CN102816552A - Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof - Google Patents
Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof Download PDFInfo
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- CN102816552A CN102816552A CN 201110151777 CN201110151777A CN102816552A CN 102816552 A CN102816552 A CN 102816552A CN 201110151777 CN201110151777 CN 201110151777 CN 201110151777 A CN201110151777 A CN 201110151777A CN 102816552 A CN102816552 A CN 102816552A
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Abstract
The invention belongs to the technical field of adhesive, and particularly relates to an organosilicon encapsulating adhesive used for electrical and electronic products, and a preparation method thereof. The adhesive comprises the following components of 100 parts by weight of a composite silicon resin, 20-40 parts by weight of an epoxy resin, 30-50 parts by weight of organosilicon oil, 30-40 parts by weight of fumed silica, 3-8 parts by weight of a coupling agent, and 0.5-1 part by weight of a curing agent. Catalyst concentration in a total weight of all the components is 23-30 [mu]g/g. The method comprises the steps of adding a certain amount of the composite silicon resin and the epoxy resin into corresponding proportion of the organosilicon oil; mixing uniformly in a water bath with a temperature of 40-50 DEG C; adding a proper amount of fillers, the catalyst, the curing agent and the coupling agent in the above polymer; mixing uniformly at a room temperature; and reacting for 0.5 hour with stirring. The adhesive has good thermal conductivity, heat-resistant property, cohesiveness, electroconductibility and the like, has good water-resistant performance and good sealing effect, can be cured at room temperature, and satisfy the requirements for encapsulating materials of modern electrical and electronic industry.
Description
Technical field
The invention belongs to the adhesive technology field, be specifically related to a kind of organic silicon packaging glue stick that is used for the electronic apparatus goods and preparation method thereof.
Background technology
Along with industrial production and science and technology development, from material has constantly been proposed new requirement.At electric power electricity the field because the developing rapidly of integrated technology and package technique, the volume hundreds of millions of of electric element, logical circuit doubly dwindles, thereby needs the heat-conducting insulation material of high-cooling property.
Now the most frequently used microelectronics, electronics and the photoelectron industry of being applied to is to chip or device conducts electricity and/or heat conduction and bonding tackiness agent mainly are epoxy composites; Being about to liquid epoxies mixes with solidifying agent, curing catalyst; And add various conductions or heat conductive filler, process the pulpous state adhesive compound.The thermotolerance of epoxy resin is relatively poor, but can utilize solidifying agent to realize self-vulcanizing, and simultaneously to high by sticking material adhesive power, but cross-linking density is high behind the epoxy resin cure, and internal stress is big, and fragility is big, poor impact resistance.And because resin partly adopts the pure epoxy based composition; Get into bubble in production, packing and the use easily; And these bubbles are difficult to automatic eliminating; Especially the micro-bubble that adheres to filler marginal trough place is difficult to gathering to be become air pocket and is excluded the cementability after causing solidifying and the reduction of electroconductibility.
Silicone resin is the netted structural group one-tenth in space of main chain by Si-O-Si, is cross-linking type half inorganic polymer that is connected with the machine group on the Siliciumatom, at high temperature can further be condensed into highly cross-linked and hard and crisp resin.The sealer that is made as base polymer by organosilicon keeps certain fluidity in the wider molecular weight scope, receive Influence of Temperature also little, and it can be used under multiple environment and condition.And has good high and low temperature resistance, resistance to weathering and electrical insulating property and elasticity after its sulfuration.Life-time service in-60～200 ℃ of scopes, its physical and mechanical properties such as tensile strength, tearing strength, elongation, hardness etc. almost seldom change, and organic silicon adhesive has better heat-resisting property, water tolerance, electrical insulating property.
In view of the foregoing, the relative merits of coupling collar epoxy resins of the present invention and silicone resin are learnt from other's strong points to offset one's weaknesses, and provide a kind of thermotolerance, cohesiveness and electroconductibility all good electronic apparatus goods encapsulating adhesive, and good mechanical property, and cost reduces.
Summary of the invention
One of the object of the invention provides a kind of organic silicon packaging glue stick that is used for the electronic apparatus goods, possesses performances such as good thermotolerance, cohesiveness and electroconductibility simultaneously.
20 of the object of the invention provides a kind of preparation method who is used for the organic silicon packaging glue stick of electronic apparatus goods.
The objective of the invention is to realize like this: a kind of organic silicon packaging glue stick that is used for the electronic apparatus goods is characterized in that:
Said adhesive compound comprises following component and content (weight part):
Wherein:
The comprehensive silicon resin is in order to strengthen the intensity of organosilicon polymer as strengthening agent.
Epoxy resin is in order further to improve the self-vulcanizing performance of organic silicon packaging glue stick of the present invention as properties-correcting agent.
Thermal silica is as reinforced filling.Can increase the cohesive strength of tackiness agent on the one hand, can reduce cost on the other hand, can also reduce the convergent force and the heat of glue-line and answer, especially can significantly improve the shearing resistance under the high temperature.
Coupling agent is selected a kind of of KH-550, KH560, Nanjing University-42 for use.Coupling agent can be erected " molecule bridge " between tackiness agent and adherend interface, make the physical adsorption reverse between the interface be chemisorption, to improve the cohesive strength and the ageing-resistant performance of glue-line.
Solidifying agent is selected from a kind of of diethylenetriamine, mphenylenediamine, MDA, hexahydropyridine.In order to improve the temperature tolerance of tackiness agent.
Catalyzer is selected metal complex for use.
A certain amount of comprehensive silicon resin and epoxy resin are added in the organosilicon silicone oil of corresponding proportion, in 40～50 ℃ of waters, mix.In above-mentioned polymkeric substance, add an amount of filler, catalyzer, solidifying agent and coupling agent, and at room temperature mix, stirring reaction 0.5h gets finished product.
Beneficial effect of the present invention:
The organic silicon packaging glue stick that is used for the electronic apparatus goods through the present invention's preparation possesses performances such as good thermal conductivity, thermotolerance, cohesiveness and electroconductibility simultaneously.And water resistance is good, good sealing effect, and the requirement of hyundai electronics electrical apparatus industry to packaged material satisfied in self-vulcanizing very much.
Embodiment
Embodiment 1:
According to the composition of above-mentioned prescription, at first comprehensive silicon resin and epoxy resin are added in the organosilicon silicone oil of corresponding proportion, in 40～50 ℃ of waters, mix.In above-mentioned polymkeric substance, add filler, catalyzer, solidifying agent and coupling agent, and at room temperature mix, stirring reaction 0.5h gets finished product.
Embodiment 2:
According to the composition of above-mentioned prescription, at first comprehensive silicon resin and epoxy resin are added in the organosilicon silicone oil of corresponding proportion, in 40～50 ℃ of waters, mix.In above-mentioned polymkeric substance, add filler, catalyzer, solidifying agent and coupling agent, and at room temperature mix, stirring reaction 0.5h gets finished product.
Embodiment 3:
According to the composition of above-mentioned prescription, at first comprehensive silicon resin and epoxy resin are added in the organosilicon silicone oil of corresponding proportion, in 40～50 ℃ of waters, mix.In above-mentioned polymkeric substance, add filler, catalyzer, solidifying agent and coupling agent, and at room temperature mix, stirring reaction 0.5h gets finished product.
The tackiness agent performance perameter sees the following form:
The tackiness agent that the present invention produces have a superior conductivity, have good cohesive strength, water resistance and heat conductivility simultaneously, have the very strong market competitiveness and promotional value.
Claims (2)
1. an organic silicon packaging glue stick that is used for the electronic apparatus goods is characterized in that comprising following component: comprehensive silicon resin 100 weight parts; Epoxy resin 20～40 weight parts; Organic silicone oil 30～50 weight parts; Thermal silica 30～40 weight parts; Coupling agent 3～8 weight parts; Solidifying agent 0.5～1 weight part; Catalyst concn is at 20～30 μ g/g of component gross weight.
2. press the described tackiness agent of claim 1 for one kind, it is characterized in that its preparation method is: a certain amount of comprehensive silicon resin and epoxy resin are added in the organosilicon silicone oil of corresponding proportion, in 40～50 ℃ of waters, mix; In above-mentioned polymkeric substance, add an amount of filler, catalyzer, solidifying agent and coupling agent, and at room temperature mix, stirring reaction 0.5h gets finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110151777 CN102816552A (en) | 2011-06-08 | 2011-06-08 | Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110151777 CN102816552A (en) | 2011-06-08 | 2011-06-08 | Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102816552A true CN102816552A (en) | 2012-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110151777 Pending CN102816552A (en) | 2011-06-08 | 2011-06-08 | Organosilicon encapsulating adhesive used for electrical and electronic products, and preparation method thereof |
Country Status (1)
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| CN (1) | CN102816552A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106256869A (en) * | 2015-06-19 | 2016-12-28 | 镇江耀华密封电器有限公司 | A kind of electric insulating sealant |
| CN111849363A (en) * | 2020-07-24 | 2020-10-30 | 今程粘胶(惠州)有限公司 | Formula and process of green environment-friendly epoxy resin glue |
| CN113621341A (en) * | 2021-09-10 | 2021-11-09 | 镇江恒星科技有限公司 | Special high-temperature repairing agent for leaking stoppage of drying cylinder |
-
2011
- 2011-06-08 CN CN 201110151777 patent/CN102816552A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106256869A (en) * | 2015-06-19 | 2016-12-28 | 镇江耀华密封电器有限公司 | A kind of electric insulating sealant |
| CN111849363A (en) * | 2020-07-24 | 2020-10-30 | 今程粘胶(惠州)有限公司 | Formula and process of green environment-friendly epoxy resin glue |
| CN113621341A (en) * | 2021-09-10 | 2021-11-09 | 镇江恒星科技有限公司 | Special high-temperature repairing agent for leaking stoppage of drying cylinder |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121212 |