CN102683166B - Packaged-chip detecting and classifying device - Google Patents
Packaged-chip detecting and classifying device Download PDFInfo
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- CN102683166B CN102683166B CN201110069606.7A CN201110069606A CN102683166B CN 102683166 B CN102683166 B CN 102683166B CN 201110069606 A CN201110069606 A CN 201110069606A CN 102683166 B CN102683166 B CN 102683166B
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Abstract
The invention provides a packaged-chip detecting and classifying device. The packaged-chip detecting and classifying device comprises a rotating unit for conveying a plurality of packaged chips, a chip testing unit and a chip classifying unit. The rotating unit comprises at least one rotatable table, a plurality of accommodating parts arranged on the rotatable table, and a plurality of air intake-exhaust dual-purpose openings respectively arranged in the accommodating parts, wherein each accommodating part selectively accommodates at least one of the packaged chips. The chip testing unit comprises at least one chip testing module arranged close to the rotating unit and is used for testing each packaged chip. The chip classifying unit comprises at least one chip classifying module arranged close to the rotating unit and is used for classifying the plurality of packaged chips. Thus, the device detects and classifies the no-lead packaged chips such as QFN (quad fiat no-lead) chips by the cooperation of the rotating unit, the chip testing unit and the chip classifying unit.
Description
Technical field
The present invention relates to a kind of detection and classification device, particularly relating to a kind of for detecting and the packaged chip detection and classification device of sorting packaged chips.
Background technology
In semiconductor processing, often generate tiny particulate or defect because of some unavoidable reasons, and along with constantly reducing of component size in semiconductor technology and improving constantly of circuit closeness, these atomic little defects or the impact of particulate on integrated circuit quality are also on the rise, therefore for maintaining the stable of product quality, usually while carrying out every semiconductor technology, also defects detection must be carried out for produced semiconductor element, to analyze according to the result detected the basic reason causing these defects, could avoid further by the adjustment of technological parameter or reduce the generation of defect afterwards, to reach the object promoting semiconductor technology qualification rate and reliability.
A kind of defect inspection method has been disclosed in known technology, first it comprise the following steps:, sample, selected semiconductor crystal grain is that sample is to carry out the work of subsequent defective examination and analysb, then a defects detection is carried out, generally speaking, utilize suitable defect checking machine platform in the mode of large area scanning mostly, detect all defect on this semiconductor grain, because the defect number on semiconductor crystal grain is mostly quite large, therefore can not carry out sweep electron microscope in artificial mode one by one in practice to detect again, therefore for convenience's sake, most likely first carry out an artificial defect classification, by in detected all defect, some more representative defect types are taken out in sampling, engineer is allowed to detect to carry out defect selected sample in artificial mode more again, with a step, Causes Analysis is carried out to described defect, to find out the method suppressing or reduce these defects.
Summary of the invention
The object of the present invention is to provide a kind of packaged chip detection and classification device, it can be used for the packaged chip (such as Quad Flat No lead (QFN) chip) of detection and classification without pin.
The embodiment of the present invention provides a kind of packaged chip detection and classification device, and it comprises: one for carrying the rotary unit of multiple packaged chip, a chip testing unit and a sorting chips unit, a die orientation detecting unit and a die orientation adjustment unit.Wherein, this rotary unit has at least one rotatable turntable, is multiplely arranged at holding part in above-mentioned at least one rotatable turntable and multiple dual-purpose opening of suction and discharge be arranged at respectively in above-mentioned multiple holding part, wherein optionally holds at least one in above-mentioned multiple packaged chip in each holding part.This chip testing unit has this rotary unit of at least one vicinity and chip testing modular for testing each packaged chip, and above-mentioned at least one chip testing modular has multiple for optionally each packaged chip in electrical contact and for judging that each packaged chip is the detector probe of well packaged chip or bad packaged chip and at least one mobile suction nozzle going above-mentioned multiple detector probe in electrical contact for each packaged chip mobile.This sorting chips unit has this rotary unit of at least one vicinity and for the sorting chips module of above-mentioned multiple packaged chip of classifying.This die orientation detecting unit this supply unit contiguous and this rotary unit, it has the die orientation image zooming-out element that a speculum and be positioned at below this packaged chip is positioned at a side side of this speculum.This die orientation adjustment unit has this die orientation detecting unit contiguous and die orientation adjustment suction nozzle for being carried out adjusting in the orientation of this packaged chip.
The embodiment of the present invention provides a kind of packaged chip detection and classification device, and it comprises: one for carrying the first rotary unit of multiple packaged chip, a chip testing unit, one second rotary unit, a bridge-jointing unit, a sorting chips unit, a supply unit, a die orientation detecting unit and a die orientation adjustment unit.Wherein, this first rotary unit has at least one first rotatable turntable, is multiplely arranged at the first holding part in above-mentioned at least one first rotatable turntable and multiple dual-purpose opening of the first suction and discharge be arranged at respectively in above-mentioned multiple first holding part, wherein optionally holds at least one in above-mentioned multiple packaged chip in each first holding part.This chip testing unit has this first rotary unit of at least one vicinity and chip testing modular for testing each packaged chip, and wherein above-mentioned at least one chip testing modular has multiple for optionally each packaged chip in electrical contact and for judging that each packaged chip is the detector probe of well packaged chip or bad packaged chip and at least one mobile suction nozzle going above-mentioned multiple detector probe in electrical contact for each packaged chip mobile.This second rotary unit this first rotary unit contiguous, wherein this second rotary unit has at least one second rotatable turntable, is multiplely arranged at the second holding part in above-mentioned at least one second rotatable turntable and multiple dual-purpose opening of the second suction and discharge be arranged at respectively in above-mentioned multiple second holding part, wherein optionally holds at least one in the multiple packaged chips transported by above-mentioned first rotary unit in each second holding part.This bridge-jointing unit has at least one bridging element be arranged between the first rotary unit and the second rotary unit.This sorting chips unit has this second rotary unit of at least one vicinity and for the sorting chips module of above-mentioned multiple packaged chip of classifying.This supply unit has this first rotary unit of at least one vicinity and according to different sequential with the delivery element of sequentially each the first holding part corresponding.This die orientation detecting unit this supply unit contiguous and this first rotary unit, and this die orientation detecting unit has the die orientation image zooming-out element that a speculum and be positioned at below this packaged chip is positioned at a side side of this speculum.This die orientation adjustment unit has this die orientation detecting unit contiguous and die orientation adjustment suction nozzle for being carried out adjusting in the orientation of this packaged chip.
In sum, the packaged chip detection and classification device that the embodiment of the present invention provides, it coordinates by " rotary unit (the first rotary unit and the second rotary unit), chip testing unit and sorting chips unit ", can be used for the packaged chip (such as QFN chip) of detection and classification without pin to make packaged chip detection and classification device of the present invention.
Further understand feature of the present invention and technology contents for enable, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Figure 1A is the schematic top plan view of the first embodiment of packaged chip detection and classification device of the present invention;
Figure 1B is the first rotary unit of the first embodiment or the schematic perspective view of the second rotary unit of packaged chip detection and classification device of the present invention;
The schematic perspective view of the packaged chip that the first embodiment that Fig. 1 C is packaged chip detection and classification device of the present invention uses;
Fig. 1 D is the schematic side view of the die orientation detecting unit of the first embodiment of packaged chip detection and classification device of the present invention;
Fig. 1 E is the side-looking schematic flow sheet of the packaged chip detecting step of the first embodiment of packaged chip detection and classification device of the present invention;
Fig. 2 A is the schematic top plan view of the second embodiment of packaged chip detection and classification device of the present invention; And
Fig. 2 B is the schematic perspective view of the rotary unit of the second embodiment of packaged chip detection and classification device of the present invention.
Wherein, description of reference numerals is as follows:
First rotary unit 1 first rotatable turntable 11
First holding part 12
The dual-purpose opening 13 of first suction and discharge
Rotary unit 1 ' rotatable turntable 11 '
Holding part 12 '
The dual-purpose opening 13 ' of suction and discharge
Chip testing unit 2 chip testing modular 20
Detector probe 20A
Mobile suction nozzle 20B
Second rotary unit 3 second rotatable turntable 31
Second holding part 32
The dual-purpose opening 33 of second suction and discharge
Sorting chips unit 4 sorting chips module 40
First current portion 40A
Second current portion 40B
Supply unit 5 delivery element 50
Die orientation detecting unit 6 speculum 61
Die orientation image zooming-out element 62
Die orientation adjustment unit 7 die orientation adjustment suction nozzle 70
Bridge-jointing unit 8 bridging element 80
Chip surface detecting unit 9 chip front side image zooming-out element 91
Chip back image zooming-out element 92
Load bearing unit B bearing chassis B1
Winding T packs groove T1
Packaged chip C conductive welding pad C1
Well packaged chip C '
Bad packaged chip C "
Embodiment
(the first embodiment)
Refer to shown in Figure 1A to Fig. 1 E, first embodiment of the invention provides a kind of packaged chip detection and classification device, and it comprises: one for carrying first rotary unit 1, chip testing unit 2,1 second rotary unit 3 and a sorting chips unit 4 of multiple packaged chip C.
First, coordinate shown in Figure 1A and Figure 1B, first rotary unit 1 has at least one first rotatable turntable 11, is multiplely arranged at the first holding part 12 in the first rotatable turntable 11 and multiple dual-purpose opening 13 of the first suction and discharge be arranged at respectively in above-mentioned multiple first holding part 12, wherein optionally holds at least one in above-mentioned multiple packaged chip C in each holding part 12.For example, above-mentioned multiple first holding part 12 can be arranged at the outside of the first rotatable turntable 11 around ground, to make each first holding part 12 produce first opening outwardly, each packaged chip C then enters in each first holding part 12 by each first opening outwardly.
In addition, coordinate shown in Figure 1A, Fig. 1 C and Fig. 1 E, chip testing unit 2 has at least one vicinity first rotary unit 1 and chip testing modular 20 for testing each packaged chip C.Certainly, according to different testing requirements, the present invention also can use multiple chip testing modular 20.For example, as shown in Figure 1 C, each packaged chip C can be a kind of square surface without pin package (Quad Flat No lead, QFN) chip, and each packaged chip C has multiple conductive welding pad C1.In addition, as referring to figure 1e, chip testing modular 20 has multiple for optionally each packaged chip C in electrical contact and for judging that each packaged chip C is well packaged chip C ' or bad packaged chip C " detector probe 20A and at least one mobile suction nozzle 20B removing above-mentioned multiple detector probe 20A in electrical contact for mobile each packaged chip C.The step (A) of Fig. 1 E shows mobile suction nozzle 20B and holds packaged chip C.The step (B) of Fig. 1 E shows mobile suction nozzle 20B and drives packaged chip C to move down (direction as shown by arrows), now above-mentioned multiple conductive welding pad C1 is in electrical contact to above-mentioned multiple detector probe 20A, is good or not good judgement to carry out each packaged chip C.The step (C) of Fig. 1 E shows mobile suction nozzle 20B and drives packaged chip C up to move in (direction as shown by arrows), with the position making packaged chip C be returned to original step (A).
In addition, coordinate shown in Figure 1A and Figure 1B, the outward appearance of the second rotary unit 3 can be same or similar with the first rotary unit 1, and contiguous first rotary unit 1 of the second rotary unit 3.Second rotary unit 3 has at least one second rotatable turntable 31, to be multiplely arranged in the second rotatable turntable the second holding part 32 on 31 and multiple dual-purpose opening 33 of the second suction and discharge be arranged at respectively in above-mentioned multiple second holding part 32, wherein optionally holds at least one in the above-mentioned multiple packaged chip C transported by the first rotary unit 1 in each second holding part 32.For example, above-mentioned multiple second holding part 32 can be arranged at the outside of the second rotatable turntable 31 around ground, to make each second holding part 32 produce second opening outwardly, each packaged chip C transported by the first rotary unit 1 then enters in each second holding part 32 by each second opening outwardly.
Moreover as shown in Figure 1A, sorting chips unit 4 has at least one vicinity second rotary unit 3 and for the sorting chips module 40 of the above-mentioned multiple packaged chip C that classifies.For example, sorting chips module 40 has at least one the first current portion 40A for receiving each well packaged chip C ' and at least one for receiving each bad packaged chip C " the second current portion 40B.In general, after each well packaged chip C ' is by the first current portion 40A, each well packaged chip C ' will sequentially be placed in the packaging groove T1 of a winding T, to carry out follow-up packing chip program.As each bad packaged chip C " by after the second current portion 40B, each bad packaged chip C " will be collected, to carry out follow-up relevant treatment program.
In addition, coordinate shown in Figure 1A and Fig. 1 D, first embodiment of the invention also comprises: supply unit 5, die orientation detecting unit 6 and a die orientation adjustment unit 7.Supply unit 5 has at least one vicinity first rotary unit 1 and according to different sequential with the delivery element 50 of sequentially each the first holding part 12 corresponding.Die orientation detecting unit 6 adjacent conveyor unit 5 and the first rotary unit 1, and die orientation detecting unit 6 has one is positioned at speculum below packaged chip C 61 and and is positioned at the other die orientation image zooming-out element 62 of a side of speculum 61.Die orientation image zooming-out element 62 by the reflection of speculum 61 to extract the image bottom packaged chip C.Die orientation adjustment unit 7 there is an adjacent chips orientation detection unit 6 and for is carried out adjusting in the orientation of packaged chip C die orientation adjustment suction nozzle 70.In other words, when die orientation detecting unit 6 detects that the orientation of packaged chip C is wrong, the die orientation adjustment unit 7 namely by the next stop carrys out rotary seal cartridge chip C, is positioned in correct orientation to make packaged chip C.
In addition, as shown in Figure 1A, first embodiment of the invention also comprises: a bridge-jointing unit 8, it has at least one bridging element 80 be arranged between the first rotary unit 1 and the second rotary unit 3, and each the packaged chip C that detected by chip testing modular 20 will be transported in the second holding part 32 of the second rotary unit 3 from the first holding part 12 of the first rotary unit 1 by bridging element 80, to make each well packaged chip C ' and each bad packaged chip C " can through sorting chips module 40 to carry out follow-up classification action.
Moreover, as shown in Figure 1A, first embodiment of the invention also comprises: a chip surface detecting unit 9, its contiguous second rotary unit 3 and between chip testing modular 20 and sorting chips module 40, wherein chip surface detecting unit 9 has and is at least onely positioned at the chip front side image zooming-out element 91 of the top of packaged chip C and at least one chip back image zooming-out element 92 being positioned at the below of packaged chip C.In other words, user obtains the image information of packaged chip C upper surface by chip front side image zooming-out element 91 (such as digital camera), and user obtains the image information of packaged chip C lower surface by chip back image zooming-out element 92 (such as digital camera).Therefore, cooperatively interacting, to filter out the packaged chip C with correct upper surface image information and lower surface image information by chip front side image zooming-out element 91 and chip back image zooming-out element 92.
In addition, as shown in Figure 1A, first embodiment of the invention also comprises: a load bearing unit B, and it has at least one bearing chassis B1, and wherein the first rotatable turntable 11 and the second rotatable turntable 31 all can be arranged on bearing chassis B1.Certainly, bearing chassis B1 also can be divided into two separating bottom (not shown) separated from one another, and the first rotatable turntable 11 and the second rotatable turntable 31 can be arranged in above-mentioned two separating bottom (not shown) respectively.
(the second embodiment)
Refer to shown in Fig. 2 A and Fig. 2 B, second embodiment of the invention provides a kind of packaged chip detection and classification device, and it comprises: one for carrying rotary unit 1 ', chip testing unit 2, sorting chips unit 4, supply unit 5, die orientation detecting unit 6, die orientation adjustment unit 7 and a chip surface detecting unit 9 of multiple packaged chip.From both the comparison of both Fig. 2 A and Figure 1A and Fig. 2 B and Figure 1B relatively, second embodiment of the invention and the maximum difference of the first embodiment are: second implements to omit wherein one group of rotary unit (that is second rotary unit 3 omitted in the first embodiment).
In a second embodiment, rotary unit 1 ' has at least one rotatable turntable 11 ', is multiplely arranged at holding part 12 ' in rotatable turntable 11 ' and multiple dual-purpose opening 13 ' of suction and discharge be arranged at respectively in above-mentioned multiple holding part 12 ', wherein optionally holds at least one in above-mentioned multiple packaged chip C in each holding part 12 '.For example, above-mentioned multiple holding part 12 ' can be arranged at the outside of rotatable turntable 11 ' around ground, to make each holding part 12 ' produce an opening outwardly, each packaged chip C then enters in each holding part 12 ' by each opening outwardly.
In a second embodiment, chip testing unit 2 has at least one contiguous rotary unit 1 ' and chip testing modular 20 for testing each packaged chip C.For example, as shown in Figure 1 C, each packaged chip C can be a kind of square surface pin-free package chip, and each packaged chip C has multiple conductive welding pad (not shown).In addition, chip testing modular 20 has multiple for optionally each packaged chip C in electrical contact and for judging that each packaged chip C is well packaged chip C ' or bad packaged chip C " detector probe (not shown) and at least one mobile suction nozzle (not shown) of going above-mentioned multiple detector probe (not shown) in electrical contact for mobile each packaged chip C.
In a second embodiment, sorting chips unit 4 has at least one contiguous rotary unit 1 ' and for the sorting chips module 40 of the above-mentioned multiple packaged chip C that classifies.For example, sorting chips module 40 has at least one the first current portion 40A for receiving each well packaged chip C ' and at least one for receiving each bad packaged chip C " the second current portion 40B.In general, after each well packaged chip C ' is by the first current portion 40A, each well packaged chip C ' will sequentially be placed in the encapsulation groove T1 of a winding T, to carry out follow-up packing chip program.As each bad packaged chip C " by after the second current portion 40B, each bad packaged chip C " will be collected, to carry out follow-up relevant treatment program.
In a second embodiment, supply unit 5 has at least one contiguous rotary unit 1 ' and according to different sequential with the delivery element 50 of sequentially each holding part 12 ' corresponding.Die orientation detecting unit 6 adjacent conveyor unit 5 and rotary unit 1 '.Die orientation adjustment unit 7 there is an adjacent chips orientation detection unit 6 and for is carried out adjusting in the orientation of packaged chip C die orientation adjustment suction nozzle 70.The contiguous rotary unit 1 of chip surface detecting unit 9 and between chip testing modular 20 and sorting chips module 40, wherein chip surface detecting unit 9 has and is at least onely positioned at the chip front side image zooming-out element 91 of the top of packaged chip C and at least one chip back image zooming-out element 92 being positioned at the below of packaged chip C.
Moreover second embodiment of the invention also comprises: a load bearing unit B, it has at least one bearing chassis B1, and wherein rotatable turntable 11 ' can be arranged on bearing chassis B1.
(possible effect of embodiment)
In sum, the packaged chip detection and classification device that the embodiment of the present invention provides, it coordinates by " rotary unit (the first rotary unit and the second rotary unit), chip testing unit and sorting chips unit ", can be used for the packaged chip (such as QFN chip) of detection and classification without pin to make packaged chip detection and classification device of the present invention.
The foregoing is only better possible embodiments of the present invention, non-ly therefore limit to right of the present invention, therefore the equivalence techniques change of such as using specification of the present invention and accompanying drawing content to do, be all included within the scope of the present invention.
Claims (15)
1. a packaged chip detection and classification device, is characterized in that, comprising:
One for carrying the rotary unit of multiple packaged chip, it has at least one rotatable turntable, is multiplely arranged at holding part in above-mentioned at least one rotatable turntable and multiple dual-purpose opening of suction and discharge be arranged at respectively in above-mentioned multiple holding part, wherein optionally can hold at least one in above-mentioned multiple packaged chip in each holding part;
One chip testing unit, it has this rotary unit of at least one vicinity and chip testing modular for testing each packaged chip, and above-mentioned at least one chip testing modular has multiple for optionally each packaged chip in electrical contact and for judging that each packaged chip is the detector probe of well packaged chip or bad packaged chip and at least one mobile suction nozzle going above-mentioned multiple detector probe in electrical contact for each packaged chip mobile;
One sorting chips unit, it has this rotary unit of at least one vicinity and for the sorting chips module of above-mentioned multiple packaged chip of classifying;
One die orientation detecting unit, its this supply unit contiguous and this rotary unit, wherein this die orientation detecting unit has the die orientation image zooming-out element that a speculum and be positioned at below this packaged chip is positioned at a side side of this speculum;
One die orientation adjustment unit, it has this die orientation detecting unit contiguous and die orientation adjustment suction nozzle for being carried out adjusting in the orientation of this packaged chip.
2. packaged chip detection and classification device as claimed in claim 1, is characterized in that, also comprise: a supply unit, and it has this rotary unit of at least one vicinity and according to different sequential with the delivery element of sequentially each holding part corresponding.
3. packaged chip detection and classification device as claimed in claim 1, it is characterized in that, also comprise: a load bearing unit, it has at least one bearing chassis, and wherein above-mentioned at least one rotatable turntable is arranged in above-mentioned at least one bearing chassis.
4. packaged chip detection and classification device as claimed in claim 1, it is characterized in that, above-mentioned multiple holding part is arranged at the outside of above-mentioned at least one rotatable turntable around ground.
5. packaged chip detection and classification device as claimed in claim 1, it is characterized in that, above-mentioned at least one sorting chips module has at least one the first current portion for receiving each well packaged chip and at least one the second current portion for receiving each bad packaged chip.
6. packaged chip detection and classification device as claimed in claim 1, it is characterized in that, also comprise: a chip surface detecting unit, its this rotary unit contiguous and between above-mentioned at least one chip testing modular and above-mentioned at least one sorting chips module, wherein this chip surface detecting unit has and is at least onely positioned at the chip front side image zooming-out element of the top of this packaged chip and at least one chip back image zooming-out element being positioned at the below of this packaged chip.
7. a packaged chip detection and classification device, is characterized in that, comprising:
One for carrying the first rotary unit of multiple packaged chip, it has at least one first rotatable turntable, is multiplely arranged at the first holding part in above-mentioned at least one first rotatable turntable and multiple dual-purpose opening of the first suction and discharge be arranged at respectively in above-mentioned multiple first holding part, wherein optionally can hold at least one in above-mentioned multiple packaged chip in each first holding part;
One chip testing unit, it has this first rotary unit of at least one vicinity and chip testing modular for testing each packaged chip, and wherein above-mentioned at least one chip testing modular has multiple for optionally each packaged chip in electrical contact and for judging that each packaged chip is the detector probe of well packaged chip or bad packaged chip and at least one mobile suction nozzle going above-mentioned multiple detector probe in electrical contact for each packaged chip mobile; ;
One second rotary unit, its this first rotary unit contiguous, wherein this second rotary unit has at least one second rotatable turntable, is multiplely arranged at the second holding part in above-mentioned at least one second rotatable turntable and multiple dual-purpose opening of the second suction and discharge be arranged at respectively in above-mentioned multiple second holding part, wherein optionally holds at least one in the multiple packaged chips transported by above-mentioned first rotary unit in each second holding part;
One bridge-jointing unit, it has at least one bridging element be arranged between the first rotary unit and the second rotary unit;
One sorting chips unit, it has this second rotary unit of at least one vicinity and for the sorting chips module of above-mentioned multiple packaged chip of classifying;
One supply unit, wherein this supply unit has this first rotary unit of at least one vicinity and according to different sequential with the delivery element of sequentially each the first holding part corresponding;
One die orientation detecting unit, wherein this die orientation detecting unit this supply unit contiguous and this first rotary unit, and this die orientation detecting unit has the die orientation image zooming-out element that a speculum and be positioned at below this packaged chip is positioned at a side side of this speculum; And
One die orientation adjustment unit, wherein this die orientation adjustment unit has this die orientation detecting unit contiguous and die orientation adjustment suction nozzle for being carried out adjusting in the orientation of this packaged chip.
8. packaged chip detection and classification device as claimed in claim 7, it is characterized in that, also comprise: a load bearing unit, it has at least one bearing chassis, and wherein above-mentioned at least one first rotatable turntable and above-mentioned at least one second rotatable turntable are all arranged in above-mentioned at least one bearing chassis.
9. packaged chip detection and classification device as claimed in claim 7, it is characterized in that, above-mentioned multiple first holding part is arranged at the outside of above-mentioned at least one first rotatable turntable around ground, and above-mentioned multiple second holding part is arranged at the outside of above-mentioned at least one second rotatable turntable around ground.
10. packaged chip detection and classification device as claimed in claim 7, it is characterized in that, above-mentioned at least one sorting chips module has at least one the first current portion for receiving each well packaged chip and at least one the second current portion for receiving each bad packaged chip.
11. packaged chip detection and classification devices as claimed in claim 7, it is characterized in that, also comprise: a chip surface detecting unit, its this second rotary unit contiguous and between above-mentioned at least one chip testing modular and above-mentioned at least one sorting chips module, wherein this chip surface detecting unit has and is at least onely positioned at the chip front side image zooming-out element of the top of this packaged chip and at least one chip back image zooming-out element being positioned at the below of this packaged chip.
12. 1 kinds of packaged chip detection and classification devices, is characterized in that, comprising:
One for carrying the first rotary unit of multiple packaged chip, and it has at least one first rotatable turntable, is multiplely arranged at the first holding part in above-mentioned at least one first rotatable turntable and multiple dual-purpose opening of the first suction and discharge be arranged at respectively in above-mentioned multiple first holding part;
One second rotary unit, its this first rotary unit contiguous, wherein this second rotary unit has at least one second rotatable turntable, is multiplely arranged at the second holding part in above-mentioned at least one second rotatable turntable and multiple dual-purpose opening of the second suction and discharge be arranged at respectively in above-mentioned multiple second holding part;
One bridge-jointing unit, it has at least one bridging element be arranged between the first rotary unit and the second rotary unit; One chip testing unit, it has this first rotary unit of at least one vicinity and chip testing modular for testing each packaged chip, and wherein above-mentioned at least one chip testing modular has multiple for optionally each packaged chip in electrical contact and for judging that each packaged chip is the detector probe of well packaged chip or bad packaged chip and at least one mobile suction nozzle going above-mentioned multiple detector probe in electrical contact for each packaged chip mobile;
One sorting chips unit, it has this second rotary unit of at least one vicinity and for the sorting chips module of above-mentioned multiple packaged chip of classifying;
One supply unit, wherein this supply unit has this first rotary unit of at least one vicinity and according to different sequential with the delivery element of sequentially each the first holding part corresponding;
One die orientation detecting unit, wherein this die orientation detecting unit this supply unit contiguous and this first rotary unit, and this die orientation detecting unit has the die orientation image zooming-out element that a speculum and be positioned at below this packaged chip is positioned at a side side of this speculum; And
One die orientation adjustment unit, wherein this die orientation adjustment unit has this die orientation detecting unit contiguous and die orientation adjustment suction nozzle for being carried out adjusting in the orientation of this packaged chip.
13. packaged chip detection and classification devices as claimed in claim 12, it is characterized in that, also comprise: a load bearing unit, it has at least one bearing chassis, and wherein above-mentioned at least one first rotatable turntable and above-mentioned at least one second rotatable turntable are all arranged in above-mentioned at least one bearing chassis; Wherein above-mentioned multiple first holding part is arranged at the outside of above-mentioned at least one first rotatable turntable around ground, and above-mentioned multiple second holding part is arranged at the outside of above-mentioned at least one second rotatable turntable around ground.
14. packaged chip detection and classification devices as claimed in claim 12, it is characterized in that, above-mentioned at least one sorting chips module has at least one the first current portion for receiving each well packaged chip and at least one the second current portion for receiving each bad packaged chip.
15. packaged chip detection and classification devices as described in claim 12, it is characterized in that, also comprise: a chip surface detecting unit, its this second rotary unit contiguous and between above-mentioned at least one chip testing modular and above-mentioned at least one sorting chips module, wherein this chip surface detecting unit has and is at least onely positioned at the chip front side image zooming-out element of the top of this packaged chip and at least one chip back image zooming-out element being positioned at the below of this packaged chip.
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| CN201110069606.7A CN102683166B (en) | 2011-03-18 | 2011-03-18 | Packaged-chip detecting and classifying device |
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| CN201110069606.7A CN102683166B (en) | 2011-03-18 | 2011-03-18 | Packaged-chip detecting and classifying device |
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| TW201638600A (en) * | 2015-04-22 | 2016-11-01 | All Ring Tech Co Ltd | Electronic component classification method and device |
| TWI630852B (en) * | 2015-05-12 | 2018-07-21 | 萬潤科技股份有限公司 | Electronic component packaging carrier tape replenishment method and device |
| TWI572858B (en) * | 2015-05-12 | 2017-03-01 | All Ring Tech Co Ltd | Method and device for detecting the loading of electronic components |
| TWI590876B (en) * | 2015-10-23 | 2017-07-11 | All Ring Tech Co Ltd | Electronic component classification method and device |
| CN109541439B (en) * | 2018-12-10 | 2020-11-13 | 通富微电子股份有限公司 | Adjusting method, detecting device and adjusting system for chip testing feeding direction |
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