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CN102861745B - Power-off protection silicon chip cleaning machine - Google Patents

Power-off protection silicon chip cleaning machine Download PDF

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Publication number
CN102861745B
CN102861745B CN201210348357.XA CN201210348357A CN102861745B CN 102861745 B CN102861745 B CN 102861745B CN 201210348357 A CN201210348357 A CN 201210348357A CN 102861745 B CN102861745 B CN 102861745B
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China
Prior art keywords
pipeline
seal valve
normally closed
ripple seal
silicon wafer
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Active
Application number
CN201210348357.XA
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Chinese (zh)
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CN102861745A (en
Inventor
张绍国
何金群
裴立坤
吴仪
王好肖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Sevenstar Electronics Co Ltd
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Beijing Sevenstar Electronics Co Ltd
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Priority to CN201210348357.XA priority Critical patent/CN102861745B/en
Publication of CN102861745A publication Critical patent/CN102861745A/en
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Abstract

The invention discloses a power-off protection silicon chip cleaning machine, which comprises a process chamber and N2 pipelines positioned at the bottom of the process chamber, wherein the N2 pipelines comprise a normally-open N2 pipeline and a normally-closed N2 pipeline which are arranged in parallel; a normally-open corrugated sealing valve is arranged on the normally-open N2 pipeline; and a normally-closed corrugated sealing valve is arranged on the normally-closed N2 pipeline. Double-channel interlocking parallel design is adopted in the power-off protection silicon chip cleaning machine, and when a main power supply of equipment fails, the N2 pipelines are not interrupted due to power-off by opposite control actions of the two interlocked corrugated sealing valves, so that clean environment of the cleaning machine is ensured.

Description

The silicon wafer cleaner of anti-power failure protection
Technical field
The present invention relates to Semiconductor Cleaning Technology field, particularly a kind of silicon wafer cleaner of anti-power failure protection.
Background technology
At semicon industry, need to be to after the silicon chip postchannel process copper-connection stage, porous medium material carries out hyperfine cleaning, Chuck(chuck) the silicon chip High Rotation Speed of clamping completes while cleaning, cleans and comprise that liquid rinsing, ultra-pure water rinse and N in processing chamber 2the techniques such as drying.Clean process in order to realize the recycling to chemical liquid, processing chamber adopts hierarchical design, Up/down unit drives Chuck to each technique position, drives Chuck to do high speed rotary motion by servomotor, by centrifugal force, chemical liquid is thrown to special accumulator tank the inside.In order to prevent that chemical liquids from water clock occurring downwards, need to be at the bottom of processing chamber back to blowing up N 2thereby, form one deck gas shield film from bottom to top in silicon chip bottom.Generally, if power-off occurs suddenly equipment, chemical liquids will remain in above silicon chip, if silicon chip bottom N now 2protection gas interrupts, and liquid may be by silicon chip edge water clock to processing chamber the inside, and severe contamination cleans the cleannes of environment.If whole equipment adopts UPS power-off protection, cost is higher.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is, for the deficiencies in the prior art, to provide a kind of silicon wafer cleaner of anti-power failure protection, to N 2pipeline carries out binary channels design, thereby ensures whole cleaning process N 2passage is all the time in unimpeded state.
(2) technical scheme
The silicon wafer cleaner that the invention provides a kind of anti-power failure protection, comprising: processing chamber and the N that is positioned at processing chamber bottom 2pipeline, described N 2pipeline comprises: often open N 2pipeline and normally closed N 2pipeline, the described N that often opens 2pipeline and normally closed N 2pipeline is arranged in parallel, the described N that often opens 2pipeline is provided with and often opens ripple seal valve, described normally closed N 2pipeline is provided with normally closed ripple seal valve.
Wherein, when described, when often opening ripple seal valve and opening, described normally closed ripple seal valve is closed; When described, when often opening ripple seal valve and closing, described normally closed ripple seal valve is opened.
Wherein, described ripple seal valve and the normally closed ripple seal valve often opened is by electromagnetism valve island pneumatic control.
Wherein, the silicon wafer cleaner of anti-power failure protection also comprises: be positioned at the pressure needle-valve on normally closed ripple seal valve front end pipeline.
Wherein, the silicon wafer cleaner of anti-power failure protection also comprises: be positioned at the check valve on the pipeline of normally closed ripple seal valve rear end.
Wherein, the silicon wafer cleaner of anti-power failure protection also comprises: be positioned at ultrasonic flowmeter and the filter often opened on the pipeline of ripple seal valve rear end, described ultrasonic flowmeter is positioned on the front end pipeline of described filter.
(3) beneficial effect
The silicon wafer cleaner of anti-power failure protection provided by the invention, adopts binary channels interlocking Parallel Design, and in the time of equipment main power source generation power-off, the ripple seal valve of two interlockings, by contrary control action, makes N 2path can not interrupt because of power-off, ensures cleaning machine clean environment.Brief description of the drawings
Fig. 1 is the silicon wafer cleaner pipeline structure schematic diagram of anti-power failure protection of the present invention;
Fig. 2 is the processing chamber structural representation of the silicon wafer cleaner of anti-power failure protection of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1, the invention provides a kind of silicon wafer cleaner of anti-power failure protection, comprising: processing chamber 8 and the N that is positioned at processing chamber bottom 2pipeline, described N 2pipeline comprises: often open N 2pipeline 9 and normally closed N 2pipeline 10, the described N that often opens 2pipeline 9 and normally closed N 2pipeline 10 is arranged in parallel, the described N that often opens 2pipeline 9 is provided with and often opens ripple seal valve 4, described normally closed N 2pipeline 10 is provided with normally closed ripple seal valve 3.When described, when often opening ripple seal valve 4 and opening, described normally closed ripple seal valve 3 is closed, and when described, when often opening ripple seal valve 4 and closing, described normally closed ripple seal valve 3 is opened.Described ripple seal valve 4 and the normally closed ripple seal valve 3 of often opening is by electromagnetism valve island pneumatic control.
The silicon wafer cleaner of anti-power failure protection also comprises: be positioned at pressure needle-valve 2 on normally closed ripple seal valve 3 front end pipelines, be positioned at the check valve 7 on normally closed ripple seal valve 3 rear end pipelines and be positioned at ultrasonic flowmeter 5 and the filter 6 often opened on ripple seal valve 4 rear end pipelines, described ultrasonic flowmeter 5 is positioned on the front end pipeline of described filter 6.
Operation principle:
After device start, by high definition digital pressure switch 1, by default, to needed gas pressure, dry clean source of the gas (CDA) gas by electromagnetism valve island control is to often opening ripple seal valve 4 and normally closed ripple seal valve 3 carries out pneumatic control, often opens ripple seal valve 4 and opens formation and often open N 2pipeline 9; Normally closed ripple seal valve 3 is opened and is formed normally closed N 2pipeline 10, on the pipeline of normally closed ripple seal valve 3 front ends, arrange one can manual adjustments pressure needle-valve 2, manual unlocking pressure needle-valve 2 after device start, N when ensureing power-off 2can pass through smoothly.Described normally closed ripple seal valve 3 is by the open closed condition, normally closed N of being switched to 2pipeline 10 disconnects; Often open 4 of ripple seal valves and be switched to open mode by closed condition, often open N 2pipeline 9 keeps unimpeded, N 2through ultrasonic flowmeter 5 and filter 6, enter processing chamber 8.As shown in Figure 2, in described processing chamber, air flue adopts reducing, airflow design, under processing chamber 8 top silicon chips, place, edge offers evenly spaced oblique circular hole, ensures that air-flow has enough pressure to spray from inclined hole, forms the bottom-up mobile N of one deck in silicon chip bottom 2diaphragm.
Above embodiment is only for illustrating the present invention; and be not limitation of the present invention; the those of ordinary skill in relevant technologies field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.

Claims (5)

1. a silicon wafer cleaner for anti-power failure protection, is characterized in that, comprising: processing chamber and the N that is positioned at processing chamber bottom 2pipeline, described N 2pipeline comprises: often open N 2pipeline and normally closed N 2pipeline, the described N that often opens 2pipeline and normally closed N 2pipeline is arranged in parallel, the described N that often opens 2pipeline is provided with and often opens ripple seal valve, described normally closed N 2pipeline is provided with normally closed ripple seal valve, and normally closed ripple seal valve front end pipeline is provided with pressure needle-valve.
2. silicon wafer cleaner as claimed in claim 1, is characterized in that, when described, when often opening ripple seal valve and opening, described normally closed ripple seal valve is closed; When described, when often opening ripple seal valve and closing, described normally closed ripple seal valve is opened.
3. silicon wafer cleaner as claimed in claim 1 or 2, is characterized in that, described ripple seal valve and the normally closed ripple seal valve often opened is by electromagnetism valve island pneumatic control.
4. silicon wafer cleaner as claimed in claim 1, is characterized in that, the silicon wafer cleaner of anti-power failure protection also comprises: be positioned at the check valve on the pipeline of normally closed ripple seal valve rear end.
5. silicon wafer cleaner as claimed in claim 1; it is characterized in that; the silicon wafer cleaner of anti-power failure protection also comprises: be positioned at ultrasonic flowmeter and the filter often opened on the pipeline of ripple seal valve rear end, described ultrasonic flowmeter is positioned on the front end pipeline of described filter.
CN201210348357.XA 2012-09-18 2012-09-18 Power-off protection silicon chip cleaning machine Active CN102861745B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210348357.XA CN102861745B (en) 2012-09-18 2012-09-18 Power-off protection silicon chip cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210348357.XA CN102861745B (en) 2012-09-18 2012-09-18 Power-off protection silicon chip cleaning machine

Publications (2)

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CN102861745A CN102861745A (en) 2013-01-09
CN102861745B true CN102861745B (en) 2014-07-30

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201171925Y (en) * 2007-11-26 2008-12-31 北京有色金属研究总院 Isopropyl alcohol supply device used in silicon-slice isopropyl alcohol drying method
CN102005367A (en) * 2010-09-10 2011-04-06 上海集成电路研发中心有限公司 Semiconductor silicon wafer cleaning process cavity and cleaning method
CN201935527U (en) * 2010-12-08 2011-08-17 北京有色金属研究总院 Quick drying device used after cleaning of silicon chip
CN202824050U (en) * 2012-09-18 2013-03-27 北京七星华创电子股份有限公司 Anti-power-off protective silicon wafer cleaning machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864568A (en) * 1994-08-23 1996-03-08 Toshiba Corp Wafer cleaning device
JP4623706B2 (en) * 2004-04-14 2011-02-02 東京エレクトロン株式会社 Ultrasonic cleaning equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201171925Y (en) * 2007-11-26 2008-12-31 北京有色金属研究总院 Isopropyl alcohol supply device used in silicon-slice isopropyl alcohol drying method
CN102005367A (en) * 2010-09-10 2011-04-06 上海集成电路研发中心有限公司 Semiconductor silicon wafer cleaning process cavity and cleaning method
CN201935527U (en) * 2010-12-08 2011-08-17 北京有色金属研究总院 Quick drying device used after cleaning of silicon chip
CN202824050U (en) * 2012-09-18 2013-03-27 北京七星华创电子股份有限公司 Anti-power-off protective silicon wafer cleaning machine

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