CN102896438B - Copper-zinc solder and preparation method thereof - Google Patents
Copper-zinc solder and preparation method thereof Download PDFInfo
- Publication number
- CN102896438B CN102896438B CN201210401982.6A CN201210401982A CN102896438B CN 102896438 B CN102896438 B CN 102896438B CN 201210401982 A CN201210401982 A CN 201210401982A CN 102896438 B CN102896438 B CN 102896438B
- Authority
- CN
- China
- Prior art keywords
- copper
- crucible
- zinc
- percentage
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention discloses a copper-zinc solder and a preparation method thereof. The copper-zinc solder is prepared from the following raw materials in percentage by weight: 58 to 63 percent of Cu, 1 to 2 percent of Sn, 0.1 to 0.5 percent of Si and 34 to 41 percent of Zn. The copper-zinc solder prepared from the raw materials is low in melting point and cost, convenient to process and high in soldering performance.
Description
Technical field
The present invention relates to a kind of solder and preparation method thereof, relate in particular to a kind of copper-zinc solder and preparation method thereof.
Background technology
Traditional copper bar tracheae welding procedure generally adopts Ag base solder, although Ag base brazing temperature will drop to 850 ℃ of left and right, also can obtain the soldered fitting smooth, attractive in appearance, wellability is good, the reduction of brazing temperature also can be exempted some defects of bringing because of high temperature face, is very good solder.But Ag base solder is expensive, cost is higher.By practice, when the program control flame Ag base soldering, add gas flux.But only use gas flux to be difficult to obtain satisfactory result, also must be aided with the paste of fluoride or raise the brazing flux of sap-shape, could obtain high-quality soldered fitting.And generally also having a small amount of ammonia in existing gas scaling powder, ammonia at high temperature can decomposite hydrogen ion, and the surface of copper pipe and inner containing a small amount of
.Under high temperature, hydrogen ion can be with
there is chemical reaction, will
reduction, production of copper and water.Water gasifies under the effect of high temperature, but it is again in the inside of copper pipe, and evaporation is not gone out, so the intermolecular gap of copper pipe is become to large, makes copper pipe in the situation that passing into certain pressure, breaks, and causes the leakage of refrigerating fluid.And the hydrogen ion self that ammonia at high temperature decomposites also can rest in copper pipe, be polymerized to hydrogen molecule, cause stress to concentrate, surpass the strength degree of copper, form tiny crackle copper is inner, under certain pressure, also can cause brass tube fracture.
Summary of the invention
In order to address the above problem, the object of the present invention is to provide a kind of copper-zinc solder and preparation method thereof, the fusing point of its solder is low, and cost is low, easy to process and help weldering property strong.
The present invention is the object that reaches above-mentioned, and the present invention adopts following technical scheme:
A copper-zinc solder, formulated by the raw material of following percentage by weight:
Cu 58%—63%；
Sn 1%—2%；
Si 0.1%—0.5%；
Zn 34%—41%。
Described raw material weight percentage is: Cu 60.72; Sn 1.46%; Si 0.173%; Zn 37.647%.
A production technology for copper-zinc solder, comprises the steps:
1) zinc ingot metal that first to add containing zinc percentage by weight in the bottom of crucible be 8.5%-10.25%, secondly on zinc ingot metal, adding cupric percentage by weight is 0.1%-0.5% and the siliceous percentage by weight cupro silicon that is 0.1%-0.5%, then on cupro silicon, adding cupric percentage by weight is 57.9%-62.5% cathode copper, the residue zinc ingot metal that then to add containing zinc percentage by weight on cathode copper be 25.5%-30.75%; Then above-mentioned raw materials adds after crucible, for the first time heating crucible; After crucible heating to 1100 ℃, in crucible, raw material all stops heating after fusing; Then in crucible, adding stanniferous percentage by weight is 1%-2% tin slab, and heating crucible for the second time, when crucible heating all stops heating after fusing to raw material in crucible after 1100 degree; Finally stir, remove slag;
2) will in step 1, stir, the solution after removing slag imports through funnel the mold that waters that temperature is 180-220 ℃ and obtains ingot;
3) by after ingot peeling cleaning in step 2 in cutting machine cut growth be 80-120mm, the metal nahlock that diameter is 40-55mm;
4) the metal nahlock of step 3 is put into hydraulic press and push, extrusion temperature is 550-650 ℃, and extrusion speed is 0.3-0.7cm/s, under the condition that extrusion ratio is 60-85, is squeezed into sheet metal;
5) sheet metal after extruding in step 4 is pulled into the welding wire of 0.6-1.0mm, resulting welding wire is copper-zinc solder.
The mold that waters that in described step 2, solution is 200 ℃ through funnel importing temperature obtains ingot.
In described step 3, after ingot peeling cleaning, in cutting machine, cut growth is 100mm, the metal nahlock that diameter is 47mm.
In described step 4, metal nahlock is put into hydraulic press and is pushed, and extrusion temperature is 600 ℃, and extrusion speed is 0.5cm/s, under the condition that extrusion ratio is 72, is squeezed into sheet metal.
In described step 5, the rear sheet metal of extruding pulls into the welding wire of 0.8mm, and resulting welding wire is copper-zinc solder.
Beneficial effect of the present invention is: on its material composition of a kind of copper-zinc solder provided by the invention, adopt without silver configuration, greatly lowered the cost of raw material.The copper-zinc solder preparation method that it adopts, flow process is simple, easy operating.Its fusing point of copper-zinc solder of adopting raw material of the present invention configuration and preparation method thereof to obtain is low and help weldering property strong.
The specific embodiment
Embodiment 1
A kind of copper-zinc solder of the present embodiment, formulated by the raw material of following percentage by weight: Cu 58%; Sn 2%; Si 0.1%; Zn 39.9%.
The production technology of described a kind of copper-zinc solder comprises the steps: first, first the zinc ingot metal that to add containing zinc percentage by weight in the bottom of crucible be 9.15%, secondly on zinc ingot metal, adding cupric percentage by weight is 0.1% and the siliceous percentage by weight cupro silicon that is 0.1%, then on cupro silicon, adding cupric percentage by weight is 57.9% cathode copper, the residue zinc ingot metal that then to add containing zinc percentage by weight on cathode copper be 30.75%; Then above-mentioned raw materials adds after crucible, for the first time heating crucible; After crucible heating to 1100 ℃, in crucible, raw material all stops heating after fusing; Then in crucible, adding stanniferous percentage by weight is 2% tin slab, and heating crucible for the second time, when crucible heating all stops heating after fusing to raw material in crucible after 1100 degree; Finally stir, remove slag.The second, the mold that waters that after step 1 is stirred, removed slag, solution is 190 ℃ through funnel importing temperature obtains ingot.The 3rd, after ingot peeling in step 2 is cleared up, in cutting machine, cut growth is 90mm, the metal nahlock that diameter is 45mm.The 4th, metal nahlock in step 3 to be put into hydraulic press and push, extrusion temperature is 550 ℃, extrusion speed is 0.3cm/s, under the condition that extrusion ratio is 60, is squeezed into sheet metal.The 5th, after step 4 is pushed, sheet metal pulls into the welding wire of 0.6mm, and resulting welding wire is copper-zinc solder.
On its material composition of a kind of copper-zinc solder that the present embodiment provides, adopt without silver configuration, greatly lowered the cost of raw material.The copper-zinc solder preparation method that it adopts, flow process is simple, easy operating.Its fusing point of copper-zinc solder of adopting raw material of the present invention configuration and preparation method thereof to obtain is low and help weldering property strong.
Embodiment 2
A kind of copper-zinc solder of the present embodiment, formulated by the raw material of following percentage by weight: Cu 60.72%; Sn 1.46%; Si 0.173%; Zn 37.647%.
The production technology of described a kind of copper-zinc solder comprises the steps: first, first the zinc ingot metal that to add containing zinc percentage by weight in the bottom of crucible be 8.5%, secondly on zinc ingot metal, adding cupric percentage by weight is 0.173% and the siliceous percentage by weight cupro silicon that is 0.173%, then on cupro silicon, adding cupric percentage by weight is 60.547% cathode copper, the residue zinc ingot metal that then to add containing zinc percentage by weight on cathode copper be 29.147%; Then above-mentioned raw materials adds after crucible, for the first time heating crucible; After crucible heating to 1100 ℃, in crucible, raw material all stops heating after fusing; Then in crucible, adding stanniferous percentage by weight is 1.46% tin slab, and heating crucible for the second time, when crucible heating all stops heating after fusing to raw material in crucible after 1100 degree; Finally stir, remove slag.The second, the mold that waters that after step 2 is stirred, removed slag, solution is 200 ℃ through funnel importing temperature obtains ingot.The 3rd, after ingot peeling in step 2 is cleared up, in cutting machine, cut growth is 100mm, the metal nahlock that diameter is 47mm.The 4th, the metal nahlock of step 3 to be put into hydraulic press and push, extrusion temperature is 600 ℃, extrusion speed is 0.5cm/s, under the condition that extrusion ratio is 72, is squeezed into sheet metal.The 5th, sheet metal after extruding in step 4 is pulled into the welding wire of 0.8mm, resulting welding wire is copper-zinc solder.
On its material composition of a kind of copper-zinc solder that the present embodiment provides, adopt without silver configuration, greatly lowered the cost of raw material.The copper-zinc solder preparation method that it adopts, flow process is simple, easy operating.Its fusing point of copper-zinc solder of adopting raw material of the present invention configuration and preparation method thereof to obtain is low and help weldering property strong.
Embodiment 3
A kind of copper-zinc solder of the present embodiment, formulated by the raw material of following percentage by weight: Cu 58.4%; Sn 2%; Si 0.5%; Zn 39.1%.
The production technology of described a kind of copper-zinc solder comprises the steps: first, first the zinc ingot metal that to add containing zinc percentage by weight in the bottom of crucible be 9.1%, secondly on zinc ingot metal, adding cupric percentage by weight is 0.5% and the siliceous percentage by weight cupro silicon that is 0.5%, then on cupro silicon, adding cupric percentage by weight is 57.9% cathode copper, the residue zinc ingot metal that then to add containing zinc percentage by weight on cathode copper be 30%; Then above-mentioned raw materials adds after crucible, for the first time heating crucible; After crucible heating to 1100 ℃, in crucible, raw material all stops heating after fusing; Then in crucible, adding stanniferous percentage by weight is 2% tin slab, and heating crucible for the second time, when crucible heating all stops heating after fusing to raw material in crucible after 1100 degree; Finally stir, remove slag.The second, the mold that waters that after step 1 is stirred, removed slag, solution is 210 ℃ through funnel importing temperature obtains ingot.The 3rd, after ingot peeling in step 2 is cleared up, in cutting machine, cut growth is 110mm, the metal nahlock that diameter is 50mm.The 4th, the metal nahlock of step 3 to be put into hydraulic press and push, extrusion temperature is 650 ℃, extrusion speed is 0.7cm/s, under the condition that extrusion ratio is 80, is squeezed into sheet metal.The 5th, sheet metal after extruding in step 4 is pulled into the welding wire of 0.9mm, resulting welding wire is copper-zinc solder.
On its material composition of a kind of copper-zinc solder that the present embodiment provides, adopt without silver configuration, greatly lowered the cost of raw material.The copper-zinc solder preparation method that it adopts, flow process is simple, easy operating.Its fusing point of copper-zinc solder of adopting raw material of the present invention configuration and preparation method thereof to obtain is low and help weldering property strong.
Claims (5)
1. a copper-zinc solder, is characterized in that by the raw material of following percentage by weight formulated:
Cu 58%—63%；
Sn 1%—2%；
Si 0.1%—0.5%；
Zn 34%—41%；
The production technology of described copper-zinc solder, comprises the steps:
1) zinc ingot metal that first to add containing zinc percentage by weight in the bottom of crucible be 8.5%-10.25%, secondly on zinc ingot metal, adding cupric percentage by weight is 0.1%-0.5% and the siliceous percentage by weight cupro silicon that is 0.1%-0.5%, then on cupro silicon, adding cupric percentage by weight is 57.9%-62.5% cathode copper, the residue zinc ingot metal that then to add containing zinc percentage by weight on cathode copper be 25.5%-30.75%; Then above-mentioned raw materials adds after crucible, for the first time heating crucible; After crucible heating to 1100 ℃, in crucible, raw material all stops heating after fusing; Then in crucible, adding stanniferous percentage by weight is 1%-2% tin slab, and heating crucible for the second time, when crucible heating all stops heating after fusing to raw material in crucible after 1100 degree; Finally stir, remove slag;
2) will in step 1, stir, the solution after removing slag imports through funnel the mold that waters that temperature is 180-220 ℃ and obtains ingot;
3) by after ingot peeling cleaning in step 2 in cutting machine cut growth be 80-120mm, the metal nahlock that diameter is 40-55mm;
4) the metal nahlock of step 3 is put into hydraulic press and push, extrusion temperature is 550-650 ℃, and extrusion speed is 0.3-0.7cm/s, under the condition that extrusion ratio is 60-85, is squeezed into sheet metal;
5) sheet metal after extruding in step 4 is pulled into the welding wire of 0.6-1.0mm, resulting welding wire is copper-zinc solder.
2. a kind of copper-zinc solder according to claim 1, is characterized in that: the mold that waters that in described step 2, solution is 200 ℃ through funnel importing temperature obtains ingot.
3. a kind of copper-zinc solder according to claim 1, is characterized in that: in described step 3, after ingot peeling cleaning, in cutting machine, cut growth is 100mm, the metal nahlock that diameter is 47mm.
4. a kind of copper-zinc solder according to claim 1, is characterized in that: in described step 4, metal nahlock is put into hydraulic press and pushed, and extrusion temperature is 600 ℃, and extrusion speed is 0.5cm/s, under the condition that extrusion ratio is 72, is squeezed into sheet metal.
5. a kind of copper-zinc solder according to claim 1, is characterized in that: in described step 5, the rear sheet metal of extruding pulls into the welding wire of 0.8mm, and resulting welding wire is copper-zinc solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210401982.6A CN102896438B (en) | 2012-10-22 | 2012-10-22 | Copper-zinc solder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210401982.6A CN102896438B (en) | 2012-10-22 | 2012-10-22 | Copper-zinc solder and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102896438A CN102896438A (en) | 2013-01-30 |
| CN102896438B true CN102896438B (en) | 2014-10-08 |
Family
ID=47569081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210401982.6A Expired - Fee Related CN102896438B (en) | 2012-10-22 | 2012-10-22 | Copper-zinc solder and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102896438B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103480987B (en) * | 2013-09-26 | 2015-08-19 | 郑州机械研究所 | A kind of preparation method of high fragility copper zinc welding rod/weld tabs |
| CN104942476B (en) * | 2015-07-23 | 2017-05-31 | 徐鲁豫 | It is a kind of from haptotaxis solder and preparation method thereof |
| CN106270915B (en) * | 2016-08-31 | 2018-08-31 | 安徽众汇制冷有限公司 | A kind of application method of air conditioning liquid reservoir welding protection device |
| CN106736010A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Copper zinc solder paste |
| CN107378303A (en) * | 2017-06-09 | 2017-11-24 | 芜湖云邦铜业有限公司 | A kind of high intensity alternating-current resistance welding wire production method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2036064C1 (en) * | 1991-05-14 | 1995-05-27 | Пашков Игорь Николаевич | Solder for soldering of copper and its alloys and method of its production |
| CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
| GB0426383D0 (en) * | 2004-12-01 | 2005-01-05 | Alpha Fry Ltd | Solder alloy |
| CN101664864A (en) * | 2009-09-24 | 2010-03-10 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101342644B (en) * | 2007-07-13 | 2012-05-23 | 浙江信和科技股份有限公司 | High-plasticity environment-friendly silver-saving medium-temperature brazing filler metal |
| CN102179642B (en) * | 2011-05-06 | 2012-10-17 | 郴州格瑞特焊业有限公司 | Copper-based brazing filler metal and preparation method thereof |
-
2012
- 2012-10-22 CN CN201210401982.6A patent/CN102896438B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2036064C1 (en) * | 1991-05-14 | 1995-05-27 | Пашков Игорь Николаевич | Solder for soldering of copper and its alloys and method of its production |
| CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
| GB0426383D0 (en) * | 2004-12-01 | 2005-01-05 | Alpha Fry Ltd | Solder alloy |
| CN101664864A (en) * | 2009-09-24 | 2010-03-10 | 哈尔滨工业大学 | Moderate temperature copper based brazing filler metal and preparation method thereof |
| CN102626837A (en) * | 2012-05-09 | 2012-08-08 | 哈尔滨工业大学 | Moderate temperature copper-based solder and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102896438A (en) | 2013-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102896438B (en) | Copper-zinc solder and preparation method thereof | |
| CN104907724B (en) | Reed-type environment-friendly coated silver brazing filler metal ring | |
| CN102059469B (en) | Manufacture method of environment-friendly soldering ring for copper aluminum composite pipe | |
| CN104759781B (en) | One kind is for silver-bearing copper phosphor tin flux coated brazingrod ring and preparation method thereof | |
| CN104928520A (en) | High-conductivity, arc-resistance and free-cutting leadfree tellurium copper alloy material | |
| CN102626837A (en) | Moderate temperature copper-based solder and preparation method thereof | |
| CN104526181A (en) | Electric vacuum silver base alloy solder for vacuum electronic device brazing sealing and preparation method thereof | |
| CN103567657A (en) | Silver-copper-tin alloy, silver-copper-tin alloy brazing wire and preparation method for same | |
| CN101664864B (en) | Moderate temperature copper based brazing filler metal and preparation method thereof | |
| CN102626838B (en) | Silver-based cadmium-free medium temperature brazing filler metal and preparation method thereof | |
| CN105345304A (en) | Supersaturated brazing filler metal and preparation method thereof | |
| CN109628810A (en) | A kind of wrought magnesium alloy and preparation method thereof of high strength easy corrosion | |
| CN106041355A (en) | Copper-based soldering paste | |
| CN108857138A (en) | A kind of dissimilar metal connection low silver-colored cadmium-free silver-base solder and preparation method thereof | |
| CN102744482A (en) | Vacuum brazing device and method using device to braze aluminum alloy workpiece | |
| CN103014406B (en) | Multicomponent alloy material for sealing microwave oven magnetron | |
| CN104191101B (en) | A kind of clean Sn-Zn solder of few shortcoming containing palladium and preparation method thereof | |
| CN103014404B (en) | Alloy material for sealing microwave magnetron and preparation method thereof | |
| CN102248323B (en) | Silver-based cadmium-free medium-temperature solder and preparation method thereof | |
| CN103602853A (en) | Low-lead extruded brass bar and production method thereof | |
| CN103909361A (en) | Low-silver-content cadmium-free solder | |
| CN109487136A (en) | A kind of wrought magnesium alloy of fast erosion and preparation method thereof | |
| CN104772583A (en) | Preparing method of zinc-aluminum alloy welding wires | |
| CN107971652A (en) | A kind of electrovacuum solder and preparation method thereof | |
| CN103358048A (en) | Silver, copper and phosphorus system vacuum brazing filler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141008 Termination date: 20211022 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |