[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN102763041A - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

Info

Publication number
CN102763041A
CN102763041A CN2011800102921A CN201180010292A CN102763041A CN 102763041 A CN102763041 A CN 102763041A CN 2011800102921 A CN2011800102921 A CN 2011800102921A CN 201180010292 A CN201180010292 A CN 201180010292A CN 102763041 A CN102763041 A CN 102763041A
Authority
CN
China
Prior art keywords
substrate
lithographic equipment
lens
radiation
independent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011800102921A
Other languages
Chinese (zh)
Other versions
CN102763041B (en
Inventor
约翰内斯·昂伍李
彼得·德亚格尔
埃尔温·范茨韦特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of CN102763041A publication Critical patent/CN102763041A/en
Application granted granted Critical
Publication of CN102763041B publication Critical patent/CN102763041B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A lithographic apparatus including an optical column configured to project a beam on a target portion of a substrate is disclosed. A focus controller is provided to control the focus position (906, 920, 924, 930) of the optical column with respect to a reference object, wherein the focus controller comprises a focus measurement device (942) configured to determine a focus quality on the reference object (938), and a focus actuator configured to adjust the focus position of the optical column on the basis of the determined focus quality.

Description

Lithographic equipment and device making method
The cross reference of related application
The application requires in the rights and interests of the U.S. Provisional Application 61/307,404 of application on February 23rd, 2010, and by reference its full content is incorporated herein.In addition, the application also requires in the rights and interests of the U.S. Provisional Application 61/323,182 of application on April 12nd, 2010, and by reference its full content is incorporated herein.
Technical field
The method that the present invention relates to lithographic equipment, pattern apparatus for converting able to programme, device making method and be used for producing the picture plane of fine definition at lithographic equipment.
Background technology
The machine that lithographic equipment is the pattern that applies expectation on substrate or a part of substrate.Lithographic equipment for example can be used for integrated circuit (IC), flat-panel monitor and have other device of fine-feature or the manufacturing of structure.In traditional lithographic equipment, can the pattern apparatus for converting that be called mask or mask be used to produce the circuit pattern corresponding to the individual layer of IC, flat-panel monitor or other device.Can be to substrate (for example silicon wafer or glass plate) (a part) with this design transfer, for example via imaging with said design transfer on the radiation-sensitive materials that is provided with on the said substrate (resist) layer.
Except circuit pattern, the pattern apparatus for converting can also be used to produce other pattern, for example the matrix of color filter patterns or point.Substitute traditional mask, the pattern apparatus for converting can comprise that pattern forms array, but this pattern forms the array that array comprises the independent controlled member that produces circuit or other patterned.Compare with traditional system based on mask, the advantage of such " maskless " system is can be provided with and/or change pattern more apace, and cost to be less.
Therefore, the maskless system comprises pattern apparatus for converting able to programme (for example spatial light modulator, contrast device etc.).The array that uses independent controlled member carries out (for example electronics or optically) programming to pattern apparatus for converting able to programme, is used to form the bundle of the patterning of expectation.The type of pattern apparatus for converting able to programme comprises micro reflector array, LCD (LCD) array, grating light valve array etc.
Summary of the invention
For example expectation provide a kind of flexibly, lithographic equipment cheaply, this lithographic equipment comprises pattern apparatus for converting able to programme.
In an embodiment; A kind of lithographic equipment is disclosed; Said lithographic equipment comprises modulator and optical projection system, and said modulator configuration becomes the exposure area with substrate to be exposed to a plurality of bundles according to the pattern modulation of expectation, and said optical projection system is configured to the bundle of modulation is projected on the substrate.Modulator can move with respect to the exposure area, and/or optical projection system can have the lens arra that is used to receive a plurality of bundles, and said lens arra can move with respect to the exposure area.
In an embodiment, lithographic equipment can for example be provided with optical devices row (or being called optical system) (optical column), and said optical devices row are configured on the target part of substrate, generate pattern.The optical devices row can be provided with: self-emission formula contrast device is configured to transmitted beam; And optical projection system, be configured at least a portion of said bundle is projected on the target part.Said equipment can be provided with actuator, and said actuator is configured to the part with respect to substrate mobile optical device row or optical devices row.
In the maskless lithography equipment of the above-mentioned type, in one embodiment, a plurality of optical devices row are provided, simultaneously projected bundle is projected on the different target part of substrate basically.In practice, substrate surface can be divided into band along the direction perpendicular to the direction of scanning, and each band is associated with the optical devices row.Each band further is divided into a plurality of target parts along the direction that is parallel to the direction of scanning, afterwards when the optical devices row move substrate, on the said target part of graphic pattern projection.
With graphic pattern projection to substrate the time, the bundle quilt that expectation projects to the patterning on the substrate is correctly aimed at the surface that will produce the substrate of pattern above that and is focused.Lithographic equipment has specific focusing range.Expectation in this focusing range, is used for substrate orientation correctly to form images.
In the lithographic equipment of the above-mentioned type, pattern can or roughly project on the whole width of substrate by the while simultaneously.Therefore, the whole width that expectation is directed to substrate with substrate arrangement in focusing range, thereby cause utilizing the parameter of limited quantity to carry out the leveling of substrate.
Expectation provides a kind of lithographic equipment, this lithographic equipment to be configured to substrate is held in the optical devices of lithographic equipment and is listed as into positive burnt position.
According to embodiments of the invention; A kind of lithographic equipment is provided; Comprise: the optical devices row, be configured to bundle is projected on the target part of substrate, said optical devices row comprise radiation source and the optical projection system that is configured to provide bundle; Said optical projection system is configured to said bundle is projected on the said target part; Wherein said optical devices are listed as on the fixed part that partly is installed in lithographic equipment, and partly are installed on the part that can rotate of said lithographic equipment, and wherein said optical devices row have focal position; The scanning movement actuator is configured to along the direction of scanning to be listed as with sweep velocity with respect to optical devices and moves substrate; And focus controller; Be configured to control optical devices and be listed as focal position with respect to Reference; Wherein, Focus controller comprises focusing measurement mechanism and focus actuator, and said focusing measurement mechanism is configured to confirm the focusing quality on the Reference, and said focus actuator is configured to the focal position based on fixed focusing quality adjustment optical devices row.
According to embodiments of the invention; Provide a kind of being used on positive burnt position, to generate method as the plane at lithographic equipment; Said method comprises step: measure optical devices and be listed in the focusing quality on the Reference; Based on focal position being adjusted in the measurement of optical devices row and being directed to multiple said measurement of one or more other optical devices column weight and set-up procedure.
According to one embodiment of present invention; Provide a kind of being used on substrate, to generate method of patterning at lithographic equipment; Said method comprises step: before a plurality of bundles being projected on a plurality of targets part, be directed to each optical devices and be listed as with respect to Reference and form the public plane that looks like in positive burnt position; Be adjusted to public picture plane with surface in the position that pattern forms a plurality of target parts at place with substrate.
Description of drawings
The accompanying drawing that is incorporated herein and forms the part of instructions has shown embodiments of the invention, and is used to explain principle of the present invention with said description in addition and makes those skilled in the relevant art can carry out and use the present invention.In the accompanying drawings, identical reference marker can be represented identical or functionally similar element.
Fig. 1 shows the diagrammatic side view of lithographic equipment according to an embodiment of the invention.
Fig. 2 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Fig. 3 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Fig. 4 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Fig. 5 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Fig. 6 (A)-(D) shows the diagrammatic top view and the side view of the part of lithographic equipment according to an embodiment of the invention.
Fig. 7 (A)-(O) shows the diagrammatic top view and the side view of the part of lithographic equipment according to an embodiment of the invention.
Fig. 7 (P) shows the power/forward current figure of independent addressable element according to an embodiment of the invention.
Fig. 8 shows the diagrammatic side view of lithographic equipment according to an embodiment of the invention.
Fig. 9 shows the diagrammatic side view of lithographic equipment according to an embodiment of the invention.
Figure 10 shows the diagrammatic side view of lithographic equipment according to an embodiment of the invention.
Figure 11 shows the diagrammatic top view of the array of the independent controlled member that is used for lithographic equipment according to an embodiment of the invention.
Figure 12 shows the pattern of using embodiments of the invention design transfer to be arrived substrate.
The illustrative arrangement of Figure 13 display optical engine.
Figure 14 (A) and (B) show the diagrammatic side view of the part of lithographic equipment according to an embodiment of the invention.
Figure 15 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Figure 16 (A) shows the diagrammatic side view of the part of lithographic equipment according to an embodiment of the invention.
Figure 16 (B) shows the illustrated position with respect to the surveyed area of the sensor of substrate.
Figure 17 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention.
Figure 18 shows the schematic, cross-sectional side view of lithographic equipment according to an embodiment of the invention.
Figure 19 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic top view of the part of the lithographic equipment of optical element movably.
Figure 20 shows the schematic three dimensional view of the part of the lithographic equipment among Figure 19.
Figure 21 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably, and demonstrates three different position of rotation of the optical element of setting with respect to independent controlled member 242.
Figure 22 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably, and demonstrates three different position of rotation of the optical element of setting with respect to independent controlled member 242.
Figure 23 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably, and demonstrates five different position of rotation of the optical element of setting with respect to independent controlled member 242.
Figure 24 is presented at the schematic layout of the part of the independent controlled member 102 under whole coverage conditions of the width that uses diameter to be used to obtain to cross substrate as the standard laser diode of 5.6mm.
Figure 25 shows the diagrammatic layout of the details of Figure 24.
Figure 26 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably.
Figure 27 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably.
Figure 28 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its layout of the diagrammatic side view of the part of the lithographic equipment of optical element movably, and demonstrates five different position of rotation of the optical element of setting with respect to independent controlled member 242.
Figure 29 shows the schematic three dimensional view of a part of the lithographic equipment of Figure 28.
Figure 30 schematically shows the layout of 8 lines that write out simultaneously through the single removable optical element of setting in Figure 28 and 29 242.
Figure 31 shows the illustrative arrangement be used to control focusing, wherein has the mobile roof like parts (rooftop) in the layout of Figure 28 and 29.
Figure 32 show have according to an embodiment of the invention independent controlled member static basically in X-Y plane and with respect to its movably optical element, the schematic, cross-sectional side view of lithographic equipment according to an embodiment of the invention.
Figure 33 illustrates the part of lithographic equipment according to an embodiment of the invention.
Figure 34 illustrates the vertical view of the lithographic equipment of Figure 33 according to an embodiment of the invention.
The side view of Figure 35 and 36 schematically illustrated focus control systems according to an embodiment of the invention.
Embodiment
Maskless lithography equipment, maskless lithography method, pattern apparatus for converting able to programme and miscellaneous equipment, the object of manufacturing and or more embodiment of method have been described herein.In one embodiment, provide low-cost and/or maskless lithography equipment flexibly.Because it is maskless, therefore do not need traditional mask be used to make public for example IC or flat-panel monitor.One or more ring that need not be used for similarly, package application; Pattern apparatus for converting able to programme can provide digital edge treated " ring " for package application, is used to avoid edge projection.Maskless (digital patternization) can use flexible substrate.
In one embodiment, lithographic equipment can be used in the application of ultra non-critical (super-non-critical).In one embodiment, lithographic equipment can have >=resolution of 0.1 μ m, for example >=0.5 the resolution of μ m or >=resolution of 1 μ m.In one embodiment, lithographic equipment can have≤resolution of 20 μ m, for example≤10 μ m resolution or≤resolution of 5 μ m.In one embodiment, lithographic equipment can have～resolution of 0.1-10 μ m.In one embodiment, lithographic equipment can have >=50nm overlapping, for example >=100nm overlapping, >=200nm overlapping or >=300nm overlapping.In one embodiment, lithographic equipment can have≤500nm overlapping, for example≤400nm overlapping ,≤300nm overlapping or≤200nm overlapping.These overlapping and resolution values can have nothing to do with substrate dimension and material.
In one embodiment, lithographic equipment has very high dirigibility.In one embodiment, lithographic equipment can extend to the substrate of different size, type and characteristic.In one embodiment, lithographic equipment has in fact unlimited field size.Therefore, lithographic equipment can carry out multiple application (for example, IC, flat-panel monitor, encapsulation etc.) with single lithographic equipment or with a plurality of lithographic equipments that use big public lithographic equipment platform.In one embodiment, lithographic equipment allows to produce automated job, is used to the manufacturing that provides flexible.In one embodiment, lithographic equipment provides 3D integrated.
In one embodiment, lithographic equipment is cheaply.In one embodiment, only use the parts (for example, emitted radiation diode, simply movably substrate holder and lens arra) of public existing (off-the-shelf).In one embodiment, pixel-grid imaging is used to make simple projecting optical device to operate.In one embodiment, use substrate holder to reduce cost and/or reduce complicacy with single direction of scanning.
Fig. 1 schematically shows lithographic projection apparatus 100 according to an embodiment of the invention.Equipment 100 comprises pattern apparatus for converting 104, object retainer 106 (for example object table, for example substrate table) and optical projection system 108.
In one embodiment, pattern apparatus for converting 104 comprises a plurality of independent controlled member 102 that is used for chopped radiation, is used to apply pattern to restrainting 110.In one embodiment, can be with respect to the position of optical projection system 108 fixing a plurality of independent controlled members 102.Yet in alternative layout, a plurality of independent controlled members 102 can be connected to the locating device (not shown), are used for accurately locating they one or more according to specific parameter (for example with respect to optical projection system 108).
In one embodiment, pattern apparatus for converting 104 is self-emission formula contrast devices.Such pattern apparatus for converting 104 has been eliminated the requirement to radiating system, and it can for example reduce the cost and the size of lithographic equipment.For example, each independent controlled member 102 is emitted radiation diodes, for example light emitting diode (LED), organic LED (OLED), polymer LED (PLED) or laser diode (for example solid-state laser diode).In one embodiment, each independent controlled member 102 is laser diodes.In one embodiment, each independent controlled member 102 is bluish-violet laser diode (for example Sanyo model no.DL-3146-151).Such diode is by such as Sanyo, Nichia, the supply of companies such as Osram and Nitride.In one embodiment, the diode emission has the radiation of the wavelength of about 365nm or about 405nm.In one embodiment, diode can provide the output power of selecting from the scope of 0.5-100mW.In one embodiment, the size of laser diode (naked pipe core) is to select from the scope of 250-600 micron.In one embodiment, laser diode has the emitting area of selecting from the scope of 1-5 micron.In one embodiment, laser diode has the angle of divergence of selecting from the scope of 7-44 degree.In one embodiment, pattern apparatus for converting 104 has about 1 * 10 5Individual diode, have be used to provide more than or equal about 6.4 * 10 8W/ (m 2The configuration of total brightness .sr) (for example emitting area, the angle of divergence, output power etc.).
In one embodiment, self-emission formula contrast device comprise than can not operate at another independent controlled member 102 or can not the situation of proper handling under the more independent addressable element 102 of independent controlled member 102 needed independent addressable element of " redundancy " that allow to use.In one embodiment, redundant independent controlled member possibly be advantageously utilised in use for example hereinafter among the embodiment about the movably independent controlled member 102 that Fig. 5 discussed.
In one embodiment, the independent controlled member 102 in the self-emission formula contrast device is operated in the steeply inclined part of the power/forward current curve of independent controlled member 102 (for example laser diode).This possibly be more efficient and cause less power loss/heat.In one embodiment, in use, the light of each independent controlled member output is 1mW at least, for example 10mW, 25mW, 50mW, 100mW or 200mW at least at least at least at least at least.In one embodiment, in use, the output of the light of each independent controlled member is less than 300mW, less than 250mW, and less than 200mW, less than 150mW, less than 100mW, less than 50mW, less than 25mW, or less than 10mW.In one embodiment, the power attenuation that is used to operate independent controlled member of each pattern apparatus for converting able to programme is less than 10kW in use, for example less than 5kW, and less than 1kW, or less than 0.5kW.In one embodiment, the power attenuation that is used to operate each pattern apparatus for converting able to programme of independent controlled member in use is 100W at least, 300W at least for example, 500W at least, or 1kW at least.
Lithographic equipment 100 comprises object retainer 106.In the present embodiment, the object retainer comprises the object table 106 that is used to keep substrate 114 (for example being coated with the silicon wafer or the glass substrate of resist).Object table 106 can be movably and be connected to locating device 116, is used for according to specific parameter position substrate 114 accurately.For example locating device 116 can be with respect to optical projection system 108 and/or pattern apparatus for converting 104 position substrate 114 accurately.In one embodiment, can realize moving of object table 106 with locating device 116, this locating device 116 comprises the long stroke module (coarse positioning) that in Fig. 1, do not specifically illustrate and optional short stroke module (fine positioning).In one embodiment, said equipment is not used in the short stroke module of mobile object platform 106 at least.Can use similar system to locate independent controlled member 102.Should be appreciated that bundle 110 can be movably alternatively/additionally, and object table 106 and/or independent controlled member 102 can have fixing position, are used to provide needed relatively moving.Such layout can help the size of limiting device.Among the embodiment in the manufacturing that can for example be used in flat-panel monitor, object table 106 can be static, and locating device 116 is configured to move substrate 114 with respect to object table 106 (for example above that).For example, object table 106 can be provided with and be used for striding the system through the substrate 114 of object table 106 with the velocity sweeping of substantial constant.Under this situation about being done, the uppermost surface that object table 106 can be smooth is provided with a large amount of openings, gas be supplied to through said opening, be used to provide can support substrates 114 air cushion (gas cushion).This is commonly referred to gas bearing and arranges.Use one or more actuator (not shown) on object table 106, to move substrate 114, said actuator can be with respect to the path of bundle 110 position substrate 114 accurately.Alternately, can move substrate 114 with respect to object table 106 through optionally opening and ending the path that gas passes opening.In one embodiment, object retainer 106 can be the lift-over system, and substrate rolls in said lift-over system, and locating device 116 can be a motor, is used to rotate the lift-over system to provide substrate to object table 106.
Optical projection system 108 (for example quartz and/or CaF 2Lens combination or comprise the refraction-reflection system or the mirror system of the lens element of processing by such material) can be used for the bundle by the patterning of independent controlled member 102 modulation is projected to the target part 120 (for example or more tube core) of substrate 114.Optical projection system 108 can make pattern as one man be formed on the substrate 114 the graphic pattern projection imaging that is provided by a plurality of independent controlled members 102.Alternately, the image that optical projection system 108 can the projection secondary source, the element in a plurality of independent controlled members 102 is as the shading piece of secondary source.
In this respect; Optical projection system can comprise a concentrating element or a plurality of concentrating element (hereinafter is referred to as lens arra); For example microlens array (being known as MLA) or array of fresnel lenses for example are used to form secondary source and make hot spot be imaged onto on the substrate 114.In one embodiment, lens arra (for example MLA) comprises at least 10 concentrating elements, at least 100 concentrating elements for example, at least 1000 concentrating elements, at least 10000 concentrating elements, at least 100000 concentrating elements or at least 1000000 concentrating elements.In one embodiment, the quantity of the independent controlled member in the pattern apparatus for converting is equal to or greater than the quantity of the concentrating element in the lens arra.In one embodiment; Lens arra comprises concentrating element; One or more independent controlled member optical correlation in this concentrating element and the independent controlled member array; For example only with independent controlled member array in an independent controlled member optical correlation; Or with independent controlled member array in two or more independent controlled member optical correlation, for example 3 or more, 5 or more, 10 or more, 20 or more, 25 or more, 35 or more or 50 or more independent controlled member optical correlation; In one embodiment, concentrating element with less than 5000 independent controlled member optical correlations, for example with less than 2500, less than 1000, less than 500, or less than 100 independent controlled member optical correlation.In one embodiment, lens arra comprises concentrating element more than one (for example more than 1000, great majority or approximately all), one or more independent controlled member optical correlation in itself and the independent controlled member array.
In one embodiment, for example through using one or more actuator, lens arra is movably arriving on substrate and the direction away from substrate at least.Can mobile lens array to substrate and make away from substrate and to allow for example under the situation that needn't move substrate, to focus on adjustment.In one embodiment, the separate lenses element in the lens arra (for example each separate lenses element in the lens arra) is at least along to substrate and direction away from substrate being movably (for example on the substrate of non-flat forms, carry out local focus on adjustment or make each optical devices row reach identical focal length).
In one embodiment, during more than or equal to about 400nm (for example 405nm), lens arra comprises plastics concentrating element (it can be easy to make (for example through injection-molded) and/or be that cost is low) at the wavelength of for example radiation.In one embodiment, the wavelength of radiation is selected from the scope of about 400nm-500nm.In one embodiment, lens arra comprises quartzy concentrating element.In one embodiment, each concentrating element or a plurality of concentrating element can be asymmetric lens.Asymmetry can be identical or asymmetry can be to be different from a plurality of concentrating elements one or more different concentrating element for one in a plurality of concentrating elements or more concentrating element in a plurality of concentrating elements each.Asymmetric lens possibly are convenient to convert oval radiation output to the circular projection spot, and vice versa.
In one embodiment, concentrating element has high-NA (NA), and it is arranged and is used for radiation in focal position outer projection to substrate, to obtain the low NA for said system.The higher lens of NA can be more cost effective, popular and/or have than the better quality of available low NA lens.In one embodiment, low NA is less than or equal to 0.3, and in one embodiment, low NA is 0.18,0.15 or littler.Correspondingly, the lens that NA is higher have the NA bigger than the design NA of said system, for example greater than 0.3, greater than 0.18 or greater than 0.15.
Though optical projection system 108 is separated with pattern apparatus for converting 104 in one embodiment, this not necessarily.Optical projection system 108 can be one with pattern apparatus for converting 108.For example, lens arra piece or plate can connect (one connection) to pattern apparatus for converting 104.In one embodiment, lens arra can become the form of the lenslet of separate space separation, and each lenslet connects the independent addressable element in (one connection) to pattern apparatus for converting 104, describes in detail more like hereinafter.
Alternatively, lithographic equipment can comprise the radiating system that radiation (for example ultraviolet (UV) radiation) is supplied to a plurality of independent controlled members 102.If the pattern apparatus for converting self is radiation source (for example diode laser matrix or a led array), can design lithographic equipment so and do not have a radiating system, i.e. the radiation source except pattern apparatus for converting self not, or be the radiating system of simplifying at least.
Radiating system comprises irradiation system (irradiator), and said irradiation system configuration is used to receive the radiation from radiation source.Irradiation system comprises one or more element in the following element: radiation delivery system (for example be fit to directional mirror), radiation regulating device (for example beam expander), be used to set adjusting gear, integrator and/or the condenser of the angle intensity distributions (usually, can adjust the said at least outside and/or the inner radial scope (generally being called σ-outside and σ-inside respectively) of the intensity distributions in the pupil plane of irradiator) of said radiation.Irradiation system can be used to adjust radiation, and this radiation can provide to independent controlled member 102, is used for having at its xsect the homogeneity and the intensity distributions of expectation.Irradiation system can be arranged to radiation is divided into a plurality of son bundles, said sub-bundle can be for example each with a plurality of independent controlled members in one or more is relevant.Two-dimensional diffraction gratings can for example be used for radiation is divided into the son bundle.In said description, term " bundle of radiation " and " radiation beam " include but not limited to restraint the situation that is made up of a plurality of such radiator bundles.
Radiating system can also comprise radiation source (for example excimer laser), is used to produce be supplied to a plurality of independent controlled members 102 or by the radiation of a plurality of independent controlled members 102.Radiation source and lithographic equipment 100 can be discrete entities, for example when radiation source is excimer laser.Under such situation, can radiation source be considered to a part that forms lithographic equipment 100, and radiation is passed to irradiator from the source.Under other situation, radiation source can be the ingredient of lithographic equipment 100, when for example being mercury lamp in the source.Should be appreciated that these two kinds of situations all are designed within the scope of the invention.
In one embodiment, radiation source can be a plurality of independent controlled members 102, and radiation source can provide wavelength to be 5nm at least in one embodiment, for example 10nm at least; At least 50nm, 100nm, 150nm, 175nm at least at least at least; At least 200nm, 250nm, 275nm at least at least; At least 300nm, 325nm at least, 350nm or the radiation of 360nm at least at least.In one embodiment, the wavelength of radiation is 450nm at the most, 425nm at the most for example, 375nm at the most, 360nm at the most, 325nm at the most, 275nm at the most, 250nm at the most, 225nm at the most, 200nm at the most, or 175nm at the most.In one embodiment, the wavelength of radiation comprises 436nm, 405nm, 365nm, 355nm, 248nm, 193nm, 157nm, 126nm, and/or 13.5nm.In one embodiment, radiation comprises the wavelength of about 365nm or about 355nm.In one embodiment, radiation comprises broad band wavelength, for example comprises 365nm, 405nm and 436nm.Can use the 355nm lasing light emitter.In one embodiment, the wavelength that has of radiation is about 405nm.
In one embodiment, with in the angle between 0 and 90 °, for example between 5 and 85 °, between 15 and 75 °, between 25 and 65 ° or the angle between 35 and 55 ° from irradiation system radiation is directed to pattern apparatus for converting 104.Radiation from irradiation system can directly be provided to pattern apparatus for converting 104.In alternative embodiment, can radiation be guided to pattern apparatus for converting 104 from irradiation system through the beam splitter (not shown), this beam splitter is arranged such that radiation is at first by beam splitter reflection and be directed to pattern apparatus for converting 104.Pattern apparatus for converting 104 is modulated said bundles and its reflection is back to beam splitter, and this beam splitter is towards the modulated bundle of substrate 114 transmission.Yet, should be appreciated that alternative layout can be used for radiation is guided to pattern apparatus for converting 104 and guides to substrate 114 afterwards.Especially, are self-emission formula (for example a plurality of diodes) if use transmission-type pattern apparatus for converting 104 (for example LCD arrays) or pattern apparatus for converting 104, possibly not need irradiation system to arrange so.
In the operation of lithographic equipment 100; When pattern apparatus for converting 104 is not (for example the comprising LED) of emitted radiation type; Radiation is incided on the pattern apparatus for converting 104 (for example a plurality of independent controlled member) from radiating system (irradiation system and/or radiation source), and modulates through pattern apparatus for converting 104.After producing through a plurality of independent controlled members 102, the bundle 110 of patterning passes optical projection system 108, and this optical projection system 108 will be restrainted 110 and focused on the target part 120 of substrate 114.
Under locating device 116 help of (with alternatively the position transducer on the pedestal 136 134 (for example receiving interferometric measuring means, linear encoder or the capacitive transducer of interfering beams 138)); Can accurately move substrate 114, for example so that in the path of bundle 110, locate different target parts 120.In use, the locating device that is used for a plurality of independent controlled members 102 can be used for the position of accurately proofreading and correct a plurality of independent controlled members 102 with respect to the path of bundle 110, for example in scan period.
Though lithographic equipment 100 is described as the resist on the substrate that is used to make public herein according to an embodiment of the invention, should be appreciated that equipment 100 can be used for the bundle 110 of projection patternization, is used for being used in the photolithography of no resist.
So the place shows, lithographic equipment 100 is reflection type (for example adopting reflective independent controlled member).Alternately, equipment can be transmission-type (for example adopting transmission-type independence controlled member).
Can said specialized equipment 100 be used for following a kind of or more modes, for example:
1. in step mode, independent controlled member 102 and substrate 114 are remained static basically in, whole patterned beam of radiation 110 is once projected on the target part 120 (that is, single static exposure).Then substrate 114 is moved along X and/or Y direction, making can be so that the radiation beam that different target part 120 is patterned 110 exposure.In step mode, the full-size of exposure field has limited the size of the said target part 120 that in single static exposure, forms images.
2. in scan pattern, when independent controlled member 102 is synchronously scanned with substrate 114, patterned beam of radiation 110 is projected on the target part 120 (that is, single dynamic exposure).Substrate can be confirmed through (dwindling) magnification and the image inversion characteristic of said optical projection system PS with respect to the speed and the direction of independent controlled member.In scan pattern, the full-size of exposure field has limited the width (along non-direction of scanning) of the part of target described in the single dynamic exposure, and the length of said scanning motion has been confirmed the height (along said direction of scanning) of said target part.
3. in pulse mode, independent controlled member 102 remains static basically, and use (for example by impulse radiation source or provided) pulse through pulsed modulation independence controlled member with whole graphic pattern projection on the target part 120 of substrate 114.Speed with substantial constant moves substrate 114, makes the bundle 110 of patterning pass through the line sweep of substrate 114.The pattern that is provided by independent controlled member upgrades between pulse as required, and pulse is controlled to the continuous target part 120 of desired location place exposure that makes on substrate 114 by the time.Therefore, the bundle 110 of patterning can cross substrate 114 and scan, and thinks the complete pattern of band exposure of substrate 114.Repeat said process, till entire substrate 114 is made public line by line.
4. in the continuous sweep pattern; Except substrate 114 scanned with the speed of substantial constant with respect to the radiation beam B of modulation and independent controlled member array on pattern the bundle 110 of patterning crosses that substrate 114 scans and upgrades when making its exposure, identical with pulse mode in fact.Can use the radiation source or the impulse radiation source of substantial constant, its be caught with independent controlled member array on the renewal of pattern synchronous.
Also can adopt the combination and/or the variant of above-mentioned use pattern, or diverse use pattern.
Fig. 2 shows the diagrammatic top view that is used for the lithographic equipment according to an embodiment of the invention of wafer (the for example wafer of 300mm) use.As shown in Figure 2, lithographic equipment 100 comprises the substrate table 106 that is used to keep wafer 114.Locating device 116 is associated with substrate table 106, is used for moving substrate table 106 on the directions X at least.Alternatively, locating device 116 can move substrate table 106 on Y direction and/or Z direction.Locating device 116 can also center on X, Y and/or Z direction rotation substrate table 106.Therefore, locating device 116 can provide up to the motion to 6 degree of freedom.In one embodiment, substrate table 106 provides the only motion on directions X, and its advantage is that cost is low lower with complicacy.In one embodiment, substrate table 106 comprises relay optics.
Lithographic equipment 100 also comprises a plurality of independent addressable element 102 that is arranged on the framework 160.Framework 160 can with substrate table 106 and its locating device 116 mechanical isolation.Can be for example through framework 160 is connected to ground or with the discrete firm pedestal of the framework that is used for substrate table 106 and/or its locating device 116, mechanical isolation is provided.In addition or alternately, can with damper be arranged on framework 160 and with said structure that this framework is connected between, no matter and said structure whether be ground, firm pedestal or be used for support substrates platform 106 and/or the framework of its locating device 116.
In the present embodiment, each independent addressable element 102 is emitted radiation diode, for example bluish-violet laser diode.As shown in Figure 2, the array of at least 3 separations of the independent addressable element 102 that can independent addressable element 102 is arranged to extend along the Y direction.In one embodiment, the array of the array of independent addressable element 102 and adjacent independent addressable element 102 is staggered on directions X.Lithographic equipment 100, especially independent addressable element 102 can be arranged to provide the pixel-grid imaging as describing in detail more here.
In the array of independent addressable element 102 each can be the part of independent optics engine components, and for the ease of duplicating, it can be manufactured into a unit.In addition, can be configured to be such light engine parts that expandable and configurable one-tenth is easy to adopt any amount to framework 160.The light engine parts can comprise the combination of the array and the lens arra 170 (referring to for example Fig. 8) of independent addressable element 102.For example, in Fig. 2, demonstrate 3 light engine parts (below each array separately of independent addressable element 102, having relevant lens arra 170).Therefore, in one embodiment, the multicolumn optical arrangement can be provided, and each light engine forms a post.
In addition, lithographic equipment 100 comprises alignment sensor 150.Alignment sensor be used for before the exposure at substrate 114 and/or during confirm the aligning between independent addressable element 102 and the substrate 114.The result of alignment sensor 150 can be used by the controller in the lithographic equipment 100, is used for for example controlling locating device 116 and comes position substrate platform 106, improves aligning.In addition or alternately, controller can for example be controlled the locating device of locating or more independent addressable element 102 with independent addressable element 102 relevant being used to, and improves aligning.In one embodiment, alignment sensor 150 can comprise the pattern recognition functions/software that is used to carry out aligning.
In addition or alternately, lithographic equipment 100 comprises horizon sensor 150.Horizon sensor 150 is used for confirming that whether substrate 106 is level with respect to the projection from the pattern of independent addressable element 102.Horizon sensor 150 can before the exposure substrate 114 and/or during confirm horizontality.The result of horizon sensor 150 can be used by the controller in the lithographic equipment 100, for example controls locating device 116 and comes position substrate platform 106, to improve leveling.In addition or alternately, controller can control the element that for example is used for system of positioning projection 108 (for example lens arra), with the locating device that optical projection system 108 (for example lens arra) is associated, improve leveling.In one embodiment, can operate horizon sensor on the substrate 106 and/or operate on it through supersonic beam is projected through electromagnetic radiation beam is projected on the substrate 106.
In one embodiment, the result from alignment sensor and/or horizon sensor can be used to change the pattern that is provided by independent addressable element 102.Pattern can be changed and be used for proofreading and correct for example distortion, and this distortion possibly caused by the for example optical devices (if any) between independent addressable element 102 and the substrate 114, the scrambling in the location of substrate 114, the irregularity degree of substrate 114 etc.Therefore, can be used to change institute's projected pattern, realize that nonlinear deformation proofreaies and correct from the result of alignment sensor and/or horizon sensor.It possibly be favourable for for example flexible display that nonlinear deformation is proofreaied and correct, and flexible display possibly not have consistent linearity or nonlinear deformation.
In the operation of lithographic equipment 100, for example using, robotic delivery device (not shown) is loaded into substrate 114 on the substrate table 106.Afterwards, substrate 114 is along directions X displacement below framework 160 and independent addressable element 102.Substrate 114 is measured by horizon sensor and/or alignment sensor 150, and uses independent addressable element 102 to make substrate by pattern exposure afterwards.For example, substrate 114 is by the focal plane (as plane) of scanning through optical projection system 108, simultaneously son bundle and therefore scheme image patch S (referring to for example Figure 12) and switched to by pattern apparatus for converting 104 and connect (ON) at least in part or all connect (ON) or turn-off (OFF).Characteristic corresponding to the pattern in the pattern apparatus for converting 104 is formed on the substrate 114.Independent addressable element 102 can be operated, and for example is used to provide the described pixel in place like this-grid imaging.
In one embodiment, substrate 114 can be scanned on positive directions X fully, and quilt scanning fully on negative directions X afterwards.In such embodiment, extra horizon sensor on the opposition side of independent addressable element 102 and/or alignment sensor 150 possibly need for negative directions X scanning.
Fig. 3 shows and is used for making the for example diagrammatic top view of the lithographic equipment according to an embodiment of the invention of flat-panel monitor (for example LCD, OLED display etc.) exposure substrate.As lithographic equipment 100 as showing among Fig. 2; Lithographic equipment 100 comprises the substrate table 106 that is used to keep flat-panel display substrates 114, move the locating device 116 of substrate table 106 on up to 6 degree of freedom, be used for confirming the alignment sensor 150 and the horizon sensor 150 of the aligning between independent addressable element 102 and the substrate 114, and said horizon sensor 50 is used for confirming whether substrate 114 is level with respect to the projection from the pattern of independent addressable element 102.
Lithographic equipment 100 also comprises a plurality of independent addressable element 102 that is arranged on the framework 160.In this embodiment, each independent addressable element 102 is emitted radiation diode, for example bluish-violet laser diode.As shown in Figure 3, independent addressable element 102 is arranged to the array of the independent addressable element 102 of the static separation of in Y side upwardly extending a large amount of (for example at least 8).In one embodiment, array is static basically, and promptly they can not move during projection significantly.In addition, in one embodiment, the array of the array of a large amount of independent addressable element 102 and adjacent independent addressable element 102 is so that alternately mode is staggered on directions X.Lithographic equipment 100, especially independent addressable element 102 can be arranged so that pixel-grid imaging to be provided.
In the operation of lithographic equipment 100, for example using, robotic delivery device (not shown) is loaded into flat-panel display substrates 114 on the substrate table 106.Afterwards, substrate 114 is along directions X displacement below framework 160 and independent addressable element 102.Substrate 114 is measured by horizon sensor and/or alignment sensor 150, and afterwards through using independent addressable element 102 by pattern exposure.Independent addressable element 102 can be operated, and for example is used to provide the described pixel in place like this-grid imaging.
Fig. 4 shows the diagrammatic top view according to the lithographic equipment of the embodiment of the invention be used for roll-to-roll flexible display/electronic installation.As the lithographic equipment that shows among Fig. 3 100, lithographic equipment 100 comprises a plurality of independent addressable element 102 that is arranged on the framework 160.In this embodiment, each independent addressable element 102 is emitted radiation diode, for example bluish-violet laser diode.In addition, lithographic equipment comprises the alignment sensor 150 that is used for confirming the aligning between independent addressable element 102 and the substrate 114 and is used for confirming that substrate 114 is with respect to from the projection of the pattern of independent addressable element 102 horizon sensor 150 of level whether.
Lithographic equipment can also comprise the object retainer with object table 106, and substrate 114 moves on object table 106.Substrate 114 is flexible and is rolled on the roller that is connected to locating device 116 that this locating device 116 can be the motor of live-rollers.In one embodiment, substrate 114 can roll from the roller that is connected to locating device 116 in addition or alternately, and this locating device can be the motor of live-rollers.In one embodiment, have at least two rollers, a roller is the roller that substrate rolls and leaves, and another roller is the roller that substrate rolls and arrives.In one embodiment, if for example substrate 114 is enough rigidity, object table 106 need be set so between roller.In such situation, will still have the object retainer, for example one or more roller.In one embodiment, lithographic equipment can provide carrier-free (carrier-less) substrate (for example carrier-free paillon foil (CLF)) and/or roll-to-roll manufacturing.In one embodiment, lithographic equipment can provide the manufacturing of sheet material to sheet material.
In the operation of lithographic equipment 100, flexible substrate 114 is rolled on the roller and/or rolls and leave roller along directions X below framework 160 and independent addressable element 102.Substrate 114 is measured by horizon sensor and/or alignment sensor 150, and uses independent addressable element 102 to make substrate 114 by pattern exposure afterwards.Independent addressable element 102 can be operated, and the pixel-grid imaging as being discussed herein for example is provided.
Fig. 5 shows the diagrammatic top view according to the lithographic equipment of the embodiment of the invention with removable independent addressable element 102.As the lithographic equipment that shows among Fig. 2 100, whether alignment sensor 150 and the definite substrate 114 that lithographic equipment 100 comprises the substrate table 106 that is used to keep substrate 114, move the locating device 116 of substrate table 106 on up to 6 degree of freedom, be used for confirming the aligning between independent addressable element 102 and the substrate 114 be with respect to from the projection of the pattern of independent addressable element 102 horizon sensor 150 of level whether.
Lithographic equipment 100 also comprises a plurality of independent addressable element 102 that is arranged on the framework 160.In this embodiment, each independent addressable element 102 is emitted radiation diodes, for example laser diode (such as bluish-violet laser diode).As shown in Figure 5, independent addressable element 102 is arranged to along the array 200 of the independent addressable element 102 of a large amount of separation of Y direction extension.In addition, in one embodiment, the array 200 of a large amount of independent addressable element 102 is staggered along the adjacent array 200 of directions X and independent addressable element 102 with the mode that replaces.Lithographic equipment 100, especially independent addressable element 102 can be arranged to provide pixel-grid imaging.Yet in one embodiment, lithographic equipment 100 need not provide pixel-grid imaging.More properly, lithographic equipment 100 can be not to be formed for projecting to the single pixel on the substrate but the mode that is formed for projecting to the roughly continuous images on the substrate with the tomographic projection of diode to substrate.
In one embodiment; Between one or more position outside exposure area and exposure area in a plurality of independent addressable element 102 is movably; One or more independent addressable element are used for all or part of projection with bundle 110 in the exposure area, and one or more independent addressable element can any bundles 110 of projection in the position outside this exposure area.In one embodiment; One or more independent addressable element 102 are emitted radiation devices; It is switched on (ON) or part connection (ON) at least in exposure area 204; Be their (in the light shading zone among Fig. 5) emitted radiations, and when being positioned at exposure area 204 outside, be turned off (OFF), i.e. their not emitted radiations.
In one embodiment, one or more independent addressable element 102 are emitted radiation devices, and it can be in the exposure area 204 be switched on (ON) with the outside of exposure area 204.Under such situation; If for example radiation does not suitably project in the exposure area 204 through one or more independent addressable element 102, so one or more independent addressable element 102 can be in the exposure area 204 outside be switched on and be used to afford redress exposure.For example, with reference to figure 5, in the array relative with exposure area 204 one or more independent addressable element 102 can be switched on (ON), are used for proofreading and correct in the exposure area 204 inefficacy or unsuitable tomographic projection.
In one embodiment, exposure area 204 is elongated lines.In one embodiment, exposure area 204 is one-dimensional arraies of or more independent addressable element 102.In one embodiment, exposure area 204 is two-dimensional arraies of or more independent addressable element 102.In one embodiment, exposure area 204 is elongated.
In one embodiment, each movably independent addressable element 102 can move independently, needn't be together as a unit.
In one embodiment, one or more independent addressable element are movably, and in use at least during the projection of bundle 110 transversely the direction in the direction of propagation of bundle 110 move.For example, in one embodiment, one or more independent addressable element 102 are emitted radiation devices, and it moves along the direction of the direction of propagation that is substantially perpendicular to bundle 110 during the projection of bundle 110.
In one embodiment, but each array 200 is plates of transverse shift, and this plate has the independent addressable element 102 of separating on a plurality of spaces that plate as shown in Figure 6 is arranged.In use, each plate is along direction 208 translations.In use, the motion of independent addressable element 102 by timing controlled suitably to be arranged in exposure area 204 (being shown as the dark shadow region of Fig. 6), so that all or part of is restrainted 110 projections.For example; In one embodiment; One or more independent addressable element 102 are emitted radiation devices; Turning on and off by timing controlled of independent addressable element 102 makes one or more independent addressable element 102 be switched on (ON) in exposure area 204 time at them, is turned off (OFF) outside zone 204 time at them.For example in Fig. 6 (A), the two-dimensional array of a plurality of emitted radiation diodes 200 quilt is along direction 208 translations, and two arrays are along positive dirction 208, and the array in the centre between two arrays is along negative direction 208.Connection of emitted radiation diode 102 (ON) or shutoff (OFF) are by timing controlled; Make the specific emitted radiation diode 102 in each array 200 when they are arranged in exposure area 204, be switched on (ON), and be turned off (OFF) outside zone 204 time at them.Certainly, when array for example 200 arrived their strokes terminal, array 200 can be advanced in the opposite direction, promptly two arrays along the array in centre between 208, two arrays of negative direction along positive dirction 208.In other example, in Fig. 6 (B), a plurality of one-dimensional arraies that are interweaved of emitted radiation diode 200 are replacing on the positive dirction 208 with on the negative direction 208 along direction 208 translations.Connection of emitted radiation diode 102 (ON) or shutoff (OFF) are by timing controlled; Make the particular transmission radiation-emitting semiconductor diode 102 in each array 200 when they are arranged in exposure area 204, be switched on (ON), and when they are positioned at outside regional 204, be turned off (OFF).Certainly, array 200 can be advanced along opposite direction.In another example, in Fig. 6 (C), the single array of emitted radiation diode 200 (be shown as one-dimensional array, but this not necessarily) quilt is along direction 208 translations.Connection of emitted radiation diode 102 (ON) or shutoff (OFF) are made the particular transmission radiation-emitting semiconductor diode 102 of each array 200 when they are arranged in exposure area 204, be switched on (ON) and when they are positioned at outside regional 204, be turned off (OFF) by timing controlled.
In one embodiment, each array 200 is rotatable plates, and this plate has the independent addressable element 102 of separating on a plurality of spaces that plate is arranged.In use, each plate is around axis 206 rotations of himself, for example on the direction that arrow showed in Fig. 5.Just, array 200 can be alternately along the clockwise and rotation counterclockwise that shows like Fig. 5.Alternately, each array 200 can be rotated in a clockwise direction or rotate along counter clockwise direction.In one embodiment, array 200 rotation arounds.In one embodiment, the radian of array 200 rotations is less than a complete circle.In one embodiment, if for example substrate scans along the Z direction, array 200 can be around the axis rotation along X or the extension of Y direction so.In one embodiment, with reference to figure 6 (D), the independent addressable element 102 in the array 200 can be arranged in edge, and along outside radial direction projection towards substrate 114.Substrate 114 can center at least a portion of the side of array 200 and extend.In this situation, array 200 is around the axis rotation of extending along directions X, and substrate 114 moves along directions X.
In use, the motion of independent addressable element 102 quilt suitably timing controlled is used for being positioned at exposure area 204, so that will restraint all or part of projection of 110.For example; In one embodiment; One or more independent addressable element 102 are emitted radiation devices; The connection of independent addressable element 102 (ON) or turn-off (OFF) by timing controlled makes one or more independent addressable element 102 is switched on (ON) when they are arranged in exposure area 204 and be turned off (OFF) outside they are positioned at zone 204 time.Therefore, in one embodiment, emitted radiation device 102 can during movement all keep connecting, and some emitted radiation device 102 is modulated into shutoff (OFF) in exposure area 204 afterwards.In between emitted radiation device 102 and the substrate and suitable covering outside exposure area 204 possibly be needs, is used to cover exposure area 204 and prevents that emitted radiation device 102 is switched on (ON) outside exposure area 204.Make emitted radiation device 102 as one man connect (ON) and can be convenient to during use make that emitted radiation device 102 is in consistent temperature basically.In one embodiment, emitted radiation device 102 can keep turn-off (OFF) in the most of the time, and one or more emitted radiation device 102 are switched on (ON) in being in exposure area 204 time.
In one embodiment, rotatable plate can have configuration as shown in Figure 7.For example, in Fig. 7 (A), shown the diagrammatic top view of rotatable plate.Rotatable plate can have array 200; This array 200 has around a plurality of subarrays 210 of the independent addressable element 102 of plate layout (compare with the rotatable plate among Fig. 5, it schematically shows around the single array 200 of the independent addressable element 102 of plate layout).In Fig. 7 (A), subarray 210 is shown as interlaced with each other, makes the independent addressable element 102 of a subarrays 210 between two independent addressable element 102 of another subarray 210.Yet the independent addressable element 102 of subarray 210 can be aligned with each other.Independent addressable element 102 can be rotated around axis through motor 216 independently or together, and in this example, axis extends through motor 216 along the Z direction among Fig. 7 (A).Motor 216 can be connected to rotatable plate and be connected to framework (for example framework 160) or be connected to framework (for example framework 160) and be connected to rotatable plate.In one embodiment, motor 216 (or for example, being positioned at certain motor of other position) possibly cause other the moving of independent addressable element 102, moves individually or together no matter be.For example, motor 216 can cause one or the translation of more independent addressable element 102 on X, Y and/or Z direction.In addition or alternately, motor 216 possibly cause one or more independent addressable element 102 rotation (that is R, around X and/or Y direction xAnd/or R yMotion).
Among the embodiment of the rotatable plate that in as Fig. 7 (B) of vertical view, schematically shows, rotatable plate heart zone therein has opening 212, and the array 200 of independent addressable element 102 is arranged on the plate of opening 212 outsides.Therefore, for example rotatable plate can form the annular disk that is shown like Fig. 7 (B), and the array 200 of independent addressable element 102 is arranged around dish.Opening can reduce the weight of rotatable plate, and/or is convenient to cool off independent addressable element 102.
In one embodiment, can use support member 204 to support rotatable plate in outer circumference.Support member 214 can be a bearing, for example roller bearing or gas bearing.Rotation (and/or other motion, for example along the translation and/or the R of X, Y and/or Z direction xMotion and/or R yMotion) can provide through the motor 216 that is shown like Fig. 7 (A).Additionally or alternately, support member 214 can comprise and makes independent addressable element 102 (and/or provide other to move, for example along the translation and/or the R of X, Y and/or Z direction around axis A rotation xMotion and/or R yMotion) motor.
In one embodiment, with reference to figure 7 (D) and 7 (E), the rotatable plate with array 200 of independent addressable element 102 can be connected to rotatable structure 218.Rotatable structure 218 can be through motor 220 around axis B rotation.In addition, rotatable plate can be through motor 216 with respect to rotatable structure 218 rotations, and motor 216 makes rotatable plate around axis A rotation.In one embodiment, rotation A and B can not overlap, so spatially separating of showing among axis such as Fig. 7 (D) and 7 (E).In one embodiment, rotation A and B are parallel basically.In the use between exposure period, rotatable structure 218 and rotatable plate rotation.Rotation can be coordinated, makes that independent addressable element 102 can be along roughly adjusting to a line in exposure area 204.This can compare with the embodiment of for example Fig. 5, wherein the independent addressable element 102 in the exposure area 204 can be not by along roughly adjusting to a line.
Under situation with movably independent addressable element as indicated above, when needed can be through independent addressable element being moved to the quantity that reduces independent addressable element in the exposure area 204.Therefore, can reduce heat load.
In one embodiment, can provide than the more movably independent addressable element of needed movably independent addressable element (for example on rotatable plate) in theory.The possible advantage of this layout is: if one or more movably independent addressable element are broken and maybe can not be operated, alternatively can use one or more other movably independent addressable element.In addition or alternately; Extra movably independent addressable element can have the advantage of the heat load on the independent addressable element of control; This is because movably independent addressable element is many more, and the cooler of the movably independent addressable element outside the exposure area 204 can be just big more.
In one embodiment, movably independent addressable element 102 is embedded in the material with lower thermal conductivity.For example, material can be ceramic, for example trichroite or based on the pottery and/or devitrified glass (Zerodur) pottery of trichroite.In one embodiment, movably independent addressable element 102 is embedded in the material with high heat conductance, such as metal, and the for example relatively metal of lightweight, for example aluminium or titanium.
In one embodiment, array 200 can comprise temperature control layout.For example, with reference to figure 7 (F), array 200 can have fluid (for example liquid) guiding channel 222, be used to transmit cooling fluid to array 200, transmission cooling fluid near the array 200 or transmit cooling fluid and cool off array through array 200.Passage 222 can be connected to suitable heat exchanger and pump 228, so that fluid passes through channel cycle.Feedway 224 and the loop back device 226 that between passage 222 and heat exchanger and pump 228, is connected can promote the circulation of fluid and temperature to control.Sensor 234 can be arranged in the array, on the array or near the array, to measure the parameter of array 200, the temperature that the fluid that the gained measurement result can be used to control to be provided by heat exchanger and pump flows.In one embodiment, sensor 234 can be measured the expansion and/or the contraction of the main body of array 200, and the gained measurement result can be used to control the temperature of the fluid stream that is provided by heat exchanger and pump.Such expansion and/or contraction can be the representatives of temperature.In one embodiment, sensor 234 can be 200 integrated with array (as by the sensor that becomes form a little 234 showed) and/or can be discrete (as being shown by the sensor that becomes box form 234) with array 200.The sensors 234 discrete with array 200 can be optical sensors.
In one embodiment, with reference to figure 7 (G), array 200 can have one or more heat radiator 230, is used to increase the surface area of heat radiation.Heat radiator 230 can for example be positioned on the top surface of array 200 and/or on the side surface of array 200.Alternatively, one or more other heat radiator 232 can be provided for heat radiator 230 and cooperate, so that dispel the heat.For example, heat radiator 232 can absorb heats from heat radiator 230, and can comprise fluid (for example liquid) guiding channel be similar to as demonstration in Fig. 7 (F) with about its described relevant heat exchanger/pump.
In one embodiment, with reference to figure 7 (H), array 200 can be positioned at fluid restricted structure 236 places or near, this fluid restricted structure 236 is configured to keep fluid 238 to contact so that dispel the heat through fluid with the main body of array 200.In one embodiment, fluid 238 can be liquid, for example water.In one embodiment, fluid restricted structure 236 is provided at the sealing between the main body of it and array 200.In one embodiment, sealing can be for example through contactless sealing that air-flow or capillary force provided.In one embodiment, be similar to like what discussed about fluid guiding channel 222, fluid 238 is recycled to promote heat radiation.Can fluid 238 be provided through fluid supply apparatus 240.
In one embodiment, with reference to figure 7 (H), array 200 can be positioned at fluid supply apparatus 240 places or near, this fluid supply apparatus 240 is configured to towards the main body of array 200 projection fluid 238, so that dispel the heat through fluid.In one embodiment, fluid 238 is a gas, the dry gas that for example cleans, N 2, inert gas etc.Though fluid restricted structure 236 is presented at together in Fig. 7 (H) with fluid supply apparatus 240, they needn't be set together.
In one embodiment, the main body of array 200 is roughly solid structures, and has the chamber that for example is used for fluid guiding channel 222.In one embodiment, the main body of array 200 is most of roughly frame-like structure of opening wide, and various parts (for example independent addressable element 102, fluid guiding channel 222 etc.) are connected to this roughly frame-like structure.The structure of this open state is convenient to gas flow and/or is increased surface area.In one embodiment, the main body of array 200 is the roughly solid constructions with a plurality of entering or the chamber through said main body, so that gas flow and/or increase surface area.
Though described the embodiment that cooling is provided at preceding text, embodiment is alternative or in addition heating can be provided.
In one embodiment, array 200 expectation remains on the steady temperature of constant between the exposure operating period.Therefore; For example the perhaps how independent addressable element 102 of all in the array 200 can be energized before exposure with the steady temperature that reaches expectation or near it; And any one or the control of more temperature are arranged and can be used for cooling and/or heating electrodes 200 between exposure period, to keep steady temperature.In one embodiment, any one or the control of more temperature arranges and can be used for heating electrodes 200 before exposure, with the steady temperature that reaches expectation or near it.Afterwards, between exposure period, any one or the control of more temperature are arranged and can be used for cooling and/or heating electrodes 200, to keep steady temperature.Measurement result from sensor 234 can be used with the mode of feedforward and/or feedback, to keep steady temperature.In one embodiment, each in a plurality of arrays 200 can have identical steady temperature, or in a plurality of array 200 one or more array 200 can have of being different from a plurality of arrays 200 or the more steady temperature of other array 200.In one embodiment; Array 200 is heated to the high temperature of steady temperature than expectation, and afterwards because the cooling that applied is arranged in any one or the control of more temperature and/or because the use of independent addressable element 102 is not enough to keep than the high temperature of steady temperature of expectation between exposure period temperature reduce.
In one embodiment, in order to improve heat control and whole cooling, the quantity of the main body of array 200 by along and/or stride through the exposure area and increase.Therefore, four arrays 200 that for example show in the alternate figures 5 can be provided with 5,6,7,8,9,10 or more array 200.Array still less can be set, and array 200 for example is such as the single big array of the whole width that cover substrate.
In one embodiment, as the lens arra described herein and independent addressable element movably be associated or one.For example, lens array plate can be connected to each removable array 200, and is (for example rotatable) that can move with independent addressable element 102 therefore.As indicated above, lens array plate can be to be displaceable with respect to independent addressable element 102 (for example along the Z direction).In one embodiment, can a plurality of lens array plates be set for array 200, each lens array plate is associated with the different child group of a plurality of independent addressable element 102.
In one embodiment, with reference to figure 7 (I), the lens 242 of single separation can be connected the front of each independent addressable element 102, and 102 is (for example around axis A be rotatable) that can move with independent addressable element.In addition, through using actuator 244, lens 242 can be to be displaceable with respect to independent addressable element 102 (for example along the Z direction).In one embodiment, with reference to figure 7 (J), independent addressable element 102 can be shifted through the main body 246 of actuator 244 with respect to array 200 with lens 242 together.In one embodiment, actuator 244 is configured to (promptly with respect to independent addressable element 102 or with independent addressable element 102) and only makes lens 242 displacements along the Z direction.
In one embodiment, actuator 244 is configured on up to 3 degree of freedom (Z direction, around the rotation of directions X and/or around the rotation of Y direction) with lens 242 displacements.In one embodiment, actuator 244 is configured on up to 6 degree of freedom, lens 242 are shifted.When lens 242 are removable with respect to its independent addressable element 102, can be through actuator 244 mobile lens 242 to change the focal position of lens 242 with respect to substrate.When lens 242 moved with its independent addressable element 102, the focal position of lens 242 was constants, but is shifted about substrate.In one embodiment, lens 242 move for array 200 in each independent addressable element 102 each relevant lens 242 controlled by independent.In one embodiment, the child group of a plurality of lens 242 moves with respect to the relevant sub-group of their a plurality of independent addressable element 102 together, or moves with them.Under one situation of back,, possibly be to be cost to sacrifice meticulous focus control for lower data management expense and/or response faster.In one embodiment, the size of the radiation spot that is provided by independent addressable element 102 can be adjusted through out of focus, and promptly out of focus is big more, and the size of radiation spot is big more.
In one embodiment, with reference to figure 7 (K), the aperture structure 248 that has aperture therein can be positioned at lens 242 below.In one embodiment, aperture structure 248 can be located at lens 242 tops, and between lens 242 and relevant independent addressable element 102.Aperture structure 248 possibly limit lens 242, the independent addressable element 102 of being correlated with and/or the diffraction effect of adjacent lenses 242/ independent addressable element 102.
In one embodiment, independent addressable element 102 can be emitted radiation device, for example laser diode.Such emitted radiation device can have high spatial coherence and therefore possibly demonstrate speckle issue.For fear of such speckle issue, should upset by emitted radiation device radiation emitted with respect to another bundle phase place partly through moving a branch of part.In one embodiment, with reference to figure 7 (L) and 7 (M), plate 250 for example can be positioned on the framework 160, and independent addressable element 102 moves with respect to plate 250.When independent addressable element 102 moved with respect to plate 250 and on plate 250, plate 250 had caused by the destruction of independent addressable element 102 towards the spatial coherence of substrate radiation emitted.In one embodiment, when independent addressable element 102 moved with respect to plate 250 with on plate 250, plate 250 was between lens 242 and its relevant independent addressable element 102.In one embodiment, plate 250 can be between lens 242 and substrate.
In one embodiment, with reference to figure 7 (N), spatial coherence breaking plant 252 can be between substrate and independent at least addressable element 102, this independent addressable element 102 with tomographic projection to the exposure area.In one embodiment, spatial coherence breaking plant 252 and can be connected to main body 246 between independent addressable element 102 and lens 242.In one embodiment, spatial coherence breaking plant 252 is phase-modulator, oscillating plate or swivel plate.With radiation during towards the substrate projection, spatial coherence breaking plant 252 makes and destroys the spatial coherences by independent addressable element 102 radiation emitted in independent addressable element 102.
In one embodiment; Lens arra (no matter whether being together as a unit or as lens independently) (desirably via high thermal conductivity material) is connected to array 200; So that, heat is conducted to array 200 from lens arra providing under the more favourable cooling situation.
In one embodiment, array 200 can comprise one or more focus on or horizon sensor 254, as horizon sensor 150.For example, sensor 254 can be configured to measure the focusing of a plurality of independent addressable element 102 of each independent addressable element 102 or array 200 in the array 200.Therefore, if the out-of-focus appearance of detecting can be proofreaied and correct focusing for each the independent addressable element 102 in the array 200 or for a plurality of independent addressable element 102 in the array 200 so.Focusing can be through for example proofreading and correct along Z direction (and/or around X axis and/or around the Y axis) mobile lens 242.
In one embodiment, sensor 254 is one (or can be one with a plurality of independent addressable element 102 in the array 200) with independent addressable element 102.With reference to figure 7 (O), schematically show exemplary sensor 254.Focus detection bundle 256 away from substrate surface, is passed lens 242 by changed course (for example reflection), and is guided towards detecting device 262 by partially silvered mirror 258.In one embodiment, focus detection bundle 256 can be the radiation that is used to make public, and this radiation is just altered course from substrate.In one embodiment, focus detection bundle 256 can be the special bundle that is directed at the substrate place, and it becomes bundle 256 when being altered course by substrate.Before bundle 256 struck on the detecting device 262, knife-edge edge 260 (it can be an aperture) was arranged in the path of bundle 256.In this example, detecting device 262 comprises at least two the radiosensitive parts (for example zone or detecting device) that in Fig. 7 (O), show through separate detection device 262.When substrate was in positive burnt position, 260 places formed picture rich in detail on the edge of, so the radiosensitive part of detecting device 262 receives the radiation of equal quantities.When substrate is in out-of-focus appearance, bundle 256 displacements, image will be formed on the front or the back at edge 260.Therefore, edge 260 is with the specific part of intercepting bundle 256, and a radiosensitive part of detecting device 262 will receive another radiosensitive part radiation more in a small amount of ratio sensor 262.The plane of the substrate that the bundle 256 that come the bundle 256 that relatively makes it possible to obtain being altered course of output signal of radiosensitive part of self-detector 262 amount different with desired position, is altered course and the not residing simultaneously direction of desired position and the bundle 256 that altered course and desired position are not left simultaneously.Signal can for example can be adjusted lens 242 through this control signal by electronic processing so that control signal to be provided.Catoptron 258, edge 260 and detecting device 262 can be mounted to array 200.In one embodiment, detecting device 262 can be the four-quadrant photovoltaic element.
In one embodiment, 400 independent addressable element 102 can be provided, and (at any one time) 133 carries out work.In one embodiment, can be provided with the independent addressable element 102 of 600-1200 work, and have extra independent addressable element 102 alternatively, for example be used as reservation and/or be used for correction exposure (as for example mentioned above).The quantity of the independent addressable element 102 of work possibly for example depend on resist, and it need be used to form the given dose of the radiation of pattern.In independent addressable element 102 is that independent addressable element 102 can be rotated in the frequency of 6Hz, and has the independent addressable element 102 of 1200 work under rotatable (like independent addressable element 102) situation.If have less independent addressable element 102, then can under higher frequency, rotate independent addressable element 102; If have more independent addressable element 102, can rotate independent addressable element 102 with lower frequency.
In one embodiment, compare, can use movably independent addressable element 102 to reduce the quantity of independent addressable element 102 with the array of independent addressable element 102.For example, can (at any one time) 600-1200 independent addressable element 102 of working be provided.In addition, the quantity that reduces can produce basically and the similar result of the array of independent addressable element 102, but has one or more advantage.For example,, possibly need the array of 100000 purplish blue diodes, for example be arranged to 200 diode * 500 diodes for the sufficient exposure ability of using the purplish blue diode array.With the frequencies operations of 10kHz the time, the luminous power of each laser diode will be 0.33mW.The electric power of each laser diode will be 150mW=35mA * 4.1V.Therefore, for said array, electric power will be 15kW.In using the embodiment of independent addressable element movably, 400 purplish blue diodes can be provided, wherein 133 are carried out work.When under the frequency of 9Mhz, operating, the luminous power of each laser diode will be 250mW.The electric power of each laser diode will be 1000mW=240mA * 4.2V.Therefore, for said array, electric power will be 133W.Therefore; Diode during movably independent addressable element is arranged can as for example among Fig. 7 (P), operate in the optical output power of demonstration and the precipitous part in the forward current relation curve (240mA v.35mA); Thereby produced the high-output power (250mW v.0.33mW) of each diode, but had low electric power for a plurality of independent addressable element (133W v.15kW).Therefore, the diode power attenuation and/or the heat that can use more effectively and cause reducing.
Therefore, in one embodiment, diode is operated in the precipitous part of power/forward current curve.In the non-precipitous part of power/forward current curve, operate the incoherentness that possibly cause radiation.In one embodiment, diode under greater than the luminous power of 5mW but be less than or equal to 20mW, or be less than or equal to 30mW, or be less than or equal under the situation of 40mW and operate.In one embodiment, diode is not operated under the luminous power greater than 300mW.In one embodiment, diode is operated with single pattern, rather than operates with multi-mode.
The quantity of the independent addressable element 102 on the array 200 possibly depend on; The speed that particularly depends on the length of the exposure area that (and as in addition in the pointed degree of preceding text) array 200 will cover, moves at array between exposure period, the size of spot (promptly project to the cross sectional dimensions of the spot on the substrate from independent addressable element 102; Width/diameter for example), sweep velocity, cost consideration, the independent addressable element of the expectation of each independent addressable element desired intensity that should provide (for example whether expecting the dosage that launches expectation for more than the spot on the substrate of one independent addressable element top), substrate to avoid infringement to the resist on substrate or the substrate can be switched on (ON) or turn-off (OFF) frequency and for the expectation of the independent addressable element 102 of redundancy (as before discuss; For example be used for correction exposure or as reserving, if for example one or more independent addressable element fault).In one embodiment, array 200 comprises at least 100 independent addressable element 102, for example at least 200 independent addressable element; At least 400 independent addressable element; At least 600 independent addressable element, at least 1000 independent addressable element, at least 1500 independent addressable element; At least 2500 independent addressable element, or at least 5000 independent addressable element.In one embodiment, array 200 comprises less than 50000 independent addressable element 102, for example less than 25000 independent addressable element; Less than 15000 independent addressable element, less than 10000 independent addressable element, less than 7500 independent addressable element; Less than 5000 independent addressable element, less than 2500 independent addressable element, less than 1200 independent addressable element; Less than 600 independent addressable element, or less than 300 independent addressable element.
In one embodiment; Array 200 comprising for every 10cm exposure area length (that is, making the quantity of the independent addressable element in the array carry out standardization for the exposure area length of 10cm): at least 100 independent addressable element 102, for example at least 200 independent addressable element; At least 400 independent addressable element; At least 600 independent addressable element, at least 1000 independent addressable element, at least 1500 independent addressable element; At least 2500 independent addressable element, or at least 5000 independent addressable element.In one embodiment, array 200 comprising for every 10cm exposure area length (promptly making the quantity of the independent addressable element in the array carry out standardization for the exposure area length of 10cm): less than 50000 independent addressable element 102, for example less than 25000 independent addressable element; Less than 15000 independent addressable element; Less than 10000 independent addressable element, less than 7500 independent addressable element, less than 5000 independent addressable element; Less than 2500 independent addressable element; Less than 1200 independent addressable element, less than 600 independent addressable element, or less than 300 independent addressable element.
In one embodiment, array 200 comprises the independent addressable element 102 less than 75% redundancy, for example 67% or still less, 50% or still less, about 33% or still less, 25% or still less, 20% or still less, 10% or still less, or 5% or still less.In one embodiment, array 200 comprises the independent addressable element 102 of at least 5% redundancy, for example at least 10%, at least 25%, at least 33%, at least 50%, or at least 65%.In one embodiment, array comprises the independent addressable element of about 67% redundancy.
In one embodiment, the size of the spot of the independent addressable element on the substrate is 10 microns or still less, 5 microns or still less, and for example 3 microns or still less, 2 microns or still less, 1 micron or still less, 0.5 micron or still less, 0.3 micron or still less, or about 0.1 micron.In one embodiment, the size of the spot of the independent addressable element on the substrate is 0.1 micron or bigger, 0.2 micron or bigger, and 0.3 micron or bigger; 0.5 micron or bigger, 0.7 micron or bigger, 1 micron or bigger; 1.5 micron or bigger, 2 microns or bigger, or 5 microns or bigger.In one embodiment, the size of spot is about 0.1 micron.In one embodiment, the size of spot is about 0.5 micron.In one embodiment, the size of spot is about 1 micron.
In operation during lithographic equipment 100, substrate 114 for example is used that robotic delivery device (not shown) is loaded on the substrate table 106.Substrate 114 is shifted along directions X below framework 160 and independent addressable element 102 afterwards.Substrate 114 is measured through horizon sensor and/or alignment sensor 150, and use afterwards independent addressable element 102 with substrate with pattern exposure, as indicated above.Independent addressable element 102 can be operated, the pixel-grid imaging that for example provides place like this to discuss.
Fig. 8 shows the diagrammatic side view of lithographic equipment according to an embodiment of the invention.As shown in Figure 8, lithographic equipment 100 comprises pattern apparatus for converting 104 and optical projection system 108.Optical projection system 108 comprises two lens 176,172.First lens 176 are arranged to receive the radiation beam 110 through ovennodulation from pattern apparatus for converting 104, and focus on it through the contrast aperture in the aperture diaphragm 174.Other lens (not shown) can be arranged in aperture.Radiation beam 110 is dispersed afterwards, and is focused on by second lens 172 (for example field lens).
Optical projection system 108 also comprises and is arranged to receive the lens arra 170 through the radiation beam 110 of ovennodulation.Pass the different separately lens in the lens arra 170 with the different piece of the corresponding radiation beam 110 through ovennodulation of in the pattern apparatus for converting 104 or more independent controlled member.Each lens will focus on the point that is positioned on the substrate 114 through the part separately of the radiation beam 110 of ovennodulation.Like this, the array of radiation spot S (referring to Figure 12) is exposed on the substrate 114.Though should be appreciated that 5 lens that only demonstrate in the shown lens arra 170, lens arra can comprise hundreds of or thousands of lens (this is equally applicable to the independent controlled member as pattern apparatus for converting 104).
As shown in Figure 8, between substrate 114 and lens arra 170, free operating distance FWD is set.This moves apart from permission substrate 114 and/or lens arra 170, thereby allows for example convergence correction.In one embodiment, free operating distance in the scope of 1-3mm, for example about 1.4mm.The independent addressable element of pattern apparatus for converting 104 is arranged in pitch P place, and it causes associated section at the one-tenth image patch at substrate 114 places apart from P.In one embodiment, lens arra 170 can provide 0.15 or 0.18 NA.In one embodiment, becoming the size of image patch is about 1.6 μ m.
In this embodiment, optical projection system 108 can be 1: 1 optical projection system, and wherein the array pitch of the figure image patch on the substrate 114 is identical with the array pitch of the pixel of pattern apparatus for converting 104.For the resolution of improvement is provided, the figure image patch can be much smaller than the pixel of pattern apparatus for converting 104.
Fig. 9 demonstrates the diagrammatic side view of lithographic equipment according to an embodiment of the invention.In this embodiment, except lens arra 170, between pattern apparatus for converting 104 and substrate 114, there are not optical devices.
Lithographic equipment 100 among Fig. 9 comprises pattern apparatus for converting 104 and optical projection system 108.In this case, optical projection system 108 only comprises and is arranged to receive the lens arra 170 through the radiation beam 110 of ovennodulation.Pass the different lens separately in the lens arra 170 with in the pattern apparatus for converting 104 one or the different piece of the corresponding radiation beam 110 of more independent controlled member.Each lens will focus on the point that is positioned on the substrate 114 through the part separately of the radiation beam 110 of ovennodulation.Like this, the array of radiation spot S (referring to Figure 12) is exposed on the substrate 114.Though should be appreciated that 5 lens that only demonstrate in the lens arra 170 that is shown, lens arra can comprise hundreds of or thousands of lens (this is equally applicable to the independent controlled member as pattern apparatus for converting 104).
As in that kind shown in Fig. 8, between substrate 114 and lens arra 170, be provided with free operating distance FWD.This is apart from allowing substrate 114 and/or lens arra 170 to move, to allow for example to carry out convergence correction.The independent addressable element of pattern apparatus for converting 104 is arranged in pitch P place, and it has caused associated section at the one-tenth image patch at substrate 114 places apart from P.In one embodiment, lens arra 170 can provide 0.15 NA.In one embodiment, becoming the size of image patch is about 1.6 μ m.
Figure 10 shows that use is about the diagrammatic side view according to the lithographic equipment of the embodiment of the invention of Fig. 5 in above-described movably independent addressable element 102.In this embodiment, except lens arra 170, between pattern apparatus for converting 104 and substrate 114, there are not other optical devices.
Lithographic equipment 100 among Figure 10 comprises pattern apparatus for converting 104 and optical projection system 108.In this case, optical projection system 108 only comprises and is arranged to receive the lens arra 170 through the radiation beam 110 of ovennodulation.Pass the different lens separately in the lens arra 170 with in pattern apparatus for converting 104 one or the different piece of the corresponding radiation beam 110 of more independent controlled member.Each lens will focus on the point that is positioned on the substrate 114 through the part separately of the radiation beam 110 of ovennodulation.Like this, the array of radiation spot S (referring to Figure 12) is exposed on the substrate 114.Though should be appreciated that 5 lens in the lens arra 170 shown in only demonstrating, lens arra can comprise hundreds of or thousands of lens (this is equally applicable to the independent controlled member as pattern apparatus for converting 104).
As in that kind shown in Fig. 8, between substrate 114 and lens arra 170, be provided with free operating distance FWD.This is apart from allowing substrate 114 and/or lens arra 170 to move, to allow for example to carry out convergence correction.The independent addressable element of pattern apparatus for converting 104 is arranged in pitch P place, and it has caused associated section at the one-tenth image patch at substrate 114 places apart from P.In one embodiment, lens arra 170 can provide 0.15 NA.In one embodiment, becoming the size of image patch is about 1.6 μ m.
Figure 11 shows a plurality of independent addressable element 102, specifically 6 independent addressable element 102.In this embodiment, each independent addressable element 102 is emitted radiation diode, for example bluish-violet laser diode.Two electric wires of each emitted radiation diode bridge joint are to supply an electric current to the emitted radiation diode with the control diode.Therefore, diode forms the addressable grid.Article two, the width between the electric wire is about 250 μ m, and the emitted radiation diode has the pitch of about 500 μ m.
Figure 12 shows schematically how the pattern on the substrate 114 can produce.Solid circles representes to project to through the lens arra MLA in the optical projection system 108 array of the spot S on the substrate 114.When on substrate, carrying out a series of exposure, substrate 114 is moved on directions X with respect to optical projection system 108.The spot exposure SE that on substrate, has been made public before empty circles is represented.As shown in the figure, project on substrate 114, the make public spot of a row R of each spot on the substrate 114 through the lens arra in the optical projection system 108 170.Through produced the complete pattern of substrate 114 by the summation of the spot exposure SE of all row R of each spot S exposure.Such layout is commonly referred to " pixel-grid imaging ".Should be appreciated that Figure 12 is that schematic accompanying drawing and spot S possibility in reality are overlapping.
It is thus clear that the array of radiation spot S is arranged (edge of substrate 114 is positioned at and is parallel to X and Y direction) with the angle [alpha] with respect to substrate 114.This is done and makes at substrate 114 when (directions X) moves along the direction of scanning, and each radiation spot will be through the different zone of substrate, thereby the permission entire substrate is covered by the array of radiation spot S.In one embodiment, angle [alpha] is 20 ° at the most, 10 °, and for example at the most 5 °, 3 ° at the most, 1 ° at the most, 0.5 ° at the most, 0.25 ° at the most, 0.10 ° at the most, 0.05 ° at the most, or 0.01 ° at the most.In one embodiment, angle [alpha] is at least 0.0001 °, for example at least 0.001 °.According in width and the inclined angle alpha of confirming the array on the direction of scanning perpendicular to the array pitch on the direction of direction of scanning and image spot size, be used to guarantee that the whole surface area of substrate 114 is addressed.
How Figure 13 schematically shows can be through using a plurality of light engines entire substrate 114 of in single scanning, making public, and each light engine comprises one or more independent addressable element.Produce 8 array SA of radiation spot S (not shown) through 8 light engines; These 8 light engines are arranged to two row R1, the R2 on " chessboard plate "; Or interconnected, make that the edge of adjacent array of edge and radiation spot S of an array of radiation spot S is overlapping slightly.In one embodiment, light engine is arranged at least 3 rows, for example 4 rows or 5 rows.Like this, radiation belt extends across the width of substrate W, thereby allows in single scanning, to carry out the exposure to entire substrate." full duration " single like this helps to avoid connecting twice or more times possible stitching problem through process through exposure, and can also reduce the machine trace, because substrate maybe not need on the direction transverse to the substrate direction of passage, is moved.Should be appreciated that the light engine that can use any suitable quantity.In one embodiment, the quantity of light engine is at least 1, for example at least 2, at least 4, at least 8, at least 10, at least 12, at least 14, or at least 17.In one embodiment, the quantity of light engine is less than 40, for example less than 30 or less than 20.Each light engine can comprise the optical projection system 108 and/or the radiating system of discrete pattern apparatus for converting 104 and optional separation as indicated above.Yet should be appreciated that two or more light engines possibly have at least a portion in or more radiating system, pattern apparatus for converting 104 and/or the optical projection system 108.
Among the embodiment that describes herein, be provided for controlling the controller of independent addressable element.For example, be in the example of emitted radiation device in independent addressable element, controller can control when independent addressable element is switched on (ON) or shutoff (OFF) and the acquisition high frequency modulated to independent addressable element.Controller can be controlled the power by one or more independent addressable element radiation emitted.Controller can be modulated the intensity through one or more independent addressable element radiation emitted.The intensity homogeneity on all or the part of array of independent addressable element can be controlled/be adjusted to controller.Controller can be adjusted the radiation output of independent addressable element, so that image error (for example etendue and optical aberration (for example coma, astigmatism etc.)) is proofreaied and correct.
In photolithography, can through optionally with the resist layer on the substrate with radiant exposure (for example through with the radiant exposure resist layer of patterning), and on substrate, produce the characteristic of expectation.Receive the resist zone experience chemical reaction of specific MID (" dosage threshold value "), and other zone remains unchanged.Chemical difference in the consequent resist layer allows resist is developed, and promptly selective removal has received the zone of minimum dose at least or removed the zone that does not receive minimum dose.As a result, a part of substrate is still by resist protection, and made public in the zone that has removed the substrate of resist, thereby allows for example additional processing steps, and for example selective etch substrate, selective metal deposition etc. produce the characteristic of expectation thus.Can be through in the pattern apparatus for converting, setting the patterning that independent controlled member is realized radiation; Make the regional radiation of resist layer on the substrate that is transferred to the characteristic that is positioned at expectation be in sufficiently high intensity; Make said zone between exposure period, receive radiation dose greater than the dosage threshold value; And the corresponding independent controlled member of other zone passage setting on the substrate receives the radiation dose that is lower than the dosage threshold value, so that zero or lower significantly radiation intensity to be provided.
In reality; Even independent controlled member is provided on the side of characteristic boundary and maximum radiant intensity is provided and minimized radiation intensity is provided, maybe not can be changed to zero-dose sharp from given maximum dose at the radiation dose of the edge of the characteristic of expectation on opposite side.Alternatively, because diffraction effect, the level of radiation dose maybe be across reducing through zone of transition.Then, the dosage that the position on the border of the final desired character that forms passes through to be received after the development resist is reduced to the position that is lower than the radiation dose threshold value and confirms.Radiation dose across through zone of transition and the distribution that descends and thus the exact position of characteristic boundary can come more accurately to control through setting independent controlled member, this independent controlled member provide be not only maximum or minimum intensity level and also can be positioned on radiation to the substrate of the strength level between the minimum and maximum strength level on the characteristic boundary or near point on.This is commonly referred to " gray level " or " grey level ".
Gray level can provide and feasible comparing in etching system, to the bigger control of the position of characteristic boundary, wherein provides to the radiation intensity of substrate through given independent controlled member and can only be configured to two values (promptly only being maximal value and minimum value).In one embodiment, at least three different radiation intensity values can be projected on the substrate, for example at least 4 radiation intensity values; At least 8 radiation intensity values, at least 16 radiation intensity values, at least 32 radiation intensity values; At least 64 radiation intensity values; At least 100 radiation intensity values, at least 128 radiation intensity values, or at least 256 radiation intensity values.If the pattern apparatus for converting self is radiation source (the for example array of light emitting diode or laser diode), can realize gray level so, the strength level of the radiation that for example is transmitted through control.If the contrast device is a micro-mirror device, can realize gray level, for example through controlling the angle of inclination of micro-reflector.In addition, can realize gray level through a plurality of programmable elements in the contrast device being divided into groups and being controlled at the quantity of the element in said group that is switched on preset time or turn-offs.
In an example, the pattern apparatus for converting can have a series of state, comprising: (a) black state, the radiation that is wherein provided to the contribution of the intensity distributions of its respective pixel be minimum or even be zero; (b) the whitest state, maximum contribution has been made in the radiation that is wherein provided; Contribution in the middle of (c) a plurality of states between aforementioned two states, the radiation that is wherein provided have been made.Said state is divided into normal group and compensation group, and this normal group is used for reasonable beam patterning/printing, and this compensation group is used for the effect of compensating defective element.Normal group comprises black state and first group of intermediateness.This first group will be described as grey states, and they are optional, provide from the ever-increasing contribution of the black value of minimum up to specific normal maximum size to give respective pixel intensity.The compensation group comprises remaining second group of intermediateness and the whitest state.This second group of intermediateness will be described as white state, they be optional, so that the contribution bigger than normal maximum size to be provided, constantly increase to true maximal value corresponding to the whitest state.Though second group of intermediateness is described as white state, is to be understood that: this only is to be convenient between normal and compensation step of exposure, distinguish.Whole a plurality of states will alternately be described as be at the sequence of the grey states between black and white, selectively can make it possible to carry out the gray level printing.
Should be appreciated that gray level can be used for extra or alternative purpose for mentioned above.For example, the processing of substrate after exposure can be adjusted, and feasiblely depends on the radiation dose level that is received, have substrate the zone more than two potential response.For example, a part that receives the substrate of the radiation dose be lower than first threshold responds with first mode; Reception is higher than first threshold but the part of substrate that is lower than the radiation dose of second threshold value responds with second mode; The part of substrate that is higher than the radiation dose of second threshold value with reception responds with Third Way.Therefore, gray level can be used to provide through the radiation dose on the substrate and distributes, and it has the dosage level more than two expectation.In one embodiment; Radiation dose distributes and has the dosage level of at least 2 expectations; For example the radiation dose level of at least 3 expectations, the radiation dose level of the radiation dose level of at least 4 expectations, at least 6 expectations or the radiation dose level of at least 8 expectations.
It is also understood that can control radiation dose through the method the intensity of the radiation that receives except the every bit place that only is controlled on the substrate distributes, as indicated above.For example, alternately or additionally, the duration of exposure that can be through controlling said point is controlled by the radiation dose that every bit received on the substrate.As another example, the every bit on the substrate can receive the radiation in a plurality of continuous exposures potentially.Therefore, can be alternately by radiation dose that every bit received or additionally through using the child group of having selected in the said a plurality of continuous exposure said point that makes public to control.
In order on substrate, to form pattern, need set each the independent controlled member in the pattern apparatus for converting for needed state in each stage during the exposure process.Therefore, the control signal of representing needed state must be transferred to each independent controlled member.Desirably, lithographic equipment comprises the controller 400 that produces control signal.The pattern that will on substrate, form can provide to lithographic equipment with the form (for example GDSII) of vector definition.In order design information to be converted to the control signal of each independent controlled member, controller comprises one or more data operating means, and each is configured on the data stream of expression pattern, carry out treatment step.The data manipulation device can be referred to as " data path (datapath) ".
Data manipulation device in the data path can be configured to carry out one or more in the following function: will convert the bitmap pattern data based on the design information of vector to; Radiation dose figure (promptly the needed radiation dose on entire substrate distributes) with bitmap pattern data-switching one-tenth needs; The radiation dose figure of needs is converted to the required radiation intensity value of each independent controlled member; And convert the radiation intensity value of the needs of each independent controlled member to corresponding control signal.
In one embodiment, control signal can be supplied to independent controlled member 102 and/or one or more other device (for example sensor) through wire communication or radio communication.In addition, from independent controlled member 102 and/or from one or more the signal of other device (for example sensor) can be communicated to controller 400.
With reference to Figure 14 (A), in wireless embodiment, transceiver (or only being transmitter) 406 emissions comprise the signal of the control signal that is received by transceiver (or only being receiver) 402.Through one or more line 404 control signal is sent to independent controlled member 102 separately.In one embodiment; Signal from transceiver 406 can comprise a plurality of control signals, and transceiver 402 can be decomposed into separately independent controlled member 102 and/or one or more a plurality of control signals of other device (for example sensor) with said signal multichannel.In one embodiment, wireless transmission can be to carry out through radio frequency (RF).
With reference to Figure 14 (B), in wired embodiment, one or more line 404 can be connected to independent controlled member 102 and/or one or more other device (for example sensor) with controller 400.In one embodiment, single line 404 can be provided, transmit each control signal with the main body that each control signal is sent to array 200 and/or from the main body of array 200.At the main body place of array 200, can provide individually after the control signal to independent controlled member 102 and/or one or more other device (for example sensor).For example, be similar to wireless example, for transmission on single line can be carried out multipath transmission to control signal, and afterwards for provide to independent controlled member 102 and/or one or more other device (for example sensor) can carry out multichannel to it and decompose.In one embodiment, many lines 404 can be provided, to transmit independent controlled member 102 and/or one or the more control signal separately of other device (for example sensor).In array 200 rotatable embodiment, can line 404 be provided along rotation A.In one embodiment, through at motor 216 places or the sliding contact around motor 216 can signal be provided to the main body of array 200, or signal is provided from the main body of array 200.This possibly be favourable for rotatable embodiment.Sliding contact can be the brush through contacting with plate for example.
In one embodiment, line 404 can be an optical line.In this situation, signal can be an optical signalling, wherein for example can transmit the Different control signal with different wavelengths.
Being similar to the mode of control signal, can be through wired or wireless mode with power supply to independent controlled member 102 or one or more other device (for example sensor).For example, in wired embodiment, can be through one or more line 404 supply powers, and no matter be identical, or different with the line that transmits signal whether.As stated, sliding contact can be set arranges with through-put power.In wireless embodiment, can pass through RF couple transmission power.
Though concentrating on, discussion before is supplied to independent controlled member 102 and/or one or the more control signal of other device (for example sensor); But be to be understood that they also comprise, additionally or alternately through the configuration that is fit to signal from independent controlled member 102 and/or one or more other device (for example sensor) transfer to controller 400.Therefore; Communication can be unidirectional (for example only arrive or from independent controlled member 102 and/or one or more other device (for example sensor)) or two to (that is, arrive and from independent controlled member 102 and/or one or more other device (for example sensor)).For example, transceiver 402 can be in order to transfer to transceiver 406 will from independent controlled member 102 and/or one or more a plurality of signals of other device (for example sensor) carry out multipath transmission, this moment, it can be resolved into separate signal by multichannel.
In one embodiment, consider the correct supply of the pattern that possibly influence on the substrate and/or the factor of realization, can change the control signal that pattern is provided.For example, considered can correction be applied to control signal to one or the more heating of array 200.Such heating possibly cause the pointing direction of the change of independent controlled member 102, from inhomogeneity variation of the radiation of independent controlled member 102 etc.In one embodiment; Temperature and/or expansion from the measurement relevant with (for example one or more independent controlled member 102) array 200 of for example sensor 234 can be used to change control signal, otherwise will provide this control signal to form pattern.Therefore, for example between exposure period, the temperature of independent controlled member 102 possibly change, and this variation has caused will be in the variation of institute's projected pattern that single stationary temperature provides.Therefore, consider such variation, can change control signal.Similarly, in one embodiment, can be used to change the pattern that provides through independent controlled member 102 from the result of alignment sensor and/or horizon sensor 150.Can change this pattern to proofread and correct for example distortion, this distortion possibly caused by the scrambling of the for example location of the optical devices (if any) between independent controlled member 102 and the substrate 114, substrate 114, the irregularity degree of substrate 114 etc.
In one embodiment, based on the theory of the physics/optical results on the desired pattern that causes by measured parameter (temperature of for example measuring, through the horizon sensor measurement distance etc.), can confirm the variation of control signal.In one embodiment, can confirm the variation of control signal based on the test or the empirical model of the physics/optical results on desired pattern that causes by measured parameter.In one embodiment, can apply the variation of control signal with the mode of feedforward and/or feedback.
In one embodiment, lithographic equipment can comprise the sensor 500 of the characteristic of measuring radiation, this radiation by or will be transmitted towards substrate through one or more independent controlled member 102.Such sensor can be spot sensor or transmission image sensor.Sensor for example can be used for confirming from the radiation of independent controlled member 102 intensity, from the homogeneity of the radiation of independent controlled member 102, from the cross sectional dimensions of the radiation spot of independent controlled member 102 or area and/or from the position of the radiation spot (in X-Y plane) of independent controlled member 102.
Figure 15 shows the diagrammatic top view of lithographic equipment according to an embodiment of the invention, demonstrates the position of the certain exemplary of sensor 500.In one embodiment, one or more sensor 500 are arranged in the substrate table 106 that keeps substrate 114 or on the substrate table 106.For example, sensor 500 can be arranged on the leading edge of substrate table 106 and/or the trailing edge of substrate table 106.In this example, demonstrate four sensors 500, for each array 200 corresponding sensor.Expect that they are positioned at the position that can be covered by substrate 116 not.In alternative or other example, can sensor be arranged on the lateral edges of substrate table 106, desirably be arranged on the position that can be covered by substrate 116 with not.Sensor 500 at the leading edge place of substrate table 106 can be used for the detection of the pre-exposure of independent controlled member 102.Sensor 500 at the trailing edge place of substrate table 106 can be used for the detection of the post-exposure of independent controlled member 102.Sensor 500 at the lateral edges place of substrate table 106 can be used for the detection between exposure period (" operating (on-the-fly) " detects) of independent controlled member 102.
With reference to Figure 16 (A), demonstrate the diagrammatic side view of the part of lithographic equipment according to an embodiment of the invention.In this example, only demonstrate single array 200, and for the sake of clarity omitted other part of lithographic equipment; Sensor described herein can be applied to each array 200 or some arrays 200.In Figure 16 (A), demonstrate some other or alternative examples (except the sensor 500 of substrate table 106) of the position of sensor 500.First example is the sensor 500 on the framework 160, and this sensor receives the radiation from independent controlled member 102 of transmitted beam changed course structure 502 (for example reflective catoptron is arranged).In this first example, independent controlled member 102 moves in X-Y plane, and therefore the different independent controlled member in the independent controlled member 102 can be configured to provide radiation to Shu Gaixiang structure 502.Second example in addition or alternative is the sensor 500 on framework 160, and this sensor 500 receives the radiation from independent controlled member 102 of dorsal part from independent controlled member 102 (promptly with exposing radiation is provided relative a side).In this second example, independent controlled member 102 moves in X-Y plane, and therefore the different independent controlled member in the independent controlled member 102 can be configured to provide radiation to sensor 500.Though the sensor 500 in second example is presented in the path of independent controlled member 102 at 204 places, exposure area, sensor 500 can be positioned at the position that shows sensor 510.In one embodiment, the sensor 500 on the framework 160 is positioned at fixing position or can is movably through for example relevant actuator in addition.Except or alternative pre-exposure sensing and/or post-exposure sensing, first and second examples of preceding text can be used to provide " operating " sensing.The 3rd example is the sensor 500 on the structure 504,506.Structure 504,506 can be through actuator 508 movably.In one embodiment, structure 504 is positioned at that substrate table will move path following of (shown in Figure 16 (A)) or in the side in said path.In one embodiment; Structure 504 can be the position (if substrate table 106 is not there) that moves to sensor 500 places of the substrate table 106 that in Figure 16 (A), shows through actuator 508; If structure 504 is in the side in path, and then such moving can be along Z direction (shown in Figure 16 (A)) or along X and/or Y direction.In one embodiment, structure 506 be positioned at substrate table will move (shown in Figure 16 (A)) place the path the top or in the side in path.In one embodiment, structure 506 can move to the position (if substrate table 106 is not there) at sensor 500 places of the substrate table 106 that is shown at Figure 16 (A) through actuator 508.Structure 506 can be connected to framework 160 and be displaceable with respect to framework 160.
Measuring through one or more independent controlled member 102 in the operation of the characteristic of the radiation that substrate transport maybe will be transmitted; Radiation beam through movable sensor 500 and/or mobile independent controlled member 102 makes sensor 500 be arranged in the path from the radiation of independent controlled member 102.Therefore, as an example, can move substrate table 106, sensor 500 is positioned in the path from the radiation of the independent controlled member 102 of demonstration among Figure 16 (A).In this situation, sensor 500 is positioned in the path of independent controlled member 102 at 204 places, exposure area.In one embodiment, sensor 500 can be positioned in the path of the outer independent controlled member 102 in exposure area 204 (for example the independent controlled member 102 that shows of side, if Shu Gaixiang structure 502 is not there) leftward.If be arranged in radiation path, sensor 500 can detect the characteristic of radiation and measuring radiation.For the ease of sensing, sensor 500 can move with respect to independent controlled member 102, and/or independent controlled member 102 can move with respect to sensor 500.
As another example, can independent controlled member 102 be moved to a position, feasible radiation from independent controlled member 102 strikes on the Shu Gaixiang structure 502.Shu Gaixiang structure 502 guides to the sensor 500 on the framework 160 with bundle.For the ease of sensing, sensor 500 can move with respect to independent controlled member 102, and/or independent controlled member 102 can move with respect to sensor 500.In this example, the 204 external pelivimetry independence controlled members 102 in the exposure area.
In one embodiment, sensor 500 can be that fix or mobile.If fixing, independent controlled member 102 is movably with respect to fixed sensing 500 desirably, so that sensing.For example, array 200 can move (for example rotation or translation) with respect to sensor 500 (the for example sensor 500 on the framework 160), so that carry out sensing through sensor 500.If sensor 500 is movably (for example sensors 500 on the substrate table 106), that then independent controlled member 102 can be held in is static, be used for sensing, or is moved in addition for example to quicken sensing.
Sensor 500 can be used to calibrate one or more independent controlled member 102.For example, before exposure, can detect the position of the spot of independent controlled member 102 through sensor 500, and correspondingly system is calibrated.Afterwards can be based on this desired location adjustment exposure of spot (for example control the position of substrate 114, control the position of independent controlled member 102, control the shutoff (OFF) of independent controlled member 102 or connect (ON) etc.).In addition, can calibrate subsequently.For example, can be after exposure, before another exposure, use the sensor 500 on the trailing edge of substrate table 106 for example to calibrate immediately.Calibration can be carried out under situation such as before each exposure, after the exposure at specific quantity.In addition, through the position of the spot that uses sensor 500 " to be in operation " to detect independent controlled member 102, and correspondingly adjustment exposure.Perhaps, independent controlled member 102 can be calibrated based on " being in operation " sensing once more.
In one embodiment, one or more independent controlled member 102 can be encoded and so that can detect which independent controlled member 102 be positioned at certain location or be used.In one embodiment, independent controlled member 102 can have sign, and sensor 510 can be used for detecting sign, and this sign can be RFID, bar code etc.For example, each in a plurality of independent controlled members 102 can be moved near sensor 510, to read sign.Knowing under the situation of which independent controlled member 102 near sensor 510, can know which independent controlled member 102 near sensor 500, which independent controlled member 102 is 204 medium in the exposure area.In one embodiment, each independent controlled member 102 can be used to provide the radiation with different frequency, and which independent controlled member 102 sensor 500,510 can be used to detect near sensor 500,510.For example; In a plurality of independent controlled members 102 each can be moved near sensor 500,510; To receive radiation from independent controlled member 102; And sensor 500,510 can multichannel decomposes received radiation afterwards, with confirm which independent controlled member 102 at special time near sensor 500,510.Knowing under the situation of above-mentioned situation, can know which independent controlled member 102 near sensor 500, it is medium that which independent controlled member 102 is positioned at exposure area 204.
In one embodiment, as indicated above, position transducer can be provided to confirm that one or more independent controlled member 102 are up to the position on 6 degree of freedom.For example, sensor 510 can be used for position probing.In one embodiment, sensor 510 can comprise interferometer.In one embodiment, sensor 510 can comprise scrambler, and this scrambler can be used to detect one or more one-dimensional coding device grating and/or one or more two-dimentional scrambler grating.
In one embodiment, can provide sensor 520 to be used for definite characteristic that has transferred to the radiation of substrate.In this embodiment, sensor 520 is caught by the radiation of substrate changed course.In the use of example, the radiation that the quilt of being caught by sensor 520 alters course can be used to be convenient to confirm from the position of the spot of the radiation of independent controlled member 102 dislocation of the spot of the radiation of independent controlled member 102 (for example from).Particularly, sensor 520 can be caught the radiation that the part of making public from the firm quilt of substrate is altered course, i.e. sub-image.Whether measurement to the intensity of the radiation of this afterbody changed course can provide spot by the indication of suitably aiming at.For example, can provide the signal of repetition, from the dislocation (for example, the signal of out-phase possibly represented misalignment) that will show spot that departs from of the signal of this repetition to the duplicate measurements of this afterbody.Figure 16 (B) shows the illustrated position of the surveyed area of sensor 520 with respect to the exposure area 522 of substrate 114.In this embodiment, demonstrate 3 surveyed areas, its result can be compared and/or made up so that the identification dislocation.Only need use a surveyed area, for example on the side leftward.In one embodiment, can be to use the detecting device 262 of independent controlled member 102 with sensor 520 similar modes.For example, outside the exposure area 204 of the array on right-hand side 200 or more independent controlled member 102 can be used to detect the radiation that the sub-image from the substrate is altered course.
Figure 17 shows an embodiment of lithographic equipment.In this embodiment, a plurality of independent controlled members 102 are towards rotatable polygon spare 600 guiding radiation.The surface 604 that radiation strikes the polygon spare 600 on it alters course radiation towards lens arra 170.Lens arra 170 is towards substrate 114 guiding radiation.Between exposure period, polygon spare 600 is around axis 602 rotations, thereby making to stride through lens arra 170 along the Y direction from each the bundle separately in a plurality of independent controlled members 102 moves.Particularly, when each the new facet of polygon spare 600 and radiation bump, bundle will be striden through lens arra 170 along positive Y direction and repeated scanning.Independent controlled member 102 is modulated between exposure period, so that the pattern like the expectation of discussing here to be provided.Polygon spare can have the limit that is fit to of any amount.In addition, independent controlled member 102 quilt on sequential is modulated with the polygon 600 of rotation, makes bundle separately strike on the lens in the lens arra 170.In one embodiment, a plurality of independent controlled member 102 in addition can be arranged on the opposition side of polygon spare, promptly on right-hand side, so that make radiation strike on the surface 606 of polygon spare 600.
In one embodiment, can use the vibration with optical element to substitute polygon spare 600.The vibration with optical element has the specific fixed angle with respect to lens arra 170, and can scan back and forth so that bundle is striden through lens arra 170 along the Y direction along the translation back and forth of Y direction.In one embodiment, can use the optical element that rotates back and forth through a radian around axis 602 to substitute polygon spare 600.Through rotating back and forth optical element, make bundle stride through lens arra 170 and scan back and forth along the Y direction through a radian.In one embodiment, the optical element of polygon spare 600, vibration with optical element and/or rotation has one or more mirror surface.In one embodiment, the optical element of polygon spare 600, vibration with optical element and/or rotation comprises prism.In one embodiment, can use acousto-optic modulator to substitute polygon spare 600.Acousto-optic modulator can be used to stride through lens arra 170 scanning beams.In one embodiment, can lens arra 170 be placed in the optical element and/or the radiation path between the acousto-optic modulator of a plurality of independent controlled members 102 and polygon spare 600, vibration with optical element, rotation.
Therefore, usually, compare, can export the width that covers exposure area (for example substrate) with littler radiation with the width that these radiation of the width that is divided into the exposure area are exported.In one embodiment, this can comprise with respect to the exposure area and moves radiation or move radiation beam with respect to the exposure area.
Figure 18 shows according to the schematic, cross-sectional side view of the lithographic equipment of the embodiment of the invention to have movably independent controlled member 102.As the lithographic equipment 100 that shows among Fig. 5, lithographic equipment 100 comprises the substrate table 106 that is used to keep substrate and moves the locating device 116 of substrate table 106 on up to 6 degree of freedom.
Lithographic equipment 100 also comprises a plurality of independent controlled member 102 that is arranged on the framework 160.In this embodiment, each independent controlled member 102 is emitted radiation diodes, and laser diode for example is such as bluish-violet laser diode.Independent controlled member 102 is arranged to along the array 200 of the independent controlled member 102 of Y direction extension.Though demonstrate an array 200, lithographic equipment can have a plurality of arrays 200 that for example in Fig. 5, show.
In this embodiment, array 200 is rotatable plates, has discrete independent controlled member 102 on a plurality of spaces that plate is arranged.In use, plate is around axis 206 rotations of himself, for example along the direction that is shown by the arrow among Fig. 5.Use motor 216 that the plate of array 200 is rotated around axis 206.In addition, the plate of array 200 can move along the Z direction through motor 216, makes that independent controlled member 102 can be with respect to substrate table 106 displacements.
In this embodiment, array 200 can have one or more heat radiator 230, to increase cooling surface area.Heat radiator 230 can be for example on the top surface of array 200.Alternatively, one or more other heat radiator 232 can be provided, to cooperate so that dispel the heat with heat radiator 230.For example, heat radiator 232 can absorb heats from heat radiator 230, and can comprise fluid (for example liquid) guiding channel and be similar among Fig. 7 (F), show and with respect to the heat exchanger/pump of being correlated with of its description.
In this embodiment, lens 242 can be positioned at the front of each independent controlled member 102, and can move (being rotatable around axis A for example) with independent controlled member 102.In Figure 18, demonstrate two lens 242 and be connected to array 200.In addition, lens 242 can be displaceable with respect to independent controlled member 102 (for example along the Z direction).
In this embodiment, the aperture structure 248 that wherein has aperture can be above the lens 242, between lens 242 and relevant independent controlled member 102.Aperture structure 248 can limit the diffraction effect of lens 242, relevant independent controlled member 102 and/or the diffraction effect of adjacent lenses 242/ independent controlled member 102.
In this embodiment, sensor 254 can be provided with independent addressable element 102 (or a plurality of independent addressable element 102 in the array 200).In this embodiment, sensor 254 is arranged to be used for detecting and is focused on.Focus detection bundle 256 quilt changed courses (for example reflection) away from substrate surface, are passed lens 242, and are guided towards detecting device 262 through for example partially silvered mirror 258.In one embodiment, focus detection bundle 256 can be the radiation that is used to make public, and this radiation is just altered course from substrate.In one embodiment, focus detection bundle 256 can be the special bundle that is directed at the substrate place, and it becomes bundle 256 when being altered course by substrate.About Fig. 7 (O), exemplary focus sensor has been described at preceding text.Catoptron 258 can be mounted to array 200 with detecting device 262.
In this embodiment, control signal can be supplied to independent controlled member 102 and/or one or more other device (for example sensor) through wire communication or radio communication.In addition, from independent controlled member 102 and/or from one or more the signal of other device (for example sensor) can be communicated to controller.In Figure 18, can line 404 be set along rotation 206.In one embodiment, line 404 can be an optical line.In said situation, said signal can be an optical signalling, wherein for example transmits the Different control signal with different wavelengths.Being similar to the mode of control signal, can be through wired or wireless mode with power supply to independent controlled member 102 or one or more other device (for example sensor).For example in wired embodiment, can pass through one or more line 404 supply powers, and no matter it is identical or different with the line that transmits signal.In wireless embodiment, can be through RF couple transmission power as showing at mark 700 places.
In this embodiment, lithographic equipment can comprise the sensor 500 of the characteristic of measuring radiation, this radiation by or will be transmitted towards substrate through one or more independent controlled member 102.Such sensor can be spot sensor or transmission image sensor.Sensor for example can be used for confirming from the radiation of independent controlled member 102 intensity, from the homogeneity of the radiation of independent controlled member 102, from the cross sectional dimensions of the radiation spot of independent controlled member 102 or area and/or from the position (in X-Y plane) of the radiation spot of independent controlled member 102.In this embodiment, sensor 500 and can adjacent substrate platform 106 or addressable through substrate table 106 on framework 160.
In one embodiment, be not to have movably independent controlled member 102 in X-Y plane, independent controlled member 102 is roughly static in X-Y plane between the exposure period of substrate.Needless to say, controlled member 102 possibly be immovable in X-Y plane.For example, they can be movably in X-Y plane, to proofread and correct their position.Possible advantage with static basically controlled member 102 is more easily power and/or data to be transferred to controlled member 102.Possible advantage in addition or alternative is that the ability that local adjustment focuses on the difference in height on the compensation substrate is improved, and wherein said difference in height is greater than the depth of focus of system and be in than on the higher spatial frequency of the pitch of mobile controlled member.
In this embodiment,, has at least one optical element that moves with respect to independent controlled member 102 though controlled member 102 is static basically.The various layouts of independent controlled member 102 static basically in X-Y plane have been described hereinafter and with respect to its optical element movably.
In the description hereinafter; When situation allows; Term " lens " should be usually understood as any or its combination that comprises various types of opticses; Comprise refraction type, reflective, magnetic, electromagnetic type and electrostatic optics, such as refraction type, reflective and/or diffraction-type optical element arbitrarily, it provides and mentioned lens identical functions.For example, imaging len can be specially the traditional refraction type lens with focal power form, become to have focal power the Schwarzschild reflect system form and/or become to have the form of the zone plate of focal power.In addition, if the effect that produces is on substrate, to produce the bundle of assembling, then imaging len can comprise the optical devices of non-imaging.
In addition, in the description hereinafter, a plurality of independent controlled members 102 are made reference, such as the catoptron in the reflection mirror array modulator or a plurality of radiation source.Yet, should be appreciated that description typically refers to the modulator that is arranged to export a plurality of bundles more.For example, modulator can be an acousto-optic modulator, to export a plurality of bundles from the bundle that is provided by radiation source.
Figure 19 shows according to having in X-Y plane of the embodiment of the invention and is static basically a plurality of independent controlled member 102 (for example laser diode) and is the diagrammatic top view layout of the part of the movably lithographic equipment of optical element 242 with respect to it.In this embodiment; A plurality of independent controlled members 102 can be connected to framework; And be static basically in X-Y plane; A plurality of imaging lens 242 move (like what in Figure 19, shown by the rotation indication of taking turns 801) basically with respect to these independent controlled members 102 in X-Y plane, substrate moves along direction 803.In one embodiment, imaging len 242 is through moving with respect to independent controlled member 102 around the axis rotation.In one embodiment, imaging len 242 is installed on the structure of axis (direction that for example shows in Figure 19) rotation and is arranged with the mode of circle (like what partly show among Figure 19).
Each independent controlled member 102 provides collimated beam to the imaging len 242 that moves.In one embodiment, independent controlled member 102 is relevant with one or more collimation lens, so that collimated beam to be provided.In one embodiment, collimation lens is static basically in X-Y plane and is connected on the framework at independent controlled member 102 connection places.
In this embodiment, the cross-sectional width of collimated beam is less than the cross-sectional width of imaging len 242.Therefore, just dropped into fully in the optical transmission part of imaging len 242 at collimated beam, independent controlled member 102 (for example laser diode) just can be switched on.When bundle drops into outside the optical transmission part of imaging len 242, then turn-off independent controlled member 102 (for example laser diode) afterwards.Therefore, in one embodiment, pass single imaging len 242 at any one time from the bundle of independent controlled member 102.Imaging len 242 has produced relevant imaging line 800 with respect to formed the crossing (traversal) from the bundle of independent controlled member 102 by each the independent controlled member 102 that is switched on substrate.In Figure 19, demonstrate three imaging line 800 about in three among Figure 19 exemplary independent controlled members 102 each, although other the independent controlled member 102 obviously among Figure 19 can produce the imaging line 800 of being correlated with on substrate.
In the layout of Figure 19, the pitch of imaging len 242 can be 1.5mm, is slightly less than 0.5mm from the cross-sectional width (for example diameter) of the bundle of each independent controlled member 102.For this configuration, can write the line of the about 1mm of length with each independent controlled member 102.Therefore, be that the diameter of 0.5mm and imaging len 242 is that dutycycle can be up to 67% in this configuration of 1.5mm at beam diameter.For suitably locate independent controlled member 102 with respect to imaging len 242, all standing of striding through the width of substrate is feasible.Therefore, if for example only use the laser diode of standard 5.6mm diameter, several concentric rings of laser diode so shown in figure 19 can be used to obtain to stride the whole coverings through the width of substrate.Therefore, in this embodiment, can use the situation independent controlled member 102 (for example laser diode) still less that maybe possibly use mobile independent controlled member 102 described herein than the fixed array of only using independent controlled member 102.
In this embodiment, each imaging len 242 should be identical, and this is because each independent controlled member 102 will be carried out to picture through all imaging lens 242 that moves.In this embodiment, all imaging lens 242 need not make imaging, although need have the lens of higher NA, for example greater than 0.3, greater than 0.18 or greater than 0.15.For the optical devices of so single element, the diffraction-limited imaging is possible.
The focusing of the bundle on the substrate is no matter where collimated beam gets into lens, all is fixed to the optical axis (referring to, Figure 20 for example, its demonstration is the schematic three dimensional view of a part of the lithographic equipment of Figure 19) of imaging len 242.The shortcoming of this layout is or not the heart far away from imaging len 242 towards the bundle of substrate, and therefore focusing error can take place, thereby possibly cause aliasing error.
In this embodiment, possibly cause halation through the element adjustment focusing of using (for example at independent controlled member 102 places) that in X-Y plane, do not move.Therefore, the focusing of expectation adjustment should take place in the imaging len 242 that moves.This therefore maybe be than the actuator of imaging len 242 higher frequencies that move.
Figure 21 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably, and shows three different position of rotation with respect to 242 groups of the imaging lens of independent controlled member.In this embodiment, the lithographic equipment among Figure 19 and 20 is expanded through having imaging len 242, and this imaging len 242 comprises and is used to receive two lens 802,804 from the collimated beam of independent controlled member 102.As shown in Figure 19, imaging len 242 moves (for example around arranging imaging len 242 pairing axis rotations with circular, fashion at least in part) with respect to independent controlled member 102 in X-Y plane.In this embodiment, before arriving imaging len 242, scioptics 806 make from the bundle collimation of independent controlled member 102, but such lens need be provided in one embodiment.Lens 806 are static basically in X-Y plane.Substrate moves along directions X.
Two lens 802,804 be arranged in collimated beam from independent controlled member 102 to the light path of substrate, so that the Shu Chaoxiang substrate is the heart far away.Lens 802 between independent controlled member 102 and lens 804 comprise two lens 802A, the 802B of the focal length that has about equally., focus between the 802B at two lens 802A from the collimated beam of independent controlled member 102, make that lens 802B will be towards the said bundle of imaging len 804 collimations.Imaging len 804 makes bundle be imaged onto on the substrate.
In this embodiment, lens 802 move with specific speed (the for example specific revolution (RPM) of per minute) in X-Y plane with respect to independent controlled member 102.Therefore, in this embodiment,, will in X-Y plane, have the speed that doubles mobile imaging len 804 from the collimated beam of the outgoing of lens 802 if the imaging len 804 that moves is moving with lens 802 identical speed.Therefore, in this embodiment, imaging len 804 moves with respect to the speed of independent controlled member 102 with the speed that is different from lens 802.Especially, imaging len 804 moves in X-Y plane with the speed (the for example twice of the RPM of lens 802) of the twice of the speed of lens 802, makes bundle to be focused on the substrate by heart far away.The collimated beam of outgoing and aiming at of imaging len 804 in three of Figure 21 exemplary positions, have schematically been shown from lens 802.In addition, because the actual inscription on substrate is compared with the example among Figure 19 the speed with the twice of said speed is accomplished, so the power of independent controlled member 102 should be twice.
In this embodiment, focus on, possibly cause heart loss far away and cause halation through using (for example independent controlled member 102 places) the element adjustment of in X-Y plane, not moving.Therefore, the focusing adjustment of expectation should appear in the imaging len 242 that moves.
In addition, in this embodiment, all imaging lens 242 need not make the field form images.For the optical devices of such discrete component, the imaging of diffraction-limited is possible.About 65% dutycycle is possible.In one embodiment, lens 806,802A, 802B and 804 can comprise 2 non-spherical lenses and 2 spherical lenses.
In one embodiment, can use about 380 independent controlled members 102 (for example standard laser diode).In one embodiment, can use the group of about 1400 imaging lens 242.In the embodiment that uses the standard laser diode, can use the group of about 4200 imaging lens 242,6 concentric rings that it can be arranged to take turns.In one embodiment, the wheel of the rotation of imaging len will be with about 12000RPM rotation.
Figure 22 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably, and shows three different position of rotation with respect to the group of the imaging len 242 of independent controlled member.In this embodiment; For fear of with as the different speed mobile lens described about Figure 21, can advance like the so-called 4f heart far away that the demonstration of Figure 22 institute is used for mobile imaging lens 242/far the heart goes out the imaging system of (telecentric in/telecentric out).The imaging len 242 that moves comprises two imaging lens 808,810; These two imaging lens 808,810 move (for example being centered around the axis rotation of arranging 242 edges of imaging len at least in part with circular, fashion) with roughly the same speed in X-Y plane, and receive heart Shu Zuowei input far away and export the telecentric imaging bundle to substrate.In the layout of 1 x magnification, the image on the substrate moves with the same with the speed of imaging len 242 twices that move fastly.Substrate moves along directions X.In this layout, optical devices possibly make an imaging with big relatively NA (for example greater than 0.3, greater than 0.18 or greater than 0.15).This layout possibly not have two unit piece optical devices.Possibly have six or more element of alignment tolerance very accurately, to obtain the diffraction-limited image.About 65% dutycycle is possible.In this embodiment, also relatively easily carry out part focusing with the element that does not move or cooperate imaging len 242 movably to move with imaging len movably 242.
Figure 23 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably, and shows five different position of rotation with respect to the group of the imaging len 242 of independent controlled member.In this embodiment; For fear of with about the described speed mobile lens inequality of Figure 21; And have and to make as about the pointed optical devices to the field imaging of Figure 22, the combination of stationary lens combines with mobile imaging len 242 basically in X-Y plane.With reference to Figure 23, be provided with independent controlled member 102 static basically in X-Y plane.Basically optional collimation lens 806 static in X-Y plane is provided, has been used for the bundle of collimation, and provide collimated beam (having the for example cross-sectional width of 0.5mm (for example diameter)) to lens 812 from independent controlled member 102.
In addition, lens 812 are static basically in X-Y plane and collimated beam are focused to the field lens 814 (having the for example cross-sectional width of 1.5mm (for example diameter)) of mobile imaging len 242.Lens 814 have big relatively focal length (for example f=20mm).
Movably the field lens 814 of imaging len 242 moves (for example being centered around the axis rotation of arranging 242 edges of imaging len at least in part with circular, fashion) with respect to independent controlled member 102.Field lens 814 is towards the imaging len 818 guiding bundles of imaging len 242 movably.As field lens 814, imaging len 818 moves (for example being centered around the axis rotation of arranging 242 edges of imaging len at least in part with circular, fashion) with respect to independent controlled member 102.In this embodiment, field lens 814 is to move with imaging len 818 roughly the same speed.A pair of field lens 814 is aligned with each other with imaging len 818.Substrate moves along directions X.
Between field lens 814 and imaging len 818 is lens 816.Lens 816 are static basically in X-Y plane, and will be collimated to imaging len 818 from the bundle of field lens 814.Lens 816 have big relatively focal length (for example, f=20mm).
In this embodiment, the optical axis of field lens 814 should with the optical axis coincidence of corresponding imaging len 816.Field lens 814 is designed to make said bundle folding, thereby by the optical axis coincidence of the principal ray of the bundle of lens 816 collimations and imaging len 818.Like this, the bundle towards substrate is the heart far away.
Because big f number, lens 812 and 816 can be simple spherical lenses.Field lens 814 can not influence image quality, and can also be the sphere element.In this embodiment, collimation lens 806 is need be to the lens of field imaging with imaging len 818.For the optical devices of this discrete component, the diffraction-limited imaging is possible.About 65% dutycycle is fine.
In one embodiment, be under the rotatable situation at imaging len 242 movably, at least two concentric rings of independent controlled member 102 and lens are provided, to obtain to stride whole coverings through the substrate width.In one embodiment, the independent controlled member 102 on these rings is arranged to be in the pitch place of 1.5mm.Have the standard laser diode of diameter if use, possibly need at least 6 concentric rings for whole coverings so as 5.6mm.Figure 24 and 25 shows the layout according to the concentric ring of the independent controlled member 102 of these layouts.In one embodiment, this will cause about 380 independent controlled members 102 and the lens of static basically correspondence in X-Y plane.The imaging len 242 that moves will have=4200 groups of lens 814,818 of 700 * 6 rings.By means of this configuration, can inscribe the line of the about 1mm of length with each independent controlled member 102.In one embodiment, can use the group of about 1400 imaging lens 242.In one embodiment, lens 812,814,816 and 818 can comprise 4 non-spherical lenses.
In this embodiment, possibly cause heart loss far away and cause halation through using the element adjustment of in X-Y plane, not moving (for example at independent controlled member 102 places) to focus on.Therefore, the focusing of expectation adjustment should take place in the imaging len 242 that moves.This therefore maybe be than the actuator of imaging len 242 higher frequencies that move.
Figure 26 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably.In this embodiment, optics derotator (derotator) is used for being coupled to mobile imaging len 242 at the roughly static independent controlled member 102 of X-Y plane.
In this embodiment, independent controlled member 102 is arranged to ring with optional collimation lens.Two parabolic mirrors 820,822 make the ring from the collimated beam of independent controlled member 102 be decreased to for derotator 824 acceptable diameters.In Figure 26, Pei Ken (pechan) prism is as derotator 824.If the half the speed rotation of derotator to compare with the speed of imaging len 242, each independent controlled member 102 looks that with respect to its imaging len 242 separately be roughly static.Two other parabolic mirrors 826,828 make and change the ring extension of bundle extremely for the imaging len 242 acceptable diameters that move from disappearing of derotator 824.Substrate moves along directions X.
In this embodiment, each independent controlled member 102 becomes a pair of with imaging len 242.Therefore, cannot independent controlled member 102 be installed on the concentric ring, therefore can not obtain to stride whole coverings through the width of substrate.About 33% dutycycle is possible.In this embodiment, imaging len 242 is need be to the lens of field imaging.
Figure 27 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably.In this layout, imaging len 242 is arranged to be centered around the direction rotation of extending in the X-Y plane (for example going barrel, rather than as for example about the described swiveling wheel of Figure 19-26).With reference to Figure 27, movably imaging len 242 is arranged in and is arranged on the drum of for example Y direction rotation.Movably imaging len 242 the radiation that is received in bulging rotation and movably extends on the line on the Y direction between the imaging len 242 from independent controlled member 102.In principle, the line of inscribing through the movably imaging len 242 of such drum will be parallel to the direction of scanning 831 of substrate.Therefore, be arranged to the line half-twist made through the movably imaging len 242 of drum, make the line of imaging perpendicular to the direction of scanning of substrate with the derotator 830 of 45 ° of installations.Substrate moves along directions X.
For the every stripe on the substrate, on drum, will need the movably circle of imaging len 242.If such circle can be inscribed the wide striped of 3mm on substrate and substrate is that 300mm is wide, 700 (optical devices on the circumference of drum) * 100=70000 optical module possibly needed on the drum so.If on drum, use Acylindrical optical devices, then it possibly be less.In addition, imaging optical device possibly form images to particular field in this embodiment, and it possibly make optical devices complicated more.About 95% dutycycle is possible.The advantage of this embodiment be the striped that formed images can have length about equally and be almost parallel and be straight.In this embodiment, be relatively easy with not moving or combine its element that moves together to carry out local focusing with imaging len movably 242.
Figure 28 shows to have independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its diagrammatic side view layout of the part of the lithographic equipment of optical element movably, and shows five different position of rotation with respect to the group of the imaging len 242 of independent controlled member.
With reference to Figure 28, be provided with independent controlled member 102 static basically in X-Y plane.Movably imaging len 242 comprises a plurality of lens combination, and each lens combination comprises field lens 814 and imaging len 818.Substrate moves along directions X.
Movably the field lens 814 of imaging len 242 (for example spherical lens) with respect to independent controlled member 102 along direction 815 move (for example be centered around imaging len 242 by at least in part with circular, fashion arrange the institute edge the axis rotation).Field lens 814 is towards the guiding of the imaging len 818 of imaging len 242 (for example, such as non-spherical lenses such as two non-spherical lenses) movably bundle.As field lens 814, imaging len 818 moves (for example being centered around imaging len 242 is arranged the institute edge at least in part with circular, fashion axis rotation) with respect to independent controlled member 102.In this embodiment, field lens 814 is to move with imaging len 818 identical speed basically.
815 places overlap with the back focal plane of imaging len 818 in the position in the focal plane of field lens 814, and it provides the heart far away to advance/system that the heart far away goes out.Opposite with the layout of Figure 23,818 pairs of particular field imagings of imaging len.The focal length of field lens 814 makes the field size be used for imaging len 818 less than 2 to 3 ° half-angle.In this situation, can also use unit piece optical devices (for example two non-spherical surface unit piece) to obtain the diffraction-limited imaging.Layout field lens 814 is mounted between each field lens 814 does not have spacing.In this case, the dutycycle of independent controlled member 102 can be about 95%.
The focal length of imaging len 818 make for the substrate place be 0.2 NA, these lens will can be greater than the diameter of field lens 814.The focal length of imaging len 818 that equals the diameter of field lens 814 will provide the diameter of imaging len 818, and it has stayed the enough spaces that are used to install imaging len 818.
Because an angle can be inscribed the line bigger slightly than the pitch of field lens 814.Depend on the focal length of imaging len 818 in addition, this provides overlapping between the line that is formed images of the adjacent independent controlled member 102 on the substrate.Therefore, independent controlled member 102 can be installed in a ring on the identical pitch of imaging len 242 pitches on.
Figure 29 demonstrates the schematic three dimensional view of a part of the lithographic equipment of Figure 28.In this description, 5 independent controlled members 102 show to have 5 relevant movably imaging lens group 242.Can understand, other independent controlled member 102 and relevant movably imaging lens group 242 can be provided.Substrate moves along the directions X that is shown by arrow 829.In one embodiment, field lens 814 is arranged to there is not spacing between them.Pupil plane is positioned at mark 817 places.
For fear of relatively little two aspherical imaging lens 818; The amount of the optical devices of the imaging len 242 that reduces to move and use standard laser diode are as independent controlled member 102, and in this embodiment, possibly using movably, the single lens combination of imaging len 242 forms images to a plurality of independent controlled members 102.As long as independent controlled member 102 is imaged onto each movably on the field lens 814 of imaging len 242 by heart far away, corresponding imaging len 818 will make and be imaged onto on the substrate from the Shu Zaici of independent controlled member 102 heart far away.If for example 8 lines are inscribed simultaneously, the focal length of the diameter of field lens 814 and imaging len 818 can be increased 8 times under identical throughput rate so, and movably the quantity of imaging len 242 can be reduced 8 times simultaneously.In addition, because a part that is used to make independent controlled member 102 be imaged onto needed optical devices on the field lens 814 can be public, so static basically optical devices can be reduced in X-Y plane.In Figure 30, schematically show such layout of inscribing 8 lines through the group of single movably imaging len 242 simultaneously, the group of rotation 821 and imaging len 242 of group with imaging len 242 is apart from the radius 823 of rotation 821.Pitch (when inscribing 8 lines simultaneously through the group of single movably imaging len 242) from the pitch of 1.5mm to 12mm has stayed enough spaces for the standard laser diode of installing as independent controlled member 102.In one embodiment, 224 independent controlled members 102 (for example standard laser diode) can be used.In one embodiment, can use the group of 120 imaging lens 242.In one embodiment, can use 28 static basically optical devices groups and 224 independent controlled members 102.
In this embodiment, also relatively easily with not moving or cooperating its element that moves together to carry out part focusing with imaging len movably 242.As long as the heart image far away of the independent controlled member 102 on the field lens 814 is moved and be held in the heart far away along optical axis, with the focus variations of the image on the substrate only, and image is with keeping being the heart far away.Figure 31 shows the illustrative arrangement that focuses on the mobile roof like unit control in the layout of Figure 28 and 29.It is intrafascicular that two folding catoptrons 832 and roof like parts (for example prism or reflector group) 834 are placed on from the heart far away of independent controlled member 102, and in the front of field lens 814.Through move along direction 833 roof like parts 834 away from or towards folding catoptron 832, image is by along the optical axis displacement, and therefore also be shifted with respect to substrate.Because because axial focusing changes the quadratic power ratio that equals the F/ number; Has big enlargement factor along optical axis, so have the focusing displacement of 5.625mm (37.5/2.5) 2 at field lens 814 places that the out of focus of 25 μ m at substrate place of the bundle of F/2.5 will be provided at the bundle of f/37.5.This means that roof like parts 834 must move the half the of its.
Figure 32 shows to have according to an embodiment of the invention independent controlled member static basically in X-Y plane according to an embodiment of the invention and with respect to its schematic, cross-sectional side view of the lithographic equipment of optical element movably.Though Figure 32 shows the layout that is similar to Figure 23, it can be revised as the arbitrary embodiment among suitable Figure 19-22 and/or Figure 24-31.
With reference to Figure 32, lithographic equipment 100 comprises the substrate table 106 that keeps substrate and moves the locating device 116 of substrate table 106 on up to 6 degree of freedom.
Lithographic equipment 100 also is included in a plurality of independent controlled member of arranging on the framework 160 102.In this embodiment, each independent controlled member 102 is emitted radiation diodes, and laser diode for example is such as bluish-violet laser diode.Independent controlled member 102 is arranged on the framework 838 and along the Y direction and extends.Though show a framework 838, lithographic equipment can have a plurality of frameworks 838 that show similarly with the for example array in Fig. 5 200.Be arranged in further on the framework 838 is lens 812 and 816.Framework 838 is static basically with therefore independent controlled member 102 in X-Y plane with lens 812 and 816.Framework 838, independent controlled member 102 and lens 812 and 816 can move along the Z direction through actuator 836.
In this embodiment, rotatable framework 840 is set.Field lens 814 is arranged on the framework 840 with imaging len 818, and wherein field lens 814 and imaging len 818 has been combined to form movably imaging len 242.In use, plate is around axis 206 rotations of himself, for example along the direction by arrow demonstration among Fig. 5 with respect to array 200.Use motor 216 to make framework 840 around axis 206 rotations.In addition, can make that movably imaging len 242 can be with respect to substrate table 106 displacements through motor 216 along Z direction travelling frame 840.
In this embodiment, the aperture structure 248 that has aperture therein can be above the lens 812, between lens 812 and relevant independent controlled member 102.Aperture structure 248 can limit the diffraction effect of lens 812, relevant independent controlled member 102 and/or the diffraction effect of adjacent lenses 812/ independent controlled member 102.
In one embodiment, lithographic equipment 100 comprises one or more removable plate 890 (for example rotatable plate, for example rotatable dish), and it comprises optical element, for example lens.In the embodiment of Figure 32, show plate 890 with field lens 814 and plate 890 with imaging len 818.In one embodiment, lithographic equipment any reflection type optical element of rotation not in use.In one embodiment, lithographic equipment has no reflection type optical element, and it receives the radiation from any or all independent controlled members 102, and it rotates in use.In one embodiment, one or more (for example whole) plate 890 are general planar, for example do not reach or more surface or following optical element (or part of optical element) of plate.For example this can be enough thick (promptly thick and location optical element makes them can not stretch out than the height of optical element at least) or realize through the smooth cover plate that is provided at plate 890 (not shown)s top through guaranteeing plate 890.Guarantee that one of plate or more surface are the smooth basically noises that can help for example when equipment is in use, to reduce.
The xsect side-looking synoptic diagram of the part of the schematically illustrated lithographic equipment of Figure 33, this lithographic equipment have roughly independent controlled member static in X-Y plane.Lithographic equipment 900 comprises the substrate support structure 902 that is used to keep substrate and the locating device 904 that is used for moving on up to 6 degree of freedom substrate support structure 902.Substrate can be the substrate (for example silicon wafer or glass plate) that is coated with resist.
Lithographic equipment 900 also comprises the controlled radiation source 906 of a plurality of independences that is configured to launch a plurality of bundles.Shown in figure 33, radiation source 906 is self-emission formula contrast devices.In an embodiment, self-emission formula contrast device 906 is emitted radiation diodes, such as light emitting diode (LED), organic LED (OLED), polymer LED (PLED) or laser diode (for example solid-state laser diode).In an embodiment, each independent controlled member 906 is bluish-violet color laser diode (for example model no.DL-3146-151 of Sanyo (Sanyo)).Such diode can be by such as Sanyo, Nichia, company's supply of Osram and Nitride.In an embodiment, the diode emission has about 365nm or the approximately radiation of the wavelength of 405nm.In an embodiment, diode can provide the output power of selecting in the scope of 0.5-200mW.In an embodiment, the size of laser diode (exposed tube core) is in the scope of 100-800 micron, to select.In an embodiment, laser diode has the emitting area of selecting in the scope of 1-5 square micron.In an embodiment, laser diode has the angle of divergence of selecting from the scope of 7-44 degree.In an embodiment, diode has and is used to provide more than or equal to about 6.4x10 8W/ (m 2The configuration of total brightness .sr) (for example, emitting area, the angle of divergence, output power etc.).
Independent controllable device 906 is arranged on the framework 908 and can extends along Y direction and/or directions X.Though show a framework 908, lithographic equipment can have a plurality of frameworks 908.On framework 908, also be furnished with lens 920.Framework 908 roughly is static with therefore independent controllable device 906 in X-Y plane with lens 920.Can be through actuator 910 along Z direction travelling frame 908, independent controllable device 906 and lens 920.
Self-emission formula contrast device 906 can be configured to transmitted beam, and optical projection system 920,924 and 930 can be configured to bundle is projected on the target part of substrate.Self-emission formula contrast device 906 forms the optical devices row with optical projection system.Lithographic equipment 900 can comprise the actuator (for example motor 918) that is used for respect to substrate mobile optical device row or its a part.The framework 912 that is furnished with field lens 924 and imaging len 930 above that can be along with actuator rotates.Field lens 924 and imaging len 930 be combined to form movably optical devices 914.In use, framework 912 is around axis 916 rotations of himself, for example along the direction rotation that is shown by the arrow among Figure 34.Through using actuator (for example motor 918) to make framework 912 around axis 916 rotations.In addition, can framework 912 be moved along the Z direction, make that movably optical devices 914 can be with respect to substrate support structure 902 displacements through motor 910.In Figure 33, on the opposite side of lithographic equipment, demonstrate two optical devices row.In practice, lithographic equipment for example can comprise above the periphery of lithographic equipment, distribute more than two optical devices row.Each optical devices row comprises the fixed part of one or more self-emission formula contrast device 906 and optical projection system 920.The rotatable portion (comprising lens 924,930) of optical devices row can be used with respect to a plurality of optical devices row, for example when making framework 912 rotations.
Pore structure 922 wherein has the hole, can be positioned at the top of lens 920 and between lens 920 and self-emission formula contrast device 906.Pore structure 922 can limit the diffraction effect of lens 920, the relevant controlled self-emission formula of independence contrast device 906 and/or the diffraction effect of adjacent lenses 920/ independent controlled self-emission formula contrast device 906.
Shown equipment can be used through rotating frame 912 and while substrate on the mobile substrate support structure 902 below the optical devices row.Self-emission formula contrast device 906 can lens 920,924 and 930 when roughly aligned with each other transmitted beam pass these lens.Through mobile lens 924 and 930, bundle is scanned by on the part at substrate at the picture on the substrate.Through the substrate on the mobile substrate support structure 902 below the optical devices row simultaneously, also moved by the part of substrate of the picture of self-emission formula contrast device 906.Through under the control of the controller of the speed that is configured to control optical devices row or its a part of rotation and control substrate, connecting and/or turn-off self-emission formula contrast device 906 at high speed, be carried out to picture to the pattern of expectation in can the resist layer on substrate.
Figure 34 illustrates the schematic plan of the lithographic equipment of the Figure 33 with self-emission formula contrast device 906.Like the lithographic equipment 900 that shows among Figure 33, lithographic equipment 900 comprises the substrate support structure 902 that is used to keep substrate 928, be used for moving on up to 6 degree of freedom substrate support structure 902 locating device 904, be used for confirming the aligning between independent addressable element 906 and the substrate 928 and be used for confirming that whether substrate 928 is in the aligning/leveling sensor 932 of level with respect to the projection of self-emission formula contrast device 906.As shown in the figure, substrate 928 has rectangular shape, yet, can handle (for example circular) substrate of other shape.
Self-emission formula contrast device 906 is arranged on the framework 926.Self-emission formula contrast device 906 can be the emitted radiation diode, for example laser diode, for example bluish-violet color laser diode.Shown in figure 34, contrast device 906 can be arranged in the array that in X-Y plane, extends, and one or more contrast device 906 are listed as relevant with each optical devices.Contrast device 906 is separated above the photoetching more than 4 shown in figure 33 is taken turns.Each photoetching wheel comprises a plurality of optical devices row that are installed on fixed frame 908 and the rotatable framework 912.In the photoetching wheel; The optical devices row can be shared the part of the optical devices row that are installed on the rotatable framework 912; Such as lens 924,930, promptly when making the framework rotation, lens 924,930 possibly used by the different optical devices row in the photoetching wheel subsequently.
Said array can be elongated line.In an embodiment, said array can be one or the more independently one-dimensional array of controlled contrast device 906.In an embodiment, said array can be the two-dimensional array of one or more independent addressable contrast device 906.
Rotatable framework 912 can be provided, and it can be along the direction rotation that is shown by said arrow.Rotatable framework can be provided with lens 924,930 (in Figure 33), so that the image of each movably independent contrast device 906 to be provided.In this application, term " radially " and " tangential " are used about rotatable framework 912 and its longitudinal axis 916.
Said equipment can be provided with the actuator that is configured to rotate rotatable framework 912, so the rotatable portion of optical devices row comprises lens 924,930.
During the process that produces pattern, in an embodiment, substrate 928 is moved with constant scan velocity V scan along the direction of scanning.Substrate 928 is divided into many bands 934 along the direction that is approximately perpendicular to the direction of scanning; Each band 934 is associated with the optical devices row of himself, and each optical devices row comprises fixed part and or the more self-emission formula contrast device 906 of optical projection system 920.The rotatable portion (comprising lens 924,930) of optical devices row also can be used about other bands 934 that covered by rotatable framework 912.Each band 934 is divided into a plurality of adjacent and partly overlapping target parts 936 along the direction of scanning.During the scanning of substrate was moved, the target part in the single band was made public by the bundle of the contrast device 906 in the relevant optical devices row subsequently.Target part 936 have with adjacent band 934 in adjacent target part 936 overlapping and with same band 934 in adjacent target part 936 overlapping.This is overlapping can be used for obtaining in entire substrate lip-deep reliably and accurate patterns.
In an embodiment,, the optical devices row are set, make and on substrate, to generate pattern through single pass at all bands 934 that are approximately perpendicular on the direction of direction of scanning.
With graphic pattern projection to substrate the time, expectation projects to the bundle of the patterning on the substrate and is correctly aimed at the surface of the substrate that will generate pattern, and is in positive burnt position with the surface of said substrate.
In order during projection process, to optimize the focusing of optical projection system, each optical devices row was caught before the photoetching process of reality begins with respect to public picture flat focus.During photoetching process, substrate surface form at pattern at that time the place a plurality of targets parts the position can with public picture planar alignment.
In order to confirm whether optical devices row separately are in positive Jiao focal position of expecting (for example focal height and/or degree of tilt) and public as the plane; Each optical devices row comprises focus control system or focus controller, is configured to control the focal position of optical devices row separately.
Reference 938 with many marks is installed on the substrate supports device 902.In lithographic equipment, the height level of Reference is roughly corresponding with the height level of substrate 928.Reference is processed with high precision and on the whole width of substrate, is extended.
Each focus controller is configured to confirm that separately optical devices be listed ass to be listed as with respect to the focusing quality of this Reference 938 with at optical devices adjusts the focal position that these optical devices are listed as when being in out of focus with respect to Reference 938.Each focus controller comprises focusing measurement mechanism 942 (referring to Figure 35 and 36) and focus actuator 940 (referring to Figure 33).Focus actuator 940 is installed on the framework 908 and is arranged to mobile lens 920.Moving of scioptics 920, optical devices are listed in the focal position of substrate height at and can be adjusted.When the focal position that all optical assemblies of taking turns in photoetching is listed as must be adjusted, possibly expect to adjust focal position, rather than adjust focal position through the actuating of all focus actuator 940 individually through the actuating of actuator 910.In another alternative embodiment, for each optical devices row are provided with actuator, and this actuator is configured to move whole optical devices row, with the focal position with respect to Reference 938 adjustment optical devices row.
Figure 35 and 36 shows focusing measurement mechanism 942, to confirm that each optical devices is listed as the focal position with respect to Reference 938.In order to confirm focal position, Reference be arranged in separately optical devices row below.Through the said bundle of contrast device 906 projections on the Reference.Lens 920, beam splitting arrangement or beam splitter 944, quarter wave plate 946 and the lens on rotatable framework 912 924,930 pass in projected bundle.Said bundle is by Reference 938 reflections, and the bundle of reflection comprises the image that is arranged on the mark on the Reference 938.The Shu Zaici of reflection passes lens 924,930 and quarter wave plate 946.Because the phase shift that quarter wave plate 946 is caused, the bundle of reflection are now by beam splitter 944 reflections.The bundle of reflection marches to imageing sensor 950 via lens 948, for example the CCD camera.Lens 948 and imageing sensor 950 are arranged such that at image by positive when projecting on the imageing sensor burntly, optical devices are listed as with respect to Reference 938 and are in positive burnt position.
Therefore,, can confirm whether the focal position of optical devices row is correctly adapted to Reference, and therefore correctly adapt to public picture plane through the image on the analysis image sensor 950.When the optical devices row were in out of focus, shown in figure 35, the image that projects to the mark on the imageing sensor 950 also was an out of focus.On the contrary, shown in figure 36 when the optical devices row are in positive Jiao with Reference 938, the image that projects to the mark on the imageing sensor 950 also is positive burnt.Through the adjustment concentrating element, under the situation of lens 920, based on to projecting to the analysis of the image on the imageing sensor 938, can be so that focal position adapts to Reference 938.Mark on the Reference can have any adapting to and analyze to confirm whether image is in positive Jiao's shape.
Can be to the analysis that projects to the image on the imageing sensor 950 through carrying out as the processing unit of the part of imageing sensor 950 or processor or independent processing unit.Processing unit can be the CPU of lithographic equipment or the part of central processing unit.
Through adjustment, can obtain public picture plane for all optical devices row for the multiple focal position of each optical devices column weight.This realizes through moving all lens elements 920 with actuator 940, makes all optical devices be listed as with respect to high-precision Reference from positive burnt position.In case obtain this public picture plane through reference, substrate 928 can be arranged in during projection process in the public picture plane optimisedly, is in the focusing range of lithographic equipment to keep substrate 928.
The control of the focal position of all optical assemblies row and possible adjustment are carried out as at the actual photoetching process calibration steps before of beginning to obtain public picture plane usually.Such calibration process can carried out during the incipient stage of lithographic equipment and between the regular alignment epoch of lithographic equipment, but also can before each lithographic projection process, be performed.
With reference now to Figure 34,, when the beginning photoetching process, substrate 928 is moved towards the photoetching wheel with scan velocity V scan.The band partly of the target on the whole width of substrate 928 that extends along the direction that is approximately perpendicular to the direction of scanning is provided with pattern simultaneously.Before such target partly is with through the photoetching wheel; One or more sensor 932 can be measured height and/or the level of incline at the substrate 928 of the position of target part, and the height of substrate 928 and/or level of incline and the public any difference as between the plane can be determined.
When in fact the band of target part arrived the optical devices row of photoetching wheel, the position of substrate 928 can be with respect to public being optimized as the plane.Like this, substrate 928 is positioned in the focusing range of optical devices row, or is arranged at least as much as possible with respect to public being optimized as the plane.
Should be appreciated that because optical devices are listed on the whole width of substrate 928 to generate pattern, so when substrate surface adapted to public picture plane, only the position of substrate 928 was feasible with respect to the public limited correction as the plane.In the embodiment of Figure 34, can move substrate 928 and substrate 928 tilted along the z direction, with optimally with respect to public picture plane positioning substrate 928 along Rx and Ry.
When sensor 932 being set for each photoetching wheel, the height of photoetching wheel and/or obliquity can be adapted to the target that is associated with separately photoetching wheel partly with target substrate surface partly.For example; After substrate orientation is on respect to the public picture suitable position on plane, the height of independent photoetching wheel and/or tilt to be adapted to actual substrate surface elevation and/or the inclination that the focal position of the optical devices row of separately photoetching wheel is adjusted to the target part of these optical devices row.For example, the height of photoetching wheel and/or inclination can be carried out adaptive through the actuating of actuator 910.
In an embodiment; Optical devices are listed as with respect to the focusing quality of target part and can measure substrate surface and further improved and actuating through concentrating element 920 makes focal position adapt to the measuring position of each optical devices row independently through organizing for the son of each optical devices row in the photoetching wheel or optical devices row.For example, the adaptive adjustment carried out in the position of the concentrating element 920 in the group of the height of the group of independent optical devices row or optical devices row and/or tilt optical devices row or optical devices row that can be through will be separately.
In order to obtain results of optimization with the focus control system, the quality of expectation Reference is acceptable.Above-mentioned method supposition Reference is ideally smooth along the z direction.Yet even Reference 938 is carried out machine work with high precision, Reference possibly be faulty to a certain extent also.
For this reason, public picture plane calibration reference object 938 before can limited.The focus control system of embodiments of the invention can be used for this purpose.
For example, can be directed to all optical devices Lieque fixation planes, the focal position of all optical devices row can be adjusted to this as the plane.Subsequently, the Reference 938 that is installed on the substrate support structure is strictly moved along y direction (promptly being approximately perpendicular to the direction of direction of scanning), and the focusing quality of all optical devices row is confirmed through focusing on measurement mechanism 942 once more.When Reference 938 is ideally smooth,, should not change so focus on quality because Reference 938 only moves along the y direction.When any adjusted focal position in must being directed to the optical devices row, Reference was not perfect smooth.Can confirm said difference, and use it for the calibration of Reference 938.
Be marked with hereinafter embodiment also be provided in the aspect of sequence number:
1. lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator, the exposure area that is configured to make said substrate is by a plurality of Shu Jinhang exposures of modulating according to the pattern of expectation; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate and comprises the lens arra that receives said a plurality of bundles, and said optical projection system is configured between the exposure period of said exposure area, move said lens arra with respect to said modulator.
2. according to embodiment 1 described lithographic equipment, wherein each lens comprises at least two lens arranging along from the beam path of at least one said a plurality of intrafascicular bundle of said modulator to said substrate.
3. according to embodiment 2 described lithographic equipments, first lens in wherein said at least two lens comprise field lens, and second lens in said at least two lens comprise imaging len.
4. according to embodiment 3 described lithographic equipments, the focal plane of wherein said field lens overlaps with the back focal plane of said imaging len.
5. according to embodiment 3 or 4 described lithographic equipments, wherein said imaging len comprises two non-spherical lenses.
6. according to any described lithographic equipment among the embodiment 3-5, the focal length of wherein said field lens makes the field size of said imaging len less than 2 to 3 ° of half-angles.
7. according to any described lithographic equipment among the embodiment 3-6, the focal length of wherein said imaging len make to said substrate place be 0.2 NA, said imaging len is not more than the diameter of said field lens.
8. according to embodiment 7 described lithographic equipments, the focal length of wherein said imaging len equals the diameter of said field lens.
9. according to any described lithographic equipment among the embodiment 3-8, wherein the single combination with said field lens and said imaging len makes a plurality of said bundles form images.
10. according to any described lithographic equipment among the embodiment 3-9, also comprise focus control device, this focus control device is arranged along the beam path from said modulator at least one said a plurality of intrafascicular bundle of said field lens.
11. according to embodiment 10 described lithographic equipments, wherein said focus control device comprises folding mirror and removable roof like parts.
12. according to embodiment 3 described lithographic equipments, also be included in the lens in the said path, with will be from said first lens to the said bundle collimation of said second lens.
13. according to embodiment 12 described lithographic equipments, the lens in said path that wherein are used for the said bundle of collimation are static with respect to said modulator basically.
14. according to any described lithographic equipment in embodiment 3,12 and 13, also be included in the lens in the path between said modulator and said first lens, with towards said a plurality of intrafascicular at least one of said first lens focus.
15. according to embodiment 14 described lithographic equipments, the lens in said path that wherein are used for focusing on said bundle are static basically with respect to said modulator.
16. according to any described lithographic equipment, the optical axis of wherein said field lens and the optical axis coincidence of said imaging len among embodiment 3 and the 12-15.
17. according to embodiment 2 described lithographic equipments, first lens in wherein said at least two lens comprise at least two sub-lens, wherein said a plurality of at least one intrafascicular bundle focus in the middle of said two sub-lens.
18. according to embodiment 17 described lithographic equipments, each in wherein said at least two sub-lens has focal length about equally.
19. according to any described lithographic equipment in embodiment 2,17 and 18, second lens that wherein said first lens are arranged at least in said two lens are exported by the bundle of collimation.
20., be configured to move first lens in said at least two lens with the speed that is different from second lens in said at least two lens according to any described lithographic equipment among embodiment 2 and the 17-19.
21. according to embodiment 20 described lithographic equipments, the speed of wherein said second lens is twices of the speed of said first lens.
22. according to embodiment 1 described lithographic equipment, wherein each lens comprises that the 4f heart far away advances/imaging system that the heart far away goes out.
23. according to embodiment 22 described lithographic equipments, the wherein said 4f heart far away advances/and imaging system that the heart far away goes out comprises at least 6 lens.
24., also be included in the derotator between said modulator and the said lens arra according to embodiment 1 described lithographic equipment.
25. according to embodiment 24 described lithographic equipments, wherein said derotator comprises Pechan prism.
26. according to embodiment 24 or 25 described lithographic equipments, wherein said derotator is arranged to move with the half the of the speed of said lens arra.
27. according to any described lithographic equipment among the embodiment 24-26, also comprise parabolic mirror, to reduce the size of the bundle between said modulator and said derotator.
28. according to any described lithographic equipment among the embodiment 24-27, also comprise parabolic mirror, to be increased in the size of the bundle between said derotator and the said lens arra.
29. according to any described lithographic equipment among the embodiment 1-28, wherein said lens arra rotates with respect to said modulator.
30. according to any described lithographic equipment among the embodiment 1-29, wherein said modulator comprises the controlled radiation source of a plurality of independences that is used to launch electromagnetic radiation.
31. according to any described lithographic equipment among the embodiment 1-29, wherein said modulator comprises micro reflector array.
32. according to any described lithographic equipment among the embodiment 1-29, wherein said modulator comprises radiation source and acousto-optic modulator.
33. a device making method comprises step:
A plurality of bundles according to the pattern modulation of expectation are provided; With
Use the lens arra that receives said a plurality of bundles that said a plurality of bundles are projected on the substrate; With
During said projection, with respect to the said lens arra of said Shu Yidong.
34. according to embodiment 33 described methods, wherein each lens comprises at least two lens arranging to the beam path of at least one said a plurality of intrafascicular bundle of said substrate along from the source of said at least one bundle.
35. according to embodiment 34 described methods, first lens in wherein said at least two lens comprise field lens, second lens in said at least two lens comprise imaging len.
36. according to embodiment 35 described methods, the focal plane of wherein said field lens overlaps with the back focal plane of said imaging len.
37. according to embodiment 35 or 36 described methods, wherein said imaging len comprises two non-spherical lenses.
38. according to any described method among the embodiment 35-37, the focal length of wherein said field lens makes the field size of said imaging len less than 2 to 3 ° of half-angles.
39. according to any described method among the embodiment 35-38, the focal length of wherein said imaging len make to said substrate place be 0.2 NA, said imaging len is not more than the diameter of said field lens.
40. according to embodiment 39 described methods, the focal length of wherein said imaging len equals the diameter of said field lens.
41. according to any described method among the embodiment 35-40, wherein the single combination with said field lens and said imaging len forms images to a plurality of said bundles.
42., comprise that also use is at the source of said a plurality of intrafascicular at least one bundle and the focus control device between the said field lens according to any described method among the embodiment 35-41.
43. according to embodiment 42 described methods, wherein said focus control device comprises folding mirror and roof like parts movably.
44., also comprise and use at least one bundle collimation that lens will be between said first lens and said second lens according to embodiment 35 described methods.
45. according to embodiment 44 described methods, the lens that wherein are used for said at least one bundle of collimation are static with respect to said at least one bundle basically.
46. according to any described method in embodiment 35,44 and 45, also comprise use, towards said a plurality of intrafascicular at least one of said first lens focus at the source of said at least one bundle and the lens in the path between said first lens.
47. according to embodiment 46 described methods, the lens that wherein are used to focus on said at least one bundle are static basically with respect to said at least one bundle.
48. according to any described method among embodiment 35 and the 44-47, the optical axis coincidence of the optical axis of wherein said field lens and said corresponding imaging len.
49. according to embodiment 34 described methods, first lens in wherein said at least two lens comprise at least two sub-lens, wherein said a plurality of at least one intrafascicular bundle focus in the middle of said two sub-lens.
50. according to embodiment 49 described methods, each in wherein said at least two sub-lens has focal length about equally.
51. according to any described method in embodiment 34,49 and 50, second lens that wherein said first lens are arranged at least in said two lens are exported by the bundle of collimation.
52., comprise with the speed that is different from second lens in said at least two lens and move first lens in said at least two lens according to any described method among embodiment 34 and the 49-51.
53. according to embodiment 52 described methods, the speed of wherein said second lens is twices of the speed of said first lens.
54. according to embodiment 33 described methods, wherein each lens comprises that the 4f heart far away advances/imaging system that the heart far away goes out.
55. according to embodiment 54 described methods, the wherein said 4f heart far away advances/and imaging system that the heart far away goes out comprises at least 6 lens.
56. according to embodiment 33 described methods, also comprise use at the source of said bundle and the derotator between the said lens arra to the said Shu Jinhang commentaries on classics that disappears.
57. according to embodiment 56 described methods, wherein said derotator comprises Pechan prism.
58., comprise half the mobile said derotator with the speed of said lens arra according to embodiment 56 or 57 described methods.
59., also comprise and use parabolic mirror to reduce in the source of said bundle and the size of the bundle between the said derotator according to any described method among the embodiment 56-58.
60., also comprise the size of using parabolic mirror to be increased in the bundle between said derotator and the said lens arra according to any described method among the embodiment 56-59.
61., comprise said lens arra with respect to said Shu Xuanzhuan according to any described method among the embodiment 33-60.
62. according to any described method among the embodiment 33-61, each in the controlled radiation source of wherein a plurality of independences is launched said a plurality of intrafascicular each.
63. according to any described method among the embodiment 33-61, wherein micro reflector array is launched a plurality of bundles.
64. according to any described method among the embodiment 33-61, wherein radiation source and acousto-optic modulator produce said a plurality of bundle.
65. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences of launching electromagnetic radiation, and the exposure area that is configured to make said substrate is by a plurality of Shu Jinhang exposures of modulating according to the pattern of expectation; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate and comprises the lens arra that receives said a plurality of bundles, and said optical projection system is configured between the exposure period of said exposure area, move said lens arra with respect to the controlled radiation source of said independence.
66. a device making method comprises step:
Use the controlled radiation source of a plurality of independences that a plurality of bundles according to the pattern modulation of expectation are provided; With
Use the lens arra that receives said a plurality of bundles that said a plurality of bundles are projected on the substrate; With
During said projection, move said lens arra with respect to the controlled radiation source of said independence.
67. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator, the exposure area that is configured to make said substrate is by a plurality of Shu Jinhang exposures of modulating according to the pattern of expectation; With
Optical projection system is configured to the bundle of being modulated is projected on the substrate and comprises a plurality of lens arras that are used to receive said a plurality of bundles, and each in the said array is arranged along the beam path of said a plurality of bundles independently.
68. according to embodiment 67 described lithographic equipments, wherein said optical projection system is configured between the exposure period of said exposure area, move said lens arra with respect to said modulator.
69. according to embodiment 67 or 68 described lithographic equipments, wherein the said lens layout in each array is in single main body.
70. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences of launching electromagnetic radiation; Be configured to made public by a plurality of Shu Jinhang that modulate according to the pattern of expectation in the exposure area of said substrate; And be configured between the exposure period of said exposure area, move said a plurality of radiation source with respect to said exposure area, make only to be less than all a plurality of radiation sources of said a plurality of radiation sources said exposure area of can making public at any one time; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
71. a lithographic equipment comprises:
The controlled radiation source of a plurality of independences is configured to provide a plurality of bundles according to the pattern modulation of expectation, and at least one radiation source in said a plurality of radiation sources is movably between the position of its emitted radiation and the position in its not emitted radiation;
Substrate holder is configured to keep substrate; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
72. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences that is used to launch electromagnetic radiation; Be configured to made public by a plurality of Shu Jinhang that modulate according to the pattern of expectation in the exposure area of said substrate; And be configured between the exposure period of said exposure area, move at least one radiation source in said a plurality of radiation source with respect to said exposure area, make from the radiation of said at least one radiation source synchronization with from the radiation of at least one other the radiation source in said a plurality of radiation sources in abutting connection with or overlapping; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
73. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
The controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; At least one radiation source in said a plurality of radiation source it can emitted radiation between the position of said exposure area and its not emitted radiation to the position of said exposure area be movably and
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
74. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured between the exposure period of said exposure area, move said a plurality of radiation source with respect to said exposure area, said modulator has to the output of a plurality of bundles of said exposure area, and said output has the area less than the area of the output of said a plurality of radiation sources; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
75. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; The array that comprises the controlled radiation source of a plurality of independences; Being configured to provide the exposure area separately to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each array with respect to its exposure area separately; Or move said a plurality of bundles with respect to its exposure area separately from each array, or move said array and said a plurality of bundle with respect to said exposure area separately, the exposure area separately of the exposure area separately of the array in wherein a plurality of in use arrays and another array in said a plurality of array in abutting connection with or overlapping; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
76. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area; Or move said a plurality of bundle with respect to said exposure area, or move each and said a plurality of bundles in said a plurality of radiation source with respect to said exposure area, each in the wherein in use said radiation source is operated in the precipitous part of its power/forward current curve separately; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
77. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated, and be configured to move each in said a plurality of radiation source with respect to said exposure area, or move said a plurality of bundle with respect to said exposure area; Or with respect to said exposure area move in said a plurality of radiation source each with said a plurality of bundles, each in the controlled radiation source of wherein said independence comprises bluish-violet laser diode; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
78. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in two concentric circular array at least; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
79. according to embodiment 78 described lithographic equipments, at least one circular array in the wherein said circular array is disposed at least one other the circular array in the said circular array with staggered mode.
80. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are around the center arrangement of structure, and said structure has the opening that extends through said structure in said a plurality of radiation sources; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
81. according to embodiment 80 described lithographic equipments, the outside that also is included in said radiation source place or said radiation source keeps the support member of supporting construction.
82. according to embodiment 81 described lithographic equipments, wherein said support member comprises the bearing that allows said structure to move.
83. according to embodiment 81 or 82 described lithographic equipments, wherein said support member comprises the motor that moves said structure.
84. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated, and be configured to move each in said a plurality of radiation source with respect to said exposure area, and said a plurality of radiation sources are around the center arrangement of structure;
Support member is used in the said structure of the external support of said radiation source place or said radiation source, and said structural arrangements becomes the said structure of rotation or allows the said structure of rotation; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
85. according to embodiment 84 described lithographic equipments, wherein said support member comprises the bearing that allows the said structure of rotation.
86. according to embodiment 84 or 85 described lithographic equipments, wherein said support member comprises the motor that rotates said structure.
87. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged on the removable frame, and said removable frame is arranged in again on the removable plate; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
88. according to embodiment 87 described lithographic equipments, wherein said removable frame is rotatable.
89. according to embodiment 87 or 88 described lithographic equipments, wherein said removable plate is rotatable.
90. according to embodiment 89 described lithographic equipments, the rotation center of wherein said removable plate does not overlap with the rotation center of said removable frame.
91. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in the removable frame or on the removable frame;
The fluid passage is arranged in the said removable frame, so that the position of temperature control fluid to contiguous at least said a plurality of radiation sources to be provided; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
92., also comprise the sensor that is arranged on said removable frame or the removable frame according to embodiment 91 described lithographic equipments.
93. according to embodiment 91 or 92 described lithographic equipments, also comprise sensor, said sensor be arranged in contiguous said a plurality of radiation sources at least one radiation source the position but not on said removable frame or said removable frame.
94. according to embodiment 92 or 93 described lithographic equipments, wherein said sensor comprises temperature sensor.
95. according to any described lithographic equipment among the embodiment 92-94, wherein said sensor comprises the sensor that is configured to measure said expansion of structure and/or contraction.
96. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in the removable frame or on the removable frame;
Heat radiator, said heat radiator are arranged in the said removable frame or on the removable frame, to provide the temperature of said structure are controlled; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
97. according to embodiment 96 described lithographic equipments, also comprise static heat radiator, with said removable frame in or heat radiator on the removable frame cooperate.
98. according to embodiment 97 described lithographic equipments; Be included in the said removable frame or at least two heat radiator on removable frame, at least one heat radiator in the said static said heat radiator of heat radiator in said removable frame or on the removable frame and the said removable frame or between at least one other heat radiator in the said heat radiator on the said removable frame.
99. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in the removable frame or on the removable frame;
Fluid supply apparatus is configured to supply with the extremely outside surface of said structure of fluid, to control the temperature of said structure; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
100. according to embodiment 99 described lithographic equipments, wherein said fluid supply apparatus is configured to supply gas.
101. according to embodiment 99 described lithographic equipments, wherein said fluid supply apparatus is configured to feed fluid.
102. according to embodiment 101 described lithographic equipments, also comprise the fluid restricted structure, be configured to keep said liquid to contact with said structure.
103. according to embodiment 102 described lithographic equipments, wherein said fluid restricted structural arrangements becomes to keep the sealing between said structure and the said fluid restricted structure.
104. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
Lens independently on the structure, said lens are connected near each radiation source in said a plurality of radiation source or are connected to each radiation source in said a plurality of radiation source, and can move with radiation source separately.
105. according to embodiment 104 described lithographic equipments, also comprise actuator, said actuator is configured to make the lens displacement with respect to its radiation source separately.
106. according to embodiment 104 or 105 described lithographic equipments, also comprise actuator, said actuator is configured to make lens and its radiation source displacement separately with respect to the structure that supports said lens and its radiation source separately.
107. according to embodiment 105 or 106 described lithographic equipments, wherein said actuator is configured on up to 3 degree of freedom, move said lens.
108., also comprise the aperture structure in the downstream of at least one radiation source in said a plurality of radiation source according to any described lithographic equipment among the embodiment 104-107.
109., wherein said lens are connected to the structure and its radiation source separately that supports said lens with high thermal conductivity material according to any described lithographic equipment among the embodiment 104-107.
110. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
The spatial coherence breaking plant is configured to upset the radiation from least one radiation source in said a plurality of radiation sources; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
111. according to embodiment 110 described lithographic equipments, wherein said spatial coherence breaking plant comprises static plate, said at least one radiation source is movably with respect to said plate.
112. according to embodiment 110 described lithographic equipments, wherein said spatial coherence breaking plant comprises at least one that from following apparatus, select: phase-modulator, swivel plate or oscillating plate.
113. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
Sensor, be configured to measure with said a plurality of radiation sources in the relevant focusing of at least one radiation source, at least a portion of said sensor is in said at least one radiation source or on said at least one radiation source; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
114. according to embodiment 113 described lithographic equipments, wherein said sensor configuration becomes each relevant focusing of independent measurement and said radiation source.
115. according to embodiment 113 or 114 described lithographic equipments, wherein said sensor is an edge of a knife focused detector.
116. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
Transmitter is configured to wirelessly send signal and/or power to said a plurality of radiation sources, to control said a plurality of radiation source respectively and/or said a plurality of radiation sources are supplied power; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
117. according to embodiment 116 described lithographic equipments, wherein said signal comprises a plurality of signals, and also comprises demultiplexer, to send each signal in said a plurality of signal towards separately radiation source.
118. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in the removable frame or on the removable frame;
Single line is used for controller is connected to said removable frame, so that a plurality of signals and/or power are sent to said a plurality of radiation source, to control said a plurality of radiation source respectively and/or it is supplied power; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
119. according to embodiment 118 described lithographic equipments, wherein said signal comprises a plurality of signals, and also comprises demultiplexer, to send each signal in said a plurality of signal towards separately radiation source.
120. according to embodiment 118 or 119 described lithographic equipments, wherein said line comprises optical line.
121. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
Sensor is measured by at least one radiation source in said a plurality of radiation sources towards said substrate emission or characteristic that will radiation emitted; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
122. according to embodiment 121 described lithographic equipments, at least a portion of wherein said sensor is arranged on said substrate holder or the said substrate holder.
123. according to embodiment 122 described lithographic equipments, said at least a portion of wherein said sensor is arranged in a position that is supported on the outside in residing zone on the said substrate holder on said substrate holder or the said substrate holder and at said substrate.
124. according to any described lithographic equipment among the embodiment 121-123, at least a portion of wherein said sensor is positioned at a side of said substrate, it extends along the direction of scanning of said substrate in use basically.
125. according to any described lithographic equipment among the embodiment 121-124, at least a portion of wherein said sensor is installed in the framework that supports said removable frame or on the framework.
126. according to any described lithographic equipment among the embodiment 121-125, wherein said sensor configuration becomes to measure the radiation from said at least one radiation source outside the said exposure area.
127. according to any described lithographic equipment among the embodiment 121-126, at least a portion of wherein said sensor is movably.
128. according to any described lithographic equipment among the embodiment 121-127, also comprise controller, said controller is configured to calibrate said at least one radiation source based on the result of said sensor.
129. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, said a plurality of radiation sources are arranged in the removable frame or on the removable frame;
Sensor is used to measure the position of said removable frame; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
130. according to embodiment 129 described lithographic equipments, at least a portion of wherein said sensor is installed in the framework that supports said removable frame or on the framework.
131. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator; Comprise the controlled radiation source of a plurality of independences; Being configured to provide the exposure area to said substrate according to a plurality of bundles that the pattern of expectation is modulated; And be configured to move each in said a plurality of radiation source with respect to said exposure area, each in said a plurality of radiation sources has distinguishing mark or distinguishing mark is provided;
Sensor is configured to detect said distinguishing mark; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
132. according to embodiment 131 described lithographic equipments, at least a portion of wherein said sensor is installed in the framework that supports said a plurality of radiation sources or on the framework.
133. according to embodiment 131 or 132 described lithographic equipments, wherein said distinguishing mark comprises the radiation frequency from separately radiation source.
134. according to any described lithographic equipment among the embodiment 131-133, wherein said distinguishing mark comprises at least one that from following, select: bar code, mark or radio frequency identification marker.
135. a lithographic equipment comprises:
Substrate holder is configured to keep substrate;
Modulator comprises the controlled radiation source of a plurality of independences, and being configured to provides the exposure area to said substrate with a plurality of bundles of modulating according to the pattern of expectation, and is configured to move each in said a plurality of radiation source with respect to said exposure area;
Sensor, be configured to detect by said substrate changed course, from the radiation of at least one radiation source in said a plurality of radiation sources; With
Optical projection system is configured to the bundle of being modulated is projected on the said substrate.
136. according to embodiment 135 described lithographic equipments, wherein said sensor configuration becomes according to the radiation of said changed course to confirm to incide the position from the spot of the said radiation of said at least one radiation source on the said substrate.
137. according to any described lithographic equipment among the embodiment 70-136, wherein said modulator configuration becomes at least one radiation source of axis rotation around the direction of propagation that is arranged essentially parallel to said a plurality of bundles.
138. according to any described lithographic equipment among the embodiment 70-137, wherein said modulator configuration becomes transversely at least one radiation source of direction translation of the direction of propagation of said a plurality of bundles.
139. according to any described lithographic equipment among the embodiment 70-138, wherein said modulator comprises the beam-deflector that is configured to move said a plurality of bundles.
140. according to embodiment 139 described lithographic equipments, wherein said beam-deflector is from the group that is made up of following parts, to select: catoptron, prism and acousto-optic modulator.
141. according to embodiment 139 described lithographic equipments, wherein said beam-deflector comprises polygon spare.
142. according to embodiment 139 described lithographic equipments, wherein said beam-deflector is configured to vibration.
143. according to embodiment 139 described lithographic equipments, wherein said beam-deflector is configured to rotation.
144. according to any described lithographic equipment among the embodiment 70-143, wherein said substrate holder is configured to move said substrate along the direction that said a plurality of bundles are set.
145. according to embodiment 144 described lithographic equipments, the mobile of wherein said substrate is rotation.
146. according to any described lithographic equipment among the embodiment 70-145, wherein said a plurality of radiation sources can move together.
147. according to any described lithographic equipment among the embodiment 70-146, wherein said a plurality of radiation sources are arranged with circular, fashion.
148. according to any described lithographic equipment among the embodiment 70-147, wherein said a plurality of radiation sources are arranged in the plate and are spaced apart from each other.
149. according to any described lithographic equipment among the embodiment 70-148, wherein said optical projection system comprises lens arra.
150. according to any described lithographic equipment among the embodiment 70-149, wherein said optical projection system is made up of lens arra in fact.
151. according to embodiment 149 or 150 described lithographic equipments; The lens of wherein said lens arra have high numerical aperture; Said lithographic equipment is arranged such that said substrate is in the outside of the focal position of the radiation relevant with said lens, to reduce the numerical aperture of said lens effectively.
152. according to any described lithographic equipment among the embodiment 70-151, each in the wherein said radiation source comprises laser diode.
153. according to embodiment 152 described lithographic equipments, wherein each laser diode is configured to launch the radiation of the wavelength with about 405nm.
154. according to any described lithographic equipment among the embodiment 70-153, also comprise temperature controller, said temperature controller is configured between exposure period said a plurality of radiation sources are remained on the temperature of constant.
155. according to embodiment 154 described lithographic equipments, wherein said controller is configured to the temperature of the temperature of temperature or approaching said constant that will said a plurality of radiation source heats to the temperature that is in said constant before exposure.
156. according to any described lithographic equipment among the embodiment 70-155, comprise arrange along a direction at least 3 independently arrays, each comprises a plurality of radiation sources in the said array.
157. according to any described lithographic equipment among the embodiment 70-156, wherein said a plurality of radiation sources comprise at least about 1200 radiation sources.
158. according to any described lithographic equipment among the embodiment 70-157, also comprise alignment sensor, aiming between at least one radiation source that is used for confirming said a plurality of radiation sources and the said substrate.
159. according to any described lithographic equipment among the embodiment 70-158, also comprise horizon sensor, be used for confirming the position of said substrate with respect to the focal position of said a plurality of intrafascicular at least one bundle.
160. according to embodiment 158 or 159 described lithographic equipments, also comprise controller, said controller is configured to change said pattern based on the result of the result of alignment sensor and/or horizon sensor.
161. according to any described lithographic equipment among the embodiment 70-160; Also comprise controller, said controller is configured to change said pattern based on the measurement of the measurement of the temperature of at least one radiation source in said a plurality of radiation sources or the temperature relevant with at least one radiation source in said a plurality of radiation sources.
162. according to any described lithographic equipment among the embodiment 70-161, also comprise sensor, be used for measuring by at least one radiation sources of said a plurality of radiation sources by towards said substrate emission or will be by the characteristic of radiation emitted.
163. a lithographic equipment comprises:
The controlled radiation source of a plurality of independences is configured to provide a plurality of bundles according to the pattern modulation of expectation;
Lens arra comprises a plurality of lenslets; With
Substrate holder is configured to keep substrate,
Wherein during use, except said lens arra, between said a plurality of radiation sources and said substrate, there are not other optical devices.
164. a pattern apparatus for converting able to programme comprises:
Substrate has on said substrate along the array of the isolated emitted radiation diode of at least one direction; With
Lens arra is at the place, radiation downstream of said emitted radiation diode.
165. according to embodiment 164 described pattern apparatus for converting able to programme; Wherein said lens arra comprises having a plurality of lenticular microlens arrays; Said lenticular quantity is corresponding to the quantity of emitted radiation diode, and is positioned to focus on the radiation that will optionally pass the emitted radiation diode separately in the said emitted radiation diode and becomes little spot array.
166. according to embodiment 164 or 165 described pattern apparatus for converting able to programme, wherein said emitted radiation diode is spaced apart along the direction of at least two quadratures.
167. according to any described pattern apparatus for converting able to programme among the embodiment 164-166, wherein said emitted radiation diode is embedded in the material with lower thermal conductivity.
168. a device making method comprises step:
Use the controlled radiation source of a plurality of independences that a plurality of bundles according to the pattern modulation of expectation are provided towards the exposure area of substrate;
When said a plurality of bundle is provided, move at least one in said a plurality of radiation source, make only to be less than all a plurality of radiation sources of said a plurality of radiation sources said exposure area of can making public at any one time; With
Said a plurality of bundles are projected on the said substrate.
169. a device making method comprises step:
Use the controlled radiation source of a plurality of independences that a plurality of bundles according to the pattern modulation of expectation are provided;
Between the position of the position of its emitted radiation and its not emitted radiation, move at least one in said a plurality of radiation sources; With
Said a plurality of bundles are projected on the said substrate.
170. a device making method comprises and uses the controlled radiation source of a plurality of independences that the bundle according to the pattern modulation of expectation is provided, and only uses lens arra to be projected to substrate from the bundle of the modulation of the controlled radiation source of said a plurality of independences.
171. a device making method comprises step:
Use the controlled radiation source of a plurality of independences that a plurality of electromagnetic radiation beams according to the pattern modulation of expectation are provided;
Between the exposure period of exposure area, move at least one radiation source in said a plurality of radiation source with respect to said exposure area, make from the radiation of said at least one radiation source synchronization with from the radiation of at least one other radiation source in said a plurality of radiation sources in abutting connection with or overlapping; With
Said a plurality of bundles are projected on the substrate.
172., wherein move step and comprise at least one radiation source of axis rotation around the direction of propagation that is arranged essentially parallel to said a plurality of bundles according to any described method among the embodiment 168-171.
173., wherein move step and comprise transversely at least one radiation source of direction translation of the direction of propagation of said a plurality of bundles according to any described method among the embodiment 168-172.
174., comprise through using beam-deflector to move said a plurality of bundle according to any described method among the embodiment 168-173.
175. according to embodiment 174 described methods, wherein said beam-deflector is to select in the group that is made up of following parts: catoptron, prism and acousto-optic modulator.
176. according to embodiment 174 described methods, wherein said beam-deflector comprises polygon spare.
177. according to embodiment 174 described methods, wherein said beam-deflector is configured to vibration.
178. according to embodiment 174 described methods, wherein said beam-deflector is configured to rotation.
179., comprise said substrate is moved along the direction that said a plurality of bundles are set up the place according to any described method among the embodiment 168-178.
180. according to embodiment 179 described methods, the motion of wherein said substrate is rotation.
181., comprise and move said a plurality of radiation sources together according to any described method among the embodiment 168-180.
182. according to any described method among the embodiment 168-181, wherein said a plurality of radiation sources are arranged with circular, fashion.
183. according to any described method among the embodiment 168-182, wherein said a plurality of radiation sources are arranged in the plate and are spaced apart from each other.
184. according to any described method among the embodiment 168-183, wherein said projection step comprises through using lens arra that the image of said intrafascicular each bundle is formed on the said substrate.
185. according to any described method among the embodiment 168-184, wherein said projection step comprises in fact only uses lens arra that the image of said intrafascicular each bundle is formed on the said substrate.
186. according to any described method among the embodiment 168-185, each in the wherein said radiation source comprises laser diode.
187. according to embodiment 186 described methods, wherein each laser diode is configured to launch the radiation of the wavelength with about 405nm.
188. flat-panel monitor of making according to any described method among the embodiment 168-187.
189. IC-components of making according to any described method among the embodiment 168-187.
190. a radiating system comprises:
A plurality of movably radiating curtains, each radiating curtain comprise the controlled radiation source of a plurality of independences, and the controlled radiation source of said a plurality of independences is configured to provide a plurality of bundles according to the pattern modulation of expectation; With
Motor is configured to move each in the said radiating curtain.
191. according to embodiment 190 described radiating systems, wherein said motor is configured to rotate each in the said radiating curtain around the axis of the direction of propagation that is arranged essentially parallel to said a plurality of bundles.
192. according to embodiment 190 or 191 described radiating systems, wherein said motor is configured to transversely each in the said radiating curtain of direction translation of the direction of propagation of said a plurality of bundles.
193. according to any described radiating system among the embodiment 190-192, also comprise beam-deflector, said beam-deflector is configured to move said a plurality of bundles.
194. according to embodiment 193 described radiating systems, wherein said beam-deflector is to select in the group that is made up of following parts: catoptron, prism and acousto-optic modulator.
195. according to embodiment 193 described radiating systems, wherein said beam-deflector comprises polygon spare.
196. according to embodiment 193 described radiating systems, wherein said beam-deflector is configured to vibration.
197. according to embodiment 193 described radiating systems, wherein said beam-deflector is configured to rotation.
198. according to any described radiating system among the embodiment 190-197, a plurality of radiation sources of each radiating curtain in the wherein said radiating curtain can move together.
199. according to any described radiating system among the embodiment 190-198, a plurality of radiation sources of each radiating curtain in the wherein said radiating curtain are arranged with circular, fashion.
200. according to any described radiating system among the embodiment 190-199, said a plurality of radiation sources of each radiating curtain in the wherein said radiating curtain are arranged in the plate and are spaced apart from each other.
201. according to any described radiating system among the embodiment 190-200, also comprise with said radiating curtain in the lens arra that is associated of each radiating curtain.
202. according to embodiment 201 described radiating systems, each in said a plurality of radiation sources of each radiating curtain in the wherein said radiating curtain is associated with lens in the lens arra that is associated with said radiating curtain.
203. according to any described radiating system among the embodiment 190-202, each source in the multiple source of each radiating curtain in the wherein said radiating curtain comprises laser diode.
204. according to embodiment 203 described radiating systems, wherein each laser diode is configured to launch the radiation of the wavelength with about 405nm.
205. one kind is used for the lithographic equipment of substrate with radiant exposure, said lithographic equipment comprises the pattern apparatus for converting able to programme with 100-25000 self-emission formula independence addressable element.
206., comprise at least 400 self-emission formula independence addressable element according to embodiment 205 described lithographic equipments.
207., comprise at least 1000 self-emission formula independence addressable element according to embodiment 205 described lithographic equipments.
208., comprise less than 10000 self-emission formula independence addressable element according to any described lithographic equipment among the embodiment 205-207.
209., comprise less than 5000 self-emission formula independence addressable element according to any described lithographic equipment among the embodiment 205-207.
210. according to any described lithographic equipment among the embodiment 205-209, wherein said self-emission formula independence addressable element is a laser diode.
211. according to any described lithographic equipment among the embodiment 205-209, wherein said self-emission formula independence addressable element is arranged to have the spot size of selecting from the scope of 0.1-3 micron on said substrate.
212. according to any described lithographic equipment among the embodiment 205-209, wherein said self-emission formula independence addressable element is arranged to have about 1 micron spot size on said substrate.
213. one kind is used for the lithographic equipment of substrate with radiant exposure; Said lithographic equipment comprises pattern apparatus for converting able to programme; Said pattern apparatus for converting able to programme makes, is benchmark with the exposure field length of 10cm, has 100-25000 self-emission formula independence addressable element.
214., comprise at least 400 self-emission formula independence addressable element according to embodiment 213 described lithographic equipments.
215., comprise at least 1000 self-emission formula independence addressable element according to embodiment 213 described lithographic equipments.
216., comprise less than 10000 self-emission formula independence addressable element according to any described lithographic equipment among the embodiment 213-215.
217., comprise less than 5000 self-emission formula independence addressable element according to any described lithographic equipment among the embodiment 213-215.
218. according to any described lithographic equipment among the embodiment 213-217, wherein said self-emission formula independence addressable element is a laser diode.
219. according to any described lithographic equipment among the embodiment 213-217, wherein said self-emission formula independence addressable element is arranged to have the spot size of selecting from the scope of 0.1-3 micron on said substrate.
220. according to any described lithographic equipment among the embodiment 213-217, wherein said self-emission formula independence addressable element is arranged to have about 1 micron spot size on said substrate.
221. a pattern apparatus for converting able to programme comprises rotatable dish, said dish has 100-25000 self-emission formula independence addressable element.
222. according to embodiment 221 described pattern apparatus for converting able to programme, wherein said dish comprises at least 400 self-emission formula independence addressable element.
223. according to embodiment 221 described pattern apparatus for converting able to programme, wherein said dish comprises at least 1000 self-emission formula independence addressable element.
224. according to any described pattern apparatus for converting able to programme among the embodiment 221-223, wherein said dish comprises less than 10000 self-emission formula independence addressable element.
225. according to any described pattern apparatus for converting able to programme among the embodiment 221-223, wherein said dish comprises less than 5000 self-emission formula independence addressable element.
226. according to any described pattern apparatus for converting able to programme among the embodiment 221-225, wherein said self-emission formula independence addressable element is a laser diode.
227. in making flat-panel monitor, use one or more the present invention.
228. in the integrated circuit encapsulation, use one or more the present invention.
229. a photoetching method, comprise use have self-emission formula element pattern apparatus for converting able to programme with substrate with radiant exposure, wherein in the power consumption of the pattern apparatus for converting said able to programme of the said self-emission formula of said exposure manipulate element less than 10kW.
230. according to embodiment 229 described methods, wherein said power consumption is less than 5kW.
231. according to embodiment 229 or 230 described methods, wherein said power consumption is 100mW at least.
232. according to any described method among the embodiment 229-231, wherein said self-emission formula element is a laser diode.
233. according to embodiment 232 described methods, wherein said laser diode is a bluish-violet laser diode.
234. a photoetching method, comprise use have self-emission formula element pattern apparatus for converting able to programme with substrate with radiant exposure, wherein the output of the light of each emission-type element is 1mW at least in use.
235. according to embodiment 234 described methods, the output of wherein said light is 10mW at least.
236. according to embodiment 234 described methods, the output of wherein said light is 50mW at least.
237. according to any described method among the embodiment 234-236, wherein said light output is less than 200mW.
238. according to any described method among the embodiment 234-237, wherein said self-emission formula element is a laser diode.
239. according to embodiment 238 described methods, wherein said laser diode is a bluish-violet laser diode.
240. according to embodiment 234 described methods, the output of wherein said light is greater than 5mW but be less than or equal to 20mW.
241. according to embodiment 234 described methods, the output of wherein said light is greater than 5mW but be less than or equal to 30mW.
242. according to embodiment 234 described methods, the output of wherein said light is greater than 5mW but be less than or equal to 40mW.
243. according to any described method among the embodiment 234-242, wherein said self-emission formula element is operated with single-mode.
244. a lithographic equipment comprises:
Pattern apparatus for converting able to programme has self-emission formula element; With
Rotatable framework has and is used to receive the optical element from the radiation of said self-emission formula element, and said optical element is the refraction type optical element.
245. a lithographic equipment comprises:
Pattern apparatus for converting able to programme has self-emission formula element; With
Rotatable framework has and is used to receive the optical element from the radiation of said self-emission formula element, and said rotatable framework is not used in the reflection type optical element of reception from the radiation of any said self-emission formula element or all said self-emission formula elements.
246. a lithographic equipment comprises:
Pattern apparatus for converting able to programme; With
Rotatable framework, said rotatable framework comprises the plate with optical element, said surface with plate of optical element is smooth.
247. when making flat-panel monitor, use in the said invention one or more.
248. one or more in the encapsulation of integrated circuit in the said invention of use.
249. a flat-panel monitor, said FPD quilt is according to any means manufacturing in the said method.
250. IC-components of making according to any means in the said method.
251. a lithographic equipment comprises:
The optical devices row; Be configured to bundle is projected on the target part of substrate, said optical devices row comprise the radiation source that is configured to provide bundle, and optical projection system; Said optical projection system is configured to said bundle is projected on the said target part; Wherein said optical devices are listed as on the fixed part that partly is installed in lithographic equipment, and partly are installed on the part that can rotate of said lithographic equipment, and wherein said optical devices row have focal height;
The scanning movement actuator is configured to along the direction of scanning to be listed as with sweep velocity with respect to optical devices and moves substrate; With
Focus controller; Be configured to control optical devices and be listed as focal height with respect to Reference; Wherein, Focus controller comprises focusing measurement mechanism and focus actuator, and said focusing measurement mechanism is configured to confirm the focusing quality on the Reference, and said focus actuator is configured to the focal height based on fixed focusing quality adjustment optical devices row.
252. according to embodiment 251 described lithographic equipments; Wherein Reference comprises a plurality of marks; Focus on the imageing sensor that measurement mechanism comprises the image that is arranged to receive a mark in a plurality of marks, wherein focus on quality and confirmed based on the image that projects on the imageing sensor.
253. according to embodiment 252 described lithographic equipments, wherein focus on measurement mechanism and comprise beam splitter and quarter wave plate, be arranged to the image from the Reference reflection is directed to imageing sensor.
254., wherein focus on measurement mechanism and be integrated in the optical devices row according to embodiment 251 described lithographic equipments.
255. according to embodiment 251 described lithographic equipments, wherein said optical devices row comprise at least one movably concentrating element, wherein focus actuator is connected to said concentrating element with the said focal height of mobile adjustment through said concentrating element.
256. according to embodiment 251 described lithographic equipments, wherein said focus actuator is arranged to adjust the distance between optical devices row and the Reference.
257. according to embodiment 251 described lithographic equipments, comprise a plurality of optical devices row, each optical devices row comprises one or more controllable concentrating element, optical projection system and focus controller.
258. according to embodiment 251 described lithographic equipments, wherein said focus controller is arranged to make focal height to adapt to the public picture plane of lithographic equipment.
259. according to embodiment 258 described lithographic equipments, comprise be used for confirming said public picture plane and graphic pattern projection the sensor of the difference between the projection surface of substrate extremely.
260. according to embodiment 251 described lithographic equipments, wherein Reference is a substrate.
261. according to embodiment 251 described lithographic equipments, wherein Reference is the reference plate that is installed on the substrate supports device that is used for support substrates.
262. one kind is used in the lithographic equipment of embodiment 251, generating the method as the plane in positive burnt position, said method comprises step:
Measure optical devices and be listed in the focusing quality on the Reference;
Based on focal height is adjusted in the measurement of optical devices row; With
Be directed to multiple said measurement of one or more other optical devices column weight and set-up procedure.
263., wherein be directed to all optical assemblies row that the part correlations that can rotate with lithographic equipment a plurality of join and carry out said method according to embodiment 262 described methods.
264. generate method of patterning on the substrate that a kind is used in the lithographic equipment of embodiment 251, said method comprises step:
Before a plurality of bundles being projected on a plurality of targets part, be directed to each optical devices and be listed as with respect to Reference and form the public plane that looks like in positive burnt position;
Before the projection process or during measure the height and/or the level of incline of substrate; With
Position with substrate during projection process is adjusted to public picture plane in the position that pattern generates a plurality of target parts at place.
265., also comprise step: the true altitude and/or the level of incline of the target part during the target that the focal height of optical devices row or one group of optical devices row is adjusted to measured substrate is partly organized according to embodiment 264 described methods.
266. according to embodiment 251 described lithographic equipments, wherein, said radiation source is a self-emission formula contrast device.
267. according to embodiment 266 described lithographic equipments, wherein said self-emission formula contrast device is a diode.
Although can make concrete reference in this article, said lithographic equipment is used to make specific device or structure (for example integrated circuit or flat-panel monitor), be to be understood that lithographic equipment described here and photoetching method can have other application.Application includes but not limited to that (it is display or electronic installation for guiding and check pattern, flat-panel monitor, LCD (LCD), OLED display, thin-film head, micro electro mechanical device (MEMS), MOEMS (MOEMS), DNA chip, encapsulation (for example flip-chip, distribute etc. again), flexible display or the electronic installation of integrated circuit, integrated optics system, magnetic domain memory; It can be rotatable, as paper flexible and the shape that remains unchanged, conformal, rugged, thin and/or lightweight, for example flexiplast display) etc. manufacturing.In addition, for example in flat-panel monitor, equipment of the present invention and method can be used for helping to produce various layers, for example tft layer and/or color filter layers.It will be understood by those skilled in the art that in the situation of this alternate application, can use therein any term " wafer " or " tube core " be thought respectively and more upper term " substrate " or " target part " synonym.Here the substrate of indication can be handled before or after exposure, for example in track (for example, a kind of typically resist layer is coated onto on the substrate and the instrument that the resist that has made public is developed), measuring tool or the instruments of inspection.Under applicable situation, can the disclosure here be applied in this and other substrate processing instrument.In addition, more than said substrate can be handled once, for example, make said term used herein " substrate " also can represent to have comprised the substrate of a plurality of processing layers so that produce multilayer IC.
The term " radiation " and " bundle " that use comprise all types of electromagnetic radiation here; Comprise ultraviolet (UV) radiation (for example have or about 365,248,193,157 or the wavelength of 126nm) and extreme ultraviolet (EUV) radiation (for example having the wavelength in the scope of 5-20nm) and the particle beams, such as ion beam or electron beam.
Flat-panel display substrates can be a rectangular shape.The lithographic equipment that is designed for the such substrate of exposure can provide the exposure area, and it covers whole width of rectangular substrate, or covers the part (for example width is half the) of said width.Can be below the exposure area scanning substrate, the pattern that variation is provided of bundle synchronous scanning pattern apparatus for converting or the pattern apparatus for converting through patterning simultaneously.Like this, all or a part of the pattern of expectation are transferred on the substrate.If the exposure area covers whole width of substrate, can accomplish exposure with single sweep operation so.If the exposure area covers width half the of substrate for example, can after first scanning, laterally move substrate so and carry out the remainder of another scanning usually with the substrate that makes public.
Any device that expression can be used for the xsect of radiation beam should broadly be annotated in the term " pattern apparatus for converting " that here uses, such as the pattern that produces in (part) substrate.Should be noted that the pattern of giving radiation beam can be not exclusively corresponding to the pattern of the expectation in the target part of substrate, if for example pattern comprises phase shift characteristic or so-called supplemental characteristic.Similarly, finally possibly not correspond to the pattern that the arbitrary moment on the array at independent controlled member forms at the pattern that produces on the substrate.This can be especially such for following layout: in said layout; Be formed on final pattern on each part of substrate on the given time cycle or giving between the exposure period of determined number and building; In the given time cycle or between the exposure period of determined number, pattern on the array of independent controlled member and/or the variation of the relative position of substrate.Usually; The pattern that on the target part of substrate, produces will be corresponding to the particular functional layer in the device that in the target part, produces, for example integrated circuit or flat-panel monitor (for example color filter layers in the flat-panel monitor or the tft layer in the flat-panel monitor).The example of such pattern apparatus for converting comprises for example mask, array of programmable mirrors, diode laser matrix, light emitting diode matrix, grating light valve and LCD array.Its pattern is that programmable pattern apparatus for converting is collectively referred to as " contrast device " herein under the help of electronic installation (for example computing machine); The pattern apparatus for converting that for example comprises a plurality of programmable elements; It can each programmable element radiation beam a part intensity (for example except mask before sentence in all devices of mentioning); Comprise the electronic programmable pattern apparatus for converting with a plurality of programmable elements, its phase place through the part of the radiation beam of assigning to respect to the adjacent portions of radiation beam is given radiation beam with pattern.In one embodiment, the pattern apparatus for converting comprises at least 10 programmable elements, for example at least 100, at least 1000, at least 10000, at least 100000, at least 1000000, or at least 10000000 programmable elements.Several embodiment in these devices is discussed hereinafter to a certain extent in further detail:
Array of programmable mirrors.Array of programmable mirrors can comprise matrix-addressable surface, and this matrix-addressable surface has viscoelasticity key-course and reflecting surface.The ultimate principle of such equipment institute foundation be the zone that is addressed of for example reflecting surface with the radiation of incident reflection as diffraction radiation, and the zone that is not addressed with the radiation reflection of incident as not by the radiation of diffraction.Through using suitable spatial filter, can from reflecting bundle, filter out not by the radiation of diffraction, only stay diffraction radiation and arrive substrate.Like this, said bundle is patterned according to the addressing pattern of matrix-addressable surface.Should be appreciated that alternatively wave filter can filter out diffraction radiation, do not stay and arrived substrate by the radiation of diffraction.The array of the optical MEMS device of diffraction also can use in a corresponding way.The optical MEMS device of diffraction can comprise a plurality of zones of reflections, and said a plurality of zones of reflections can relative to each other be out of shape, to form the grating of reflection incident radiation as diffraction radiation.The additional embodiments of array of programmable mirrors adopts the matrix arrangements of tiny mirror, and each tiny mirror can be through applying suitable internal field or tilting independently through adopting piezoelectric actuated device to center on axis.Degree of tilt has defined the state of each catoptron.When element was zero defect, catoptron can be controlled through the control signal that is fit to of coming self-controller.Each flawless element is controllable, adopting any in a series of states, so that be adjusted at the intensity of its corresponding pixel in the radiation pattern of projection.Moreover catoptron is a matrix-addressable, makes the catoptron that is addressed reflect the radiation beam of incident along the direction different with the catoptron that is not addressed; Like this, reflecting bundle can carry out patterning according to the addressing pattern of matrix-addressable catoptron.Can use suitable electronics mode to carry out needed matrix addressing.So the more information of the relevant reflection mirror array of place citation can reference example such as United States Patent(USP) Nos. US 5; 296,891 with US 5,523; 193 and open Nos.WO 98/38597 of PCT patented claim and WO98/33096, through being incorporated herein with reference to full content with them.
The Programmable LCD array.The example of such structure is provided, through with reference to its full content is incorporated herein in United States Patent(USP) No. US 5,229,872.
Lithographic equipment can comprise one or more pattern apparatus for converting, for example one or more contrast device.For example, it can have the array of a plurality of independent controlled members, and each is controlled independently of one another.In such layout, some in the independent controlled member array or all can have public irradiation system (or part of irradiation system), be used for common support structure and/or at least one of public optical projection system (or part of optical projection system) of the array of independent controlled member.
Be to be understood that; When offset features, optical proximity correction features, phase change technology and/or multiple-exposure technology are used in advance, for example can be different from layer finally transferring to substrate or the pattern on the substrate basically at " demonstration " pattern on the array of independent controlled member.Similarly, finally possibly not correspond to the pattern that forms in a flash in office on the array at independent controlled member at the pattern that produces on the substrate.This can be especially such to following layout: in said layout; Be formed on final pattern on each part of substrate on the given time cycle or giving in the exposure of determined number and building, in the given time cycle or change for pattern and/or the relative position of substrate on the array of independent controlled member between the exposure period of determined number.
Optical projection system and/or irradiation system can comprise various types of opticses, and the for example optics of refraction type, reflective, magnetic, electromagnetic type, electrostatic or other type, or their combination in any is with guiding, be shaped or the control radiation beam.
Said lithographic equipment can be the type with two (for example two platforms) or more substrate tables (and/or two or more pattern apparatus for converting platform).In this " many " machine, can use additional platform concurrently, or can on one or more platform, carry out in the preliminary step, be used for exposure with one or more other.
Lithographic equipment can also be that " immersion liquid " (for example water) that at least a portion substrate can be had relative high index of refraction covers so that fill the type in the space between optical projection system and the substrate.Immersion liquid can also be applied to other space in the lithographic equipment, for example between pattern apparatus for converting and optical projection system.Immersion technique is used to increase the numerical aperture of optical projection system.As employed herein term " submergence " and not meaning that such as structures such as substrates must be immersed in the liquid, but means at exposure period interstitial fluid body and be positioned between optical projection system and the substrate.
In addition, equipment can be provided with fluid processing unit, with the interaction between the illuminated portion that allows fluid and substrate (for example optionally chemicals is connected to substrate or optionally revises the surface structure of substrate).
In one embodiment, substrate has the circular shape, has alternatively along the recess of the part of its circumference and/or the edge of planarization.In one embodiment, substrate has polygonal shape, for example rectangular shape.The embodiment that substrate has the circular shape comprises such embodiment: wherein the diameter of substrate is 25mm at least, for example 50mm, 75mm, 100mm at least at least at least; At least 125mm, 150mm, 175mm at least at least; At least 200mm, 250mm at least, or 300mm at least.In one embodiment, the diameter of substrate is 500mm at the most, 400mm at the most, 350mm at the most, 300mm at the most, 250mm at the most, 200mm at the most, 150mm at the most, 100mm at the most, or 75mm at the most.Substrate is at least 1 side that the embodiment of polygon (for example rectangle) comprises substrate, and for example at least 2 sides or at least 3 sides have 5cm at least, for example 25cm at least; At least 50cm, 100cm, 150cm at least at least; At least 200cm, or the embodiment of the length of 250cm at least.In one embodiment, the length that at least 1 side of substrate has is 1000cm at the most, 750cm at the most for example, 500cm at the most, 350cm at the most, 250cm at the most, 150cm at the most, or 75cm at the most.In one embodiment, substrate is that to have length be the rectangular substrate of about 250-300cm for about 250-350cm and width.The thickness of substrate can change, and can depend on for example backing material and/or substrate dimension to a certain extent.In one embodiment, thickness is at least 50 μ m, at least 100 μ m for example, at least 200 μ m, at least 300 μ m, at least 400 μ m, at least 500 μ m, or at least 600 μ m.In one embodiment, the thickness of substrate is 5000 μ m at the most, 3500 μ m at the most for example, 2500 μ m at the most, 1750 μ m at the most, 1250 μ m at the most, 1000 μ m at the most, 800 μ m at the most, 600 μ m at the most, 500 μ m at the most, 400 μ m at the most, or 300 μ m at the most.Here the substrate of indication can be handled before or after exposure, for example in track (a kind of typically resist layer is coated onto on the substrate and the instrument that the resist that has made public is developed).Can measure the character of substrate before exposure or after the exposure, for example in the measuring tool and/or the instruments of inspection.
In one embodiment, resist layer is arranged on the substrate.In one embodiment, substrate is a wafer, for example semiconductor wafer.In one embodiment, wafer material is from by Si, SiGe, and SiGeC, SiC, Ge, GaAs selects in the group that InP and InAs constitute.In one embodiment, wafer is an III/V compound semiconductor wafer.In one embodiment, wafer is a silicon wafer.In one embodiment, substrate is a ceramic substrate.In one embodiment, substrate is a glass substrate.Glass substrate possibly be useful, for example in making flat-panel monitor and panel of LCD.In one embodiment, substrate is a plastic.In one embodiment, substrate is transparent (for people's naked eyes).In one embodiment, substrate has color.In one embodiment, substrate does not have color.
Though pattern apparatus for converting 104 as describe and/or be shown as on substrate 114 in one embodiment at preceding text, it can substitute or additionally be positioned at substrate 114 below.In addition, in one embodiment, pattern apparatus for converting 104 can be side by side with substrate 114, and for example pattern apparatus for converting 104 vertically extends with substrate 114, and pattern is by projection flatly.In one embodiment, at least two the relative sides of pattern apparatus for converting 104 with exposure substrate 114 are provided.For example, can on each opposite flank separately of substrate 114, have at least two pattern apparatus for converting 104 at least, with these sides of making public.In one embodiment, possibly have single pattern apparatus for converting 104, with side of projection substrate 114 with the optical devices (for example restrainting directing mirror) that are fit to and will be to the another side of substrate 114 from the graphic pattern projection of single pattern apparatus for converting 104.
Although below described certain embodiments of the present invention, it should be understood that the present invention can be to realize with above-mentioned different form.For example; The present invention can take to comprise the form of the computer program of one or more sequence of machine-readable instructions that is used to describe above-mentioned disclosed method; Perhaps take to have the form (for example, semiconductor memory, disk or CD) of data storage medium of this computer program of storing therein.
In addition; Though under the situation of certain embodiments and example, disclose the present invention; But it will be understood by those of skill in the art that the present invention exceeds specific disclosed embodiment and extends to other alternative embodiment and/or use of the present invention and its conspicuous modification and equivalent.In addition, although at length show and described many distortion of the present invention, it is to understand easily to those skilled in the art that within the scope of the invention other revised open based on this.For example, the various combinations of the special characteristic of contemplated example and aspect or sub-combination can be carried out and still fallen in the scope of the present invention.Therefore, should be appreciated that the various characteristics of disclosed embodiment and the aspect can be bonded to each other or substitute, be used to form the pattern of disclosed variation of the present invention.For example in one embodiment, the embodiment of the movably independent controlled member of Fig. 5 can with immovable array combination of independent controlled member, for example provide or have a standby system.
Therefore, although described various embodiment of the present invention at preceding text, the mode by way of example that only should be appreciated that demonstrates them, and is not restrictive.Those skilled in the relevant art should be understood that under the condition that does not deviate from the spirit and scope of the present invention, can carry out various variations in form and details to the present invention.Therefore, width of the present invention and scope should be by any restrictions in the above-described exemplary embodiment, but should only limit according to claim and their equivalent.

Claims (17)

1. lithographic equipment comprises:
The optical devices row; Be configured to bundle is projected on the target part of substrate, said optical devices row comprise radiation source and optical projection system, and said radiation source is configured to provide bundle; Said optical projection system is configured to said bundle is projected on the said target part; Wherein said optical devices are listed as on the fixed part that partly is installed in lithographic equipment, and partly are installed on the part that can rotate of said lithographic equipment, and wherein said optical devices row have focal position;
The scanning movement actuator is configured to along the direction of scanning to be listed as with sweep velocity with respect to optical devices and moves substrate; With
Focus controller; Be configured to control optical devices and be listed as focal position with respect to Reference; Wherein, Focus controller comprises focusing measurement mechanism and focus actuator, and said focusing measurement mechanism is configured to confirm the focusing quality on the Reference, and said focus actuator is configured to the focal position based on determined focusing quality adjustment optical devices row.
2. lithographic equipment according to claim 1; Wherein Reference comprises a plurality of marks; Focus on the imageing sensor that measurement mechanism comprises the image that is arranged to receive a mark in a plurality of marks, wherein focus on quality and confirmed based on the image that projects on the imageing sensor.
3. lithographic equipment according to claim 2 wherein focuses on measurement mechanism and comprises beam splitter and quarter wave plate, is arranged to the image from the Reference reflection is directed to imageing sensor.
4. according to each described lithographic equipment among the claim 1-3, wherein focus on measurement mechanism and be integrated in the optical devices row.
5. according to each described lithographic equipment among the claim 1-4, wherein said optical devices row comprise movably concentrating element, and wherein focus actuator is connected to said concentrating element with the said focal position of mobile adjustment through said concentrating element.
6. according to each described lithographic equipment among the claim 1-5, wherein said focus actuator is arranged to adjust the distance between optical devices row and the Reference.
7. according to each described lithographic equipment among the claim 1-6, comprise a plurality of optical devices row, each optical devices row comprises one or more controllable concentrating element, optical projection system and focus controller.
8. according to each described lithographic equipment among the claim 1-7, wherein said focus controller is arranged to make focal position to adapt to the public picture plane of lithographic equipment.
9. lithographic equipment according to claim 8 comprises being used for confirming the said public sensor as the difference between the projection surface of plane and the substrate that graphic pattern projection belongs on it.
10. according to each described lithographic equipment among the claim 1-9, wherein Reference is a substrate.
11. according to each described lithographic equipment among the claim 1-10, wherein Reference is the reference plate that is installed on the substrate supports device that is used for support substrates.
12. according to each described lithographic equipment among the claim 1-11, wherein, said radiation source is a self-emission formula contrast device.
13. lithographic equipment according to claim 12, wherein said self-emission formula contrast device is a diode.
14. one kind is used in the lithographic equipment of claim 1, generating the method as the plane in positive burnt position, said method comprises step:
The focusing quality of the optical devices row on the witness mark object;
Based on focal position is adjusted in the measurement of optical devices row; With
Be directed to multiple said measurement of one or more other optical devices column weight and set-up procedure.
15. method according to claim 14 wherein is directed to all optical assemblies row that the part correlations that can rotate with lithographic equipment a plurality of join and carries out said method.
16. generate method of patterning on the substrate that a kind is used in the lithographic equipment of claim 1, said method comprises step:
Before a plurality of bundles being projected on a plurality of targets part, be directed to each optical devices and be listed as with respect to Reference and form the public plane that looks like in focal position; With
Position with substrate during projection process is adjusted to public picture plane in the position that pattern generates a plurality of target parts at place.
17. method according to claim 16 also comprises step: the true altitude and/or the level of incline of the target part during the target that the focal position of optical devices row or one group of optical devices row is adjusted to measured substrate is partly organized.
CN201180010292.1A 2010-02-23 2011-02-18 Lithographic apparatus and device manufacturing method Expired - Fee Related CN102763041B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US30740410P 2010-02-23 2010-02-23
US61/307,404 2010-02-23
US32318210P 2010-04-12 2010-04-12
US61/323,182 2010-04-12
PCT/EP2011/052406 WO2011104178A1 (en) 2010-02-23 2011-02-18 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
CN102763041A true CN102763041A (en) 2012-10-31
CN102763041B CN102763041B (en) 2014-10-22

Family

ID=44259769

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180010292.1A Expired - Fee Related CN102763041B (en) 2010-02-23 2011-02-18 Lithographic apparatus and device manufacturing method

Country Status (6)

Country Link
JP (1) JP5603957B2 (en)
KR (1) KR101457460B1 (en)
CN (1) CN102763041B (en)
NL (1) NL2006254A (en)
TW (1) TWI414904B (en)
WO (1) WO2011104178A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104406526B (en) * 2014-11-13 2017-02-15 浙江大学 Pulse micro displacement sensor and displacement measuring method thereof
CN113165375A (en) * 2019-03-11 2021-07-23 登士柏希罗纳有限公司 Stereolithography apparatus with detection unit for optical adjustment and image modification

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5580434B2 (en) * 2010-02-23 2014-08-27 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and device manufacturing method
CN103238113B (en) 2010-12-08 2015-09-09 Asml荷兰有限公司 Lithographic equipment and device making method
CN102331687B (en) * 2011-10-21 2013-07-17 苏州大学 Step optical processing system and processing method
US9606442B2 (en) 2012-07-30 2017-03-28 Asml Netherlands B.V. Position measuring apparatus, position measuring method, lithographic apparatus and device manufacturing method
KR102135316B1 (en) 2015-12-30 2020-09-17 에이에스엠엘 네델란즈 비.브이. Method and apparatus for direct write maskless lithography
WO2017114658A1 (en) 2015-12-30 2017-07-06 Asml Netherlands B.V. Method and apparatus for direct write maskless lithography
US10928736B2 (en) 2015-12-30 2021-02-23 Asml Netherlands B.V. Method and apparatus for direct write maskless lithography
JP6655753B2 (en) * 2016-07-13 2020-02-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Micro LED array as illumination source
US10908507B2 (en) 2016-07-13 2021-02-02 Applied Materials, Inc. Micro LED array illumination source
JP2019079030A (en) * 2017-10-24 2019-05-23 キヤノン株式会社 Exposure equipment and manufacturing method for article
JP2019079029A (en) * 2017-10-24 2019-05-23 キヤノン株式会社 Exposure equipment and manufacturing method for article
WO2019082726A1 (en) * 2017-10-24 2019-05-02 キヤノン株式会社 Exposure device, and method for manufacturing article
US11469108B2 (en) 2018-08-31 2022-10-11 Taiwan Semiconductor Manufacturing Company, Ltd. System, semiconductor device and method
CN112505713B (en) * 2020-11-27 2024-08-23 Oppo（重庆）智能科技有限公司 Distance measuring device and method, computer readable medium and electronic device
WO2024010520A1 (en) * 2022-07-08 2024-01-11 Agency For Science, Technology And Research Optical system, method of forming the same, method of direct laser writing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003115437A (en) * 2001-10-03 2003-04-18 Canon Inc Aligner and exposure method
US20030091277A1 (en) * 2001-11-15 2003-05-15 Wenhui Mei Flattened laser scanning system
JP3550037B2 (en) * 1999-01-21 2004-08-04 シャープ株式会社 Exposure apparatus and liquid crystal display manufacturing method
EP1653280A1 (en) * 2003-08-06 2006-05-03 Sharp Kabushiki Kaisha Pattern exposing system and pattern exposing method
US20090280441A1 (en) * 2007-01-25 2009-11-12 Nikon Corporation Exposure method, exposure device, and micro device manufacturing method
JP2010014796A (en) * 2008-07-01 2010-01-21 Nsk Ltd Maskless exposure apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2690498B2 (en) * 1988-04-14 1997-12-10 大日本印刷株式会社 Pattern generator
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
JP2938568B2 (en) 1990-05-02 1999-08-23 フラウンホファー・ゲゼルシャフト・ツール・フォルデルング・デル・アンゲバンテン・フォルシュング・アインゲトラーゲネル・フェライン Lighting equipment
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
KR100459813B1 (en) 1997-01-29 2004-12-04 마이크로닉 레이저 시스템즈 에이비 Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate
SE509062C2 (en) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Data conversion method for a multi-beam laser printer for very complex microcolytographic designs
US7081947B2 (en) * 2004-02-27 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006234959A (en) * 2005-02-22 2006-09-07 Fuji Photo Film Co Ltd Exposure method and exposure apparatus
US20080316458A1 (en) * 2005-03-28 2008-12-25 Fujifilm Corporation Light Quantity Adjustment Method, Image Recording Method, and Device
JP4885029B2 (en) * 2007-03-28 2012-02-29 株式会社オーク製作所 Exposure drawing device
JP2010014797A (en) * 2008-07-01 2010-01-21 Nsk Ltd Maskless exposure apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3550037B2 (en) * 1999-01-21 2004-08-04 シャープ株式会社 Exposure apparatus and liquid crystal display manufacturing method
JP2003115437A (en) * 2001-10-03 2003-04-18 Canon Inc Aligner and exposure method
US20030091277A1 (en) * 2001-11-15 2003-05-15 Wenhui Mei Flattened laser scanning system
EP1653280A1 (en) * 2003-08-06 2006-05-03 Sharp Kabushiki Kaisha Pattern exposing system and pattern exposing method
US20090280441A1 (en) * 2007-01-25 2009-11-12 Nikon Corporation Exposure method, exposure device, and micro device manufacturing method
JP2010014796A (en) * 2008-07-01 2010-01-21 Nsk Ltd Maskless exposure apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104406526B (en) * 2014-11-13 2017-02-15 浙江大学 Pulse micro displacement sensor and displacement measuring method thereof
CN113165375A (en) * 2019-03-11 2021-07-23 登士柏希罗纳有限公司 Stereolithography apparatus with detection unit for optical adjustment and image modification
CN113165375B (en) * 2019-03-11 2024-05-17 登士柏希罗纳有限公司 Stereolithography apparatus with detection unit for optical adjustment and image modification

Also Published As

Publication number Publication date
JP2013520819A (en) 2013-06-06
JP5603957B2 (en) 2014-10-08
TWI414904B (en) 2013-11-11
NL2006254A (en) 2011-08-24
CN102763041B (en) 2014-10-22
KR101457460B1 (en) 2014-11-03
TW201214055A (en) 2012-04-01
WO2011104178A1 (en) 2011-09-01
KR20120108048A (en) 2012-10-04

Similar Documents

Publication Publication Date Title
CN102763041B (en) Lithographic apparatus and device manufacturing method
CN102203674B (en) Lithographic equipment, programmable patterning device and photoetching method
CN102834777B (en) Lithographic equipment and device making method
CN102822749B (en) Lithographic equipment and device making method
CN102770811B (en) Lithographic apparatus and device manufacturing method
JP5738981B2 (en) Substrate handling apparatus, lithographic apparatus, tool, and device manufacturing method
CN102893217B (en) Lithographic equipment and device making method
CN102770810B (en) Lithographic equipment and device making method
US20120307223A1 (en) Lithographic apparatus and device manufacturing method
JP5438848B2 (en) Lithographic apparatus and device manufacturing method
CN102782581B (en) Lithographic apparatus and device manufacturing method
CN102844713B (en) Lithographic equipment and device making method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141022

Termination date: 20180218