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CN102779926B - Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio - Google Patents

Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio Download PDF

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Publication number
CN102779926B
CN102779926B CN201210272821.1A CN201210272821A CN102779926B CN 102779926 B CN102779926 B CN 102779926B CN 201210272821 A CN201210272821 A CN 201210272821A CN 102779926 B CN102779926 B CN 102779926B
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Prior art keywords
layer
light
shell
dark
black
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Expired - Fee Related
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CN201210272821.1A
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CN102779926A (en
Inventor
区永超
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KINDWIN OPTO (SHENZHEN) CO Ltd
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KINDWIN OPTO (SHENZHEN) CO Ltd
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Priority to CN201210272821.1A priority Critical patent/CN102779926B/en
Publication of CN102779926A publication Critical patent/CN102779926A/en
Priority to US13/742,055 priority patent/US8974090B2/en
Priority to EP13158902.0A priority patent/EP2693854B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明公开了一种高对比度的防水表贴LED灯,其包括:设有反光杯(1)的外壳、设于外壳下表面的PCB板(12)、设于反光杯(10)内的LED芯片(1)和导光封装胶(4)。所述的外壳由下层的浅色层(8)和上层的深色层(9)复合而成;所述PCB板(12)上表面和外壳浅色层(8)的外表面设有黑色防水密封胶(11)。本发明反光杯的内表面下层为浅色层、上层为深色层,可以防止外来光线对LED芯片出光亮度的干扰,以致产品显示的对比度得到加强。另外,设置的黑色防水密封胶使得从外壳的外观来看均是黑色的,从而把LED芯片的出光亮度保持在最好效果。还可以获得有效的防水效果。

The invention discloses a high-contrast waterproof surface-mounted LED lamp, which comprises: a housing provided with a reflective cup (1), a PCB board (12) provided on the lower surface of the housing, and an LED provided in the reflective cup (10). Chip (1) and light guide encapsulant (4). The shell is composed of the lower light-colored layer (8) and the upper dark-colored layer (9); the upper surface of the PCB (12) and the outer surface of the light-colored layer (8) of the shell are provided with black waterproof Sealant (11). The lower layer of the inner surface of the reflective cup of the present invention is a light-colored layer and the upper layer is a dark-colored layer, which can prevent external light from interfering with the brightness of the LED chip, so that the contrast of the product display is enhanced. In addition, the black waterproof sealant provided makes the shell black in appearance, so as to keep the brightness of the LED chips at the best effect. An effective waterproof effect can also be obtained.

Description

高对比度的防水表贴LED灯High-contrast waterproof surface-mount LED lights

技术领域 technical field

本发明涉及表贴LED灯,尤其涉及一种高对比度的防水表贴LED灯。 The invention relates to a surface-mounted LED lamp, in particular to a high-contrast waterproof surface-mounted LED lamp.

背景技术 Background technique

随着LED灯的快速普及,直接导致了市场销量的上升和成本的不断降低,这为推广更高对比度、更高分辨率的显示屏带来良好前景。现有LED灯一般包括:设有反光杯的塑胶外壳,设于塑胶外壳背面的封装PCB ,反光杯内设有与PCB电连接的LED芯片以及导光封装胶。 With the rapid popularization of LED lights, it has directly led to the increase of market sales and the continuous reduction of costs, which brings good prospects for the promotion of higher contrast and higher resolution displays. Existing LED lamps generally include: a plastic shell with a reflector, a packaging PCB located on the back of the plastic shell, an LED chip electrically connected to the PCB, and a light-guiding encapsulant in the reflector.

为了提高显示的对比度,传统表贴LED灯一般有如下几种做法: In order to improve the contrast of the display, the traditional surface mount LED lights generally have the following methods:

1、白壳丝印黑面 — 在白色塑胶外壳2的顶部表面丝印黑色涂层3,则白色的反光杯5表面和顶部表面的黑色涂层3形成色度的反差,以增加产品显示的对比度,反光杯5内还设有LED芯片1和导光封装胶4,如图1所示。 1. White shell silk screen black surface - silk screen black coating 3 on the top surface of the white plastic shell 2, then the surface of the white reflector 5 and the black coating 3 on the top surface form a chromatic contrast to increase the contrast of the product display, The reflective cup 5 is also provided with an LED chip 1 and a light guide encapsulant 4 , as shown in FIG. 1 .

缺点:由于LED芯片1的四周及反光杯5内表面都是白色的,这些白色塑胶的表面会反射外来的光线,而使产品显示的对比度降低。 Disadvantage: Since the surroundings of the LED chip 1 and the inner surface of the reflector 5 are all white, the surface of these white plastics will reflect external light, thereby reducing the contrast of the product display.

2、全黑壳 — 使用黑色塑胶代替原来的白色塑胶来注塑外壳,使整个外壳6以及反光杯5的表面均为黑色,以增强产品显示的对比度,如图2所示。 2. All-black shell — Use black plastic instead of the original white plastic to inject the shell, so that the entire shell 6 and the surface of the reflector 5 are black to enhance the contrast of the product display, as shown in Figure 2.

缺点:由于LED芯片1内的反光杯5表面也是黑色,LED芯片发出的光线不能较好的从黑色的反光杯表面反射出去, 则大大降低了LED的出光亮度。有些厂家为了解决亮度低的问题,用提高LED电流的方法来提高LED的亮度,但这违反了使用LED省电的初衷, 这也增加了产品的热量排放,影响产品的寿命。 Disadvantage: Since the surface of the reflective cup 5 inside the LED chip 1 is also black, the light emitted by the LED chip cannot be well reflected from the surface of the black reflective cup, which greatly reduces the light output brightness of the LED. In order to solve the problem of low brightness, some manufacturers increase the brightness of LED by increasing the LED current, but this violates the original intention of using LED to save power, which also increases the heat emission of the product and affects the life of the product.

3、外黑内白壳 — 使用黑色塑胶注塑外壳6,配上白色料注塑的反光杯衬里7,这使得反光杯衬里的外围及顶部均为黑色,而反光杯衬里7的表面是白色的,这能有效提高对比度,又不会降低LED芯片的出光亮度,如图3所示。 3. Outer black and inner white shell - use black plastic injection molded shell 6, coupled with reflective cup lining 7 injected with white material, which makes the periphery and top of the reflective cup lining black, while the surface of reflective cup lining 7 is white, This can effectively improve the contrast without reducing the light output brightness of the LED chip, as shown in FIG. 3 .

缺点:外来的光线会从反光杯表面反射出来而使得对比度降低。另外由于 Disadvantages: extraneous light will be reflected from the surface of the reflector, which will reduce the contrast. Also due to

是三层合成结构,较难达到理想的防水效果。一般厂家只会使用在防水性要求不高的产品上,适用性较低。 It is a three-layer synthetic structure, which is difficult to achieve the ideal waterproof effect. Generally, manufacturers will only use it on products that do not require high water resistance, and the applicability is low.

 如何设计出对比度高、耗能低和适用性高的防水表贴LED灯,是业界亟待解决的技术问题。 How to design a waterproof surface-mount LED lamp with high contrast, low energy consumption and high applicability is a technical problem that needs to be solved urgently in the industry.

发明内容 Contents of the invention

本发明为了解决上述技术问题,提出一种对比度高、耗能低和适用性高的高对比度的防水表贴LED灯。 In order to solve the above technical problems, the present invention proposes a high-contrast waterproof surface-mounted LED lamp with high contrast, low energy consumption and high applicability.

本发明提出的高对比度的防水表贴LED灯,其包括:设有反光杯的外壳、设于外壳下表面的PCB板、设于反光杯内的LED芯片和导光封装胶。所述的外壳由下层的浅色层和上层的深色层复合而成;所述PCB板上表面和外壳浅色层的外表面设有黑色防水密封胶。 The high-contrast waterproof surface-mounted LED lamp proposed by the present invention includes: a housing provided with a reflective cup, a PCB board disposed on the lower surface of the housing, an LED chip disposed in the reflective cup, and light-guiding packaging glue. The shell is composed of a lower light-colored layer and an upper dark-colored layer; the upper surface of the PCB board and the outer surface of the light-colored layer of the shell are provided with a black waterproof sealant.

其中,所述的浅色层可以为白色层、淡黄色层或浅灰色层的一种。 Wherein, the light-colored layer can be one of white layer, light yellow layer or light gray layer.

所述的深色层可以为黑色层、深蓝色层、深灰色层或深咖啡色层的一种。 The dark layer can be one of black layer, dark blue layer, dark gray layer or dark brown layer.

本发明带有反光杯的外壳由下层的浅色层和上层的深色层叠加复合而成,那么由该外壳上表面向下沉陷的反光杯的内表面,其下层为浅色层、上层为深色层。当LED芯片发光时,反光杯的底部表面及下层浅色表面会将光反射出去。外来光一般只能照射到反光杯上层的深色表面(但不会反射光线)、而不易照射到下层的浅色表面,这样外来光线就不会干扰LED芯片的出光亮度,以致产品显示的对比度得到加强。另外,PCB板上表面和外壳浅色层的外表面设有黑色防水密封胶。而这些密封胶将外壳浅色层的外表面全部覆盖,使得从外壳的上表面及四周来观看均是黑色的,但却巧妙地保留LED四周及反光杯下部白色的反光部份,从而把LED芯片的出光亮度保持在最好效果。由于外壳的上、下层结合部、LED芯片外露的夹层线及底层部份均被防水密封胶完全覆盖,防水效能得到保证。 The shell with the reflective cup of the present invention is composed of the light-colored layer of the lower layer and the dark-colored layer of the upper layer. Dark layer. When the LED chip emits light, the bottom surface of the reflector cup and the lower light-colored surface will reflect the light. External light generally can only irradiate the dark surface of the upper layer of the reflector (but does not reflect light), and is not easy to irradiate the light-colored surface of the lower layer, so that the external light will not interfere with the brightness of the LED chip, so that the contrast of the product display be strengthened. In addition, a black waterproof sealant is provided on the upper surface of the PCB board and the outer surface of the light-colored layer of the shell. These sealants cover all the outer surface of the light-colored layer of the shell, so that it is black when viewed from the upper surface and surroundings of the shell, but skillfully retain the white reflective part around the LED and the lower part of the reflector cup, so that the LED The light output brightness of the chip is kept at the best effect. Since the upper and lower joints of the shell, the exposed interlayer wires of the LED chips and the bottom part are completely covered by the waterproof sealant, the waterproof performance is guaranteed.

附图说明 Description of drawings

图1为“白壳丝印黑面” LED灯的的剖视图; Figure 1 is a cross-sectional view of the "white shell silk screen black surface" LED lamp;

图2为“全黑壳” LED灯的的剖视图; Figure 2 is a cross-sectional view of the "full black shell" LED lamp;

图3为“外黑内白壳” LED灯的的剖视图; Figure 3 is a cross-sectional view of the "black outside and white inside" LED lamp;

图4为本发明优选实施例LED灯的剖视图。 Fig. 4 is a cross-sectional view of an LED lamp according to a preferred embodiment of the present invention.

具体实施方式 Detailed ways

如图4所示,本发明提出的一种高对比度的防水表贴LED灯的实施例,其包括:设有反光杯1的塑胶外壳、设于外壳下表面的PCB板12、设于反光杯10内的LED芯片1,该LED芯片与PCB板电联接。反光杯10内还灌装有导光封装胶4。本发明的外壳由下层的浅色层8和上层的深色层9叠加复合而成。PCB板12上表面和外壳浅色层8的外表面设有黑色防水密封胶11。本实施例中,浅色层8为白色层,根据需要还可以选择其他浅色层,如、淡黄色层或浅灰色层的等等。深色层9 为黑色层,根据需要还可以选择其他深色层,如、深蓝色层、深灰色层或深咖啡色层等等。 As shown in Figure 4, an embodiment of a high-contrast waterproof surface-mounted LED lamp proposed by the present invention includes: a plastic casing provided with a reflector 1, a PCB board 12 arranged on the lower surface of the casing, and a plastic casing arranged on the reflector cup 1. LED chip 1 in 10, the LED chip is electrically connected with the PCB board. The reflective cup 10 is also filled with a light-guiding encapsulant 4 . The shell of the present invention is formed by superimposing and compounding the light-colored layer 8 of the lower layer and the dark-colored layer 9 of the upper layer. A black waterproof sealant 11 is provided on the upper surface of the PCB board 12 and the outer surface of the light-colored layer 8 of the casing. In this embodiment, the light-colored layer 8 is a white layer, and other light-colored layers, such as a light yellow layer or a light gray layer, can also be selected as required. The dark layer 9 is a black layer, and other dark layers can also be selected as required, such as, dark blue layer, dark gray layer or dark brown layer or the like.

本发明反光杯的内表面下层为浅色层、上层为深色层。当LED芯片发光时,反光杯的底部表面及下层浅色表面会将光反射出去。外来光一般只能照射到反光杯上层的深色表面(但不会反射光线)、而不易照射到下层的浅色表面,这样外来光线就不会干扰LED芯片的出光亮度,以致产品显示的对比度得到加强。另外,设置的黑色防水密封胶使得从外壳的外观来看均是黑色的,从而把LED芯片的出光亮度保持在最好效果。由于外壳的上、下层结合部、LED芯片外露的夹层线及底层部份均被防水密封胶完全覆盖,防水效能得到保证。 The lower layer of the inner surface of the reflective cup of the present invention is a light-colored layer, and the upper layer is a dark-colored layer. When the LED chip emits light, the bottom surface of the reflector cup and the lower light-colored surface will reflect the light. External light generally can only irradiate the dark surface of the upper layer of the reflector (but does not reflect light), and is not easy to irradiate the light-colored surface of the lower layer, so that the external light will not interfere with the brightness of the LED chip, so that the contrast of the product display be strengthened. In addition, the black waterproof sealant provided makes the shell black in appearance, so as to keep the brightness of the LED chips at the best effect. Since the upper and lower joints of the shell, the exposed interlayer wires of the LED chips and the bottom part are completely covered by the waterproof sealant, the waterproof performance is guaranteed.

以上具体实施例仅用以举例说明本发明的结构,本领域的普通技术人员在本发明的构思下可以做出多种变形和变化,这些变形和变化均包括在本发明的保护范围之内。 The above specific embodiments are only used to illustrate the structure of the present invention. Those skilled in the art can make various modifications and changes under the conception of the present invention, and these modifications and changes are all included in the protection scope of the present invention.

Claims (3)

1. the waterproof Surface Mount LED of a high-contrast, comprise the shell being provided with reflector (10), the pcb board being located at shell lower surface (12), be located at LED chip (1) in reflector (10) and guide-lighting packaging plastic (4), it is characterized in that, described shell is composited by the bleached bed (8) of lower floor and the dark layer (9) on upper strata; when described LED chip (1) is luminous, light can reflect away by bleached bed (8) surface of the lower surface of reflector (10) and lower floor, and ambient light can only be irradiated to dark layer (9) surface on reflector upper strata and can not be irradiated to bleached bed (8) surface of lower floor;the outer surface of described pcb board (12) upper surface and shell bleached bed (8) is provided with black waterproof gasket cement (11), the interlayer line that the joint portion of shell bleached bed (8) and dark layer (9), LED chip expose by this black waterproof gasket cement and bottom part cover completely.
2. the waterproof Surface Mount LED of high-contrast as claimed in claim 1, is characterized in that, described bleached bed (8) is white layer, the one of yellowish chromatograph or light gray chromatograph.
3. the waterproof Surface Mount LED of high-contrast as claimed in claim 1, is characterized in that, described dark layer (9) is black layer, the one of deep blue layer, dark-grey chromatograph or dark brown chromatograph.
CN201210272821.1A 2012-08-02 2012-08-02 Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio Expired - Fee Related CN102779926B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201210272821.1A CN102779926B (en) 2012-08-02 2012-08-02 Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio
US13/742,055 US8974090B2 (en) 2012-08-02 2013-01-15 High contrast water-proof LED lamp
EP13158902.0A EP2693854B1 (en) 2012-08-02 2013-03-13 High-contrast waterproof surface-mounted led lamp

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CN201210272821.1A CN102779926B (en) 2012-08-02 2012-08-02 Waterproof watch patch LED (light emitting diode) lamp with high-contract ratio

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CN102779926B true CN102779926B (en) 2015-01-28

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US8974090B2 (en) 2015-03-10
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