[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN102762028A - 焊盘 - Google Patents

焊盘 Download PDF

Info

Publication number
CN102762028A
CN102762028A CN2011101067838A CN201110106783A CN102762028A CN 102762028 A CN102762028 A CN 102762028A CN 2011101067838 A CN2011101067838 A CN 2011101067838A CN 201110106783 A CN201110106783 A CN 201110106783A CN 102762028 A CN102762028 A CN 102762028A
Authority
CN
China
Prior art keywords
pad
piece
signal
inclined plane
splicing block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101067838A
Other languages
English (en)
Inventor
周华丽
白家南
许寿国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011101067838A priority Critical patent/CN102762028A/zh
Priority to TW100115058A priority patent/TW201244574A/zh
Priority to US13/217,626 priority patent/US8633401B2/en
Publication of CN102762028A publication Critical patent/CN102762028A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种焊盘，包括一第一拼块及一第二拼块，所述第一拼块包括一第一水平面及一第一倾斜面，所述第二拼块包括一第二水平面及一第二倾斜面，所述第一倾斜面与第二倾斜面相接触，其中所述第一拼块由铜箔组成且与一导线相连，所述第二拼块由绝缘材料组成。上述焊盘可有效改善信号传输过程中的反射问题，使阻抗匹配更好。

Description

焊盘
技术领域
本发明涉及一种焊盘。
背景技术
焊盘（Pad）是印刷电路板用来焊接电子元件的连接媒介，它将电子元件与电路按照设计要求接合在一起，从而使电路功能得以实现。请参考图1，其为现有的设置于电路板上的焊盘1的结构。当焊盘1上贴合一电子元件时，该电子元件的信号将通过其引脚及焊盘1传输至与焊盘1相连的导线2，从而传输至其他电子元件处。在传输过程中，根据反射原理可知，电子元件的信号将会发生反射，其中图1中箭头A为入射信号的方向，箭头B为反射信号的方向，箭头C为传输信号的方向。显然，入射信号的方向与反射信号的方向位于同一直线上，且方向相反，将使得信号产生较强的反射，进而影响到信号传输的质量。请参考图2，其为对图1中焊盘1进行仿真而得到的阻抗示意图，它反映了信号的反射情况，其中所述焊盘1的半径为7mil。
发明内容
鉴于以上内容，有必要提供一种能提高信号传输质量的焊盘。
一种焊盘，包括一第一拼块及一第二拼块，所述第一拼块包括一第一水平面及一第一倾斜面，所述第二拼块包括一第二水平面及一第二倾斜面，所述第一倾斜面与第二倾斜面相接触，其中所述第一拼块由铜箔组成且与一导线相连，所述第二拼块由绝缘材料组成。
与现有焊盘相比，本发明的焊盘通过该变其结构可大大改善其自身的信号反射系数，进而改善信号通过焊盘及导线传输时的质量。
附图说明
图1是现有焊盘的示意图。
图2是对图1中焊盘进行仿真得到的示意图。
图3是本发明焊盘的第一较佳实施方式的示意图。
图4是对图3中焊盘进行仿真得到的示意图。
图5是本发明焊盘的第二较佳实施方式的示意图。
主要元件符号说明
焊盘 1、10、20
第一拼块 11、21
第二拼块 12、22
水平面 110、120
倾斜面 112、122
导线 2、15
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面结合附图及较佳实施方式对本发明作进一步详细描述：
请参考图3，本发明焊盘10的第一较佳实施方式包括一第一拼块11及一第二拼块12。
所述第一拼块11包括一水平面110及一倾斜面112，所述水平面110呈圆形，所述倾斜面112呈椭圆形。所述第二拼块12的结构与第一拼块11相同，包括一水平面120及一倾斜面122。其中所述第一拼块11的倾斜面112由铜箔组成，水平面110上镀有锡和阻焊剂，其与现有焊盘的材料相同；所述第二拼块12由绝缘材料（如FR4）制成。
所述第一拼块11的倾斜面112及第二拼块12的倾斜面122相接触，且所述第一拼块11的水平面110及第二拼块12的水平面120相互平行，以组成一圆柱体。
该第一拼块11的铜箔还与一导线15相连，以将焊盘上10的信号通过导线15传输至其他电子元件等处。
当一电子元件通过表面贴装技术（SMT）贴合于焊盘10处时，来自电子元件引脚的信号在第一拼块11的倾斜面112处被反射。根据反射原理，如图3中箭头所示，该信号的反射方向将不再与信号的入射方向处于同一直线上。其中图3中箭头D表示信号的入射方向，箭头E表示信号的反射方向，箭头F表示信号的传输方向。相对于图1中信号的反射方向与入射方向相差180度而言，图2中信号的反射方向不再与入射方向处于同一直线上，改善了焊盘10的反射系数，从而解决了由于焊盘与导线的阻抗不匹配所带来的信号完整性问题。
请继续参考图4，其为对图3中焊盘10进行仿真而得到的示意图，其中所述焊盘10的半径为7mil。将图2与图4进行比较可以看出，焊盘10与导线15的阻抗匹配要明显优于焊盘1与导线2的阻抗匹配。其中图2及图4中直线段可视为导线2或15的阻抗，V字形部分即可视为焊盘1或10的阻抗。
请继续参考图5，同第一较佳实施方式相同，本发明焊盘20的第二较佳实施方式包括一第一拼块21及一第二拼块22，其中该第二较佳实施方式与第一较佳实施方式的区别在于第二实施方式中所述第一拼块21的水平面与倾斜面之间的夹角为45度，如此即可使得信号反射方向与信号传输方向相同，其中图5中箭头X表示信号入射的方向，箭头Y表示信号反射的方向，箭头Z表示信号传输的方向。此时，相对于图1中信号的反射方向与入射方向相差180度以及图2中信号的反射方向不与入射方向处于同一直线上而言，第二实施方式中信号反射方向与信号传输方向一致可极大的改善焊盘10的反射系数，从而更佳的解决了由于焊盘与导线的阻抗不匹配所带来的信号完整性问题。
上述焊盘10、20通过该变其结构可大大改善其自身的信号反射系数，进而改善信号通过焊盘10、20及导线15传输时的质量。

Claims (3)

1.一种焊盘，包括一第一拼块及一第二拼块，所述第一拼块包括一第一水平面及一第一倾斜面，所述第二拼块包括一第二水平面及一第二倾斜面，所述第一倾斜面与第二倾斜面相接触，其中所述第一拼块由铜箔组成且与一导线相连，所述第二拼块由绝缘材料组成。
2.如权利要求1所述的焊盘，其特征在于：所述第一水平面与第一倾斜面之间的夹角为45度，所述第一水平面与第二水平面相互平行。
3.如权利要求1所述的焊盘，其特征在于：所述第一拼块与第二拼块组成一圆柱体。
CN2011101067838A 2011-04-27 2011-04-27 焊盘 Pending CN102762028A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011101067838A CN102762028A (zh) 2011-04-27 2011-04-27 焊盘
TW100115058A TW201244574A (en) 2011-04-27 2011-04-29 Pad
US13/217,626 US8633401B2 (en) 2011-04-27 2011-08-25 Soldering pad

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011101067838A CN102762028A (zh) 2011-04-27 2011-04-27 焊盘

Publications (1)

Publication Number Publication Date
CN102762028A true CN102762028A (zh) 2012-10-31

Family

ID=47056312

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101067838A Pending CN102762028A (zh) 2011-04-27 2011-04-27 焊盘

Country Status (3)

Country Link
US (1) US8633401B2 (zh)
CN (1) CN102762028A (zh)
TW (1) TW201244574A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030067755A1 (en) * 2000-03-31 2003-04-10 Alfred Haimerl Electronic component with flexible contacting pads and method for producing the electronic component
US20040164400A1 (en) * 2003-02-24 2004-08-26 Georg Meyer-Berg Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
US20040248341A1 (en) * 2003-05-07 2004-12-09 Octavio Trovarelli Connection between a semiconductor chip and an external conductor structure and method for producing it
TW200950042A (en) * 2008-05-16 2009-12-01 Siliconware Precision Industries Co Ltd Packaging substrate having landless conductive traces disposed thereon

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100541394B1 (ko) * 2003-08-23 2006-01-10 삼성전자주식회사 비한정형 볼 그리드 어레이 패키지용 배선기판 및 그의제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030067755A1 (en) * 2000-03-31 2003-04-10 Alfred Haimerl Electronic component with flexible contacting pads and method for producing the electronic component
US20040164400A1 (en) * 2003-02-24 2004-08-26 Georg Meyer-Berg Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
US20040248341A1 (en) * 2003-05-07 2004-12-09 Octavio Trovarelli Connection between a semiconductor chip and an external conductor structure and method for producing it
TW200950042A (en) * 2008-05-16 2009-12-01 Siliconware Precision Industries Co Ltd Packaging substrate having landless conductive traces disposed thereon

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板

Also Published As

Publication number Publication date
US20120273254A1 (en) 2012-11-01
US8633401B2 (en) 2014-01-21
TW201244574A (en) 2012-11-01

Similar Documents

Publication Publication Date Title
US9203171B2 (en) Cable connector assembly having simple wiring arrangement between two end connectors
JP2017103223A (ja) リジッド−フレックス回路コネクタ
US10062993B1 (en) Flexible cable for pluggable modules
US9907187B1 (en) PCB with two rows of solder pads including both SMT-based and DIP-based structures
CN101945538A (zh) 柔性电路板、柔性电路板与印刷电路板连接机构及方法
CN103052258B (zh) 印刷电路板及其制造方法
CN201234406Y (zh) 一种软性印刷线路板
US8633394B2 (en) Flexible printed circuit board
CN112242618A (zh) 电连接器
CN102762028A (zh) 焊盘
CN205902199U (zh) Fpc金手指结构
CN202695715U (zh) 表面粘着型天线
US9953206B2 (en) Fingerprint sensor package and fabricating method thereof
US20090071702A1 (en) Circuit board
CN113179579A (zh) 电路板和电子设备
JP2009141170A (ja) 基板のパッド構造
JP2013065657A (ja) プリント配線基板およびプリント配線基板の配線方法
JP4358269B2 (ja) 電子部品モジュール
CN205454216U (zh) 一种光模块的印刷电路板
US8124884B2 (en) Printed circuit board
TWI583960B (zh) Probe module with feedback test function (3)
US9318851B2 (en) Connector and manufacturing method thereof
CN106900136B (zh) 一种光模块的印刷电路板
TWI853982B (zh) 電連接器
CN202488884U (zh) 板线拼装式信号输出装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121031