"'. Therefore, when the LED display module is spliced, the hidden flexible board bending area B"' is beneficial to eliminate the flexible board bending area. The influence brought by the bending radius solves the problem of incomplete and discontinuous splicing images, and the length of the LED chip layout area A'" is an integer multiple of the LED dot pitch, which can realize seamless splicing of LED display screens and optimize the screen Ornamental effect.

The LED display module provided by the present invention has been introduced in detail above. For those of ordinary skill in the art, according to the idea of the embodiment of the present invention, there will be changes in the specific implementation and application range. In summary As stated above, the content of this specification should not be construed as limiting the present invention.

Claims (6)

1. a LED shows module, comprises wiring board, led chip, surface-mounted integrated circuit IC chip, it is characterized in that:

Described wiring board is multilayer circuit board, and described wiring board comprises led chip fabric swatch zone, soft board bending region and IC fabric swatch zone, and wherein, described led chip fabric swatch zone length is the integral multiple of LED lattice point distance;

Described wiring board forms branch at described led chip fabric swatch zone one end, wherein a branch extends horizontally to end, another branch extends to described soft board bending region downwards, described led chip fabric swatch zone hides described soft board bending region fully, so that described soft board bending region is hidden under the described led chip fabric swatch zone.

2. LED according to claim 1 shows module, it is characterized in that, described wiring board is the hard and soft board that flexible PCB FPC or FPC are combined with printing board PCB, wherein, wiring board on the described led chip fabric swatch zone is FPC or described hard and soft board, wiring board on the described soft board bending region is FPC, and the wiring board on the described IC fabric swatch zone is FPC or described hard and soft board.

3. LED according to claim 1 shows module, it is characterized in that,

Described led chip is arranged at described led chip fabric swatch zone and is electrically connected with described wiring board;

Described IC chip is arranged at described IC fabric swatch zone and is electrically connected with described wiring board.

4. according to claim 1 to 3 each described LED demonstration modules, it is characterized in that,

Described wiring board forms the branch of Y-shaped setting at one end isolated edge 1-2 millimeter place, described led chip fabric swatch zone.

5. according to claim 1 to 3 each described LED demonstration modules, it is characterized in that,

Wiring board on the described soft board bending region is the FPC of 1-2 layer.

6. LED according to claim 1 shows module, it is characterized in that, described LED shows that module comprises that also IC prohibits the cloth zone, and the wiring board that described IC prohibits on the cloth zone is multilayer circuit board, between described soft board bending region and described IC fabric swatch zone.

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