CN102896770A - Hot-melting packaging device for body cavity temperature sensor - Google Patents
Hot-melting packaging device for body cavity temperature sensor Download PDFInfo
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- CN102896770A CN102896770A CN2011102141617A CN201110214161A CN102896770A CN 102896770 A CN102896770 A CN 102896770A CN 2011102141617 A CN2011102141617 A CN 2011102141617A CN 201110214161 A CN201110214161 A CN 201110214161A CN 102896770 A CN102896770 A CN 102896770A
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- temperature sensor
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Abstract
The invention relates to a hot-melting packaging device for a body cavity temperature sensor and a conduit, comprising a cooling port, a motor base, a heater, a mold, a temperature sensor and a temperature control assembly, and a power switch. According to the invention, the power switch is turned on, the heater starts to heat the mold, a product needing to be packaged is put into the mold, when the temperature reaches to a preset value, the mold melts the product end for packaging; simultaneously, the temperature sensor and the temperature control assembly control the heater to stop heating and control the cooling port to cool the mold, the product is cooled and then taken out, and the packaging work is complete.
Description
Technical field
The present invention relates to a kind of hot melt sealed in unit for using hot melting way that body cavity body temperature trans or end of conduit are encapsulated.
Background technology
Body temperature trans in the chamber of using at present mostly adopts epoxy encapsulation, and more liquid because of epoxy resin, the dry solidification time is long, difficult control during production, and the production cycle is longer.Be unfavorable for producing in enormous quantities.Simultaneously, epoxy resin and wire rod different in kind, packaging body and wire rod itself can not well form one, occurs packaging body during use and is shed in the body cavity, causes potential safety hazard.
Also have producer to adopt the injection moulding mode to encapsulate, the sensor after can encapsulating and wire rod can not firm engagement, very easily rupture in the use, in order to address this problem, invented this hot melt sealed in unit.
Summary of the invention
The present invention relates to a kind of equipment for using hot melting way that body cavity body temperature trans or conduit are encapsulated.Be used for body cavity body temperature trans and the molten sealed in unit of catheter fever, comprise heater, encapsulating mould, support, refrigeration, TEMP and temperature control assembly, it is characterized in that behind the equipment heating mould product being carried out hot melt processing, there is a power that product is sent to mould during heating, make the end fusion of product closely knit, and utilize the die cavity shape to make product reach designing requirement, and stopped heating after mould reaches temperature, cooling system cools off mould.
Description of drawings
Fig. 1 is the product structure explosive view;
Fig. 2 is the overall structure schematic diagram of product of the present invention;
The specific embodiment
Below with reference to drawings and Examples the present invention is further described:
Shown in accompanying drawing 1, product is comprised of coolant interface 5, support 1, heating element 4, mould 3, temperature sensor and temperature control assembly 8, power switch 12, anchor clamps 11, mechanical finger 10, cylinder 9.
At first turn on the power switch 12, heating element 4 begins mould 3 heating, the product of needs encapsulation is put in the mould 3, and when temperature reached setting value by the time, mould melted the product end, cylinder 9 promotion robots refer to that 10 encapsulate product to die cavity 3 interior pressurizations, simultaneously, temperature sensor and temperature control assembly 8 control heating elements 4 stopped heatings, and the cooling of blowing of 5 pairs of moulds of control coolant interface, take out product after the cooling, finish packaging operation.
The present invention is a kind of structure innovation, and is easy to process, safe and reliable hot melt sealed in unit.
The above is preferred embodiment of the present invention only, is not limited to the present invention, all any modifications of making in the spirit and principles in the present invention, variation, remodeling, interpolation, replaces and improvement etc. on an equal basis, all should be included in protection scope of the present invention.
Claims (6)
1. the molten sealed in unit of a body cavity body temperature trans and catheter fever, comprise heater, encapsulating mould, support, refrigeration, TEMP and temperature control assembly, it is characterized in that behind the equipment heating mould product being carried out hot melt processing, there is a power that product is sent to mould, reaches after the temperature stopped heating and begin to cool off.
2. as claimed in claim 1 have a heater that mould is heated.
3. mould as claimed in claim 1 reaches stopped heating after the temperature, and to mould refrigeration.
4. as claimed in claim 1 have a power that product is sent to mould, and this power also can be manual.
5. use wind-force as claimed in claim 3 or water cool off mould fast.
6. heater as claimed in claim 3 can automatic stopped heating after being heated to design temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102141617A CN102896770A (en) | 2011-07-28 | 2011-07-28 | Hot-melting packaging device for body cavity temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102141617A CN102896770A (en) | 2011-07-28 | 2011-07-28 | Hot-melting packaging device for body cavity temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102896770A true CN102896770A (en) | 2013-01-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102141617A Pending CN102896770A (en) | 2011-07-28 | 2011-07-28 | Hot-melting packaging device for body cavity temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102896770A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401456A (en) * | 1987-10-07 | 1995-03-28 | Formex Manufacturing, Inc. | Method of forming a plastic unit having an outer plastic shell encapsulating a foam core |
| CN1919952A (en) * | 2006-08-23 | 2007-02-28 | 领胜电子科技（深圳）有限公司 | Hot melt adhesion technique |
| CN101327644A (en) * | 2008-07-09 | 2008-12-24 | 联塑(杭州)机械有限公司 | Compression molding butt-fusion forming method for large-sized plastic pipe joint |
| CN201268099Y (en) * | 2008-09-22 | 2009-07-08 | 周超 | Multifunctional plastic bonding machine |
| CN101499429A (en) * | 2008-01-28 | 2009-08-05 | 日亚化学工业株式会社 | Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package |
| CN101607688A (en) * | 2009-06-19 | 2009-12-23 | 大连理工大学 | A kind of non-energy-oriented ridge polymer ultrasonic bonding method based on temperature-compensating |
| CN101863449A (en) * | 2010-06-21 | 2010-10-20 | 东南大学 | Encapsulation method of MEMS infrared sensor with infrared focusing function |
| CN101865735A (en) * | 2010-05-28 | 2010-10-20 | 北京康华盛鸿能源科技发展有限公司 | Packaging structure and method of quasi-distributed fiber grating temperature sensor |
-
2011
- 2011-07-28 CN CN2011102141617A patent/CN102896770A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401456A (en) * | 1987-10-07 | 1995-03-28 | Formex Manufacturing, Inc. | Method of forming a plastic unit having an outer plastic shell encapsulating a foam core |
| CN1919952A (en) * | 2006-08-23 | 2007-02-28 | 领胜电子科技（深圳）有限公司 | Hot melt adhesion technique |
| CN101499429A (en) * | 2008-01-28 | 2009-08-05 | 日亚化学工业株式会社 | Metal mold for injection molding and semiconductor package formed therewith and method of manufacturing semiconductor package |
| CN101327644A (en) * | 2008-07-09 | 2008-12-24 | 联塑(杭州)机械有限公司 | Compression molding butt-fusion forming method for large-sized plastic pipe joint |
| CN201268099Y (en) * | 2008-09-22 | 2009-07-08 | 周超 | Multifunctional plastic bonding machine |
| CN101607688A (en) * | 2009-06-19 | 2009-12-23 | 大连理工大学 | A kind of non-energy-oriented ridge polymer ultrasonic bonding method based on temperature-compensating |
| CN101865735A (en) * | 2010-05-28 | 2010-10-20 | 北京康华盛鸿能源科技发展有限公司 | Packaging structure and method of quasi-distributed fiber grating temperature sensor |
| CN101863449A (en) * | 2010-06-21 | 2010-10-20 | 东南大学 | Encapsulation method of MEMS infrared sensor with infrared focusing function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Taijia Electronics Co., Ltd. Zhang Dachun Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Taijia Electronics Co., Ltd. Document name: the First Notification of an Office Action |
|
| DD01 | Delivery of document by public notice |
Addressee: Shenzhen Taijia Electronics Co., Ltd. Document name: Notification that Application Deemed to be Withdrawn |
|
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130130 |
|
| RJ01 | Rejection of invention patent application after publication |