CN102869197A - Method for forming flexible circuit board - Google Patents
Method for forming flexible circuit board Download PDFInfo
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- CN102869197A CN102869197A CN2011101869097A CN201110186909A CN102869197A CN 102869197 A CN102869197 A CN 102869197A CN 2011101869097 A CN2011101869097 A CN 2011101869097A CN 201110186909 A CN201110186909 A CN 201110186909A CN 102869197 A CN102869197 A CN 102869197A
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- electrically conductive
- conductive composition
- circuit board
- deflection circuit
- formation
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a method for forming a flexible circuit board. An insulation base board including a first face and a second face is provided; and a through hole located in the insulating base board and used for communicating the first face with the second face is formed. The method comprises the following steps of: performing a printing step, wherein a conductive precursor is printed on the first face, the conductive precursor is covered and embedded in the through hole; and curing the conductive precursor and forming a conductive composition while forming a circuit to obtain a flexible circuit board, wherein the conductive composition includes at least one of silver and carbon.
Description
Technical field
The present invention relates to a kind of method that forms deflection circuit board.The present invention is specifically related to conduction precursor that a kind of printing comprises silver or carbon on insulated substrate, again slaking conduction precursor and form the method for deflection circuit board.The conduction precursor covers simultaneously and inserts in the first surface that is communicated with insulated substrate and second 's the through hole.The inventive method can reduce the consumption of copper metal, with Decrease production cost.
Background technology
By the made circuit board of deflection material, in various electronic products now, use very extensive.Because metallic copper has excellent conductivity, especially the first first-selection of the electric conducting material of circuit in the circuit board.
In general, make the method for circuit in the circuit board normally, the insulating substrate of whole piece coated copper is provided.Then form the mask of patterning at the copper layer, to define the pattern of circuit.Re-using etching mode removes unnecessary copper layer and obtains being positioned at copper conductor on the insulating substrate.
In the recent period, because the price of raw material is constantly soaring, coat the cost of fine copper base material also because when the river rises the boat goes up, cause burden arduous on the production cost.In addition, after etching, major part is not carried out removal in order to the copper layer as wire, not only waste, and also producing a large amount of waste copper liquids need to be by extra process.This does not meet the Production trend of now environmental protection and energy saving yet.
Therefore, still need a kind of novel method of making deflection circuit board.Can not use metallic copper as wire, and save the production cost that uses expensive metal copper.In addition, also wish to omit the step of etched copper, and with the loss reduce of raw material, meet the Production trend of now environmental protection and energy saving.
Summary of the invention
So the present invention proposes a kind of method that forms deflection circuit board.Deflection circuit board of the present invention is not because use the full wafer metallic copper as the source of wire pattern, so can save the production cost that uses expensive metal copper.In addition, the present invention also omits the step of etched copper, so can also with the loss reduce of raw material, meet again the Production trend of now environmental protection and energy saving.
In the method for formation deflection circuit board proposed by the invention, at first provide the insulated substrate (step 1) that comprises first surface and second.Secondly, form and be arranged in insulated substrate and be communicated with first surface and second through hole (step 2).Then, carry out a print steps (step 3), and at first surface printing one conduction precursor, this conduction precursor also covers simultaneously in printing process and inserts in the through hole.Continue, slaking conduction precursor (step 6) has just formed an electrically conductive composition, obtains simultaneously a circuit, to become a deflection circuit board.Wherein electrically conductive composition comprises at least a of silver and carbon.
Implement in the aspect of the present invention first, electrically conductive composition is in fact without copper.Implement in the aspect of the present invention second, if when electrically conductive composition comprised the silver slurry of slaking, the live width of electrically conductive composition was not less than 60 millimeters, and the line-spacing of electrically conductive composition is not less than 70 millimeters.Implement in the aspect the of the present invention the 3rd, if when electrically conductive composition comprised the carbon slurry of slaking, the live width of electrically conductive composition was 100 millimeters to 150 millimeters, and the line-spacing of electrically conductive composition is not less than 150 millimeters.Implement can before print steps, to carry out a surfaction step (step 4) in the aspect the of the present invention the 4th, and between 130 ℃ to 150 ℃ of temperature alligatoring first surface 30 minutes to 60 minutes.Implement to carry out a pre-treatment step in the aspect the of the present invention the 5th, and make the electricity consumption slurry process insulated substrate.
Implement before print steps, can also carry out a surface cleaning (step 5) in the aspect the of the present invention the 6th, with static cleaning first surface.Implement in the aspect the of the present invention the 7th, electrically conductive composition can form the electrode with special pattern, and this special pattern can be pattern, literal or numeral.Implement in the aspect the of the present invention the 8th, the conduction precursor can also be formed at second upper (step 8).Then, slaking conduction precursor, and upward form electrically conductive composition and cover through hole in second is so that the electrically conductive composition that is positioned on second can be electrically connected via through hole with electrically conductive composition on being positioned at first surface.Implement in the aspect the of the present invention the 9th, electrically conductive composition can be the first electrically conductive composition and one second electrically conductive composition, so that the first electrically conductive composition covers the second electrically conductive composition.Implement to form electrical connection pad (step 7) at second in the aspect the of the present invention the tenth.Implement to carry out a circuit test (step 9) to electrically conductive composition in the aspect the of the present invention the 12.Implement to cover the second electrically conductive composition (step 10) with the first electrically conductive composition in the aspect the of the present invention the 13.Implement to cover the insulated substrate (step 11) of first surface with welding resisting layer in the aspect the of the present invention the 14.Implement to cover second insulated substrate (step 12) with welding resisting layer in the aspect the of the present invention the 15.Implement in the aspect the of the present invention the 16, can cut insulated substrate becomes strip (step 13).
Description of drawings
Fig. 1 illustrates the flow chart that the present invention forms the deflection circuit board method.
Fig. 2 to Figure 11 then illustrates the schematic diagram that the present invention forms the deflection circuit board method, wherein
Fig. 2 illustrates the pre-treatment step of insulated substrate;
Fig. 2 illustrates and form at least one through hole in insulated substrate;
Fig. 3 illustrates and carries out surface treatment step;
Fig. 4 illustrates on the first surface of insulated substrate and carries out print steps;
Fig. 5 illustrates slaking conduction precursor and forms electrically conductive composition;
Fig. 6 illustrates the formation electrical connection pad;
Fig. 7 illustrates and carries out circuit test;
Fig. 8 illustrates with the first electrically conductive composition and covers the second electrically conductive composition;
Fig. 9 illustrates the pattern of the pattern covers electrically conductive composition of welding resisting layer;
Figure 10 illustrates so that the pattern of the pattern of welding resisting layer and electrically conductive composition is complementary;
Figure 11 illustrates and cuts insulated substrate.
Wherein, description of reference numerals is as follows:
Two insulated substrate is communicated with first surface and second 's
Through hole
Step 5 surface cleaning step 6 slaking conduction precursor
Step 7 forms electrical connection pad step 8 and will conduct electricity precursor and be formed at second
On the face
Step 9 is carried out circuit test step 10 and is come with the first electrically conductive composition
Cover the second electrically conductive composition
Step 11 covers step 12 with welding resisting layer and covers second with welding resisting layer
The insulated substrate of the insulated substrate face of one side
Step 13 cuts insulated substrate becomes bar 110 look edge substrates
Shape
112 second of 111 first surfaces
113 through holes, 120 conduction precursors
121 electrically conductive compositions, 122 circuit
123 deflection circuit boards, 124 first electrically conductive compositions
125 second electrically conductive compositions, 126 configurations
131 welding resisting layers, 139 electrical connection pads
Embodiment
The present invention can provide a kind of method that forms deflection circuit board.Deflection circuit board of the present invention can be save the production cost that uses expensive metal copper.In addition, the inventive method can also be with the loss reduce of raw material.Electrically conductive composition in the deflection circuit board of the present invention can be silver slurry, carbon slurry or its combination of slaking.
Fig. 1 illustrates the flow chart that the present invention forms the deflection circuit board method.Fig. 2 to Figure 11 then illustrates the schematic diagram that the present invention forms the deflection circuit board method.At first, please refer to Fig. 1 and Fig. 2, an insulated substrate 110 is provided.Insulated substrate 110 comprises one group of upper and lower relative first surface 111 and second 112.The bendable material of normally a kind of heatproof of insulated substrate 110 more than 150 ℃, for example polyethylene terephthalate (polyethylene terephthalate, PET), polyimides (polyimide) or glass fibre (glass fiber) etc.Preferred person, insulated substrate 110 can be first through a pre-treatment step, with the character of stable insulation substrate 110.For example, insulated substrate 110 toasted 30-60 minute in 130 ℃-180 ℃ scope, with the size of stable insulation substrate 110.Insulated substrate 110 ' before Fig. 2 represents to process with the dotted line person of illustrating.
Secondly, please refer to Fig. 1 and Fig. 2, in insulated substrate 110, form at least one through hole 113, with the first surface 111 that is communicated with insulated substrate 110 and second 112.Can form with different modes through hole 113, so that the aperture of through hole 113 is between about the 0.05-0.5 millimetre, and be positioned on the preposition.For example, can use drill point to punch insulated substrate 110, so that the aperture of through hole 113 is large than 0.1 millimeter.Or, need less aperture, can form through hole 113 with laser, so that through hole 113 minimums can be down to about 0.05 millimeter.
Then, please refer to Fig. 1 and Fig. 4, carry out a print steps at the first surface 111 of insulated substrate 110.For example, can use the screen painting step, with a conduction precursor 120, be printed on the first surface 111 of insulated substrate 110, and the figure that obtains being scheduled to.In printing process, also conduction precursor 120 can be covered and inserts in the through hole 113 simultaneously.Electrically conductive composition forms at least a of a pattern, a literal and a numeral.
Depending on the circumstances or the needs of the situation, please refer to Fig. 1 and Fig. 3, before print steps, can also carry out a surface treatment step.Surfaction step roughens first surface 111 for example is to increase the adhesive force of conduction precursor 120 and insulated substrate 110.For example, can make electricity consumption starch to carry out this surfaction step.In addition, depending on the circumstances or the needs of the situation, please refer to Fig. 1 and Fig. 3, before print steps, can also carry out a surface cleaning, with cleaning first surface 111.For example, can use static to remove dust particle on the first surface 111.
Next, please refer to Fig. 1 and Fig. 5, just can carry out a maturation stage and come slaking conduction precursor 120, and form an electrically conductive composition 121, for example slaking conduction precursor 120 about 30 minutes to 60 minutes between 130 ℃ to 180 ℃ of temperature.Because conduction precursor 120 has predetermined figure, so electrically conductive composition 121 just can form a circuit 122.Be positioned at the electrically conductive composition 121 on the insulated substrate 110, just become together deflection circuit board 123.Because conduction precursor 120 has predetermined figure, so electrically conductive composition 121 just can form pattern, literal or numeral.For example, if deflection circuit board 123 is used for showing consumer information, electrically conductive composition 121 can form required numeral, and for example 0,1,2,3,4,5,6,7,8,9, or letter, G for example, K, M, Q, e, f, t, v, Ξ, Ψ, β, δ ... etc., or symbol, $ for example, *, %, ￡
, $,
... etc.Preferred person, electrically conductive composition 121 can be formed for showing the electrode of above information, such as the show electrode that comprises liquid crystal display (LCD), light-emitting diode (LED) or Organic Light Emitting Diode (OLED) etc.
On the other hand, if electrically conductive composition comprises the carbon slurry of slaking, those are in circuit 122 formed patterns, and the live width of electrically conductive composition 121 can be between 100 millimeters to 150 millimeters, and line-spacing then can be not less than 150 millimeters, for example greater than 150 millimeters.Electrically conductive composition 121 can also comprise the first electrically conductive composition 124 and the second electrically conductive composition 125.
Depending on the circumstances or the needs of the situation, please refer to Fig. 1 and Fig. 6, can also form electrical connection pad 139 at second 112.Electrical connection pad 139 not only is positioned on second 112, and covers through hole 113.Thus, electrical connection pad 139 namely can be used as the electrically conductive composition 121 outside media that are electrically connected that are positioned on the first surface 111.Through after the above step, just can obtain a single face and have electrically conductive composition 121 as the deflection circuit board 123 of circuit 122.Through hole 113 can with the circuit 122 on the first surface 111, extend to preposition on second 112.
Depending on the circumstances or the needs of the situation, in another execution mode of the present invention, conduction precursor 120 can also be formed on second 112, and form the electrically conductive composition 121 that is electrically connected with circuit 122 on the first surface 111 at second 112.Please refer to Fig. 1 and Fig. 7, the precursor that will conduct electricity first is formed on second 112, then with reference to aforementioned, and slaking conduction precursor, and on second 112, form the electrically conductive composition 121 of another layer.Be positioned at the electrically conductive composition 121 on second 112, also can cover through hole 113, so be positioned at the electrically conductive composition 121 on second, can be electrically connected via through hole 113 with electrically conductive composition 121 on being positioned at first surface 111.The electrically conductive composition 121 that is positioned on second 112 can form a configuration 126, and the circuit 122 on first surface 111 forms a loop or opens circuit.
Depending on the circumstances or the needs of the situation, please refer to Fig. 1 and Fig. 7, the electrically conductive composition 121 on the electrically conductive composition 121 on can also first surface 111 and/or second carries out a circuit test, to confirm the reliability of electrically conductive composition 121.In the art, for different deflection circuit board 123 different circuit testing methods can be arranged, and be known by this area personage, so do not add to give unnecessary details.
Although through said method, just can form required deflection circuit board 123, electrically conductive composition 121 is exposed under the extraneous environmental impact.If wish to improve the reliability of electrically conductive composition 121, the frequency converter of relatively more fragile electrically conductive composition 121 can also be got up.
In an embodiment of the present invention, please refer to Fig. 8, can cover the second electrically conductive composition 125 with the first electrically conductive composition 124, so that the second electrically conductive composition 125 avoids extraneous moisture or the pollution of dust.At this moment, the first electrically conductive composition 124 can be the carbon slurry of slaking.
In another execution mode of the present invention, can cover with welding resisting layer 131 insulated substrate 110 of first surface 111.Please refer to Fig. 9, form the welding resisting layer 131 that is positioned at first surface 111, so that welding resisting layer 131 covers circuit 122.Also can be, please refer to Figure 10, not have welding resisting layer 131.
In the another execution mode of the present invention, can also cover with welding resisting layer 131 second 112 insulated substrate 110.Please refer to Fig. 9, can form the welding resisting layer 131 that is positioned at second 112, so that welding resisting layer 131 covers electrically conductive composition 121.Also can be, please refer to Figure 10, so that the pattern of the pattern of welding resisting layer 131 and electrically conductive composition 121 is complementary.
Depending on the circumstances or the needs of the situation, the deflection circuit board 123 of finishing can also via suitable cutting, become needed size.For example, please refer to the 11st figure, cut insulated substrate 110, so that deflection circuit board 123 becomes than small pieces, for example become strip.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (24)
1. a method that forms deflection circuit board is characterized in that, comprising:
One insulated substrate is provided, comprises a first surface and one second;
Form a through hole, be arranged in described insulated substrate and be communicated with described first surface and described second;
Carry out a screen painting step, and more cover and insert described through hole at described first surface printing one conduction precursor; And
Carry out a maturation stage, form an electrically conductive composition in described conduction precursor and form a circuit obtaining described deflection circuit board, the silver slurry that wherein said electrically conductive composition comprises slaking is at least a with carbon.
2. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described electrically conductive composition is in fact without copper.
3. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described insulated substrate comprises at least a of polyethylene terephthalate, polyimides and glass fibre.
4. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, the live width of described electrically conductive composition is greater than 60 millimeters.
5. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, the line-spacing of described electrically conductive composition is greater than 70 millimeters.
6. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described electrically conductive composition comprises the carbon slurry of slaking.
7. the method for formation deflection circuit board as claimed in claim 6 is characterized in that, the live width of described electrically conductive composition is 100 millimeters to 150 millimeters.
8. the method for formation deflection circuit board as claimed in claim 6 is characterized in that, the line-spacing of described electrically conductive composition is greater than 150 millimeters.
9. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, uses at least a to form described through hole of drill point or laser.
10. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, the diameter of described through hole is greater than 0.1 millimeter.
11. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, also comprises:
Form an electrical connection pad, be positioned at described second and go up and cover described through hole.
12. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, also comprises before described print steps:
Carry out a surfaction step, and make the described first surface of electricity consumption slurry alligatoring.
13. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, also comprises:
Carry out a pre-treatment step, to process described insulated substrate.
14. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described maturation stage described conduction precursor of slaking 30 minutes to 60 minutes between 130 ℃ to 180 ℃ of temperature.
15. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described electrically conductive composition forms at least a of a pattern, a literal and a numeral.
16. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described electrically conductive composition forms an electrode.
17. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, also comprises:
Described conduction precursor is formed on described second;
The described conduction precursor of slaking, and upper form described electrically conductive composition and cover described through hole in described second, the described electrically conductive composition that is positioned on described second is electrically connected via described through hole with described electrically conductive composition on being positioned at described first surface.
18. the method for formation deflection circuit board as claimed in claim 17 is characterized in that, the described electrically conductive composition that is positioned on described second forms a circuit.
19. the method for formation deflection circuit board as claimed in claim 18 is characterized in that, is positioned at described second described electrically conductive composition and opens circuit with the described electrically conductive composition formation that is positioned at described first surface.
20. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, described electrically conductive composition comprises one first electrically conductive composition and one second electrically conductive composition.
21. the method for formation deflection circuit board as claimed in claim 20 is characterized in that, described the first electrically conductive composition covers described the second electrically conductive composition.
22. the method for formation deflection circuit board as claimed in claim 20 is characterized in that, described the first electrically conductive composition comprises the carbon slurry.
23. the method for formation deflection circuit board as claimed in claim 1 is characterized in that, also comprises:
Formation is positioned at a welding resisting layer of described first surface, so that described welding resisting layer covers described electrically conductive composition and becomes wherein at least a with described electrically conductive composition complementation.
24. the method for formation deflection circuit board as claimed in claim 17 is characterized in that, also comprises:
Formation is positioned at described second welding resisting layer, so that described welding resisting layer covers described electrically conductive composition and becomes wherein at least a with described electrically conductive composition complementation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101869097A CN102869197A (en) | 2011-07-05 | 2011-07-05 | Method for forming flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101869097A CN102869197A (en) | 2011-07-05 | 2011-07-05 | Method for forming flexible circuit board |
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|---|---|
| CN102869197A true CN102869197A (en) | 2013-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101869097A Pending CN102869197A (en) | 2011-07-05 | 2011-07-05 | Method for forming flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104529534A (en) * | 2014-12-29 | 2015-04-22 | 中国科学技术大学 | Method for improving flexoelectric effect of ferroelectric oxide material |
| CN111072381A (en) * | 2018-10-22 | 2020-04-28 | 中国科学技术大学 | Method for controlling dielectric material apparent flexoelectric effect |
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| US5633069A (en) * | 1989-02-23 | 1997-05-27 | Fuji Xerox Co., Ltd. | Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
| US6132543A (en) * | 1997-03-14 | 2000-10-17 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a packaging substrate |
| US20020159242A1 (en) * | 2000-03-17 | 2002-10-31 | Seiichi Nakatani | Module with built-in electronic elements and method of manufacture thereof |
| US20060263003A1 (en) * | 2003-11-27 | 2006-11-23 | Ibiden Co., Ltd. | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| CN101534609A (en) * | 2008-03-12 | 2009-09-16 | 欣兴电子股份有限公司 | Circuit structure of circuit board and method for manufacture same |
-
2011
- 2011-07-05 CN CN2011101869097A patent/CN102869197A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5633069A (en) * | 1989-02-23 | 1997-05-27 | Fuji Xerox Co., Ltd. | Multilayer printed-circuit substrate, wiring substrate and process of producing the same |
| US6132543A (en) * | 1997-03-14 | 2000-10-17 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a packaging substrate |
| US20020159242A1 (en) * | 2000-03-17 | 2002-10-31 | Seiichi Nakatani | Module with built-in electronic elements and method of manufacture thereof |
| CN1381069A (en) * | 2000-03-17 | 2002-11-20 | 松下电器产业株式会社 | Module with built-in electronic elements and method of manufacture thereof |
| US20060263003A1 (en) * | 2003-11-27 | 2006-11-23 | Ibiden Co., Ltd. | Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard |
| CN101534609A (en) * | 2008-03-12 | 2009-09-16 | 欣兴电子股份有限公司 | Circuit structure of circuit board and method for manufacture same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104529534A (en) * | 2014-12-29 | 2015-04-22 | 中国科学技术大学 | Method for improving flexoelectric effect of ferroelectric oxide material |
| CN111072381A (en) * | 2018-10-22 | 2020-04-28 | 中国科学技术大学 | Method for controlling dielectric material apparent flexoelectric effect |
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Application publication date: 20130109 |