CN102744931B - Pre-coated aluminium plate for electric device - Google Patents

Abstract

The present invention relates to a pre-coated aluminium plate for an electric device, which is excellent in conductivity, lubricity, anti-fingerprint capability, and scratch resistance even for packaging materials. On an original material plate (11) there is provided a composite skin film containing an inorganic component and an organic component, and the pre-coated aluminium plate (10) for the electric device is pressed on the composite skin film (12) with a resistor value below 1 ohm between a predetermined ball-shaped terminal and an aluminium original material plate (11), wherein the surface roughness Ra of the aluminium original material plate (11) is 0.3-0.5 microns, the composite skin film (12) contains a Zr component and a silicone component as the inorganic components, and comprises at least one of a polyurethane resin and a acrylic resin, the conversion adhesion amount of the Zr component is 5-500 mg/m2, the conversion adhesion amount of the silicone component is 2-600 mg/m2, the adhesion amount of the organic resin component is 5-650 mg/m2, and the total adhesion amount of ZrO2 of the Zr component is 70-700 mg/m2.

Description

Electronic equipment precoated aluminum plate

Technical field

The present invention relates to by shaping as the precoated aluminum plate that the casing of electronic equipment or structure component etc. use.

Background technology

Aluminium sheet (comprising aluminium alloy plate) possesses high intensity and formability, simultaneously can significantly lightweight compared with steel plate, therefore, going for container, paper tinsel, electric product, automotive items by implementing various shaping, also having the various uses such as building materials.

The formed products of aluminium sheet, according to use and environment, carries out surface treatment to improve for the purpose of outward appearance and corrosion resistance etc.At this, as carrying out surface-treated method, from the viewpoint such as simplicity, cost reduction of a large amount of productivity ratio, manufacturing process, preferably utilizing and the pre-coating method that surface treatment forms the precoated aluminum plate of epithelium is carried out in advance to stamping front aluminium sheet.

In addition, in recent years, described precoated aluminum plate is adapt to the variation of goods and machine and advanced, the functional precoated aluminum plate being endowed following various function is developed, and extensively popularize, such as, anti-finger printing, resistance to marring, electric conductivity (ground connection property), thermal diffusivity, thermal insulation, antibiotic property, rust-preventing characteristic, hydrophily, drainage, lubricity etc.As electronic equipment precoated aluminum plate wherein, the precoated aluminum plate having electric conductivity, anti-finger printing, resistance to marring and lubricity concurrently is adopted the most widely.Further, herein so-called resistance to marring refer to during punch process due to resistance to marring that the scar produced with mould friction is object.

The surface treatment aluminum sheet of following anti-finger printing and resistance to marring excellence is proposed in patent document 1, wherein, the resin that precoating comprises lubricant on aluminium sheet forms resin involucra, does not so make the fingerprint being attached to surface, or eye-catching at the fine scar of Surface Creation.

According to patent document 1, although improve anti-finger printing and the resistance to marring of aluminium sheet to a certain extent, but the resin involucra as insulant makes the surface presentation insulating properties of the precoated aluminium sheet covered, therefore, when needing ground connection as the casing of described electronic equipment or structure component, need the part eliminating described resin involucra that the subsequent handling of the conducting portion that the metallic member of aluminium sheet is exposed etc. is set.

Therefore, in order to solve the problem of the electric conductivity on the surface of guaranteeing this precoated aluminum plate, in patent document 2 and patent document 3, propose the technology that precoating contains the resin involucra of conductive material.

But, contain in the method for the resin of conductive material at this precoating surfaces at aluminium sheet, need to make the particle of conductive material dispersed in described resin, when can not fully guarantee that the particle of conductive material contacts with each other in the resin involucra on surface being formed in aluminium sheet, or when fully can not guarantee the contacting of conductive material and aluminium sheet in the interface of resin involucra with aluminium sheet, just can not obtain the electric conductivity of wishing.Therefore, in order to obtain the electric conductivity of wishing, the component amount increasing conductive material is needed.But when increasing the content of conductive material, resin involucra is hardening to become fragile, therefore, when carrying out punch process to the aluminium sheet being formed with resin involucra, there will be the problem of the crackle (stripping) that resin involucra easily occurs.

The present inventors form to solve the problem points that these are added with the precoated aluminum plate of the formation of the resin involucra of conductive material, in patent document 4, be conceived to the relation of the average film thickness of surface roughness that aluminium sheet has and resin involucra, propose and do not use conductive material and the technology guaranteeing electric conductivity.Namely, as shown in Figure 5, the electronic equipment precoated aluminum plate 40 recorded in this patent document 4, on at least one side of the former material plate 41 of the aluminium of the center line average roughness with regulation, form corrosion resistance epithelium 43 and there is the composition of regulation and the resin involucra 42 of average film thickness, the fine concavo-convex protuberance on the surface of aluminium former material plate 41 exposes from resin involucra 42 with the state coating by corrosion resistance epithelium 43, so form, by forming this formation, while improving high electric conductivity, also meet other the requirement such as resistance to marring.

There is the electronic equipment precoated aluminum plate recorded in the patent document 4 of described formation, due to electric conductivity, anti-finger printing, resistance to marring, lubricity excellence, so at the shell of CD-ROM drive and framework, the backboard of liquid crystal board, the inner bin etc. of vehicle audio of liquid crystal board, be used in various electronic equipment.

[patent document]

[patent document 1] JP 6-70870 publication

[patent document 2] Unexamined Patent 7-313930 publication

[patent document 3] patent No. 3245696 publication

[patent document 4] patent No. 4237975 publication

But, in recent years, set as patent document 4 in the electronic device industry of the purposes of electronic equipment precoated aluminum plate recorded, particularly Cost Competition is fierce, consequently, the tendency being replaced as more cheap material is also had the packaging material that the electronic equipment goods assembled for the formed products be shaped concerning electronic equipment precoated aluminum plate and this formed products of use are packed.Consequently, when transporting after packing the formed products that electronic equipment precoated aluminum plate is shaped and the electronic equipment goods using this formed products to assemble, the situation that the scar that can not produce with existing packaging material enters formed products and electronic equipment goods starts to increase, increase cost hardly, and the cry improving the precoating aluminium of resistance to marring compared with existing further increases.

Summary of the invention

The present invention forms in view of described problem, its object is to provide a kind of resistance to marring excellent electronic equipment precoated aluminum plate, resistance to marring when its electric conductivity, lubricity, anti-finger printing, corrosion resistance and punch process is excellent, even and if use cheap packaging material, also can suppress the scuffing to be suitable for formed products and electronic equipment goods.

The electronic equipment precoated aluminum plate of the present invention solving described problem possesses: aluminium former material plate and the composite film containing inorganic constituents and organic resin constituent be formed at least one side of the former material plate of described aluminium, with the load of 0.4N, the bulbous end period of the day from 11 p.m. to 1 a.m that leading section is radius 10mm is being pressed to the surface being formed with described composite film side, resistance value between described spherical terminal and the former material plate of described aluminium is 1 below Ω, wherein, in the former material plate of described aluminium, the arithmetic average roughness Ra being formed with the surface of described composite film side is more than 0.3 μm less than 0.5 μm, in described composite film, zirconium composition and silicon composition is contained as inorganic constituents, the at least one in polyurethane resin and acrylic resin is contained as organic resin constituent, zirconium composition is converted into ZrO ₂adhesion amount be 5 ~ 500mg/m ², silicon composition is converted into SiO ₂adhesion amount be 2 ~ 600mg/m ², the adhesion amount of described organic resin constituent is 5 ~ 650mg/m ², the adhesion amount of described zirconium composition, the adhesion amount of described silicon composition, the adhesion amount of described organic resin constituent add up to 70 ~ 700mg/m ²(invention request 1).

So, owing to respectively the adhesion amount of the arithmetic average roughness Ra on the surface of former for aluminium material plate and the entirety of composite film being limited in specific scope, so the fine protuberance forming aluminium former material plate and the form that fly out higher than the average film thickness (highly) of composite film, consequently, resistance value when being measured by the method for regulation is 1 below Ω, can guarantee superior electrical conductivity.In addition, by limiting the composition forming composite film, the electronic equipment precoated aluminum plate can guaranteeing extremely excellent resistance to marring (resistance to marring when sliding with packaging material) can be realized.

In preferred electronic equipment precoated aluminum plate of the present invention, in the inorganic constituents of described composite film, described silicon composition is relative to being converted into ZrO ₂, SiO ₂zirconium composition and the mass ratio ([SiO of total of silicon composition ₂]/[ZrO ₂+ SiO ₂]) be less than more than 0.2 0.95 (invention request 2).

So, by the optimized composite film of ratio of the ratio and zirconium composition and silicon composition that realize the silicon composition in inorganic constituents, thereby, it is possible to realize the electronic equipment precoated aluminum plate for resistance to marring excellence when sliding with packaging material.

In preferred electronic equipment precoated aluminum plate of the present invention, in described composite film, inorganic constituents be converted into ZrO ₂, SiO ₂zirconium composition and silicon composition quality add up to [ZrO ₂+ SiO ₂] be more than 0.2 times less than 10 times (invention requests 3) of the quality of described organic resin constituent.

So, by limiting the ratio of inorganic constituents in composite film and organic resin constituent, thus when the ratio of organic resin constituent can be prevented too high produce composite film hardness deficiency cause decline with the resistance to marring of packaging material, and, the resistance to marring during punching press that the adhesion of the composite film produced when the ratio of inorganic constituents can be prevented too high is not enough to be caused declines, and occasionally can realize the electronic equipment precoated aluminum plate of resistance to marring excellence.

In preferred electronic equipment precoated aluminum plate of the present invention, described composite film also containing relative to this composite film mass ratio be more than 5% lower than 50% Lubrication Composition (invention request 4).

According to this formation, the electronic equipment precoated aluminum plate of lubricity excellence can be realized, improve the progressive forming of punching press, can degreasing process be omitted, reduce costs.

In preferred electronic equipment precoated aluminum plate of the present invention, between described aluminium former material plate and described composite film, form the substrate processing epithelium be made up of the inorganic independent epithelium containing the metal selected from chromium, zirconium, titanium or Inorganic whisker epithelium, the adhesion amount of described substrate processing epithelium is scaled 5mg/m with described metal ²above 50mg/m ²below (invention request 5).

According to this formation, by improving the adhesion of composite film and the former material plate of aluminium, thus realize resistance to marring when improving punch process further, and the electronic equipment precoated aluminum plate of excellent corrosion resistance.

In preferred electronic equipment precoated aluminum plate of the present invention, in described composite film, described zirconium composition is converted into ZrO ₂adhesion amount be 5 ~ 250mg/m ², described silicon composition is converted into SiO ₂adhesion amount be 2 ~ 300mg/m ², the adhesion amount of described organic resin constituent is 5 ~ 325mg/m ², the adhesion amount of described zirconium composition, the adhesion amount of described silicon composition, the adhesion amount of described organic resin constituent add up to 70 ~ 350mg/m ², when the spherical terminal pressing being radius 10mm by leading section with the load of 0.4N is on the surface being formed with described composite film side, the resistance value between described spherical terminal and the former material plate of described aluminium is 0.5 below Ω (invention request 6).

So, if reduce the entirety of composite film and the adhesion amount of each composition, then can realize electric conductivity and improve, and the electronic equipment precoated aluminum plate also useful to cost.

According to electronic equipment precoated aluminum plate of the present invention, the adhesion amount of the arithmetic average roughness Ra on the surface of former for aluminium material plate and the entirety of composite film is each defined in particular range, and make the composition optimization of composite film further, thus, resistance to marring significantly improves, further, electric conductivity, lubricity, anti-finger printing and corrosion resistance are also excellent.

Accompanying drawing explanation

Fig. 1 be medelling show the important part amplification sectional view of the formation of the embodiment of electronic equipment precoated aluminum plate of the present invention.

Fig. 2 is the front view of the method for the resistance value of medelling ground display measurement electronic equipment precoated aluminum plate.

Fig. 3 be medelling show the important part amplification sectional view of the formation of other embodiments of electronic equipment precoated aluminum plate of the present invention.

Fig. 4 is the sectional view of the shear-bow test method(s) of the resistance to marring of medelling ground display measurement electronic equipment precoated aluminum plate.

Fig. 5 be medelling show the important part amplification sectional view of the formation of electronic equipment precoated aluminum plate of the prior art.

Symbol description

10,10A ... electronic equipment precoated aluminum plate

11 ... the former material plate of aluminium

12 ... composite film

13 ... substrate processing epithelium

Detailed description of the invention

Below, with reference to suitable accompanying drawing, electronic equipment precoated aluminum plate of the present invention is described in detail.

As shown in Figure 1, electronic equipment precoated aluminum plate 10 of the present invention has: the aluminium former material plate 11 of the surface roughness of regulation and the adhesion amount with regulation are formed in the composite film 12 on the surface of the former material plate 11 of this aluminium.Composite film 12 also can be formed on the one side of the former material plate 11 of aluminium, also can be formed in (diagram is omitted) on two sides.In addition, other embodiment of electronic equipment precoated aluminum plate of the present invention is as shown in Figure 3 such, between the former material plate 11 of aluminium and composite film 12, and the substrate processing epithelium 13 (describing in detail afterwards) that to be formed with chromium phosphate hydrochlorate epithelium be representative.

In the former material plate 11 of aluminium, the arithmetic average roughness Ra on surface is more than 0.3 μm less than 0.5 μm, and formed fine concavo-convex, therefore, the concavo-convex recess that composite film 12 is formed as the surface of aluminium former material plate 11 is relatively thick, relatively thin for protuberance.

In addition, containing in the composite film 12 of inorganic constituents and organic resin constituent, contain zirconium composition and silicon composition as described inorganic constituents, the adhesion amount (quality of unit are) of zirconium composition is converted into ZrO ₂be 5 ~ 500mg/m ², the adhesion amount of silicon composition is converted into SiO ₂be 2 ~ 600mg/m ².In addition, in composite film 12, contain at least one of polyurethane resin and acrylic resin as described organic resin constituent, the adhesion amount of this organic resin constituent is 5 ~ 650mg/m ².And, the adhesion amount of the described each composition in composite film 12 add up to 70 ~ 700mg/m ².Below, by the total of this adhesion amount, namely contained in composite film 12 zirconium composition is converted into ZrO ₂adhesion amount, silicon composition be converted into SiO ₂adhesion amount and the total of adhesion amount of organic resin constituent be called the adhesion amount of this composite film 12.

So, in electronic equipment precoated aluminum plate 10 of the present invention, the former material plate 11 of aluminium of the surface roughness of regulation is formed with the composite film 12 first having pushed up composition and adhesion amount, therefore, it is possible to making with the load of the 0.4N spherical terminal 23 (with reference to Fig. 2) that is radius 10mm by leading section by the resistance value between the spherical terminal 23 be pressed in when being formed with composite film 12 side surperficial and the former material plate 11 of aluminium is 1 below Ω.

Below, each constitutive requirements of electronic equipment precoated aluminum plate 10 of the present invention are described.

[the former material plate of aluminium]

The present invention's former material plate 11 of aluminium used is made up of aluminum or aluminum alloy, the alloy kind that is suitable for be not particularly limited, article shape and manufacturing process can be selected arbitrarily based on the intensity required when using etc.Usually the aluminium sheet of nonheat-treatable can be used, the Al-Mg system alloy sheets that the Al-Mn system alloy sheets, 5000 that namely the 1000 industrial pure plates, 3000 being are is.Particularly, when making the casing with the dark container shapes of contraction processing, the aluminium sheets such as A1050, A1100, A3003, the A3004 specified in JISH4000 are recommended.In addition, when the casing of the casing of the shallow container shapes of comparison and bending machining main body, the aluminium sheets such as A5052, the A5182 specified in JISH4000 are recommended.For modified, thickness of slab, various material can be limited according to object and use.

The surface of the former material plate of aluminium (more than arithmetic average roughness Ra:0.3 μm less than 0.5 μm)

The arithmetic average roughness Ra on the surface of aluminium former material plate 11 is together with the adhesion amount of composite film 12 described later, contributes to the important parameter of the realization of the various characteristic such as electric conductivity, corrosion resistance, anti-finger printing, resistance to marring in electronic equipment precoated aluminum plate 10 of the present invention.

When the arithmetic average roughness Ra on the surface of the former material plate 11 of aluminium is lower than 0.3 μm, the surface gloss of electronic equipment precoated aluminum plate 10 is excessive, be attached to the fingerprint on surface and become eye-catching at the fine scar of Surface Creation, anti-finger printing and poor to the resistance to marring of packaging material.In addition, now, have the height step-down of the protuberance in the base of the former material plate 11 of aluminium of described micro concavo-convex, consequently, the thickness covering the composite film 12 of protuberance is thickening, therefore, is difficult to the electric conductivity of guaranteeing to wish.

On the other hand, when the arithmetic average roughness Ra on the surface of the former material plate 11 of aluminium is more than 0.5 μm, the excessive height of the protuberance of the former material plate 11 of aluminium, therefore, the top of protuberance is easily exposed from composite film 12.Consequently, the surface of the former material plate 11 of the aluminium exposed is worn due to mould, and therefore, resistance to marring during punch process reduces, and lubricity also declines.In addition, when protuberance exposes from composite film 12, be that spot corrosion occurs and spreads towards periphery with it, therefore, corrosion resistance declines.

That is, be limited to the scope of more than 0.3 μm less than 0.5 μm by the arithmetic average roughness Ra on the surface by former for aluminium material plate 11, excellent electric conductivity, anti-finger printing, resistance to marring and corrosion resistance can be given.

Also have, arithmetic average roughness Ra as the surface by former for aluminium material plate 11 adjusts the method in described scope, can exemplify such as, in the rolling process of aluminium former material plate 11, use the roll suitably setting surface roughness to carry out the method for cold rolling finish to gauge (finish rolling), or the surface of the former material plate 11 of the aluminium after rolling is implemented under suitable condition to the method for etch processes, use the shot-peening method etc. of particulate etc.

In the present invention, so have adjusted surperficial arithmetic average roughness Ra and be formed with the composite film 12 being formed with predetermined component and adhesion amount on the former material plate 11 of fine concavo-convex aluminium, therefore, the thickness of the composite film 12 of the fine protuberance of metallized aluminum former material plate 11 can not be blocked up, also can not be excessively thin.For this reason, electric conductivity, anti-finger printing and the resistance to marring of guaranteeing to wish can be obtained, and, the electronic equipment precoated aluminum plate 10 that corrosion resistance is improved.

[composite film]

(constituent of composite film: inorganic constituents and organic resin constituent)

(constituent of organic resin constituent: at least one of acrylic resin and polyurethane resin)

(constituent of inorganic constituents: zirconium composition and silicon composition)

As mentioned above, in composite film 12 for electronic equipment precoated aluminum plate 10 of the present invention, inorganic constituents and organic resin constituent is contained as constituent, contain zirconium composition and silicon composition as inorganic constituents, contain at least one selected from acrylic resin and polyurethane resin as organic resin constituent.

For organic resin constituent, by so limiting the kind of resin, composite film 12 can not only be coated to the surface with the former material plate 11 of fine concavo-convex aluminium recess with thin film also can be coated to protuberance, therefore, it is possible to obtain corrosion resistance, resistance to marring, precoated aluminum plate 10 that anti-finger printing is good.

Disperse in described organic resin constituent together with silicon composition by making zirconium composition, as mentioned above, not only there is the recess on the surface of the former material plate 11 of fine concavo-convex aluminium, protuberance is also coated to by thin and even (full of な く), therefore, compared with the composite film of the resin of other kinds of use, the effect that corrosion resistance and resistance to marring are improved is large.The effect that particularly resistance to marring improves significantly improves by leaps and bounds, such as, compared with existing electronic equipment precoated aluminum plate 40 (with reference to Fig. 5), can guarantee high resistance to marring.

(the adhesion amount of composite film: 70 ~ 700mg/m ²)

Electronic equipment precoated aluminum plate 10 of the present invention with the adhesion amount of composite film 12 for 70 ~ 700mg/m ²mode formed.By restriction like this, the electronic equipment precoated aluminum plate 10 of balancing good of electric conductivity, resistance to marring, processing adhesion, corrosion resistance can be obtained.

The adhesion amount of composite film 12 is lower than 70mg/m ²time, due to the former material plate 11 of aluminium surface, particularly protuberance can not be fully coated to, so corrosion resistance and resistance to marring decline.In addition, the adhesion amount of composite film 12 is more than 700mg/m ²time, thickness becomes blocked up, and therefore electric conductivity reduces.

Particularly in order to ensure the electric conductivity of excellence, the adhesion amount of composite film 12 is preferably 350mg/m ²below.

(the adhesion amount of zirconium composition contained in composite film: be converted into ZrO ₂be 5 ~ 500mg/m ²)

Zirconium composition makes the corrosion resistance of epithelium improve.Therefore, containing a certain amount of above zirconium composition in composite film 12, can give only with the corrosion resistance of the not getable degree of organic resin constituent electronic equipment precoated aluminum plate 10.

Zirconium composition is being converted into ZrO ₂the adhesion amount adhesion amount of zirconium composition (be below) lower than 5mg/m ²time, corrosion resistance declines, be suitable for chromium phosphate hydrochlorate epithelium etc. substrate processing epithelium (corrosion resistance epithelium 43) existing electronic equipment precoated aluminum plate 40 (with reference to Fig. 5) compared with, corrosion-resistant.In addition, the adhesion amount of zirconium composition is more than 500mg/m ²time, composite film is hardening, and processing adhesion declines.Therefore, preferably with the adhesion amount of zirconium composition for 5mg/m ²above 500mg/m ²below, the quality ratio in the entirety (total of zirconium composition, silicon composition, organic resin constituent) of composite film counts less than more than 1,/70 50/70.Further, zirconium composition is converted into ZrO ₂adhesion amount, such as, can the having good quality with (ZrO of whole Zr element contained by the unit are of composite film 12 ₂molecular weight)/(atomic weight of Zr) carry out converting and obtaining.

In addition, the adhesion amount of composite film 12 is at 350mg/m ²time following, the mobility etc. of resin when considering application, the adhesion amount of preferred zirconium composition is 250mg/m ²below.

(the adhesion amount of silicon composition contained in composite film: be converted into SiO ₂be 2 ~ 600mg/m ²)

Silicon composition improves the hardness of epithelium.Therefore, by composite film 12 containing the silicon composition more than a certain amount of, the electronic equipment precoated aluminum plate 10 only resistance to marring of not getable degree with organic resin constituent can be given.

Silicon composition is converted into SiO ₂the adhesion amount adhesion amount of silicon composition (be below) lower than 2mg/m ²time, resistance to marring declines.In addition, the adhesion amount of silicon composition is more than 600mg/m ²time, composite film becomes really up to the mark, and processing adhesion declines.Therefore, preferably with the adhesion amount of silicon composition for 2mg/m ²above 600mg/m ²below, the quality ratio in composite film entirety (total of zirconium composition, silicon composition, organic resin constituent) counts less than more than 0.4/70 60/70.Further, silicon composition is converted into SiO ₂adhesion amount, having good quality with (SiO of whole Si element that such as can be contained in the unit are of composite film 12 ₂molecular weight)/(atomic weight of Si) carry out converting and obtaining.

In addition, the adhesion amount of composite film 12 is at 350mg/m ²time following, the mobility etc. of resin when considering application, the adhesion amount of silicon composition is preferably 300mg/m ²below.

(ratio [the SiO of the silicon composition in inorganic constituents ₂]/[ZrO ₂+ SiO ₂]: less than more than 0.2 0.95)

The ratio of the silicon composition in inorganic constituents (total of zirconium composition and silicon composition), preferred mass ratio ([SiO ₂]/[ZrO ₂+ SiO ₂]) be less than more than 0.2 0.95.Further, the quality of zirconium composition and silicon composition is same with respective adhesion amount, is be converted into ZrO ₂, SiO ₂value, with [ZrO ₂], [SiO ₂] represent.

During regulation like this, easily obtain the composite film 12 of the balancing good of corrosion resistance and resistance to marring.([SiO ₂]/[ZrO ₂+ SiO ₂]) lower than 0.2 time, become the slightly poor composite film of resistance to marring 12, during more than 0.95, become the slightly poor composite film of corrosion resistance 12.

(the adhesion amount of organic resin constituent contained in composite film: 5 ~ 650mg/m ²)

Organic resin constituent has the effect of the processing adhesion guaranteeing composite film 12.By making composite film 12 containing a certain amount of organic resin constituent, the electronic equipment precoated aluminum plate 10 only not getable processing adhesion with inorganic constituents can be given.

The adhesion amount of organic resin constituent is lower than 5mg/m ²time, processing adhesion declines.In addition, the adhesion amount of organic resin constituent is more than 650mg/m ²time, composite film becomes soft, and resistance to marring declines, in addition, because the thickness of composite film is thickening, so electric conductivity declines.Therefore, the adhesion amount of preferred organic resin constituent is 5mg/m ²above 650mg/m ²below, less than more than 2,/70 65/70 is counted with the quality ratio in the entirety of composite film (total of zirconium composition, silicon composition, organic resin constituent).

In addition, the adhesion amount of composite film 12 is 350mg/m ²time following, particularly can guarantee excellent resistance to marring, and the adhesion amount of preferred organic resin constituent is 325mg/m ²below.

(quality of the zirconium composition in composite film and silicon composition adds up to [ZrO ₂+ SiO ₂] relative to the ratio of the quality of organic resin constituent: more than 0.2 times less than 10 times)

Inorganic constituents (total of zirconium composition and silicon composition) in composite film 12 and the ratio of organic resin constituent, the quality of preferred zirconium composition and silicon composition adds up to [ZrO ₂+ SiO ₂] be more than 0.2 times less than 10 times of quality of organic resin constituent.

During regulation like this, easily can also obtain the epithelium of the balancing good processing adhesion outside corrosion resistance and resistance to marring.[ZrO ₂+ SiO ₂] 0.2 times of adhesion amount lower than organic resin constituent time, become resistance to marring and the slightly poor epithelium of corrosion resistance, during more than 10 times, become the epithelium that processing adhesion is slightly poor.

In order to control zirconium composition, silicon composition contained in the adhesion amount of composite film 12 and this composite film 12, each adhesion amount of organic resin constituent, as described later, liquid composite film is formed with medicament (coating) to be coated on the former material plate 11 of aluminium, carry out toasting and forming composite film 12, therefore, cooperation and the coating weight that composite film forms with medicament is only controlled.It is be dispersed or dissolved in water or organic solvent etc. as required by described each composition contained in composite film 12 to be obtained by mixing that composite film forms with medicament.Due to baking, formed in medicament from the composite film coated the former material plate 11 of aluminium, volatile ingredient (water or organic solvent etc.) evaporates, the O be therefore coated with ₂the solid constituent (amount of removing volatile ingredient) that composite film forms with medicament is remaining, forms composite film 12.And the ratio (amount based on the volatile ingredient of each composition of removing) of the zirconium composition in composite film formation with medicament, silicon composition, organic resin constituent becomes the ratio of each composition in composite film 12.Therefore, the coating weight that the adhesion amount of composite film 12 can form with medicament by composite film controls, in addition, by composite film formed in medicament mix zirconium composition, silicon composition, organic resin constituent cooperation, the ratio of these each compositions is determined, derives adhesion amount in addition according to described coating weight.

In addition, for the composite film 12 be formed on electronic equipment precoated aluminum plate 10, by fluorescent x-ary analysis, quantitative analysis is carried out to zirconium (Zr), silicon (Si), is converted into ZrO respectively ₂, SiO ₂, calculate the actual adhesion amount of zirconium composition, silicon composition.Equally, carry out quantitative analysis for carbon (C), the composition based on organic resin constituent (polyurethane resin, acrylic resin) calculates the actual adhesion amount of organic resin constituent.Now, by standard specimen, obtain the relation of the intensity measured by x-ray fluorescence analysis as the adhesion amount of the composition of object and the element corresponding with this composition in advance.In addition, carry out quantitative analysis, not only calculate the adhesion amount of corresponding composition to any one of described element, the cooperation also forming with medicament according to be coated with composite film calculates the adhesion amount of other compositions and the adhesion amount of composite film 12.

(preferred component contained in composite film: Lubrication Composition)

Composite film 12 is preferably containing Lubrication Composition.Lubrication Composition, as its title, has the lubricity improving composite film 12, improves the effect of formability.Preferably use more than at least one of the wax of fusing point 70 ~ 130 DEG C as Lubrication Composition, specifically can exemplify Tissuemat E, OPE, polypropylene wax, crystallite (マ イ Network ロ Network リ ス タ リ Application) wax.Be more than 70 DEG C at fusing point and can obtain lubricity, when fusing point is below 130 DEG C, can not become really up to the mark, can lubricity be obtained.Preferred wax is with the emulsion of emulsifying agent stable dispersion in water, and preferable particle size is 0.08 ~ 3.0 μm.When particle diameter is lower than 0.08 μm, the use amount of emulsifying agent increases, and therefore, corrosion resistance declines.On the other hand, when particle diameter is more than 3.0 μm, becomes large from the part that composite film 12 is outstanding, depart from from this composite film 12, can not lubricity be obtained.

(Lubrication Composition is relative to the mass ratio of composite film: more than 5% lower than 50%)

The content of the Lubrication Composition in preferred composite film 12 is relative to the composite film 12 (total of the adhesion amount of zirconium composition, the adhesion amount of silicon composition, the adhesion amount of organic resin constituent) of this Lubrication Composition of removing, and mass ratio is more than 5% lower than 50%.

The mass ratio of Lubrication Composition lower than 5% time, be difficult to obtain lubricant effect, time more than 50%, composite film deliquescing, resistance to marring declines.

Time in composite film 12 containing Lubrication Composition, when composite film forms with medicament adjustment, the solid constituent making described wax phase form with medicament for this composite film carries out mixing to become the mode of wishing mass ratio.

(the formation method of composite film)

Described composite film 12, such as can be formed in the following way: the liquid composite film of the composition containing composite film 12 given to this invention is formed with medicament, pass through rolling method, after the one or two sides of the former material plate 11 of the aluminium of web-like is coated with continuously, make it pass through in single baking oven or the continous way baking oven that formed by multiple baking oven and toast.If so, then continuously and rapidly can manufacture electronic equipment precoated aluminum plate 10, therefore in productivity ratio this point preferably.

In addition, in described formation method, be liquid when composite film 12 is coated on the surface of aluminium former material plate 11 at first, therefore very unfertile land is coated to the protuberance on the surface of the former material plate 11 of aluminium, and on the other hand, recess is preferentially filled, and has been coated to recess with very thick.And, by the baking process proceeded, on protuberance, the composite film 12 of hard can be formed with thin thickness, and the composite film 12 of hard can be formed at recess with thick thickness.

Electronic equipment precoated aluminum plate 10, because have adhesion and the good composite film 12 of corrosion resistance, so do not need substrate processing epithelium that general precoated aluminum plate is formed, that be representative with chromium phosphate hydrochlorate epithelium.Therefore, the operation forming substrate processing epithelium can be omitted, with the medicament that the formation of substrate processing epithelium uses, so, the equipment manufacturing electronic equipment precoated aluminum plate 10 of the present invention forms and can simplify significantly, electronic equipment precoated aluminum plate 10 can be made to reduce costs, and can boost productivity.

Electronic equipment precoated aluminum plate of the present invention, improve further to make adhesion and corrosion resistance, also can give first that to carry out representated by the process of chromium phosphate hydrochlorate this changes into process for aluminium former material plate, substrate processing epithelium is formed between the former material plate of aluminium and composite film.When forming substrate processing epithelium, electronic equipment precoated aluminum plate of the present invention is such as following formation.

Electronic equipment precoated aluminum plate 10A of the present invention, as shown in Figure 3, consists of: aluminium former material plate 11, this aluminium former material plate 11 at least one side formed composite film 12, between the former material plate 11 of aluminium and composite film 12, form substrate processing epithelium 13.About the former material plate 11 of aluminium and composite film 12, because identical with electronic equipment precoated aluminum plate 10 (with reference to Fig. 1), so additional identical symbol, and omit the description.Below, substrate processing epithelium 13 is carried out.

[substrate processing epithelium]

The substrate processing epithelium that general precoated aluminum plate is formed, the adhesion of resin involucra (composite film) and the former material plate of aluminium is improved, also there is the effect that corrosion resistance is improved simultaneously, for this reason in most cases, the inorganic independent epithelium containing Cr, Zr or Ti or Inorganic whisker epithelium can be applied.In electronic equipment precoated aluminum plate 10A of the present invention, by forming these substrate processing epitheliums, also can obtain same effect.As substrate processing epithelium 13, include, for example chromium phosphate hydrochlorate epithelium, basic zirconium phosphate epithelium, titanium phosphate epithelium, particularly the chromium phosphate hydrochlorate epithelium of preferred 3 valency chromium systems.

The electronic equipment adhesion amount of the substrate processing epithelium 13 in precoated aluminum plate 10A, converts with metal (Cr, Zr, Ti), is preferably 5mg/m ²above 50mg/m ²below.If the adhesion amount of substrate processing epithelium 13 converts lower than 5mg/m with metal ², then can not get sufficient effect, in addition, if more than 50mg/m ², then processability reduces.

[electric conductivity of electronic equipment precoated aluminum plate]

(resistance value: 1 below Ω)

With the high performance of electrical equipment in recent years, the requirement that the reliability for electronic equipment is guaranteed raises year by year, and electric conductivity also becomes one of them.Electronic equipment precoated aluminum plate 10 (10A) of the present invention, needs with the resistance value of aftermentioned such method measurement at 1 below Ω.If make described resistance value be 1 below Ω, then can on the composite film 12 of electronic equipment precoated aluminum plate 10 direct ground connection.In addition, electromagnetic wave noise can be removed fully.Therefore, electronic equipment is the drive unit of CD drive etc., when the casing of this drive unit and the such structure component of main frame use electronic equipment precoated aluminum plate 10 of the present invention, is difficult to cause write or regeneration mistake.In addition, electronic equipment is liquid crystal panel, and when the fixing framework of this liquid crystal panel and the such structure component of bonnet use electronic equipment precoated aluminum plate 10 of the present invention, picture noise is difficult to occur.

If in contrast, resistance value is more than 1 Ω, then direct ground connection on composite film 12, fully can not remove electromagnetic wave noise.

In the present invention, by making the arithmetic average roughness Ra on the surface of aluminium former material plate 11 in specific scope given to this invention (more than 0.3 μm less than 0.5 μm), and make the adhesion amount of composite film 12 at specific scope (70mg/m given to this invention ²above 700mg/m ²below), the resistance value measured by specific method can be made to reach 1 below Ω.Namely, in electronic equipment precoated aluminum plate 10 of the present invention, by for the former material plate 11 of aluminium on surface of arithmetic average roughness Ra with specific scope, composite film 12 is formed with suitable uniformity, thus the form that the fine protuberance becoming aluminium former material plate 11 is more much higher than the average height of composite film 12.So at the protuberance that the average height than composite film 12 is much higher, the thickness of composite film 12 also rests on the application substrate processing epithelium of prior art (corrosion resistance epithelium 43 (with reference to Fig. 5)) substantially with the thickness of degree, therefore, it is possible to make resistance value at 1 below Ω, electric conductivity can be guaranteed.

But, the arithmetic average roughness Ra on the surface of former for aluminium material plate 11 is defined in specific scope (more than 0.3 μm less than 0.5 μm), and the adhesion amount of composite film 12 is defined in specific scope (70mg/m ²above 700mg/m ²below), this is also make resistance value reach the necessary condition of 1 this condition of below Ω for meeting, instead of adequate condition, even if meet these conditions, still has resistance value not reach the situation of 1 below Ω.Such as, the arithmetic average roughness Ra on the surface of the former material plate 11 of aluminium is near lower limit, and the adhesion amount of composite film 12 is when Near The Upper Limit, and the surface of aluminium former material plate 11 concavo-convex little, thickness is thick, and therefore resistance value is difficult to reach 1 below Ω.

Therefore, in the present invention, using the resistance value measured by specific method described later at 1 below Ω as important document.Further, certainly expect that resistance value is lower, is preferably 0.5 below Ω.

With reference to Fig. 2, the method for the resistance value measuring electronic equipment precoated aluminum plate of the present invention is described.This measuring method is mode, the condition identical with method patent document 4, JP 2005-297290 publication, JP 2002-206178 publication etc. Suo Gongkai.

The measuring method of the resistance value namely in the present invention, it carries out being the former material plate of aluminium making the direct contacting electronic equipments precoated aluminum plate of the terminal 21 of a side of detector 20, by the terminal 22 of the opposing party of detector 20, the subglobose brazen spherical terminal 23 of radius 10mm is formed as via leading section, on the composite film of electronic equipment precoated aluminum plate, make it contact with the pressing of the load of 0.4N, form some ways of contact.Further, in order to make the former material plate of the terminal 21 of detector 20 and aluminium directly contact, electronic equipment precoated aluminum plate will give and first with grinding removing composite films such as sand paper, the former material plate of aluminium be exposed.In addition, because the natural oxide film on the surface of terminal 21 and spherical terminal 23 can become the reason of the measured value generation deviation making resistance value, so needed before the measurement of resistance value, grind the surface of terminal 21 and spherical terminal 23 with sand paper etc., fully remove natural oxide film in advance.In addition, be subject to the impact of the internal resistance of detector 20 when measuring in order to get rid of resistance value, after preferably carrying out zero correction under the state that the leading section making the leading section of terminal 21 with spherical terminal 23 contacts, measure the resistance value of electronic equipment precoated aluminum plate again, select the scope that in the region of this measured value, detector 20 precision is the highest, value when adopting the measured value shown by detector 20 to stablize.And, in order to fully guarantee the reliability of resistance value, preferably make the measurement of this resistance value, in 1 piece of electronic equipment precoated aluminum plate, at least measure 10 places in random position, if possible, then measure 50 places, adopt its mean value as resistance value given to this invention.

Electronic equipment precoated aluminum plate 10 of the present invention described above, also can manage as follows.

Electronic equipment precoated aluminum plate 10 of the present invention, it is the electronic equipment precoated aluminum plate that at least one side being the former material plate 11 of aluminium of more than 0.3 μm less than 0.5 μm at the arithmetic average roughness Ra on surface is formed with composite film 12, wherein, substrate processing epithelium (being equivalent to the corrosion resistance epithelium 43 in Fig. 5) is not formed between the former material plate 11 of aluminium and composite film 12, organic resin constituent, zirconium composition, silicon composition containing at least one selected from acrylic resin, polyurethane resin, the adhesion amount of zirconium composition is converted into ZrO ₂be 5 ~ 500mg/m ², the adhesion amount of silicon composition is converted into SiO ₂be 2 ~ 600mg/m ², the adhesion amount of organic resin constituent is 5 ~ 650mg/m ², the adhesion amount as composite film 12 is 70 ~ 700mg/m ²leading section is made to be the spherical terminal 23 (with reference to Fig. 2) of radius 10mm, when pressing with the load of 0.4N for the surface being formed with composite film 12 side, the resistance value between spherical terminal 23 and the former material plate 11 of aluminium is 1 below Ω (with reference to Fig. 1).

Further, between the former material plate 11 of aluminium and composite film 12, substrate processing epithelium 13 (with reference to Fig. 3) also can be set.

So electronic equipment precoated aluminum plate 10 of the present invention has given play to following effect.

(1) in electronic equipment precoated aluminum plate 10 of the present invention, the arithmetic average roughness Ra on the surface of former for aluminium material plate 11 and the adhesion amount of composite film 12 are defined in specific scope, the kind of the resin of the organic resin constituent contained in further regulation composite film 12 and adhesion amount, and each adhesion amount of zirconium composition and silicon composition.Thus, formed and there is the protuberance of fine concavo-convex aluminium former material plate 11 form more much higher than the average height of composite film 12, cover the thickness of the composite film 12 of this protuberance and application substrate processing epithelium (corrosion resistance epithelium 43 (with reference to Fig. 5)) the same degree substantially of prior art, the performance that electric conductivity, corrosion resistance and resistance to marring reach more excellent than prior art can be guaranteed.

(2) electronic equipment precoated aluminum plate 10 of the present invention, consists of, and makes the scope that the ratio of the zirconium composition in the inorganic constituents contained in composite film 12 and silicon composition is specifying, the therefore balancing good of resistance to marring and corrosion resistance.

(3) electronic equipment precoated aluminum plate 10 of the present invention, consist of, make the ratio of inorganic constituents and the organic resin constituent contained in composite film 12 in the scope of regulation, therefore except resistance to marring, corrosion resistance, the balance of processing adhesion is also excellent.

(4) electronic equipment precoated aluminum plate 10 of the present invention, consists of, and as the formation containing Lubrication Composition in composite film 12, makes the mass ratio of Lubrication Composition in the scope of regulation, therefore, it is possible to improve formability.

(5) electronic equipment precoated aluminum plate 10A of the present invention, consist of, the former material plate 11 of aluminium is given and first implements to change into process, substrate processing epithelium 13 is formed between the former material plate 11 of aluminium and composite film 12, make the adhesion amount of this substrate processing epithelium 13 in the scope of regulation, therefore corrosion resistance is more excellent with processing adhesion.

(6) in electronic equipment precoated aluminum plate 10 of the present invention, the adhesion amount of composite film 12 is defined in the specific scope of restriction further, each adhesion amount of organic resin constituent, zirconium composition, silicon composition is also defined in the scope of restriction further.Thus, except resistance to marring, corrosion resistance, processing adhesion, the performance that electric conductivity reaches more excellent can be guaranteed.

Electronic equipment precoated aluminum plate 10 of the present invention, can be applicable to casing and the structure component of the so various electronic equipments of the casing of disk drive unit and main frame, the fixing framework of liquid crystal panel and bonnet.

In addition, electronic equipment precoated aluminum plate 10 of the present invention, because have excellent lubricity, so have excellent formability, in the operation manufacturing electronic equipment formed products, can make stamping in the bad incidence reductionization of quality, the yield rate of goods is improved.Thus, the present invention can reduce the cost of the entirety of electronic equipment formed products, consequently, goes far towards the cost reduction of electronic equipment goods.

[embodiment]

Next, by the embodiment meeting important document given to this invention with do not meet important document comparative example and contrast, electronic equipment precoated aluminum plate of the present invention is more specifically illustrated.

(making of electronic equipment precoated aluminum plate)

Make the electronic equipment precoated aluminum plate of embodiment 1 ~ 26 and comparative example 1 ~ 13 as follows.

First, will the aluminium block fusing of the composition of the A5182 of JISH4000 defined be had, after adjustment alloying component, be made the slab of rolling by casting.Segregation layer for steel slab surface carries out face milling, after the operation of the process that homogenizes, through hot rolling, the cold rolling and each operation of heat treatment, is made into the former material plate of aluminium (thickness of slab: 0.5mm, alloy species: A5182-H34).Further, in described cold rolling final (finish to gauge) operation, by being suitable for the surface roughness changing roll, make the former material plate of aluminium with the various surface roughness (arithmetic average roughness Ra) shown in table 1 and table 2.

Thereafter, use the aluminium alkalescent degreaser of market sale, degreasing is carried out, as Coating Pretreatment for the former material plate of aluminium manufactured.Then, as shown in Table 1 and Table 2, as application substrate, embodiment 1 ~ 16,18,21 ~ 26, carry out the process of chromium phosphate hydrochlorate in comparative example 1 ~ 13, in embodiment 19, carry out the substrate processing employing basic zirconium phosphate (PZr), in embodiment 20, carry out the substrate processing employing titanium phosphate (PTi).On the other hand, in embodiment 17, do not carry out the substrate processing of the chromium phosphate hydrochlorate process used usually used as the application substrate of precoated aluminum plate etc.Further, the metal adhering amount of the epithelium of substrate processing shown in table 1 and table 2, being the adhesion amount being converted into crome metal during chromium phosphate hydrochlorate, is the adhesion amount being converted into metal zirconium during basic zirconium phosphate, is the adhesion amount being converted into Titanium during titanium phosphate.

Then, on the surface of the former material plate of these aluminium, pass through rolling method, coating weight is changed and is coated with composite film formation with medicament, the kind of the resin in organic resin constituent and inorganic constituents (zirconium composition, silicon composition) are allocated by it, and the medicament addition of Lubrication Composition being changed and adjusts.Then, toasted for 30 seconds with heating-up temperature 230 DEG C, form composite film, the electronic equipment as embodiment 1 ~ 26 and comparative example 1 ~ 13 (below, should describe as " embodiment 1 ", " comparative example 1 " etc. thoroughly with precoated aluminum plate.)。

Composite film forms with medicament, adjust as follows: the organic resin constituent of the resin types shown in dissolving, being dispersed in organic solvent and water, table 1 and table 2, zirconium composition, silicon composition are mixed, make it with respective solid component meter, meet the adhesion amount of the organic resin constituent in the composite film shown in table 1 and table 2, be converted into the ZrO of zirconium composition ₂adhesion amount, be converted into the SiO of silicon composition ₂the ratio of adhesion amount, then relative to the total (solid constituent) of these compositions, to have the mode of the mass ratio shown in table 1 and table 2, add the Tissuemat E of particle diameter 0.3 μm as Lubrication Composition.Composite film through adjustment forms with medicament, makes its solid constituent become the adhesion amount of the composite film shown in table 1 and table 2, so controls coating weight and is coated on the former material plate of aluminium.In addition, for the electronic equipment precoated aluminum plate made, with x-ray fluorescence analysis, measure the absolute magnitude in the unit are of the zr element (Zr) contained in composite film, be converted into ZrO ₂, confirm with the adhesion amount of the zirconium composition shown in table 1 and table 2 basically identical.In addition, the ratio ([SiO of the silicon composition in inorganic constituents ₂]/[ZrO ₂+ SiO ₂]), inorganic constituents ([ZrO ₂+ SiO ₂]) ratio of organic resin constituent is described in table 1 and table 2.

Also have, the surface roughness (arithmetic average roughness Ra) of the former material plate of aluminium is measured in the following way: use surfagauge (society of little Ban research institute system, サ mono-Off コ mono-ダ SE-30D), the direction that scanning is at a right angle with the rolling direction of aluminium former material plate, tries to achieve arithmetic average roughness Ra (JISB0601).

Resistance value uses LCR meter (HEWLETT PACKARD society 4263B) to measure as detector 20.In addition, as the spherical terminal 23 for measuring, what the radius using leading section was 10mm is formed as subglobose brazen measuring stick.First, with the composite film of a part for sand paper grinding electronic equipment precoated aluminum plate, the former material plate of aluminium is exposed.For the former material plate of this aluminium, as shown in Figure 2, make the terminal 21 directly conducting contact of a side of detector 20, make the terminal 22 of the opposing party of detector 20, via spherical terminal 23 on the composite film of electronic equipment precoated aluminum plate, with 0.4N load contact measuring position, between terminal 21,22 energising and measured resistance value.Further, when measuring, giving the surface first with sand paper grinding terminal 21 and spherical terminal 23, carrying out zero correction with the state making the leading section of terminal 21 contact with the leading section of spherical terminal 23.The random position of the 50 spherical terminals in place 23 that changes is while carry out described measurement, calculating mean value on one side.

(evaluation method)

For the embodiment 1 ~ 26 made and comparative example 1 ~ 13, the resistance to marring (processing cut) when evaluating lubricity (coefficient of friction), anti-finger printing (aberration (Δ E)), bending machining, resistance to marring (packing timber cut), corrosion resistance (classification (RT NO.)) when packing timber is slided.These contents are measured as follows and are evaluated.

(lubricity)

Lubricity is by バ ウ デ Application レ mono-ベ Application (Bowden-Leben) method (steel ball / 3 inches (4.7625mm), load 2N (200gf), sliding speed 200mm/min), measure the coefficient of friction at 3 places of the surperficial Stochastic choice at each electronic equipment precoated aluminum plate, calculate its mean value.

If the mean value of coefficient of friction is below 0.2, then in usual the carried out formed machining of various electronic equipments, do not have special problem, if below 0.1, can be evaluated as excellent especially, therefore these are qualified, then defective during more than 0.2.The mean value of coefficient of friction is presented in table 1 and table 2.

(anti-finger printing)

Anti-finger printing is the surface of free-hand touch embodiment 1 ~ 26 and comparative example 1 ~ 13, uses コ ニ カ ミ ノ Le タ society's spectrocolorimeter (CM-600d), measures the aberration (Δ E) of the front and back of fingerprint attachment.

If aberration Δ E value is below 0.5, then with the naked eye almost can not confirm the fingerprint being attached to surface, be therefore qualified, if more than 0.5, then with the naked eye can confirm the fingerprint being attached to surface, be therefore qualified.Aberration Δ E value is presented in table 1 and table 2.

(resistance to marring (processing cut))

Resistance to marring (processing cut), by cutting off bend test method evaluation.Namely, as shown in Fig. 4 (a), (b), the test film of embodiment 1 ~ 26 and comparative example 1 ~ 13 is clamped with metal pattern 31 and lower metal pattern 32, make drift 33 slide in the face being formed with composite film of test film and carry out bending machining, attempt the reproduction of the processing cut occurred when formed machining because of punching press.Interval (metal pattern interval) d produced between lower metal pattern 32 and drift 33 is the interval that the thickness of slab of test film used adds the gap (clearance) of 10%.

The sliding surface of the test film (with reference to Fig. 4 (c)) of bending machining has been carried out in visualization, according to state, gives following mark and quantizes, carrying out the evaluation of resistance to marring: 5 points: no abnormality seen completely; 4 points: the slight grinding recognized reluctantly on composite film as seen; 3 points: on composite film, have obvious grinding as seen; 2 points: the grinding of composite film is remarkable; 1 point: have foreign matter as seen on the former material plate surface of aluminium; 0 point: foreign matter is remarkable in the situation on aluminium former material plate surface.In each specification of electronic equipment precoated aluminum plate, evaluate with 5 pieces of test films, mean value is more than 2 qualified, defective lower than 2 of mean value.The mean value of mark is presented in table 1 and table 2.

(resistance to marring (packing timber cut))

Resistance to marring (packing timber cut), as the packaging material of miniaturized electronics, bubble fender (the bubble diameter 10mm that reality is used, bubble height 4mm, the non-resistance to Electricity level of electronic component) be against the face being formed with composite film of test film, while can not break with bubble, the intensity applying pressure of this degree, slides 50 back and forth.

The sliding surface of the test film that visualization makes bubble fender slide, the cut situation corresponding to the composite film of test film, gives following mark and makes it to quantize, carrying out the evaluation of resistance to marring: 3 points: have no cut; 2 points: cut slight as seen; 1 point: visible significant cut.Qualified more than 2 points of mark, defective lower than 2 points of mark.Count and be presented in table 1 and table 2.

(corrosion resistance)

Corrosion resistance is tested according to the neutral salt spray test of JIS Z2371 defined, and implementation evaluation.That is, as the spray liquid to (stretch) test sample spraying that stretches, use the sodium-chloride water solution of 5 quality %, spray environment temperature is 35 DEG C, and spray amount is with area 80cm ²count every 1 hour 1.5 milliliters.Maximum 100 hours of test period in addition.

According to by the staging of degree quantification of corroded area rate by corrosion, the corrosion produced for tensile test piece test quantizes, classification (RTNO.) be more than 9.0 be qualified, classification lower than 9.0 defective.Classification display is in table 1 and table 2.

[table 1]

[table 2]

(result)

Content according to table 1 and table 2, is known as below result.

(impact of the surface roughness (arithmetic average roughness Ra) of the former material plate of aluminium)

Comparative example 1, the lower limit of the scope that arithmetic average roughness Ra specifies lower than the present invention, the adhesion amount of composite film is the higher limit of the scope that the present invention specifies in addition, therefore can not meet important document given to this invention about resistance value.In addition, comparative example 2, arithmetic average roughness Ra exceedes the higher limit of the present invention's restriction, in addition the adhesion amount of composite film is the lower limit of the scope that the present invention specifies, therefore becomes the result that lubricity, anti-finger printing, resistance to marring (processing cut) and corrosion resistance do not meet criterion of acceptability.

(impact of the adhesion amount of composite film)

Comparative example 3, the adhesion amount of composite film exceedes the higher limit of the scope that the present invention specifies, therefore can not meet about resistance value the important document that the present invention specifies.In addition, comparative example 4 is because the adhesion amount of composite film is lower than the lower limit of scope given to this invention, so become the result that anti-finger printing, resistance to marring (packing timber cut) and corrosion resistance do not meet criterion of acceptability.

(impact of the adhesion amount of organic resin constituent)

Comparative example 5, the lower limit of the scope that the adhesion amount of the organic resin constituent contained by composite film specifies lower than (not reaching) the present invention, therefore processes adhesion and reduces, become lubricity and do not meet criterion of acceptability result.In addition, comparative example 8, the adhesion amount of the organic resin constituent contained by composite film exceedes the higher limit of the scope that the present invention specifies, therefore can not meet important document given to this invention about resistance value.

(impact of the adhesion amount of zirconium composition)

Comparative example 6, because the lower limit of scope that the adhesion amount of the zirconium composition contained by composite film specifies lower than (not reaching) the present invention, so become the result that corrosion resistance does not meet criterion of acceptability.In addition, comparative example 9, because the adhesion amount of the zirconium composition contained by composite film exceedes the higher limit of the scope that the present invention specifies, so processing adhesion reduces, becomes the result that lubricity meets criterion of acceptability.

(impact of the adhesion amount of silicon composition)

Comparative example 7, the lower limit of the scope that the adhesion amount of the silicon composition contained by composite film specifies lower than (not reaching) the present invention, therefore becomes the result that resistance to marring (packing timber cut) does not meet criterion of acceptability.In addition, comparative example 10, because the adhesion amount of the silicon composition contained by composite film exceedes the higher limit of the scope that the present invention specifies, so processing adhesion reduces, becomes the result that lubricity does not meet criterion of acceptability.

(impact of the organic resin constituent of composite film)

As organic resin constituent, comparative example 12 is because only use mylar, and comparative example 13 uses epoxy resin, so all form the result that resistance to marring (packing timber cut) does not meet criterion of acceptability.

On the other hand, at the surface roughness (arithmetic average roughness Ra) of the former material plate of aluminium, the adhesion amount of composite film and composition (kind of the resin of organic resin constituent and adhesion amount, each adhesion amount of zirconium composition and silicon composition) all meet in the embodiment 1 ~ 26 of the scope that the present invention specifies, resistance value also meets the scope that the present invention specifies, for the result that electric conductivity, lubricity, anti-finger printing, resistance to marring (processing cut, packing timber cut) and corrosion resistance are all no problem.

In addition about the component ratio of composite film, the embodiment 1 being the invention request 2 of the present invention of same specification will be met, and the embodiment 21,22 not meeting invention request 2 compares except the adhesion amount of the inorganic constituents of composite film.Consequently, one side of embodiment 1, compared with the embodiment 21 that zirconium component ratio is few, resistance to marring (packing timber cut) and excellent corrosion resistance, compared with the embodiment 22 that silicon component ratio is few, resistance to marring (processing cut, packing timber cut) is excellent, and known whole balance of properties is excellent.Equally, if the embodiment 4 meeting invention request 2 of the present invention compared with the embodiment 8 not meeting invention request 2, then a side of embodiment 4, compared with the embodiment 8 that silicon component ratio is few, resistance to marring (processing cut) is excellent, known complete characteristic balancing good.

In addition, about the component ratio of composite film, be substantially the embodiment 1 of the invention request 3 of the present invention of same specification by meeting except the adhesion amount of the organic resin constituent of composite film, and the embodiment 23,24 not meeting invention request 3 compare.Consequently, one side of embodiment 1, compared with the embodiment 23 that inorganic constituents ratio is few, resistance to marring (packing timber cut) is excellent, compared with the embodiment 24 that organic resin constituent ratio is few, lubricity and resistance to marring (processing cut) excellence, known whole balance of properties is excellent.Equally, if will the embodiment 5 of invention request 3 of the present invention be met, compare with the embodiment 9,11 of satisfied invention request 3, a then side of embodiment 5, compared with the embodiment 9 that inorganic constituents ratio is few, electric conductivity (resistance value) is excellent, compared with the embodiment 11 that organic resin constituent ratio is few, lubricity is excellent, and known whole balance of properties is excellent.

In addition, about the Lubrication Composition that composite film is containing, being the embodiment 1,3 of the invention request 4 of the present invention of same specification except the mass ratio of the Lubrication Composition of composite film by meeting, comparing with the embodiment 25,26 not meeting invention request 4 respectively.Consequently, one side of embodiment 1, compared with not containing the embodiment 25 of Lubrication Composition, lubricity and resistance to marring (processing cut) excellence, one side of embodiment 3, contains Lubrication Composition with surplus, and composite film generation thick-film, softening embodiment 26 are compared, electric conductivity (resistance value) and excellent corrosion resistance, known whole balance of properties is excellent.

In addition, about substrate processing epithelium, will the embodiment 1,19,20 of invention request 5 of the present invention be met, compare with the embodiment 17,18 of satisfied invention request 5.Consequently, one side of embodiment 1,19,20, compared with the embodiment 17 not forming substrate processing epithelium, excellent corrosion resistance, compared with the embodiment 18 of superfluous ground chromium phosphate hydrochlorate epithelium, lubricity, anti-finger printing, resistance to marring (processing cut) are excellent, and known whole balance of properties is excellent.In addition be formed with the embodiment 1 of chromium phosphate hydrochlorate epithelium as substrate processing epithelium, compare with the embodiment 19,20 processing epithelium that changes into formed beyond chromium phosphate hydrochlorate epithelium, known corrosion resistance is the most excellent.Also have, even if do not arrange substrate processing epithelium as embodiment 17, scope given to this invention is met by the surface roughness of aluminium former material plate and the adhesion amount of composite film and composition, still can become the electronic equipment precoated aluminum plate that the characteristic of corrosion resistance etc. is good, according to the degree of required characteristic, on the point that cost degradation and productivity ratio improve, can say that its constituent ratio embodiment 1 grade is more excellent.

In addition, to meet the embodiment 1,15,13 of invention request 6 of the present invention, compare with the embodiment 5,16 and comparative example 11 that do not meet invention request 6 of the present invention respectively, its result is known, the top resistance value of embodiment 1,15,13 is low, excellent electric conductivity.

Also have, about comparative example 11, although the adhesion amount of the surface roughness (arithmetic average roughness Ra) of the former material plate of aluminium, composite film and composition (kind of organic resin constituent and adhesion amount, each adhesion amount of zirconium composition and silicon composition) all meet scope given to this invention, but only have resistance value not meet important document of the present invention.This adhesion amount be considered to due to composite film is higher limit, thus result in this result.Therefore, even if aluminium former material plate, its respective various parameters of composite film that the present invention specifies are guaranteeing it electric conductivity is necessary condition, can not say to be exactly adequate condition.Therefore, in electronic equipment precoated aluminum plate of the present invention, in order to positively give play to the effect of hope, i.e. electric conductivity, lubricity, anti-finger printing, resistance to marring (processing cut, packing timber cut) and the effect of excellent corrosion resistance, just need regulation, the resistance value measured by specific method is at 1 below Ω.

Above, by the detailed description of invention, electronic equipment precoated aluminum plate of the present invention is illustrated, but aim of the present invention does not limit by described content, can be suitable for changing in the scope of the thought based on technology of the present invention, certainly such scope also should be interpreted as being included in the thought of technology of the present invention.

Claims (6)

1. an electronic equipment precoated aluminum plate, it is characterized in that, the composite film containing inorganic constituents and organic resin constituent that there is aluminium former material plate and formed at least one side of the former material plate of described aluminium, and, to the surface of side being formed with described composite film, the bulbous end period of the day from 11 p.m. to 1 a.m being radius 10mm with the load of 0.4N pressing leading section, the resistance value between described spherical terminal and the former material plate of described aluminium is at 1 below Ω, wherein

In the former material plate of described aluminium, the arithmetic average roughness Ra being formed with the surface of described composite film side is more than 0.3 μm less than 0.5 μm,

In described composite film, contain zirconium composition and silicon composition, contain at least one in polyurethane resin and acrylic resin as described organic resin constituent as described inorganic constituents, described zirconium composition is converted into ZrO ₂adhesion amount be 5 ~ 500mg/m ², described silicon composition conversion SiO ₂adhesion amount be 2 ~ 600mg/m ², the adhesion amount of described organic resin constituent is 5 ~ 650mg/m ², wherein, the adhesion amount of described zirconium composition, the adhesion amount of described silicon composition and the adhesion amount of described organic resin constituent add up to 70 ~ 700mg/m ².

2. electronic equipment precoated aluminum plate according to claim 1, is characterized in that, in described composite film, described silicon composition is relative to being converted into ZrO ₂described zirconium composition and be converted into SiO ₂the mass ratio [SiO of total of described silicon composition ₂]/[ZrO ₂+ SiO ₂] be less than more than 0.2 0.95.

3. electronic equipment precoated aluminum plate according to claim 1 and 2, is characterized in that, in described composite film, is converted into ZrO ₂described zirconium composition and be converted into SiO ₂the quality of described silicon composition to add up to be more than 0.2 times less than 10 times of the quality of described organic resin constituent.

4. electronic equipment precoated aluminum plate according to claim 1, is characterized in that, in described composite film, also containing be more than 5% relative to this composite film mass ratio but lower than 50% Lubrication Composition.

5. electronic equipment precoated aluminum plate according to claim 1, it is characterized in that, between described aluminium former material plate and described composite film, also be formed with the substrate processing epithelium be made up of the inorganic independent epithelium containing the metal selected from chromium, zirconium, titanium or Inorganic whisker epithelium, the adhesion amount of described substrate processing epithelium is scaled 5mg/m with described metal ²above 50mg/m ²below.

6. electronic equipment precoated aluminum plate according to claim 1, is characterized in that, in described composite film, described zirconium composition is converted into ZrO ₂adhesion amount be 5 ~ 250mg/m ², described silicon composition is converted into SiO ₂adhesion amount be 2 ~ 300mg/m ², the adhesion amount of described organic resin constituent is 5 ~ 325mg/m ², wherein, the adhesion amount of described zirconium composition, the adhesion amount of described silicon composition and the adhesion amount of described organic resin constituent add up to 70 ~ 350mg/m ²,

With the load of 0.4N to being formed with the bulbous end period of the day from 11 p.m. to 1 a.m that the pressing leading section, surface of described composite film side is radius 10mm, the resistance value between described spherical terminal and the former material plate of described aluminium is 0.5 below Ω.