CN102779922A - Aluminum substrate used for packaging LED (Light Emitting Diode) - Google Patents
Aluminum substrate used for packaging LED (Light Emitting Diode) Download PDFInfo
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- CN102779922A CN102779922A CN2012101635243A CN201210163524A CN102779922A CN 102779922 A CN102779922 A CN 102779922A CN 2012101635243 A CN2012101635243 A CN 2012101635243A CN 201210163524 A CN201210163524 A CN 201210163524A CN 102779922 A CN102779922 A CN 102779922A
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Abstract
The invention relates to an aluminum substrate used for packaging an LED (Light Emitting Diode). The aluminum substrate comprises a common aluminium plate and a mirror plane plate which are laminated under high temperature. Through holes used for mounting LEDs are evenly arranged on the common aluminium plate which comprises, from top to bottom, a line layer, an insulated layer and a substrate. The insulated layer is made of epoxy resin, and alumina, carborundum, silicon dioxide and aluminum nitride which are nanoscale additives; the average particle size of the nanoscale additives is 40nm; and the purity of the nanoscale additives is above 99%. By adopting the aluminum substrate, a single chip or a plurality of chips can be packaged without being notched or polished and the substrate can be in any shape. The aluminum substrate has a flexible structure in application, is simple and practical, good in heat dissipation, simplified in process and high in light emitting efficiency.
Description
Technical field
The invention belongs to LED encapsulation technology field, relate in particular to a kind of aluminium base of the LED of being used for encapsulation.
Background technology
The LED encapsulation of existing LED fluorescent lamp, street lamp mostly is to adopt single packaged in advance led light source device, and promptly the LED of paster class is welded on the substrate, carries out circuit connection and heat radiation.Because there is insulating barrier in this connected mode; General insulating barrier main component is a resin; Cause between led chip and the substrate heat to transmit the increase and the prolongation in path of the number of plies, thereby the speed that the heat that produces when causing LED work outwards distributes reduce greatly, causes the rising of led chip working temperature.And the rising of temperature can bring the aging acceleration of led chip, light efficiency decay aggravation, and operating voltage reduces, and light intensity reduces, and failure rate raises, a series of problems such as the lost of life.
If led chip is potted directly on the metal substrate, will reduce thermal resistance, simplified manufacturing technique widely, improve packaging efficiency.But this packaging technology also is faced with a problem, is exactly that the common metal substrate all is made up of 3-tier architecture, i.e. line layer (Copper Foil), insulating barrier, metallic plate; In LED chip cooling process; The line layer of metal quality and the conductive coefficient of metallic plate are higher, but the resin of the single additive of the most employing of insulating barrier now, as adding the phenolic resins of aluminium oxide; The conductive coefficient of this insulating barrier is low, has influenced whole heat dispersion.Package metals substrate on the plate of the employing fluting that has in addition; This kind metal needs wants mechanical grinding technology to come machined grooves; Adopt this method substrate process-cycle long; Bottom portion of groove reflecting effect without polishing is not good, causes luminous efficiency low, and groove is polished problems such as the efficient that can cause substrate processing is low, consistency of product is relatively poor.
Summary of the invention
First technical problem to be solved by this invention is: a kind of preparation program of aluminium base insulating barrier of the LED of being used for encapsulation is provided, improves the heat conductivility of insulating barrier, overcome shortcomings such as paster class LED heat radiation is difficult, light decay is big, the life-span is short.
Second technical problem to be solved by this invention is: a kind of aluminium base of the LED of being used for encapsulation is provided, and solving existing aluminium base needs mechanical slotting polishing and polishing, thereby causes problems such as processed complex, consistency is poor, light efficiency is not high.
The present invention solves the technical scheme that first technical problem takes: propose a kind of preparation program of aluminium base insulating barrier of the LED of being used for encapsulation, comprise epoxy resin and nanometer additive aluminium oxide, carborundum, silicon dioxide, aluminium nitride.
Said epoxy resin be with epoxy sealing priming paint, epoxy hardener, diluent with the 4:1.5:1 proportioning, conductive coefficient is 0.2W/mK.
The particle mean size of said nanometer additive is 40nm; Purity is 99%, and the ratio of epoxy resin and aluminium oxide (conductive coefficient 20 ~ 40 W/mK), carborundum (conductive coefficient 25 W/mK), silicon dioxide, aluminium nitride (conductive coefficient 320 W/mK) is between 100:15:9:3:1～100:25:15:5:3.
The present invention solves the technical scheme that second technical problem take: propose a kind of aluminium base of the LED of being used for encapsulation, this aluminium base is by ordinary aluminum plate and minute surface aluminium sheet; Ordinary aluminum plate and minute surface aluminium sheet adopt the high temperature pressing, evenly have the through hole that is used for installing LED at described ordinary aluminum plate; Ordinary aluminum plate has three layers, is followed successively by line layer, insulating barrier and substrate from top to bottom.
Beneficial effect of the present invention:
Compare prior art; The present invention proposes a kind of preparation program of aluminium base insulating barrier of the LED of being used for encapsulation; Nano level distribution of additives is even, purity is high, specific surface is high, filling is abundant, high temperature resistant, characteristics such as caking property good, good insulating, mouldability is good, heat conduction is good that the insulating barrier of preparation has.
Led chip directly is encapsulated on the minute surface aluminium sheet, forms thermoelectric separated structures, and the minute surface aluminium sheet need not polish promptly has the minute surface reflecting effect; Thereby strengthened the light reflection; Reduce thermal resistance, improved luminous efficiency when being beneficial to heat radiation, also improved the useful life of LED when reducing light decay.
Ordinary aluminum plate punching back is closed with specular aluminium plate hight temperature and pressure, simplified grooving processes, saved polishing step.
Groove on aluminium base forms the edge that surrounds fluorescent glue naturally, not only can control the shape and the position of fluorescent glue, has solved the some glue difficult problem of no cup-like structure, can also economize in raw materials.
The present invention need not fluting polishing processing, can carry out single-chip package, also can carry out the encapsulation of multicore sheet, and substrate shape is not limit; Structure applications is flexible, the invention provides a kind of simple and practical, thermal diffusivity good, operation is simplified, luminous efficiency is high is used for the aluminium base of LED encapsulation.
Description of drawings
Fig. 1 is the aluminium base vertical view that is used for the LED encapsulation in the embodiment of the invention;
Fig. 2 is the stereogram of ordinary aluminum plate in the embodiment of the invention;
Fig. 3 is the non-groove part cutaway view of aluminium base that is used for the LED encapsulation in the embodiment of the invention;
Fig. 4 is the aluminium base groove part cutaway view that is used for the LED encapsulation in the embodiment of the invention;
Fig. 5 is the structure cutaway view behind the aluminium base packaging LED chips in the embodiment of the invention;
Fig. 6 is the structure cutaway view that the LED device is welded in aluminium base in the embodiment of the invention;
Fig. 7 is the circular aluminium base structural representation that is used for the LED encapsulation in the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing principle of the present invention, structure are described further.
As shown in Figure 1, for being used for the aluminium base vertical view of LED encapsulation in the embodiment of the invention.According to required encapsulated LED number of chips, to 1 dozen of circular hole of ordinary aluminum plate.Get the minute surface aluminium sheet 2 with ordinary aluminum plate 1 identical length and width size, carry out the high temperature pressing with it, become one after the pressing, the hole of ordinary aluminum plate 1 and minute surface aluminium sheet 2 form circular groove 3.
Said ordinary aluminum plate 1 and minute surface aluminium sheet 2 shapes, measure-alike.
The thermal conductivity of said minute surface aluminium sheet 2 is 1.3 times of ordinary aluminum plate 1 thermal conductivity, and good reflecting effect, reflectivity are arranged is 85%, and tensile strength is high.
As shown in Figure 2, be the stereogram of ordinary aluminum plate in the embodiment of the invention, aluminium sheet 12 (substrate) thickness is between 0.1mm～0.16mm; Insulating barrier 6 is for adding the epoxy resin of alumina in Nano level, carborundum, silicon dioxide, aluminium nitride, and the particle mean size of nanometer additive is 40nm, and purity is 99%; The ratio of epoxy resin and nanometer additive aluminium oxide, carborundum, silicon dioxide, aluminium nitride is between 100:15:9:3:1～100:25:15:5:3 in the insulating barrier 6, and thickness is between 110um～120um; Line layer 7 is a Copper Foil, and thickness is 35um, can electroplate above that according to different demands.
Utilization single-chip microcomputer and temperature sensor are made the temperature test system; Give the aluminium base that is used for the LED encapsulation in the existing aluminium base and embodiment of the invention energising; Thermal power P is 4.5W, and the temperature of aluminium base upper and lower surfaces is measured and record, calculating average thermal resistance R=(T2-T1)/P.
(T1 is the aluminium base underlaying surface temperature that is used for the LED encapsulation in the embodiment of the invention to the heat conductivility comparison sheet; T2 is the aluminium base upper surface temperature that is used for the LED encapsulation in the embodiment of the invention, and the insulating barrier composition of existing aluminium base is resin: Al
2O
3=100:30)
The average thermal resistance that can have aluminium base now is 1.42 C/W, epoxy resin in the insulating barrier 6: Al
2O
3: SiC:SiO
2: average thermal resistance is minimum during AlN=100:25:15:5:3, is 0.45 C/W, and heat conductivility has improved 3 times.Select the matrix of epoxy resin as insulating barrier 6 solution, in the certain proportion scope, add alumina in Nano level, carborundum, silicon dioxide, aluminium nitride, the heat conductivility of aluminium base is significantly improved, heat conduction fast, evenly.
As shown in Figure 3, for being used for the non-groove part cutaway view of aluminium base of LED encapsulation in the embodiment of the invention, ordinary aluminum plate 1 is the high temperature pressing above minute surface aluminium sheet 2, is integrally formed, and thickness is than arriving 1:8 for 1:5.
As shown in Figure 4, for being used for the aluminium base groove part cutaway view of LED encapsulation in the embodiment of the invention, after uniformly-spaced beating circular hole on the ordinary aluminum plate 1, ordinary aluminum plate 1 is the high temperature pressing above minute surface aluminium sheet 2, forms circular groove 3.
The degree of depth of said groove 3 is identical with the thickness of ordinary aluminum plate 1, and groove 3 bottoms are the minute surface aluminium sheet and are the smooth mirror surface reflective surface, and the side is that ordinary aluminum plate 1 is vertical level and smooth tangent plane.
As shown in Figure 5, be the structure cutaway view behind the aluminium base packaging LED chips in the embodiment of the invention, constitute by ordinary aluminum plate 1, minute surface aluminium sheet 2, groove 3, led chip 4, fluorescent glue 5, lead-in wire 8 and silica gel 9.
After uniformly-spaced beating circular hole on the ordinary aluminum plate 1, ordinary aluminum plate 1 is the high temperature pressing above minute surface aluminium sheet 2, forms circular groove 3.Adopt the directly mode of lead-in wire bonding, use lead-in wire 8 to set up the electrical equipment annexation of led chip 4 and ordinary aluminum plate 1, led chip 4 is packaged in the groove 3; Fill in the groove 3 with fluorescent glue 5; Cover on the led chip 4, be coated on the fluorescent glue 5 with 9 in silica gel then, cover lead-in wire 8; For packaged led chip 4 provides protection, go into curing oven 30min at last.
Said led chip 4 is packaged in the groove 3; Can contact directly heat radiation through minute surface aluminium sheet 2 with groove 3 bottoms; The light that the high reflecting rate of minute surface aluminium sheet 2 also sends for led chip 4 provides good reflection function, and simultaneously groove 3 has and prevents that fluorescent glue 5 from overflowing, controlling the function of fluorescent glue 5 shapes and position.
As shown in Figure 6, for LED device in the embodiment of the invention is welded in the structure cutaway view of aluminium base, LED device 10 is realized electric connecting relation through scolder 11 and ordinary aluminum plate 1.Said LED device 10 is on groove 3, and the bottom of groove 3 is a minute surface aluminium sheet 2, and during energising work, the light that LED device 10 sends can pass through 2 total reflections of minute surface aluminium sheet, improves light emission rate.The heat part that LED device 10 produces is transmitted to ordinary aluminum plate 1 through scolder 11 and directly is dispersed into the external world, and another part is dispersed in the external environment through minute surface aluminium sheet 2, makes LED device 10 realize good heat radiation.
As shown in Figure 7, for being used for the circular aluminium base structural representation of LED encapsulation in the embodiment of the invention.Ordinary aluminum plate 1 and the circle that minute surface aluminium sheet 2 equates for radius punch to ordinary aluminum plate 1, carry out the high temperature pressing with minute surface aluminium sheet 2, become one after the pressing, and the hole of ordinary aluminum plate 1 and minute surface aluminium sheet 2 form circular groove 3.Led chip can be packaged in the groove 3, and the bottom of groove 3 is minute surface aluminium sheet 2, and reflection of the light of led chip and heat conduction and heat radiation are had good result.
Claims (4)
1. an aluminium base that is used for the LED encapsulation is characterized in that: comprise ordinary aluminum plate and minute surface aluminium sheet; Ordinary aluminum plate and minute surface aluminium sheet adopt the high temperature pressing, evenly have the through hole that is used for installing LED at described ordinary aluminum plate;
Described ordinary aluminum plate has three layers, is followed successively by line layer, insulating barrier and substrate from top to bottom; Said insulating barrier is made up of epoxy resin, aluminium oxide, carborundum, silicon dioxide and aluminium nitride, and aluminium oxide, carborundum, silicon dioxide, aluminium nitride are nanometer additive; The particle mean size of this nanometer additive is 40nm, and purity is more than 99%;
Wherein the portion rate of epoxy resin, aluminium oxide, carborundum, silicon dioxide and aluminium nitride is: 100:15～25:9～15:3～5:1～3.
2. a kind of aluminium base that is used for LED encapsulation as claimed in claim 1 is characterized in that: the thermal conductivity of said minute surface aluminium sheet is 1.3 times of substrate thermal conductivity in the ordinary aluminum plate, and reflecting rate reaches 85%.
3. a kind of aluminium base that is used for the LED encapsulation as claimed in claim 1 is characterized in that: said ordinary aluminum plate and minute surface aluminium sheet shape, consistent size, and thickness is than being 1:5～8, the aluminium base global shape can satisfy different assembling profiles, can be rectangle or circle.
4. a kind of aluminium base that is used for the LED encapsulation as claimed in claim 1, it is characterized in that: said through hole has the function that prevents that said fluorescent glue from overflowing for circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101635243A CN102779922A (en) | 2012-05-24 | 2012-05-24 | Aluminum substrate used for packaging LED (Light Emitting Diode) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101635243A CN102779922A (en) | 2012-05-24 | 2012-05-24 | Aluminum substrate used for packaging LED (Light Emitting Diode) |
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| CN102779922A true CN102779922A (en) | 2012-11-14 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
| CN103855036A (en) * | 2012-11-30 | 2014-06-11 | 南京尚孚电子电路有限公司 | Manufacture method of polycrystalline chip on board (COB) encapsulation mirror surface aluminum substrate |
| CN103997850A (en) * | 2014-05-19 | 2014-08-20 | 深圳恒宝士线路板有限公司 | PCB structure with epoxy glass fiber board and aluminum substrate and production method thereof |
| CN104087792A (en) * | 2014-07-08 | 2014-10-08 | 安徽艳阳电气集团有限公司 | Insulating temperature-resisting aluminum-based composite heat dispersing material for light emitting diode (LED) |
| CN104141072A (en) * | 2014-07-08 | 2014-11-12 | 蚌埠市高华电子有限公司 | Aluminum-based composite heat dissipation material with low thermal impedance for LED |
| CN104152751A (en) * | 2014-07-07 | 2014-11-19 | 马鞍山市万鑫铸造有限公司 | Modified potassium titanate whisker contained aluminum-based composite heat radiating material for LED |
| CN104195377A (en) * | 2014-07-22 | 2014-12-10 | 安徽冠宇光电科技有限公司 | Corrosion-resistant and abrasion-resistant aluminum base composite heat dissipating material for LED |
| CN104497785A (en) * | 2014-11-25 | 2015-04-08 | 浙江大学自贡创新中心 | Preparation method for nanometer modified resin composite paint used for LED base plate |
| CN104538386A (en) * | 2014-10-08 | 2015-04-22 | 安徽世林照明股份有限公司 | LED bulb lamp manufacturing method |
| CN105504688A (en) * | 2016-01-08 | 2016-04-20 | 武汉理工大学 | Composite ceramic/epoxy resin composite material for F-class motor potting and preparing method thereof |
| CN107339658A (en) * | 2017-06-27 | 2017-11-10 | 佛山肆强科技有限公司 | Substrate package LED sides heat-conducting LED lamp and LED car lamp |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855036A (en) * | 2012-11-30 | 2014-06-11 | 南京尚孚电子电路有限公司 | Manufacture method of polycrystalline chip on board (COB) encapsulation mirror surface aluminum substrate |
| CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
| CN103997850A (en) * | 2014-05-19 | 2014-08-20 | 深圳恒宝士线路板有限公司 | PCB structure with epoxy glass fiber board and aluminum substrate and production method thereof |
| CN104152751A (en) * | 2014-07-07 | 2014-11-19 | 马鞍山市万鑫铸造有限公司 | Modified potassium titanate whisker contained aluminum-based composite heat radiating material for LED |
| CN104087792B (en) * | 2014-07-08 | 2016-06-08 | 安徽艳阳电气集团有限公司 | A kind of LED insulation heatproof aluminum-base composite heat sink material |
| CN104087792A (en) * | 2014-07-08 | 2014-10-08 | 安徽艳阳电气集团有限公司 | Insulating temperature-resisting aluminum-based composite heat dispersing material for light emitting diode (LED) |
| CN104141072A (en) * | 2014-07-08 | 2014-11-12 | 蚌埠市高华电子有限公司 | Aluminum-based composite heat dissipation material with low thermal impedance for LED |
| CN104195377A (en) * | 2014-07-22 | 2014-12-10 | 安徽冠宇光电科技有限公司 | Corrosion-resistant and abrasion-resistant aluminum base composite heat dissipating material for LED |
| CN104538386A (en) * | 2014-10-08 | 2015-04-22 | 安徽世林照明股份有限公司 | LED bulb lamp manufacturing method |
| CN104497785A (en) * | 2014-11-25 | 2015-04-08 | 浙江大学自贡创新中心 | Preparation method for nanometer modified resin composite paint used for LED base plate |
| CN105504688A (en) * | 2016-01-08 | 2016-04-20 | 武汉理工大学 | Composite ceramic/epoxy resin composite material for F-class motor potting and preparing method thereof |
| CN105504688B (en) * | 2016-01-08 | 2018-05-01 | 武汉理工大学 | A kind of F grades of motor embedding composite ceramics/epoxy resin composite material and preparation method thereof |
| CN107339658A (en) * | 2017-06-27 | 2017-11-10 | 佛山肆强科技有限公司 | Substrate package LED sides heat-conducting LED lamp and LED car lamp |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
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Application publication date: 20121114 |