Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
It should be noted that in the drawings or description, the same drawing reference numerals are used for similar or identical parts. Implementations not depicted or described in the drawings are of a form known to those of ordinary skill in the art. Additionally, while exemplifications of parameters including particular values may be provided herein, it is to be understood that the parameters need not be exactly equal to the respective values, but may be approximated to the respective values within acceptable error margins or design constraints. In addition, directional terms such as "upper", "lower", "front", "rear", "left", "right", and the like, referred to in the following embodiments, are directions only referring to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.
Referring to fig. 1, a drawing of a prior art optical system for measuring thermophysical properties of a solid is shown, wherein the reference numbers are for reference and are not included in the present invention. To facilitate understanding of the present invention, the main elements involved in the present invention will be first numbered by those skilled in the art, and will be specifically shown as follows:
10-heating the laser assembly; 20-a detection laser assembly;
30-a beam combining element; 40-a light splitting element;
50-heating the laser receiving assembly; 60-a sample testing assembly;
70-a sample holding element; 80-probe laser receiving assembly;
11-a signal modulator; 12-a first laser;
13-a first wave plate; 14-a first mirror;
21-a second laser; 22-a second wave plate;
23-a second mirror; 51-a first filter;
52-a first photodetector; 61-a third wave plate;
62-objective lens; 81-a focusing lens;
82-a second optical filter; 83-second photodetector.
In one exemplary embodiment of the present invention, an optical system for measuring a thermophysical parameter of a solid is provided. As shown in fig. 2, the system includes: a heating laser generating assembly 10, a detection laser generating assembly 20, a beam combining element 30, a light splitting element 40, a heating laser receiving assembly 50, a sample testing assembly 60, a sample fixing element 70, a detection laser receiving assembly 80 and a data processing assembly (not shown). The heating laser generating assembly 10 generates continuously polarized heating laser with frequency modulation, and the detection laser generating assembly 20 generates continuously polarized detection laser; the heating laser and the detection laser are combined into a combined beam laser which is positioned on the horizontal plane after passing through the beam combining element 30; the combined laser beam is incident on the light splitting element 40, the component with the polarization direction in the horizontal plane is transmitted to the sample testing assembly 60, and the component with the polarization direction vertical to the horizontal plane is reflected to the heating laser receiving assembly 50; the beam-combining light component with the polarization direction on the horizontal plane irradiates the surface of the tested sample on the sample fixing element 70 after passing through the sample testing component 60, the tested sample is heated by the heating laser, and the heated tested sample generates a modulation effect on the detection laser; the combined laser of the heating laser reflected by the surface of the tested sample on the sample fixing element 70 and the modulated detection laser is reflected to the detection laser receiving assembly 80 by the light splitting element 40 after passing through the sample testing assembly 60 again; the detection laser receiving assembly 80 filters the heating laser component in the incident heating laser and the detection laser to obtain a signal of the detection laser; the heating laser receiving assembly 50 filters out the detection laser components in the incident heating laser and detection laser to obtain a signal of the heating laser; the data processing component reversely deduces the thermophysical property parameters of the tested sample according to a theoretical model by using the modulation frequency of the heating laser, the detection laser signal generated by the detection laser receiving component 50 and the signal of the heating laser generated by the heating laser receiving component 80.
Each component/element is described in detail below.
Heating laser generating assembly 10
The heating laser generating assembly 10 is used to generate a signal modulated continuously polarized heating laser. As shown in fig. 1, the heating laser generating assembly includes: the signal modulator 11, which can be a digital signal generator, is used for modulating the first laser, the modulation frequency of the signal modulator 11 is controlled by an external computer, the modulation frequency range is determined by the signal modulator 11 and the data processing component, and can be 50kHz to 20 MHz; a first laser 12, which is a semiconductor laser, and is configured to output continuous polarized laser with a wavelength of 830nm under the modulation of the signal modulator 11, and the power of the continuous polarized laser is 170 mW; a first wave plate 13, which is a half wave plate, for adjusting the ratio of the horizontal polarization component and the vertical polarization component of the continuous polarization laser output by the first laser 12; the first laser mirror 14 has a reflectivity of more than 99%, and a reflection surface thereof forms an angle of 45 ° with the heating laser transmitted through the first wave plate 13, and is configured to deflect the incident add laser by 90 ° and then to enter the beam combining element 30 at an angle of 45 °.
Detection laser generation assembly 20
The detection laser generation assembly 20 is used to generate a continuously polarized detection laser having a wavelength different from the heating laser and a power much less than the heating laser power. As shown in fig. 1, the heating laser generating assembly 20 includes: the second laser 21 is a semiconductor laser and is used for outputting detection laser with the wavelength of 635nm, and the power of the detection laser is 6 mW; a second wave plate 22, which is a half wave plate, for adjusting the ratio of the horizontal polarization component and the vertical polarization component of the continuous polarization laser output by the second laser 21; the reflectivity of the second laser reflector 23 is greater than 99%, and the reflecting surface of the second laser reflector forms an angle of 45 ° with the detection laser transmitted through the second wave plate 22, and is used for deflecting the incident detection laser by 90 ° and then entering the beam combining element 30 at an angle of 45 °.
Beam combining element 30
The beam combining element 30 is a cold light mirror and transmits heating laser with the wavelength of 830nm incident at an angle of 45 degrees with the plane where the beam combining element is located; the detection laser with the wavelength of 635nm incident at an angle of 45 degrees with the plane where the laser is located is totally reflected, so that the heating laser and the detection laser are combined, and collinear heating detection is realized.
Light splitting element 40
The light splitting element 40 is a light splitting prism. Through the beam splitting prism, in the combined heating laser and detection laser, the components with the polarization directions on the horizontal plane are transmitted to the sample testing component, and the components with the polarization directions vertical to the horizontal plane are reflected to the heating laser receiving component; the heating laser light and the detection laser light reflected by the sample surface are reflected to the detection laser receiving assembly.
Heating laser receiver assembly 50
And the heating laser receiving assembly 50 is used for filtering out the detection laser components in the incident heating laser and the detection laser to obtain a signal of the heating laser. The heating laser receiving assembly 50 includes: a first filter 51 and a first photodetector 52. Wherein:
a first filter 51 for filtering out the detection laser component in the incident combined beam laser, wherein the transmittance of the first filter to the detection laser with the wavelength of 635nm is 10-7To 10-9。
The first photodetector 52 is used to detect the heating laser signal in the combined laser beam, and may be a high speed PIN diode, an avalanche diode, a photomultiplier, or a charge coupled device, with a response time of less than 10 ns. Wherein, the signal can include: power (amplitude), phase, etc.
Sample testing assembly 60
The combined laser of the heating laser and the detection laser transmitted by the spectroscopic element 40 passes through the sample test assembly 60 and then reacts with the surface of the sample to be tested on the sample fixing element, and the heating laser and the detection laser reflected by the surface of the sample are re-incident to the spectroscopic element 40 through the sample test assembly 60.
The sample testing assembly 60 includes: a quarter-wave plate 61 and an objective lens 62. The objective lens 62 is an achromatic objective lens with a magnification of 100 times and a focal length of 2 mm. After the incident combined laser beam passes through the quarter-wave plate 61 twice, the polarization direction changes by 90 °.
Sample holding member 70
The sample fixing element 70 is a fixing and adjusting frame for adjusting and fixing the orientation of the tested sample, so as to ensure that the combined laser beam is vertically incident on the surface of the tested sample, and the reflected combined laser beam returns to the original path and is incident on the sample testing component 60.
Heating the detected sample by the heating laser, and modulating the detection laser by the heated detected sample; the combined laser beam of the heating laser beam reflected by the surface of the sample to be tested on the sample fixing element 70 and the modulated detection laser beam is reflected by the beam splitting element 40 to the detection laser receiving assembly 80 after passing through the sample testing assembly 60 again.
Detection laser receiving assembly 80
And the detection laser receiving assembly 80 is used for filtering out the heating laser components in the incident heating laser and the detection laser to obtain a signal of the detection laser. The detection laser receiving assembly 80 includes: a focusing lens 81, a second filter 82 and a second photodetector 83. Wherein:
the focusing lens 81 is used for focusing the incident combined laser beam. The focal length of the focusing lens 81 may be 10mm to 300mm, depending on the requirements.
A second filter 82 for filtering out heating laser component in the focused combined beam laser, wherein the transmittance of the second filter to the heating laser with 830nm wavelength is 10-7To 10-9。
And a second photodetector 83 for detecting the signal of the detection laser in the combined laser, which may be a high-speed PIN diode, an avalanche diode, a photomultiplier, or a charge-coupled device, with a response time of less than 10 ns. Wherein, the signal can include: power (amplitude), phase, etc.
And calculating to obtain the thermophysical property parameters of the solid by using the signals obtained by the heating laser receiving assembly and the detection laser receiving assembly. Compared with time domain methods such as an ultrashort pulse laser pumping detection method and the like, the optical system for measuring the thermophysical parameters of the solid has no mechanical moving part, the measuring system is relatively simple, and the light path is more convenient to adjust.
Based on the optical system, the invention also provides a method for measuring the thermophysical parameters of the solid, which is to fit the thermophysical parameters of the tested sample, including thermal conductivity, interface thermal conductivity between materials and the like, according to the phase difference between the signal of the detection laser generated by the detection laser receiving component and the signal of the heating laser generated by the heating laser receiving component under different angular frequencies of the signal modulator.
In an exemplary embodiment of the present invention, as shown in fig. 3, the method includes:
step A, acquiring a detection laser signal generated by a detection laser receiving assembly and a signal generated by a heating laser receiving assembly under different heating laser modulation frequencies by using the optical system, wherein the detection laser signal and the heating laser signal both contain power information and phase information;
b, performing phase difference processing on the detection laser signal and the heating laser signal under different heating laser modulation frequencies to obtain a phase difference experimental value;
step C, giving initial values to the thermal conductivity to be fitted and the interface thermal conductivity;
step D, calculating a phase difference theoretical value under the frequency corresponding to the phase difference experimental value according to a theoretical model formula under different heating laser modulation frequencies;
wherein Q is0、Q1Power of heating laser and detection laser, gamma is light reflection coefficient of tested sample surface, l is integral variable, R is0、R1The beam waist radii when the heating laser and the detection laser are generated are respectively, and omega is the angular frequency of the modulation signal; phi is a phase difference theoretical value between the detection laser received by the detection laser receiving assembly and the heating laser received by the heating laser receiving assembly. C. Material thermophysical property parameter matrix with D of 2 x 2 The respective parameters of (a):
in the case of a certain layer, the layer is,
in the case of an interface, the interface is,
wherein,
rho, c, k and d are respectively the density, mass heat capacity, heat conductivity and thickness of a certain layer, G is interface heat conductivity, i is an imaginary number unit, and j is the number of layers counted from the incident end of the laser.
Further, with respect to specific meanings of the above-mentioned thermophysical parameters of the material, see reference 1 [ j.zhuet al.j.appl.phys.108, 094315(2010) ].
Step E, performing least square calculation on the phase difference experimental values and the corresponding phase difference theoretical values under all the heating laser modulation frequencies, wherein the least square calculation value is used as a current iteration result;
step F, recording a thermal conductivity value and an interface thermal conductivity value corresponding to the current iteration result, namely current optimal data;
g, judging whether the result of the current iteration is smaller than the result of the previous iteration, if so, executing the step H, otherwise, executing the step I;
step H, taking the thermal conductivity value and the interface thermal conductivity value corresponding to the iteration result as change detection output data, and executing step J;
step I, taking a thermal conductivity value and an interface thermal conductivity value corresponding to the previous iteration result as change detection output data, and executing step J;
step J, judging whether the iteration result for 3 times is less than the control precision (such as 10)-6) If yes, executing the step K, otherwise, executing the step L;
step K, stopping iteration, outputting the thermal conductivity value and the interface thermal conductivity value obtained in the step H or the step I, and ending the process;
and step L, increasing or decreasing the thermal conductivity value and the interface thermal conductivity value obtained in the step H or the step I according to a preset step length, determining a numerical value change path by a preset optimization function, and executing the step D.
In this step, the preset step length may be 0.5-5% of the current thermal conductivity value and the interface thermal conductivity value; the optimization function may be an lsqcurvefit function, fmisearch function, or other functions known in the art.
It should be noted that the thermal conductivity value and the interface thermal conductivity value are obtained simultaneously by using the two-parameter fitting method, and of course, a specific numerical value of the other one may also be obtained by using a single-parameter fitting method on the premise that one of the values is determined to be a fixed value. The related calculation methods are easily conceivable by those skilled in the art from the above description, and will not be repeated here.
It should be noted that the above definitions of the elements are not limited to the specific structures or shapes mentioned in the embodiments, and those skilled in the art can easily substitute them, for example:
(1) the heating laser or the detection laser can also be incident into the laser reflector at other angles;
(2) the light path of the system may not be in a horizontal plane, and the horizontal plane is selected only for convenience of adjustment in the embodiment;
(3) the focusing lens only has the function of concentrating the light beam and enabling the light beam to be incident to the photosensitive area of the photoelectric detector, and in the heating laser receiving assembly, the focusing lens is added or removed, so that the measuring result is not influenced;
(4) the first and second photodetectors may be high speed PIN diodes, avalanche diodes, photomultiplier tubes, or charge coupled devices.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.