CN102748605A - Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method - Google Patents
Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method Download PDFInfo
- Publication number
- CN102748605A CN102748605A CN2012101740714A CN201210174071A CN102748605A CN 102748605 A CN102748605 A CN 102748605A CN 2012101740714 A CN2012101740714 A CN 2012101740714A CN 201210174071 A CN201210174071 A CN 201210174071A CN 102748605 A CN102748605 A CN 102748605A
- Authority
- CN
- China
- Prior art keywords
- light fixture
- led
- heat radiation
- led chip
- dimensional heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to an LED lamp module capable of directly packaging an LED chip on a radiating supporting carrier circuit. The LED lamp module comprises a solid radiating supporting lamp carrier circuit and the LED chip, wherein the solid radiating supporting lamp carrier circuit comprises a solid radiating supporting lamp carrier and a circuit which is integrated with the solid radiating supporting lamp carrier, and the LED chip is directly packaged on the solid radiating supporting lamp carrier circuit. The invention also relates to a method for manufacturing the LED lamp module. Compared with traditional LED modules, the LED lamp module capable of directly packaging the LED chip on the solid radiating supporting lamp carrier circuit shortens the heat transfer distance greatly, the heat transfer effect is good, surface mounting technology (SMT) welding is not required to be performed on LEDs and components, the whole manufacturing process is shortened, simultaneously, materials are saved, the manufacturing time is shortened, the production efficiency is greatly improved, and the production cost is reduced.
Description
Technical field
The invention belongs to the LED application, be specifically related to directly led chip to be encapsulated in three-dimensional heat radiation and support the LED light fixture module on the light fixture carrier circuit.
Background technology
The combination that light fixture carrier and wiring board are supported in the heat radiation of traditional solid is to take to produce earlier an aluminum-based circuit board or copper base circuit board, and perhaps ceramic base wiring board is after getting well the element welding through SMT; Stick on three-dimensional heat radiation to the wiring board back side again and support on the light fixture carrier, this kind method is added thermal resistance impedance layer by layer because heat transfer distances is far away; Cause the conduction velocity of heat low; The heat conduction is very slow, and production process is quite loaded down with trivial details, and Production Time is long.
How to reduce thermal resistance, the heat that LED is produced can distribute as soon as possible, all is a difficult problem of LED industry all the time, and along with LED uses and develops rapidly in every field, it is just more and extremely more urgent to solve this difficult problem.
Therefore, in order to overcome above defective and deficiency, need a kind of more simple and reliable technology.
Summary of the invention
The invention property ground proposes, and directly led chip is encapsulated on the sets of lines zoarium that three-dimensional heat radiation support light fixture carrier and circuit combine together with the COB technology, and LED does not relate to the surface mount welding procedure; Its manufacture craft is cheap simply again; Alternative existing loaded down with trivial details traditional manufacturing technique, efficient is high, low cost of manufacture; Can be used for the LED field, and be widely used in various LED products.
Before describing the present invention in detail, it will be appreciated by those skilled in the art that in addition term " circuit " and " circuit " can use in the application with exchanging.
The present invention relates to directly led chip to be encapsulated in three-dimensional heat radiation and support the LED light fixture module on the light fixture carrier circuit.More specifically, according to a preferred embodiment of the invention, directly support and make the LED circuit on the light fixture carrier, make three-dimensional heat radiation support the light fixture carrier and combine together with the LED circuit in the solid heat radiation; With COB (Chip On Board) technology led chip nation fixed (bonding) is supported on the light fixture carrier circuit in the solid heat radiation; Sealing is solidified; Process LED light fixture module.This kind directly is encapsulated in three-dimensional heat radiation with chip and supports LED light fixture module and traditional structure and compared with techniques on the light fixture carrier circuit; Shortened heat transfer distances greatly; Heat-transfer effect is good, and LED and components and parts thereof also mount welding without SMT, and whole manufacturing process flow shortens; Also practice thrift simultaneously material and shortened Production Time, improved production efficiency greatly; Reduced production cost.
According to the present invention; Provide a kind of and directly led chip has been encapsulated in the LED light fixture module on the three-dimensional heat radiation support light fixture carrier circuit; Comprise: the light fixture carrier circuit is supported in three-dimensional heat radiation, and said solid heat radiation is supported the light fixture carrier circuit and comprised three-dimensional heat radiation support light fixture carrier and support the circuit that the light fixture carrier becomes one with said three-dimensional heat radiation; Directly be encapsulated in said three-dimensional heat radiation and support the led chip on the light fixture carrier circuit.
According to one embodiment of present invention, to support the light fixture carrier be that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulation for said three-dimensional heat radiation.
According to one embodiment of present invention, to support the light fixture carrier be that the light fixture carrier is supported in the solid heat radiation of metal for said three-dimensional heat radiation.
According to one embodiment of present invention, the solid of said metal heat radiation support light fixture carrier is processed by aluminium, copper, aluminium alloy, copper alloy or stainless steel.
According to one embodiment of present invention, said encapsulation is the encapsulation of COB formula.
According to one embodiment of present invention, said circuit and said three-dimensional heat radiation are supported the light fixture carrier and are become one with dielectric adhesive is bonding.
According to one embodiment of present invention, said circuit comprises metallic circuit layer and the insulating barrier that is bonded together.
According to one embodiment of present invention, said LED light fixture module also comprises and is arranged in the reflective membrane that side that said led chip is installed of light fixture carrier circuit is supported in said three-dimensional heat radiation.
According to one embodiment of present invention, the direct nation of said led chip decides and is encapsulated in said three-dimensional heat radiation to support on the light fixture carrier circuit.
According to one embodiment of present invention, said LED module is used to make LED illuminating module, LED bulb lamp, LED street lamp, LED fluorescent tube, LED panel light, LED shot-light, LED Down lamp or LED sign module.
According to the present invention; A kind of method that directly led chip is encapsulated in the LED light fixture module on the three-dimensional heat radiation support light fixture carrier circuit that is used to make also is provided; Comprise: LED is provided working line, and said LED working line comprises metallic circuit layer and the insulating barrier that combines; Provide three-dimensional heat radiation to support the light fixture carrier; That simultaneously is combined in said three-dimensional heat radiation and supports on the light fixture carrier and form three-dimensional heat radiation and support the light fixture carrier circuit with the insulating barrier of said LED working line; Led chip directly is encapsulated in said three-dimensional heat radiation to be supported on the LED working line of light fixture carrier circuit.
According to one embodiment of present invention, to support the light fixture carrier be that the solid heat radiation that is made of metal is supported the light fixture carrier or supported the light fixture carrier by the nonmetal solid heat radiation of processing of insulation for said three-dimensional heat radiation.
According to one embodiment of present invention; Directly the step of packaging LED chips comprises; Earlier led chip is adhesively fixed with adhesive and supports on the light fixture carrier circuit in said three-dimensional heat radiation, led chip nation is fixed on the said LED working line again, the led chip of then nation being reserved carries out sealing to be handled.
According to one embodiment of present invention, earlier said led chip is fixed on said three-dimensional heat radiation with the direct nation of COB mode and support on the conducting wire of light fixture carrier circuit, then led chip is carried out sealing.
According to one embodiment of present invention, also be included in after the encapsulation of accomplishing led chip the step of pasting reflective membrane in that side that led chip is installed of said LED light fixture module.
In following description, with the details of setting forth one or more embodiment of the present invention to the accompanying drawing and the specific embodiment.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Fig. 1 is the sketch map of circuit matrix structure according to one preferred embodiment of the present invention, has shown that the copper-clad plate of being made up of copper layer and insulating barrier is as board substrate.
Fig. 2 is the sketch map of the line layer produced according to institute's designed circuit with circuit base material shown in Figure 1.
The sketch map of light fixture carrier circuit structure is supported in the resulting three-dimensional heat radiation that Fig. 3 directly is bonded together with dielectric adhesive for line layer shown in Figure 2 and three-dimensional heat radiation support light fixture carrier.
Fig. 4 supports the sketch map on the light fixture carrier circuit for led chip nation being fixed on three-dimensional heat radiation shown in Figure 3.
Support on the light fixture carrier circuit and the sketch map of sealing after solidifying by three-dimensional heat radiation shown in Figure 3 for led chip nation fixes on for Fig. 5.
Fig. 6 supports the sketch map of pasting one deck reflective membrane on the light fixture carrier circuit for the solid heat radiation at the LED light fixture module of making shown in Figure 5.
Fig. 7 is the decomposing schematic representation of LED light fixture module shown in Figure 6 with lampshade to be covered.
Fig. 8 is the sketch map after LED light fixture module shown in Figure 6 covers lampshade.
The specific embodiment
To directly chip be encapsulated in the practical implementation that three-dimensional heat radiation supports the LED light fixture module on the light fixture carrier circuit and be described in more detail of the present invention below.
But those skilled in the art are appreciated that obviously these embodiments have only enumerated some the preferred embodiments of the present invention, and the present invention and protection domain thereof are not had any restriction.Those of ordinary skill in the art can carry out some conspicuous variation and changes to these understanding under the situation that the present invention conceives basically, and these all belong in the scope of the present invention.Scope of the present invention is only limited claim.
The copper-clad plate of being made up of copper layer 6 and insulating barrier 2 as shown in Figure 1 is used as board substrate; And on board substrate, carry out following processed step: be cut into the needed size of making circuit → boring or the anti-etching figure of punching → wire mark circuit → curing inspection and repair the making that etchingresistant printing material, oven dry → open, short-circuit test → completion circuit 3 were examined → gone in plate → etch copper → erosion, obtain line layer structure as shown in Figure 2.Fig. 2 is the sketch map of the circuit (layer) 3 produced according to institute's designed circuit with circuit base material shown in Figure 1.Because above-mentioned making circuit belongs to traditional technology, belong to those skilled in the art and know, just no longer carefully state at this.
The one side that insulating barrier 2 is arranged of making circuit 3 is preferably sticked with glue agent be bonded together, form solid heat radiation as shown in Figure 3 and support the light fixture carrier circuit with three-dimensional heat radiation support light fixture carrier 1.
According to a preferred embodiment of the invention, it is that light fixture carrier 1 is supported in the cubic metal characters or patterns heat radiation that light fixture carrier 1 is supported in solid heat radiation shown in Figure 3.The heat radiation of this cubic metal characters or patterns is supported light fixture carrier 1 and is preferably processed by the metal of the high thermal conductivity of being convenient to dispel the heat, for example aluminium, copper, aluminium alloy, copper alloy, or the like.
Certainly; Those of ordinary skill in the art it is also understood that; It also can be that the light fixture carrier is supported in nonmetal solid heat radiation that light fixture carrier 1 is supported in the solid heat radiation of LED light fixture module of the present invention, for example is ceramic monolith, thermal conductivity good insulation performance polymer support, or the like.
Next, according to a preferred embodiment of the invention, adopt COB (Chip On Board) technology that led chip 4 nations are fixed on solid heat radiation shown in Figure 3 and support on the light fixture carrier circuit.A related exemplary specific embodiment is following:
Clean solid heat radiation shown in Figure 3 and support a light fixture carrier circuit → bonded adhesives → stickup led chip 4 and oven dry on solid heat radiation support light fixture carrier circuit; And then nation decides led chip 4 (as shown in Figure 4) → test → sealing 5 (as shown in Figure 5) → curing → test → warehouse-in, thereby obtains as shown in Figure 5 directly led chip 4 be encapsulated in three-dimensional heat radiation and support the LED light fixture module on the light fixture carrier circuit.
Wherein, Fig. 4 supports the sketch map on the light fixture carrier circuit for led chip 4 direct nations being fixed on three-dimensional heat radiation shown in Figure 3.Fig. 5 is that led chip 4 direct nations fix on the three-dimensional heat radiation support light fixture carrier circuit shown in Figure 3 and the sketch map after the sealing curing.
According to another embodiment of the present invention; Can also be after the LED light fixture module shown in Figure 5 that completes; Position according to LED lamp pearl 4 and power supply wiring; Reflective membrane 7 is left window in advance, then it is pasted on (as shown in Figure 6) on the circuit 3, Fig. 6 supports the sketch map of pasting one deck reflective membrane 7 on the light fixture carrier circuit for the solid heat radiation at the LED light fixture module of making shown in Figure 5.This reflective membrane 7 plays the effect that the luminosity in the effect of light fixture carrier circuit and the front through the reflective LED of increasing light fixture module is supported in the three-dimensional heat radiation of protection.
Then, can test and cover lampshade 8 to LED light fixture module shown in Figure 6, like Fig. 7 and shown in Figure 8.Fig. 7 is the decomposing schematic representation of LED light fixture module shown in Figure 6 with lampshade 8 to be covered.Fig. 8 is the sketch map after LED light fixture module shown in Figure 6 covers lampshade 8.
More than combine accompanying drawing and directly chip be encapsulated in the three-dimensional specific embodiment that supports the LED light fixture module on the light fixture carrier circuit that dispels the heat the present invention has been carried out detailed description.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present invention, especially the scope of claim does not have any restriction.Scope of the present invention only is defined by the claims.
Claims (10)
1. one kind directly is encapsulated in the LED light fixture module on the three-dimensional heat radiation support light fixture carrier circuit with led chip, it is characterized in that said LED light fixture module comprises:
The light fixture carrier circuit is supported in three-dimensional heat radiation, and said solid heat radiation is supported the light fixture carrier circuit and comprised three-dimensional heat radiation support light fixture carrier and support the conducting wire that the light fixture carrier becomes one with said three-dimensional heat radiation; With
Directly be encapsulated in said three-dimensional heat radiation and support the led chip on the light fixture carrier circuit.
2. LED light fixture module according to claim 1 is characterized in that: it is that the light fixture carrier is supported in the nonmetallic three-dimensional heat radiation of insulating that the light fixture carrier is supported in said three-dimensional heat radiation.
3. LED light fixture module according to claim 1 is characterized in that: the solid heat radiation support light fixture carrier that the light fixture carrier is a metal is supported in said three-dimensional heat radiation.
4. LED light fixture module according to claim 1 is characterized in that: said encapsulation is the encapsulation of COB formula, and wherein, the direct nation of said led chip decides and be encapsulated in said three-dimensional heat radiation to support on the conducting wire of light fixture carrier circuit.
5. LED light fixture module according to claim 1 is characterized in that: said circuit comprises metallic circuit layer and the insulating barrier that is bonded together.
6. one kind is used to make the method that directly led chip is encapsulated in the LED light fixture module on the three-dimensional heat radiation support light fixture carrier circuit, comprising:
LED is provided working line, and said LED working line comprises metallic circuit layer and the insulating barrier that combines;
Provide three-dimensional heat radiation to support the light fixture carrier;
That simultaneously is combined in said three-dimensional heat radiation and supports on the light fixture carrier and form three-dimensional heat radiation and support the light fixture carrier circuit with the insulating barrier of said LED working line;
Led chip directly is encapsulated in said three-dimensional heat radiation to be supported on the LED working line of light fixture carrier circuit.
7. method according to claim 6 is characterized in that: it is that the solid heat radiation that is made of metal is supported the light fixture carrier or supported the light fixture carrier by the nonmetal solid heat radiation of processing of insulation that the light fixture carrier is supported in said three-dimensional heat radiation.
8. method according to claim 6; It is characterized in that: directly the step of packaging LED chips comprises; Earlier led chip is adhesively fixed with adhesive and supports on the light fixture carrier circuit in said three-dimensional heat radiation; Led chip nation is fixed on the said LED working line, the led chip of then nation being reserved carries out sealing to be handled again.
9. method according to claim 6 is characterized in that: earlier said led chip is fixed on said three-dimensional heat radiation with the direct nation of COB mode and support on the conducting wire of light fixture carrier circuit, then led chip is carried out sealing.
10. according to each described method among the claim 6-9, it is characterized in that: also be included in after the encapsulation of accomplishing led chip the step of pasting reflective membrane in that side that led chip is installed of said LED light fixture module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101740714A CN102748605A (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101740714A CN102748605A (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102748605A true CN102748605A (en) | 2012-10-24 |
Family
ID=47029003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101740714A Pending CN102748605A (en) | 2012-05-21 | 2012-05-21 | Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102748605A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102997099A (en) * | 2012-11-26 | 2013-03-27 | 宁波龙宇光电科技有限公司 | LED (Light-Emitting Diode) light source and lamp thereof |
| CN103702545A (en) * | 2013-12-09 | 2014-04-02 | 中国航天科技集团公司第九研究院第七七一研究所 | Preparation method of embedded printed structural parts |
| CN105805571A (en) * | 2016-03-30 | 2016-07-27 | 东莞市闻誉实业有限公司 | Surrounding type illumination lamp |
| CN105822908A (en) * | 2016-03-30 | 2016-08-03 | 东莞市闻誉实业有限公司 | Lighting lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334153A (en) * | 2008-07-28 | 2008-12-31 | 浙江大学 | Self radiation type luminous diode lamp fluorescent lamp |
| CN201242129Y (en) * | 2008-08-11 | 2009-05-20 | 陈鸿文 | High power LED lamp |
| CN101839414A (en) * | 2010-01-12 | 2010-09-22 | 浙江迈勒斯照明有限公司 | LED light source with heat dissipation device and processing method thereof |
| CN201903030U (en) * | 2010-11-22 | 2011-07-20 | 西安博昱新能源有限公司 | Radiating structure used for high power LED (light emitting diode) lamp |
-
2012
- 2012-05-21 CN CN2012101740714A patent/CN102748605A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334153A (en) * | 2008-07-28 | 2008-12-31 | 浙江大学 | Self radiation type luminous diode lamp fluorescent lamp |
| CN201242129Y (en) * | 2008-08-11 | 2009-05-20 | 陈鸿文 | High power LED lamp |
| CN101839414A (en) * | 2010-01-12 | 2010-09-22 | 浙江迈勒斯照明有限公司 | LED light source with heat dissipation device and processing method thereof |
| CN201903030U (en) * | 2010-11-22 | 2011-07-20 | 西安博昱新能源有限公司 | Radiating structure used for high power LED (light emitting diode) lamp |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102997099A (en) * | 2012-11-26 | 2013-03-27 | 宁波龙宇光电科技有限公司 | LED (Light-Emitting Diode) light source and lamp thereof |
| CN103702545A (en) * | 2013-12-09 | 2014-04-02 | 中国航天科技集团公司第九研究院第七七一研究所 | Preparation method of embedded printed structural parts |
| CN103702545B (en) * | 2013-12-09 | 2016-03-02 | 中国航天科技集团公司第九研究院第七七一研究所 | A kind of inserted type prints the preparation method of structural member |
| CN105805571A (en) * | 2016-03-30 | 2016-07-27 | 东莞市闻誉实业有限公司 | Surrounding type illumination lamp |
| CN105822908A (en) * | 2016-03-30 | 2016-08-03 | 东莞市闻誉实业有限公司 | Lighting lamp |
| CN105822908B (en) * | 2016-03-30 | 2019-01-22 | 东莞市闻誉实业有限公司 | Illuminator |
| CN105805571B (en) * | 2016-03-30 | 2019-04-02 | 东莞市闻誉实业有限公司 | Circulating type illuminator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102889480A (en) | Three-dimensional luminous light emitting diode (LED) lamp bulb module and manufacturing method thereof | |
| CN102709281A (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| CN202884521U (en) | Light-emitting diode (LED) module with high thermal conductivity structure | |
| CN102927483A (en) | Integrated flip type LED illuminating assembly | |
| CN102748605A (en) | Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method | |
| CN202652681U (en) | LED three-dimensional circuit board | |
| CN102162583A (en) | LED lamp manufacturing method | |
| CN202259395U (en) | LED light source | |
| CN202927518U (en) | Three-dimensional luminous light-emitting diode (LED) bulb module | |
| CN102723324A (en) | Double-face light emitting planar wafer type LED (Light-Emitting Diode) packaging structure | |
| CN202927508U (en) | Light-emitting diode (LED) lamp module with circuit directly manufactured on three-dimensional heat dissipating support lamp carrier | |
| CN201655852U (en) | LED backlight light bar encapsulated by adopting surface mount technology | |
| CN103296184A (en) | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support | |
| CN202712175U (en) | Fluorescent film planar sheet type LED array light source | |
| CN202927509U (en) | Light-emitting diode (LED) lamp module with LED chip arranged on heat dissipating carrier circuit directly in packaging mode | |
| CN203068175U (en) | Integrated light-emitting diode (LED) lighting component | |
| CN202796951U (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| CN202927510U (en) | Light-emitting diode (LED) lamp module with LED chip reversely arranged on conducting resin circuit directly | |
| CN102734665A (en) | LED (Light Emitting Diode) lamp module and manufacturing method thereof | |
| CN202647291U (en) | LED (Light-Emitting Diode) module for directly and reversely arranging reversely-arranged LED chip on mixed line | |
| CN202647294U (en) | Led lamp module | |
| CN202712177U (en) | Two-sided light emitting plane sheet type LED package structure | |
| CN201897096U (en) | Heat radiating structure of LED (light-emitting diode) lamp | |
| CN106898684A (en) | A kind of multi-chip and UVLED array supports of connecting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121024 |