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CN102970851B - 热管散热器 - Google Patents

热管散热器 Download PDF

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Publication number
CN102970851B
CN102970851B CN201210462878.8A CN201210462878A CN102970851B CN 102970851 B CN102970851 B CN 102970851B CN 201210462878 A CN201210462878 A CN 201210462878A CN 102970851 B CN102970851 B CN 102970851B
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heat
base
heat pipe
radiating fins
pipe
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CN102970851A (zh
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黄崇贤
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Dongguan Hanxu Hardware Plastic Technology Co Ltd
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Priority to CN201210462878.8A priority Critical patent/CN102970851B/zh
Priority to TW102200529U priority patent/TWM461778U/zh
Priority to TW102100879A priority patent/TWI575213B/zh
Priority to US13/748,594 priority patent/US8960267B2/en
Priority to JP2013000362U priority patent/JP3182697U/ja
Priority to DE202013100427U priority patent/DE202013100427U1/de
Priority to KR2020130001011U priority patent/KR200472451Y1/ko
Publication of CN102970851A publication Critical patent/CN102970851A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及一种热管散热器设计，其系包括一底座、复数散热鳍片及一个以上的热管，该底座的端面具有可供散热鳍片插植结合的复数插槽，底座的底面系开设一个以上可供热管匹配嵌合的嵌槽，而其特征在于底座系在端面插槽与底面嵌槽之间开设复数个对应相通的破孔，使散热鳍片的相对底部可伸入破孔而抵触热管，故散热鳍片除了可插植结合于底座的端面插槽以外，并可直接接触到热管，因此可由散热鳍片直接传递热管所吸收的热温，以加快散热效果。

Description

热管散热器
技术领域
本发明系有关一种热管散热器设计，尤指一种散热鳍片可局部穿透底座并直接抵持接触热管的热管散热器改良，使散热鳍片可直接传递热管所吸收的热温而加快散热。
背景技术
习知热管散热器，系包括一底座、复数散热鳍片及一个以上的热管所组成，复数散热鳍片系堆栈排列而结合于底座的端面，底座的底面并开设可匹配嵌合热管的嵌槽，热管则向上弯曲而贯穿结合复数散热鳍片；如申请人先前申请的中国台湾第I359254号「附热管的散热器改良」发明专利案，或中国台湾第M416756号发明专利所提供的「具有并列式热管的散热器」设计，都是在底座的底面开设嵌槽，以提供热管可适配嵌入结合，且所述热管系可平整露出底座的底面，使热管可直接接触热源（如CPU）。
习知亦有如中国台湾第M421693号发明专利所为「鳍片式散热器结构改良」设计，该类型的热管散热器则是将热管埋藏结合于底座与散热鳍片之间，故热管组件无法直接接触到热源（CPU），只能由底座贴触热源，再将底座所吸收的热温间接传递给热管及散热鳍片，用以进行散热。
上述利用底座嵌槽搭配热管嵌合组成的习知热管散热器，其中，散热鳍片只能插植结合于底座端面，但无法同时直接接触热源（CPU），因此，热管无法在第一时间将其吸收的热温直接传递给散热鳍片，故对于散热鳍片而言，只能产生间接散热的效果。
此外，上述习知底座的嵌槽，其必须具有一相对适配的凹槽深度，始足以提供热管嵌入而获平整嵌合，若嵌槽的槽深太浅，例如槽深小于热管的半径周圆时，则热管即无法完成嵌入结合，因此相对于底座而言，该底座亦必须具有一更大于嵌槽深度的板体厚度，亦即，所述嵌槽的最深位置与底座端面之间尚需预留一合适间距（厚度），但其预留的间距愈多，则底座的板体当然会愈厚，则不但体积更大、重量更重，且耗费的用材（铝或铜等金属材料）亦更多，故无形也会增加成本的负担。
发明内容
本发明之主要目的，乃在于提供一种热管散热器设计，其系包括一底座、复数散热鳍片及一个以上的热管，该底座的端面具有可插植结合散热鳍片的复数插槽，而底座的底面系开设一个以上可匹配嵌合热管的嵌槽，其特别是在底座的端面插槽与底面嵌槽之间，开设复数个对应相通的破孔，复数个破孔系呈间隔排列，并与复数散热鳍片插植位置的相对底部为相互的匹配对应，使散热鳍片局部的相对底部可伸入破孔而接触热管，故散热鳍片除了可插植结合于底座的端面插槽以外，并可利用局部的相对底部通过破孔而直接接触热管，因此该散热鳍片在第一时间即可传递热管所吸收的热温，用以加快其散热效果。
本发明之次要目的，乃在于提供一种热管散热器设计，其中，该底座嵌槽的凹槽最深位置，系可更贴近于底座的端面，因此可缩短嵌槽与底座端面之间的间距（厚度），使底座的板体厚度可相对变薄，以具有缩减底座体积重量的优点，并减少底座的金属用材耗费，以降低成本。
本发明之又一目的，乃在于提供一种热管散热器设计，其中，所述的复数散热鳍片，其系可将鳍片的底部施以反折而形成一反折面，再于反折面设有一可供伸入破孔的相对底部，以供与热管产生较佳的接触效果。
本发明之另一目的，乃在于提供一种热管散热器设计，其中，所述复数散热鳍片的相对底部，其系可为平底状、弧面状，或依热管的管壁形状而为其它相对凹凸的形状，而使散热鳍片的相对底部与热管的管壁可呈相对吻合的较佳接触。
附图说明
图1为本发明的分解立体图；
图2为本发明另一角度的分解立体图；
图3为本发明的组合立体图；
图4为图3的上视图；
图5为图4的A-A剖面图；
图6为图5呈分解状态的示意图；
图7为本发明另一实施例的局部组合剖面图；
图8为图7呈分解状态的示意图；
图9为4图的B-B剖面图；
图10为本发明又一实施例的组合立体图。
附图标号说明：
底座1          散热鳍片2
热管3          端面1a
插槽11         底面1b
嵌槽12         破孔13
相对底部21     反折面22
凹槽最深位置D  间距T1
板体厚度T2     梯形热管3’
散热鳍片2’    底座1’
嵌槽12’       相对底部21’
内凹面14       锁孔141。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步描述。
如图1至图3所示之本发明热管散热器设计，其系包括一底座1、复数散热鳍片2及一个以上的热管3，其中：
底座1，系于底座端面1a设有并排状的复数插槽11，而底座底面1b系开设一个以上嵌槽12，且在底座端面1a的插槽11与底座底面1b的嵌槽12之间，并开设复数个对应相通的破孔13，各破孔13系呈间隔排列，且与复数插槽11呈相互的匹配对应。
复数散热鳍片2，系分别插植结合于底座端面1a的复数插槽11，各散热鳍片2并具有可伸入破孔13的相对底部21。
一个以上的热管3，系可匹配嵌合于底座底面1b的嵌槽12，且于嵌入后，可使热管3的嵌入部份系平整露出底座底面1b（如图3、图4），热管3亦可弯曲而贯穿结合于复数散热鳍片2，但热管3的具体实施形态，则并无限制必要。
依上述构件，其系以复数散热鳍片2的相对底部21伸入底座1的破孔13而抵触于热管3，使散热鳍片2除可插植结合于底座1的端面插槽11以外，并可利用局部的相对底部21通过破孔13而直接接触热管3，因此使散热鳍片2可直接传递热管3所吸收的热温，用以加快散热效果。
如图5、图6所示，依本发明设计精神，所述底座嵌槽12的凹槽最深位置D，其系可更贴近于底座1的端面1a，故可缩短嵌槽12与底座端面1a之间的间距T1（厚度），使得底座1的板体厚度T2可相对变薄，从而具有缩减底座1体积重量的优点，并减少底座1的用材耗费而降低成本。
如实施例图所示，所述的复数散热鳍片2，亦可在所述散热鳍片2的底部预先反折而形成一反折面22，再于反折面22设有一可供伸入破孔13的相对底部21，以供与热管3产生较佳的接触效果。
上述散热鳍片2的相对底部21，其系可实施为平底状、弧面状，或依热管3的不同管壁形状而实施为其它相对凹凸的形状，以确保散热鳍片2的相对底部21可与热管3的管壁形成相对吻合的较佳接触。如第五、六图实施例所示，该热管3的管壁系呈圆弧状，故散热鳍片2的相对底部21亦呈相对适配的凹弧状；或如图7、图8的实施例所示，如系采用梯形热管3’时，则除了底座1’的嵌槽12’形状必须相对改变外，所述散热鳍片2’的相对底部21’亦应改为相对吻合的凹口形状，用以形成较佳的适配接触。
如上所述，底座1的嵌槽12形状，于实施时并无特别限制的必要，嵌槽12主要是匹配热管3而形成对应嵌入，进而再施予压挤整平，以使热管3可平整镶嵌于嵌槽12，因此，热管3于嵌入后的管身形状系可随着嵌槽12的形状而改变，并形成稳固的紧配结合。
图9为图4的B-B剖面图，其系显示各散热鳍片2的相对底部21可伸入底座1的破孔13而直接接触热管3，使散热鳍片2可在第一时间快速传递热管3所吸收的热温。
如实施例图显示，所述的热管3，系可从一侧相同方向弯曲贯穿结合于复数散热鳍片2，但有关热管3的具体实施形态，其于本发明而言，并无特别限制必要，例如图10之另一种实施形态组合，则是揭露热管3亦可分别从两侧不同方向弯曲贯穿结合于复数散热鳍片2。
如图所示的底座1，其系可在嵌槽12以外的板体两侧，分别形成一内凹面14，并于该内凹面14开设复数锁孔141，以使散热器适于锁合装配。
以上所述，仅是本发明较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (10)

1.一种热管散热器，包括一底座、复数散热鳍片及一个以上的热管，该底座于底座端面设有复数插槽，而底座底面开设一个以上嵌槽，复数散热鳍片分别插植结合于底座端面的复数插槽，热管匹配嵌合于底座底面的嵌槽，其特征在于：在底座端面的插槽与底座底面的嵌槽之间开设复数个对应相通的破孔，各破孔系呈间隔排列，并与复数插槽呈相互的匹配对应；在各散热鳍片设有可伸入破孔的相对底部，将复数散热鳍片的相对底部伸入底座的破孔而抵触于热管，以使散热鳍片可直接传递热管所吸收的热温。
2.如权利要求1所述的热管散热器，其特征在于：该底座的复数插槽系呈并排状。
3.如权利要求1所述的热管散热器，其特征在于：所述热管的嵌入部份系平整露出底座底面。
4.如权利要求1所述的热管散热器，其特征在于：所述复数散热鳍片系在底部预先反折而形成一反折面。
5.如权利要求1所述的热管散热器，其特征在于：所述复数散热鳍片的相对底部系呈平底状。
6.如权利要求1所述的热管散热器，其特征在于：所述复数散热鳍片的相对底部系呈弧面状。
7.如权利要求1所述的热管散热器，其特征在于：所述复数散热鳍片的相对底部系依热管的管壁形状而程相对凹凸的形状。
8.如权利要求1所述的热管散热器，其特征在于：所述热管系从一侧相同方向弯曲贯穿结合复数散热鳍片。
9.如权利要求1所述的热管散热器，其特征在于：所述热管系从两侧不同方向弯曲贯穿结合复数散热鳍片。
10.如权利要求1所述的热管散热器，其特征在于：该底座系在嵌槽以外的板体两侧分别形成一内凹面，并于内凹面开设复数锁孔。
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