CN102867770A - Silicon chip clamp for silicon chip implantation process - Google Patents
Silicon chip clamp for silicon chip implantation process Download PDFInfo
- Publication number
- CN102867770A CN102867770A CN2011101864479A CN201110186447A CN102867770A CN 102867770 A CN102867770 A CN 102867770A CN 2011101864479 A CN2011101864479 A CN 2011101864479A CN 201110186447 A CN201110186447 A CN 201110186447A CN 102867770 A CN102867770 A CN 102867770A
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- CN
- China
- Prior art keywords
- silicon chip
- egative film
- moving block
- wafer chuck
- rivet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a silicon chip clamp used for a silicon chip implantation process. The silicon chip clamp mainly comprises a base chip 1, a silicon chip 2, a rotating block 3, a rivet 4, a position spring leaf 5 and the like; the device is characterized in that the diameter of the base chip 1 is larger than the diameter of the silicon chip 2; the silicon chip 2 is fixed inside a groove of the base chip 2 by using the rotating block 3; and the spring leaf 5 can be positioned at two different positions respectively. The working principle of the device is described specifically in the specification, and the detailed embodiments are provided.
Description
Technical field
The present invention relates to a kind of wafer chuck for the silicon chip injection technology, be particularly suitable for the ion implantor in the semiconductor manufacturing equipment.
Background technology
Ion implantor is the exemplary apparatus that the semiconductor technology intermediate ion mixes, and ion source produces the ion beam that needs doping, and ion beam passes through quality analysis, correction, acceleration again, is transferred to the silicon chip surface that is in target chamber end process cavity.
Along with the semiconductor device integrated level is more and more higher, semiconductor manufacturing equipment becomes increasingly complex, and wafer size is increasing.Sophisticated equipment is the wafer of the present main flow of successful Application, and its diameter dimension is 12 inches.But a lot of wafer sizes are less, do not satisfy the flow target platform of present main flow semiconductor equipment, so the present invention announced a kind of wafer chuck for the silicon chip injection technology, are used for existing wafer holder, to satisfy the requirement of large-sized wafer process equipment.
Summary of the invention
Requirement for existing semiconductor manufacturing equipment silicon chip and target platform size, the present invention designs a kind of wafer chuck for the silicon chip injection technology, can realize in ion implantation device technique the silicon chip of different size is placed on the same size silicon wafer stage, can also realize that same size silicon chip can adapt to the silicon wafer stage of different size.This wafer chuck has solved the different size silicon chip transmitted and annotated the sheet process at same target platform linking, has also solved same size silicon chip transmitted and annotated the sheet process at different size target interstation linking, Effective Raise annotate in batches speed and the efficient of sheet.
The technical solution adopted for the present invention to solve the technical problems is: silicon chip can be embedded and is fixed on the wafer chuck by designing a kind of wafer chuck; In technological process, the wafer chuck that loads silicon chip is treated as silicon chip transmit and annotate sheet.
The present invention has following distinguishing feature:
1. simple in structure, be convenient to processing and manufacturing;
2. work is quick, and loading silicon chip efficient is high;
Description of drawings
Fig. 1 is a kind of wafer chuck assembly schematic diagram for the silicon chip injection technology.
Fig. 2 is the schematic diagram after the present invention loads silicon chip
Embodiment
The invention will be described further below in conjunction with the drawings and specific embodiments, but not as the restriction to patent of the present invention.
The invention discloses a kind of wafer chuck for the silicon chip injection technology, be applicable to ion implantor silicon chip injection process.As shown in Figure 1, this invention mainly comprises: egative film (1), silicon chip (2), moving block (3), rivet (4), positioning ejection reed (5) etc.This device characteristic is, egative film (1) has two location slotted eyes; Egative film (1) has the silicon chip positioning boss, and its radial dimension is consistent with silicon chip (2); The all boss edges of egative film (1) have two projections that are parallel to egative film, the parallel distance of this projection and egative film (1) and silicon chip (2) consistency of thickness; Egative film (1) center has cruciform vent, to eliminate machining stress.
Egative film (1) uses rivet (4) to connect with moving block (3), and moving block (3) can rotate take rivet (4) center as axle.
Positioning ejection reed (5) is fixed on the moving block (3) by rivet or other connecting modes.
When loading silicon chip (2), use moving block (3) that silicon chip (2) is fixed in the groove of egative film (2); Positioning ejection reed (5) can be positioned at two different positions by two on the egative film (1) location slotted eyes respectively; Silicon chip (2) is embedded in the boss of egative film (1), and is fixed by two projections at boss edge.Schematic diagram behind the loading silicon chip (2) as shown in Figure 2.
Specific embodiment of the present invention elaborates content of the present invention.For persons skilled in the art, any apparent change of without departing from the premise in the spirit of the present invention it being done all consists of the infringement to patent of the present invention, will bear corresponding legal liabilities.
Claims (4)
1. a wafer chuck that is used for the silicon chip injection technology mainly comprises: egative film (1), silicon chip (2), moving block (3), rivet (4), positioning ejection reed (5) etc.This device characteristic is, egative film (1) diameter uses moving block (3) that silicon chip (2) is fixed in the groove of egative film (2) greater than silicon chip (2), and positioning ejection reed (5) can be positioned at respectively two different positions.
2. such as claim 1 described a kind of wafer chuck for the silicon chip injection technology, it is characterized in that: egative film (1) uses rivet (4) to connect with moving block (3), and moving block (3) can rotate take rivet (4) center as axle;
3. such as claim 1 described a kind of wafer chuck for the silicon chip injection technology, it is characterized in that: positioning ejection reed (5) is embedded on the moving block (3), and fixing.
4. such as claim 1 described a kind of top frame device of wafer, it is characterized in that: egative film (1) has location hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101864479A CN102867770A (en) | 2011-07-05 | 2011-07-05 | Silicon chip clamp for silicon chip implantation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101864479A CN102867770A (en) | 2011-07-05 | 2011-07-05 | Silicon chip clamp for silicon chip implantation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102867770A true CN102867770A (en) | 2013-01-09 |
Family
ID=47446544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101864479A Pending CN102867770A (en) | 2011-07-05 | 2011-07-05 | Silicon chip clamp for silicon chip implantation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102867770A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108732180A (en) * | 2017-04-14 | 2018-11-02 | 上海新昇半导体科技有限公司 | Wafer chuck, detection device and its detection method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62152136A (en) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | Spinning chuck for semiconductor wafer |
| JP2000141110A (en) * | 1998-11-04 | 2000-05-23 | Kinichi Kaneko | Claw for chuck device |
| JP2000223414A (en) * | 1998-10-12 | 2000-08-11 | Ims Ionen Mikrofab Syst Gmbh | Mask-holding device |
| KR100442455B1 (en) * | 2004-02-05 | 2004-07-31 | (주)그랜드 텍 | Wafer fixing device for scratch tester |
| JP2005203661A (en) * | 2004-01-19 | 2005-07-28 | Matsushita Electric Ind Co Ltd | Measuring method for sheet material, and measuring device |
| CN101764028A (en) * | 2008-12-04 | 2010-06-30 | 北京中科信电子装备有限公司 | Wafer implanting transition clamp for implanter |
-
2011
- 2011-07-05 CN CN2011101864479A patent/CN102867770A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62152136A (en) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | Spinning chuck for semiconductor wafer |
| JP2000223414A (en) * | 1998-10-12 | 2000-08-11 | Ims Ionen Mikrofab Syst Gmbh | Mask-holding device |
| JP2000141110A (en) * | 1998-11-04 | 2000-05-23 | Kinichi Kaneko | Claw for chuck device |
| JP2005203661A (en) * | 2004-01-19 | 2005-07-28 | Matsushita Electric Ind Co Ltd | Measuring method for sheet material, and measuring device |
| KR100442455B1 (en) * | 2004-02-05 | 2004-07-31 | (주)그랜드 텍 | Wafer fixing device for scratch tester |
| CN101764028A (en) * | 2008-12-04 | 2010-06-30 | 北京中科信电子装备有限公司 | Wafer implanting transition clamp for implanter |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108732180A (en) * | 2017-04-14 | 2018-11-02 | 上海新昇半导体科技有限公司 | Wafer chuck, detection device and its detection method |
| CN108732180B (en) * | 2017-04-14 | 2020-11-20 | 上海新昇半导体科技有限公司 | Silicon wafer clamp, detection device and detection method thereof |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130109 |