CN102723592B - A kind of built-in type CMMB antenna and communication terminal - Google Patents
A kind of built-in type CMMB antenna and communication terminal Download PDFInfo
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- CN102723592B CN102723592B CN201210175627.1A CN201210175627A CN102723592B CN 102723592 B CN102723592 B CN 102723592B CN 201210175627 A CN201210175627 A CN 201210175627A CN 102723592 B CN102723592 B CN 102723592B
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Abstract
The invention provides a kind of built-in type CMMB antenna, this CMMB antenna comprises: medium substrate, be arranged at the array antenna on medium substrate one surface, a feed end be electrically connected with array antenna and a grounding parts, array antenna comprises some some patch antenna elements be electrically connected in turn.CMMB antenna of the present invention make use of and adopts multiple patch antenna element composition array antenna, radiation field forms antenna field, increase the gain of antenna, improve the sensitivity of CMMB antenna, the low-loss antenna medium base material be combined, effect when CMMB antenna is built in communication terminal is substantially identical with existing external CMMB telescopic antenna effect.
Description
Technical field
The invention belongs to the communications field, be specifically related to a kind of antenna and apply the terminal equipment of this antenna.
Background technology
Along with the development of wireless communication technique, wireless telecommunications system has had more and more higher requirement, in order to meet the requirement of communication, existing various wireless router adopts external antenna substantially, the surplus energy that the industrial design of very big limits product and mechanism design play, and external antenna also needs the impedance-matching connectors and the mechanism's module that design adaptation, these connectors and mechanism's module almost account for the cost of whole antenna more than 90 percent.
Antenna is as the radiating element of final radiofrequency signal and receiving device, and its operating characteristic will directly affect the service behaviour of whole electronic system.The installation of antenna not only needs the shape considering antenna itself, also need the electromagnetic radiation produced during the device busy considering antenna place, particularly the high-frequency work of central processing unit creates electromagnetic radiation, this can receive antenna and send signal and cause bad impact, antenna even can be therefore caused normally to work, therefore, in electronic system, the placement of antenna needs the expensive time to consider and checking.
Reception antenna is extension type telescopic antenna (CMMB frequency range 470MHz-800MHz) and adjustable CMMB built-in aerial normally.Extension type telescopic antenna normally quarter-wave is about 120 ~ 160mm.But external antenna impact is attractive in appearance, also easily damages.
Adjustable CMMB built-in aerial, it is in CMMB frequency range 470MHz-800MHz, and volume is little, structure is simple, can be built in the portable radiovisors such as mobile phone easily inner.Regulate branch and ground connection branch utilizing traditional antenna basis introduces, thus the object of regulating frequency and bandwidth can be realized, thus enable antenna in the object that CMMB frequency range 470MHz ~ 800MHz internal loss is little, Received signal strength is good.But adjustable CMMB built-in aerial technique is high, increases extra regulating circuit, increase circuit design cost, increase the jamproof cost of mobile phone EMI/EMC.Therefore, need to design a kind of antenna, CMMB equipment can be placed under the prerequisite not increasing cost.
Summary of the invention
In order to solve problems of the prior art, the invention provides a kind of built-in type CMMB antenna, by realizing the built-in of CMMB antenna to Antenna Construction Design, and meet the demand of communication, realize the good reception of the CMMB signal of the communication terminal of this CMMB antenna of application, meet the requirement of multimedia, to achieve these goals, the present invention by the following technical solutions:
A kind of built-in type CMMB antenna, comprise: medium substrate, be arranged at the array antenna on described medium substrate one surface, the feed end be electrically connected with described array antenna and a grounding parts, described array antenna comprises some some patch antenna elements be electrically connected in turn.
Further, the resonance band of described array antenna is 470MHz-800MHz.
Further, be respectively electrically connected by some connecting portions between described patch antenna element.
Further, one end of described array antenna arranges connecting portion described in, and described feed end is electrically connected with described array antenna by described connecting portion.
Further, described medium substrate, at 1GHz operation at frequencies, has≤electrical loss tangent the amount of 0.0002.
Further, described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprises the compound with described epoxy resin generation cross-linking reaction.
Further, described array antenna comprises five described patch antenna elements.
Present invention also offers a kind of communication terminal, comprise housing, be placed in the circuit board in described housing and be arranged at the CMMB communication module on described circuit board, also comprise the CMMB antenna described in right 1-7, described CMMB antenna is electrically connected with described CMMB communication module.
Further, described housing comprises back of the body lid, and described CMMB antenna is arranged in described back of the body lid.
Further, described mobile communication terminal comprises PDA, CMMB terminal, mobile phone, notebook, TV.
CMMB antenna of the present invention make use of and adopts multiple patch antenna element composition array antenna, radiation field forms antenna field, increase the gain of antenna, improve the sensitivity of CMMB antenna, the low-loss antenna medium base material be combined, effect when CMMB antenna is built in communication terminal is substantially identical with existing external CMMB telescopic antenna effect.
Accompanying drawing explanation
Fig. 1 is the flow chart of CMMB antenna one execution mode of the present invention;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of CMMB antenna shown in communication terminal application drawing 1 of the present invention.
Embodiment
Now in detail with reference to the embodiment described in accompanying drawing.In order to complete understanding the present invention, refer to numerous detail in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can realize without the need to these details.In other embodiments, be not described in detail known method, process, assembly and circuit, in order to avoid unnecessarily make embodiment fuzzy.
The structural representation of a kind of execution mode for built-in type CMMB antenna of the present invention shown in Figure 1, this CMMB antenna 10 comprises medium substrate 1 and is arranged on array antenna 2, feed end 3 and the grounding parts 4 on medium substrate 1, array antenna 2 comprises 5 patch antenna elements 21, be electrically connected in turn by connecting portion 22 between patch antenna element 21, wherein, 5 patch antenna elements 21 are approximate rectangular shape, and equal and opposite in direction; Feed end 3 is arranged at one end of array antenna 2, and be connected with one end of a junction 22 at this end of array antenna 2, feed end 3 is electrically connected with the other end of this connecting portion 22; The setting that grounding parts 4 is relative with feed end 3, as be filled to black in figure part shown in.
The medium substrate of built-in type CMMB antenna 10 shown in Fig. 1 is of a size of 107mm × 60mm, each patch antenna element is of a size of 24mm × 16mm, the length of connecting portion is 4mm, 5 patch antenna elements link together in turn through 4 connecting portions, 5 patch antenna elements linearly array arrangement, the resonant electromagnetic ripple frequency of this CMMB antenna is 470MHz-800MHz.
The radiation field of some patch antenna elements of composition array antenna forms array antenna field, can increase or reduce the quantity of patch antenna element as required, also can regulate the size of each patch antenna element, to draw the radiation pattern of needs.
Medium substrate 1 component comprises glass-fiber-fabric, epoxy resin and the compound with this epoxy resin generation cross-linking reaction, below by way of embodiment, this medium substrate is described.
First kind execution mode is as follows:
In such execution mode, for the production of the infiltration solution of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier part or similar application part etc.) in processing the present invention.Described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.Wherein the first component and the second component configure mixing according to a certain percentage.Above-mentioned first component, the second component and one or more solvents described are made into described infiltration solution.Described infiltration solution after stirring, a described glass-fiber-fabric are infiltrated in described infiltration solution the first component and the second component are adsorbed in glass-fiber-fabric or on the surface; Then baking is copied described glass-fiber-fabric and is made one or more solvent evaporates described, and makes the first component and the mutual chemical combination of the second component be cross-linked to form semi-solid preparation thing or solidfied material.Semi-solid preparation thing refers to be copied in the relatively low environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the soft mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.Solidfied material refers to be copied in the relatively high environment of temperature by the glass-fiber-fabric of absorption first component and the second component in baking, and the first component comprises the relatively hard mixture of epoxy resin and the second component inclusion compound part generation chemical combination cross-linking reaction.Wherein said semi-solid preparation or solidfied material, at 1GHz operation at frequencies, have≤nominal dielectric constant of 4.0 and the electrical loss tangent amount of≤0.01.
In the present embodiment, the described glass-fiber-fabric infiltrated forms semi-solid preparation thing (in the form of sheets) by low-temperature bake, then described semi-solid preparation thing is cut into and cuts out sheet, needs described multi-disc to cut out sheet superimposed and carry out the multilayer dielectric substrate (i.e. multilayer laminate or sheet) that is hot pressed into described in this enforcement according to thickness.Wherein hot pressing process object makes the first component comprise epoxy resin and chemical combination cross-linking reaction all occurs the second component inclusion compound exactly.
Can certainly understand, the described glass-fiber-fabric infiltrated directly forms solidfied material by high-temperature baking, i.e. single-layer medium substrate of the present invention (i.e. individual layer laminated sheet or sheet).
In the particular embodiment, the compound of described second component can select the copolymer comprised by polarity macromolecule and non-polar high polymer chemical combination, as styrene maleic anhydride copolymer.Be understandable that, can all can be used for the Formulation Ingredients of present embodiment with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6,8 styrene or any number in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, described epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing, thus be namely infiltration solution of the present invention after making the epoxy resin in described solution and styrene maleic anhydride copolymer Homogeneous phase mixing.
In the particular embodiment, impelling gel (selecting gel ambient temperature 171 DEG C) in above-mentioned infiltration solution 200-400 second by adding certain promoter, wherein promoting that about 260 seconds above-mentioned infiltration solution gelatinizing time (as 258-260 second or 250-270 second etc.) effect is better.Described promoter can be selected and be included but not limited to tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
One or more solvents described can select the mixed solvent including but not limited in acetone, butanone, DMF, EGME, toluene be mixed to form between any one or above-mentioned two or more solvent.
In another embodiment, described infiltration solution comprises: the first component, comprises epoxy resin; Second component, comprises the compound with described epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of described second component selects styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.Wherein said cyanate performed polymer concentration 75%.Promoter selects methylimidazole; Butanone selected by described solvent.This execution mode infiltrates solution and specifically fills a prescription as following table:
In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, all can there is chemical combination cross-linking reaction with epoxy resin in both simultaneously.
Equations of The Second Kind execution mode is as follows:
In Equations of The Second Kind execution mode of the present invention, the composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier part or similar application part etc.) in production the present invention, described composition comprises glass-fiber-fabric, the first component and the second component, and the first component comprises epoxy resin; Second component comprises the compound with described epoxy resin generation cross-linking reaction.Wherein said composition, at 1GHz operation at frequencies, has≤nominal dielectric constant of 4.0 and the electrical loss tangent amount of≤0.01.Wherein in present embodiment, described composition, at 1GHz operation at frequencies, has≤electrical loss tangent the amount of 0.005.
Described composition fabrication processes also comprises following technique:
First, the second component is comprised compound that crosslinked reaction occurs with described epoxy resin and described epoxy resin is prepared according to the ratio of sense value, then add a certain amount of solvent solution-forming.In the particular embodiment, described compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and the copolymer of wherein preferred embodiment can select styrene maleic anhydride copolymer.Described epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, as normal agitation bucket and reactor make epoxy resin and styrene maleic anhydride copolymer Homogeneous phase mixing.The wherein styrene maleic anhydride copolymer of present embodiment, its molecular formula is as follows:
4 styrene are comprised in above-mentioned styrene maleic anhydride copolymer molecular formula.In other embodiments, corresponding molecular weight can be selected, as comprised 6 or 8 styrene in styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound containing two or more epoxide groups in general reference molecule.
In other examples, the compound of the described second component mixture that can also select cyanate performed polymer or select styrene maleic anhydride copolymer to mix according to arbitrary proportion with cyanate performed polymer.
In the particular embodiment, make the epoxy resin in described solution and styrene maleic anhydride copolymer can carry out chemical combination cross-linking reaction under certain condition, depend on described glass-fiber-fabric after there is chemical combination cross-linking reaction, thus form medium substrate of the present invention.
One or more solvents described can select to include but not limited in acetone, butanone, DMF, EGME, toluene any one or above-mentioned between mixed solvent.
The various component ratio of described solution one specific embodiment is as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned formula, add styrene maleic anhydride copolymer and cyanate performed polymer, both are all cross-linked with epoxy resin energy chemical combination simultaneously.
Then, from above-mentioned solution, extracting described a small amount of test sample book, the solution gelatinizing time described in a certain specified temp environmental testing, regulating described solution at this fixed temperature environment gel time by adding promoter.The gel within 200-400 time second of above-mentioned solution can be impelled by adding one or more promoter, wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures, in present embodiment, carrying out gel time by being set in 171 degrees Celsius of environment, making above-mentioned solution better in gel time about 260 seconds (as 258-260 second or 250-270 second etc.) effect.Described promoter can be selected and be included but not limited to select tertiary amines, any class in imidazoles and Boron Trifluoride Ethylamine or mixture between them.
3rd step, when above-mentioned test sample book during gel, takes out oven dry after being infiltrated by glass-fiber-fabric in described solution in 200-400 time range second, forms composition.In these concrete steps, glass-fiber-fabric to be immersed in solution fully to infiltrate and ensure that described epoxy resin and styrene maleic anhydride copolymer to be adsorbed in glass-fiber-fabric or on the surface, then the glass cloth of solution is immersed by hanging on air dry oven 180 DEG C of bakings about 5 minutes, solvent butanone fully volatilizees by object exactly, and make described epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, the product of glass cloth and described chemical combination cross-linking reaction obtains semi-solid preparation composition.Be understandable that, extend baking time and or improve baking temperature, can hardening composition be formed.General a large amount of industrial production adopts in vertical gluing machine and completes in impregnation subsystem and baking oven subsystem.
Finally, the change composition of oven dry and conductive foil are carried out pressing.In these concrete steps, by change composition (prepreg or prepreg) and conductive foil pressing in vacuum hotpressing machine of drying.Described conductive foil is selected and is comprised the obtained electric conducting material such as copper, silver, gold, aluminium or above-mentioned material alloy material.Because the price of copper product is relatively low, the conductive foil be made of copper therefore is selected to be suitable for industrialization.
Simultaneously in order to some the performance parameter requirements of applicable antenna, multi-disc prepreg or prepreg are carried out lamination and form multilayer laminate.Apply these laminated sheets and can effectively reduce antenna recombination loss, and then ensure aerial radiation yield value.
Shown in Figure 2 is a kind of STRUCTURE DECOMPOSITION schematic diagram of communication terminal, this communication terminal is mobile phone, this mobile phone comprises the housing, circuit board 30 and the CMMB antenna 10 that are made up of protecgulum 201 and back of the body lid 202, wherein circuit board is placed in housing, circuit board 30 is provided with CMMB communication module 301 and the necessary module, circuit etc. (not marking in figure) of mobile communication; CMMB antenna 10 is arranged in back of the body lid 202, and be electrically connected with CMMB communication module 301 by signal transmssion line (not shown), CMMB antenna 10 is identical with execution mode shown in Fig. 1, does not endure herein and states.
Following table is CMMB mobile phone telescopic antenna and CMMB mobile phone array antenna received Sensitivity comparison:
| Frequency (MHz) | 474 | 530 | 666 | 754 | 794 |
| Telescopic antenna incoming level (dBm) | -40 | -46 | -39 | -38 | -32 |
| Array antenna received level (dBm) | -28 | -36 | -37 | -30 | -31 |
It should be noted that CMMB antenna 10 is arranged in back of the body lid 202 can be the inner side that CMMB antenna is attached at back of the body lid 202.
Mobile phone is used to describe in detail as communication terminal in present embodiment, but communication terminal is not limited to take mobile phone as the mobile communication terminal of representative, also comprise other communication terminals and multi-media broadcast terminal, include, but are not limited to PDA, CMMB terminal, mobile phone, notebook, liquid crystal display television, LCD TV and common TV.In above communication terminal, the installation site of CMMB antenna can be selected according to concrete actual conditions, such as, when CMMB antenna being applied in the CMMB terminal be installed in automotive headrest, CMMB antenna can be arranged on the side near vehicle window in headrest, to obtain how effective signal of communication.
By reference to the accompanying drawings preferred embodiment of the present invention is described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; do not departing under the ambit that present inventive concept and claim protect, also can make a lot of form, these all belong within protection of the present invention.
Claims (5)
1. a built-in type CMMB antenna, it is characterized in that, comprise: medium substrate, be arranged at the array antenna on described medium substrate one surface, one feed end be electrically connected with described array antenna, and a grounding parts, described array antenna comprises some some patch antenna elements be electrically connected in turn, respectively be electrically connected by some connecting portions between described some patch antenna elements, and be electrically connected by a connecting portion between two often adjacent patch antenna elements, the all rectangular and equal and opposite in direction of each in described some patch antenna elements, wherein, one end of described array antenna arranges connecting portion described in, described feed end is electrically connected with described array antenna by described connecting portion, and the setting that described grounding parts is relative with described feed end, wherein, described medium substrate is at 1GHz operation at frequencies, there is≤electrical loss tangent the amount of 0.005, described medium substrate component comprises glass-fiber-fabric, epoxy resin and comprise the compound with described epoxy resin generation cross-linking reaction, wherein, produce described medium substrate and comprise infiltration solution or composition, described infiltration solution comprises described epoxy resin, with the compound of described epoxy resin generation cross-linking reaction, one or more solvents, described composition comprises described glass-fiber-fabric, described epoxy resin, with the compound of described epoxy resin generation cross-linking reaction.
2. built-in type CMMB antenna according to claim 1, is characterized in that, described array antenna comprises five described patch antenna elements.
3. a communication terminal, comprise housing, be placed in the circuit board in described housing and be arranged at the CMMB communication module on described circuit board, it is characterized in that, also comprise the built-in type CMMB antenna described in right 1-2, described built-in type CMMB antenna is electrically connected with described CMMB communication module.
4. communication terminal according to claim 3, is characterized in that, described housing comprises back of the body lid, and described built-in type CMMB antenna is arranged in described back of the body lid.
5. the communication terminal according to claim 3 or 4, is characterized in that, described mobile communication terminal comprises PDA, CMMB terminal, mobile phone, notebook, TV.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210175627.1A CN102723592B (en) | 2012-05-31 | 2012-05-31 | A kind of built-in type CMMB antenna and communication terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210175627.1A CN102723592B (en) | 2012-05-31 | 2012-05-31 | A kind of built-in type CMMB antenna and communication terminal |
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| CN102723592A CN102723592A (en) | 2012-10-10 |
| CN102723592B true CN102723592B (en) | 2016-02-10 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI681593B (en) * | 2018-07-31 | 2020-01-01 | 銓鼎塑膠股份有限公司 | High-directivity antenna |
| CN111952733B (en) * | 2020-07-03 | 2023-02-03 | 深圳捷豹电波科技有限公司 | Antenna board and wireless charging and communication module applying same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1150498A (en) * | 1994-06-03 | 1997-05-21 | 艾利森电话股份有限公司 | Microstrip antenna array |
| CN1293462A (en) * | 1999-10-13 | 2001-05-02 | 索尼株式会社 | Antenna equipment and communication terminal equlpment |
| CN1721475A (en) * | 2004-07-16 | 2006-01-18 | 无锡阿科力化工有限公司 | Halogen-free epoxy resin and process for preparing same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030214439A1 (en) * | 2002-05-20 | 2003-11-20 | Donald A. Huebner | Low cross-polarization microstrip array |
| WO2009013817A1 (en) * | 2007-07-25 | 2009-01-29 | Fujitsu Limited | Wireless tag |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1150498A (en) * | 1994-06-03 | 1997-05-21 | 艾利森电话股份有限公司 | Microstrip antenna array |
| CN1293462A (en) * | 1999-10-13 | 2001-05-02 | 索尼株式会社 | Antenna equipment and communication terminal equlpment |
| CN1721475A (en) * | 2004-07-16 | 2006-01-18 | 无锡阿科力化工有限公司 | Halogen-free epoxy resin and process for preparing same |
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Effective date of registration: 20201130 Address after: 226000 Building No. 388 Yongxing Avenue, Gangzhao District, Nantong City, Jiangsu Province Patentee after: NANTONG IT-SOFT Co.,Ltd. Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |