CN102850953B - Two-element water-based resin conductive adhesive and preparation method thereof - Google Patents
Two-element water-based resin conductive adhesive and preparation method thereof Download PDFInfo
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- CN102850953B CN102850953B CN201210274588.0A CN201210274588A CN102850953B CN 102850953 B CN102850953 B CN 102850953B CN 201210274588 A CN201210274588 A CN 201210274588A CN 102850953 B CN102850953 B CN 102850953B
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Abstract
The invention discloses a two-element water-based resin conductive adhesive which is prepared from a component A and a component B, wherein the component A comprises the following components in percentage by weight: 20-25% of gum arabic, 15-25% of acrylic acid, 1-10% of ethylene glycol monobutyl ether, 1-10% of glycerol, 3-15% of ethanol, 20-30% of water, 9-18% of graphite and 6-12% of carbon black; the component B is a curing agent prepared from a photoinitiator 1173 and a photoinitiator 369 in a weight ratio of 2:1; the component B accounts for 3-6% of the total weight of the components A and B; and the sum of the component A and component B is 100%. The invention also discloses a preparation method of the two-element water-based resin conductive adhesive. The invention has the advantages of environmental protection, high curing speed and low conductive filler amount; and the coating is thin (6 mu m), and the conductivity square resistance is 15 ohm.
Description
Technical field
The invention belongs to adhesive field, relate to a kind of conductive resin being applied to electronic industry, specifically relate to a kind of binary water-base resin electrically conductive composition and preparation method thereof.
Background technology
Conductive resin is as one of requisite material of electronic industry, progressively replace the connection of the methods such as original welding for electroconductibility, conductive resin is except satisfied conduction and bonding two requirements the most basic, can also at lesser temps even cured at room temperature, material deformation, components and parts are made to damage under avoiding high temperature, the loss etc. of stress concentration and the electromagnetic riveting machine signal of riveting can also be avoided, do not need special equipment again simultaneously.But at present for obtaining the conductive resin that conductivity is stablized and resistivity is low, all select precious metal that the specific conductivity such as silver, copper is good as conductive filler material, the massfraction of filler is general all at 60-80%, and this makes the cost of conductive resin greatly improve simultaneously; And mostly selected the epoxy resin of non-ambient friendly, urethane resin and resol as the carrier of conducting particles, adopted the method for heating to be cured, power consumption is large and curing speed is slow.Need to develop one environmentally friendly, curing speed is fast, production efficiency is high, and energy consumption is low, cheap conductive resin.
Summary of the invention
Technical problem to be solved by this invention be for current conductive resin not environmentally, not energy-conservation, amount of filler is too much and expensive problem, provides a kind of binary water-base resin conductive resin.
The technical problem that the present invention also will solve, is to provide the preparation method of above-mentioned binary water-base resin conductive resin.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20-25%;
Vinylformic acid 15-25%;
Butyl glycol ether 1-10%;
Glycerol 1-10%;
Ethanol 3-15%;
Water 20-30%;
Graphite 9-18%;
Carbon black 6-12%;
B component is solidifying agent, the forming by weight 2:1 by light trigger 1173 and light trigger 369;
The weight of B component is the 3-6% of A and B gross weight;
Component A material and B component material sum are 100%.
Wherein, component A preferably includes the component of following weight percentage:
Sudan Gum-arabic 20-25%;
Vinylformic acid 15-25%;
Butyl glycol ether 2-4%;
Glycerol 2-5%;
Ethanol 4-10%;
Water 20-30%;
Graphite 12-18%;
Carbon black 6-12%.
The preparation method of above-mentioned binary water-base resin conductive resin, first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then through grinding, packaging; B component mixes rear other packaging.
Wherein, being ground to granularity is 1 ~ 10 μm.
Beneficial effect: the invention has the advantages that:
1, environmental protection, curing speed is fast, and conductive filler amount is low;
2, coating is thinner is 6 μm, and electric conductivity square resistance is 15 ohm.
Embodiment
According to following embodiment, the present invention may be better understood.But those skilled in the art will readily understand, the content described by embodiment only for illustration of the present invention, and should can not limit the present invention described in detail in claims yet.
Embodiment 1:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 15%;
Butyl glycol ether 2%;
Glycerol 5%;
Ethanol 10%;
Water 30%;
Graphite 9%;
Carbon black 6%;
B component comprises the component of following weight percentage:
Light trigger 1,173 2%;
Light trigger 369 1%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 27 Ω, the thickness of glue-line is 6 μm.
Embodiment 2:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 15%;
Butyl glycol ether 2%;
Glycerol 5%;
Ethanol 10%;
Water 25%;
Graphite 12%;
Carbon black 8%;
B component comprises the component of following weight percentage:
Light trigger 1,173 2%;
Light trigger 369 1%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 20 Ω, the thickness of glue-line is 6 μm.
Embodiment 3:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 15%;
Butyl glycol ether 2%;
Glycerol 5%;
Ethanol 5%;
Water 25%;
Graphite 15%;
Carbon black 10%;
B component comprises the component of following weight percentage:
Light trigger 1,173 2%;
Light trigger 369 1%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 15 Ω, the thickness of glue-line is 6 μm.
Embodiment 4:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 22%;
Butyl glycol ether 2%;
Glycerol 5%;
Ethanol 5%;
Water 20%;
Graphite 12%;
Carbon black 8%;
B component comprises the component of following weight percentage:
Light trigger 1,173 4%;
Light trigger 369 2%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 23 Ω, the thickness of glue-line is 5 μm.
Embodiment 5:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 15%;
Butyl glycol ether 2%;
Glycerol 5%;
Ethanol 5%;
Water 20%;
Graphite 18%;
Carbon black 12%;
B component comprises the component of following weight percentage:
Light trigger 1,173 2%;
Light trigger 369 1%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 17 Ω, the thickness of glue-line is 7 μm.
Embodiment 6:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20%;
Vinylformic acid 25%;
Butyl glycol ether 2%;
Glycerol 2%;
Ethanol 5%;
Water 20%;
Graphite 12%;
Carbon black 8%;
B component comprises the component of following weight percentage:
Light trigger 1,173 4%;
Light trigger 369 2%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 21 Ω, the thickness of glue-line is 6 μm.
Embodiment 7:
A kind of binary water-base resin conductive resin, it is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 25%;
Vinylformic acid 17%;
Butyl glycol ether 4%;
Glycerol 2%;
Ethanol 4.2%;
Water 20%;
Graphite 14%;
Carbon black 9%;
B component comprises the component of following weight percentage:
Light trigger 1,173 3.2%;
Light trigger 369 1.6%.
Preparation method: first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then is 1 ~ 10 μm through being ground to granularity, packaging; B component mixes rear other packaging.
When constructing when boning, B component being joined component A and mixes, then glue being applied on material, being cured by photo solidification machine.
Embodiment effect: square resistance is 19 Ω, the thickness of glue-line is 6 μm.
Claims (4)
1. a binary water-base resin conductive resin, is characterized in that, it is made up of A, B component:
Component A comprises the component of following weight percentage:
Sudan Gum-arabic 20-25%;
Vinylformic acid 15-25%;
Butyl glycol ether 1-10%;
Glycerol 1-10%;
Ethanol 3-15%;
Water 20-30%;
Graphite 9-18%;
Carbon black 6-12%;
B component is solidifying agent, the forming by weight 2:1 by light trigger 1173 and light trigger 369;
The weight of B component is the 3-6% of A and B gross weight;
Component A material and B component material sum are 100%.
2. binary water-base resin conductive resin according to claim 1, it is characterized in that, component A comprises the component of following weight percentage:
Sudan Gum-arabic 20-25%;
Vinylformic acid 15-25%;
Butyl glycol ether 2-4%;
Glycerol 2-5%;
Ethanol 4-10%;
Water 20-30%;
Graphite 12-18%;
Carbon black 6-12%.
3. the preparation method of binary water-base resin conductive resin according to claim 1, is characterized in that, first mixed by the liquid ingredient in the component A in formula, the solid ingredient then added in component A mixes, then through grinding, packaging; B component mixes rear other packaging.
4. the preparation method of binary water-base resin conductive resin according to claim 3, is characterized in that, being ground to granularity is 1 ~ 10 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210274588.0A CN102850953B (en) | 2012-08-02 | 2012-08-02 | Two-element water-based resin conductive adhesive and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210274588.0A CN102850953B (en) | 2012-08-02 | 2012-08-02 | Two-element water-based resin conductive adhesive and preparation method thereof |
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| CN102850953A CN102850953A (en) | 2013-01-02 |
| CN102850953B true CN102850953B (en) | 2014-12-17 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1480502A (en) * | 2002-09-04 | 2004-03-10 | ϣ | Binder layer and sealing layer for electrophoretic display device |
| CN101284928A (en) * | 2007-04-10 | 2008-10-15 | 国家淀粉及化学投资控股公司 | Electrically conductive UV-curable ink |
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2012
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1480502A (en) * | 2002-09-04 | 2004-03-10 | ϣ | Binder layer and sealing layer for electrophoretic display device |
| CN101284928A (en) * | 2007-04-10 | 2008-10-15 | 国家淀粉及化学投资控股公司 | Electrically conductive UV-curable ink |
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| CN102850953A (en) | 2013-01-02 |
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Granted publication date: 20141217 Termination date: 20170802 |