CN102650718A - Refrigeration-type coaxial packaging light-emitting tube core - Google Patents
Refrigeration-type coaxial packaging light-emitting tube core Download PDFInfo
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- CN102650718A CN102650718A CN2011100478448A CN201110047844A CN102650718A CN 102650718 A CN102650718 A CN 102650718A CN 2011100478448 A CN2011100478448 A CN 2011100478448A CN 201110047844 A CN201110047844 A CN 201110047844A CN 102650718 A CN102650718 A CN 102650718A
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Abstract
The invention provides a refrigeration-type coaxial packaging light-emitting tube core, which comprises a transistor outline (TO) tube shell, a refrigerator, a heat sink, a laser carrier and a sealing tube cap, wherein the TO tube shell comprises a tube shell base. At least seven pins are arranged around the tube shell base; the pins comprise a radio frequency (RF) signal pin, and the laser carrier with a microstrip line is arranged on the RF signal pin; the radiating surface of the refrigerator and the surface of the tube shell base are fixed in the manner of sticking; the refrigeration surface of the refrigerator and the surface of the heat sink are fixed in the manner of sticking; the heat sink and the surface of the laser carrier with a matched resistor and the microstrip line are fixed in the manner of sticking; an electric absorption modulation laser chip, a backlight detector, a thermistor and a power filter capacitor are fixedly arranged on the surface of the laser carrier in the manner of sticking; one end of the microstrip line of the laser carrier is connected with the anode of an electric absorption modulator; and the other end of the microstrip line of the laser carrier is connected with a microstrip line on the RF signal pin through a conductor wire. When installation is performed, the emitted light outlet optical axis of the laser chip and the optical axis (OA) of the central axis of the TO tube shell are coaxial. Optical steering elements are not needed, the process is simple, and the signal distortion can be reduced.
Description
Technical field
the present invention relates to a kind of optical communication system with coaxial packaging light-emitting tube core, relate in particular to a kind of refrigeration type coaxial packaging light-emitting tube core.
Background technology
coaxial packaging light emission component of the prior art; Comprise a coaxial encapsulation light-emitting tube core and a fiber adapter; Coaxial packaging light-emitting tube core divides refrigeration type and no refrigeration type again; The refrigeration type coaxial packaging light-emitting tube core 200 that is adopted among the U.S. Patent Publication US20070159773A1 as shown in Figure 1; Comprise that elements such as a chip of laser 201, back light detector 202, light steering component 203, the carrier 204 that contains circuit component and refrigerator 205 are installed on TO-CAN (Transistor Outline-CAN) base 206, and through flat window pipe cap 207 sealings.Chip of laser 201 levels are mounted on carrier 204 surfaces in this structure; And chip of laser 201 lateral emittings; Its bright dipping optical axis 210 is because in horizontal direction; Therefore especially be vertical with the optical axis OA (also being TO-CAN base 206 central shafts) of external fiber adapter, needing could be consistent with fiber adapter optical axis OA after with 90 ° of angles of bright dipping optical axis 210 commentaries on classics of chip of laser 201 through light steering component 203, and optically-coupled is exported.The refrigeration type coaxial packaging light-emitting tube core production process of this structure is complicated; Cost is high; Optically-coupled is aimed at difficult; And the modulation signal of laser instrument is through the 209 pressure welding connected mode feed-ins of the conductor wire between the pin 208 of carrier 204 and TO-CAN base 206 bottoms, makes modulation signal feed-in circuit have the serious unmatched shortcoming of impedance because its conductor wire 209 is long, and serious distortion can take place signal in the time of can causing transmitting the High Speed Modulation signal more than the 2.5Gb/s.
Summary of the invention
The components and parts that
the present invention provides a kind of High Speed Modulation signal to use are few, and technology is simple, the refrigeration type coaxial packaging light-emitting tube core that cost is low.
are for reaching above goal of the invention; The present invention provides a kind of refrigeration type coaxial packaging light-emitting tube core; Comprise: a TO shell, a refrigerator, one heat sink, sealing pipe cap that a laser instrument carrier and is provided with optical window, said TO shell comprises a shell base, is provided with at least 7 pins around it; Comprising a RF radiofrequency signal pin, the carrier of a band microstrip line is installed on it; Said refrigerator lower surface is that the sticking dress of radiating surface and said shell base top center surface is fixing; Its upper surface is that the sticking dress of chill surface and said heat sink lower surface surface is fixing; Said heat sink front is fixing with the sticking dress in said laser instrument carrier base surface with a build-out resistor and a microstrip line; Electroabsorption Modulated Laser chip, a back light detector, a thermistor and a power filtering capacitor of the fixing lateral emitting of the sticking dress in this laser instrument carrier top surface; One end of the microstrip line of said laser instrument carrier is connected with the electroabsorption modulator of Electroabsorption Modulated Laser chip is anodal; The other end is connected through conductor wire with microstrip line on the said RF radiofrequency signal pin; During installation, make the central shaft OA of radiative bright dipping optical axis and TO shell of said Electroabsorption Modulated Laser chip coaxial, and outwards export through the optical window of said sealing pipe cap.
said pin is 7; Connect respectively: the semiconductor laser diode LD of the positive and negative electrode of said refrigerator, said Electroabsorption Modulated Laser chip and the positive pole of electroabsorption modulator, said back light detector positive pole, said thermistor be an end and ground connection GND wherein, the said thermistor other end and semiconductor laser diode LD and electroabsorption modulator and said back light detector three's minus earth GND.
said sealing pipe cap is a flat window pipe cap.
said sealing pipe cap is one to be provided with the pipe cap of globe lens.
said sealing pipe cap is one to be provided with the pipe cap of non-globe lens.
In
said structure; Microstrip line on microstrip line on the RF radiofrequency signal pin and the laser instrument carrier is connected through the conductor wire of shorter length; To realize the High Speed Modulation signal feed-in of electroabsorption modulator; Can reduce distorted signals, laser works speed can be reached more than the 10Gb/s.Chip of laser bright dipping optical axis and TO shell central shaft OA are coaxial, have saved the optical inversion element, have simplified the packaging technology of light-emitting tube core simultaneously.The band refrigeration type axis light of this structure emission tube core and external optical element such as elements such as optoisolator, fiber adapter are of coupled connections then just can be made into outward appearance and meet 10Gb/s miniature device multi-source agreement (Multi-Source Agreement of 10Gb/s Miniature Device; Abbreviation XMD) axis light emitting module (the Transmitter Optical Sub-Assembly in; Be called for short TOSA); Simultaneously also can be applied to all kinds of PON (Passive Optical Network) assembly, like the transmitting illuminant of single fiber bi-directional dual-port assembly, single fiber bi-directional three port assemblies etc.
Description of drawings
Fig. 1 representes the structural representation of the refrigeration type coaxial packaging light-emitting tube core of prior art;
Fig. 2 representes the structural representation of refrigeration type coaxial packaging light-emitting tube core of the present invention;
Fig. 3 representes the blast structural representation of refrigeration type coaxial packaging light-emitting tube core shown in Figure 2.
Embodiment
are described most preferred embodiment of the present invention in detail below in conjunction with accompanying drawing.
The refrigeration type coaxial packaging light-emitting tube core 100 that
are as shown in Figure 2; Comprise: a shell 10, a refrigerator 20, one heat sink 30, one laser instrument carrier 40 and are provided with the sealing pipe cap 50 of optical window; This pipe cap can be flat window pipe cap, also can be the pipe cap that is provided with globe lens or non-globe lens, carries out selecting for use of pipe cap lens according to the different designs of coupling optical path; Optical window outside surface plating antireflection film is to reduce the influence of reflected light to laser instrument.
The refrigeration type coaxial packaging light-emitting tube core 100 that
are as shown in Figure 3; TO shell 10 comprises a shell base 11; Be provided with at least 7 pins 14 around it,, the carrier 12 of a band microstrip line 13 be installed on it comprising a RF radiofrequency signal pin.Refrigerator 20 lower surfaces are that radiating surface 21 is fixing with the sticking dress in shell base 11 top center, 15 surfaces; Its upper surface is that chill surface 22 is fixing with the sticking dress in heat sink 30 lower surfaces, 31 surfaces; Heat sink 30 front 32 is fixing with the sticking dress of laser instrument carrier 40 lower surface with a build-out resistor 43 and a microstrip line 45; The Electroabsorption Modulated Laser chip 41 of the fixing lateral emitting of the sticking dress of these laser instrument carrier 40 top surfaces, a back light detector 42, a thermistor 44 and a power filtering capacitor 46; One end of the microstrip line 45 on the laser instrument carrier 40 is connected with the electroabsorption modulator of Electroabsorption Modulated Laser chip 41 is anodal; Microstrip line 13 on the other end and the RF radiofrequency signal pin is connected through conductor wire, to realize the feed-in of Electroabsorption Modulated Laser chip 41 High Speed Modulation signals.During installation, make the central shaft OA of radiative bright dipping optical axis and TO shell 10 of Electroabsorption Modulated Laser chip 41 coaxial, and outwards export through the optical window of sealing pipe cap 50.Pin 14 the bests are 7, connect the positive and negative electrode of refrigerator 20 respectively; The semiconductor laser diode LD of Electroabsorption Modulated Laser chip 41 anodal (its negative pole is connected with ground connection GND); Electroabsorption modulator anodal (negative pole is connected with ground connection GND); Back light detector 42 positive poles (negative pole is connected with ground connection GND); Thermistor 44 is an end (other end is connected with ground connection GND) and ground connection GND wherein.Except that ground connection GND with conductive solder such as AgCu28 scolder and 11 welding of shell base, adopt the electric isolating seal of glass insulator sintering to be connected between other pin and the shell base 11.The semiconductor laser diode LD of being supplied with Electroabsorption Modulated Laser chip 41 by external power source is biased electric current; It is anodal to connect electroabsorption modulator through High Speed Modulation signal feed-in RF radiofrequency signal pin; Negative pole is connected with ground pad, and power supply absorbs the modulator FD feed.
In the assembling process of
refrigeration axis light emission of the present invention tube core; Radiating surface 21 usefulness conductive solder with refrigerator 20 mount shell base 11 top center 15 earlier; Laser instrument carrier 40 is a base material with aluminium nitride (AlN) or the high material of other heat transfer efficiency; Be positioned at laser instrument carrier 40 top surfaces with conductive solder (like 80Au20Sn) mounted Electroabsorption Modulated Laser chip 41, back light detector 42,, thermistor 44 and power filtering capacitor 46; Laser instrument carrier 40 usefulness conducting resinls or conductive solder mounted on heat sink 30 the front 32; Again heat sink 30 lower surfaces, 31 usefulness conductive solder are mounted on the chill surface 22 of refrigerator 20; And make Electroabsorption Modulated Laser chip 41 bright dipping optical axises and TO shell 10 central shaft OA coaxial, will seal pipe cap 50 and shell base 11 sealing welding completion overall package after accomplishing the conductor wire pressure welding.Electroabsorption Modulated Laser chip 41 is integrated by the semiconductor laser of electroabsorption modulator and lateral emitting, forms the electric absorption externally modulated laser.Thermistor 44 is chip-scale element pasted on surface, is used for the temperature monitoring of Electroabsorption Modulated Laser chip 41.Back light detector 42 is photodiodes of a kind of chip-scale, is mounted on the direction backlight of Electroabsorption Modulated Laser chip 41, is used to monitor the backlight power of laser instrument.Power filtering capacitor 46 is a kind of chip capacities, is used for the power supply noise that Electroabsorption Modulated Laser chip 41 is supplied with in filtering.Build-out resistor 43 on the laser instrument carrier 40 is sheet resistances, is used for the High Speed Modulation signal input impedance matching of electroabsorption modulator.Refrigerator 20 is semiconductor coolers of a kind of miniaturization; Utilize Peltier (Peltier) effect conversion thermal energy; Its radiating surface 21 and chill surface 22 are generally processed by pottery or aluminium nitride (AlN) material or the good material of other heat conduction; The thermopair that is pasted with the bismuth telluride semiconductor material formation of a plurality of N types and P type between the two sides is in series; The electrode at thermopair two ends is drawn in radiating surface 21 inboards, and the outside surface metallization of radiating surface 21 and chill surface 22 as gold-plated so that mount also can be at outside surface elder generation's pre-burned one deck conductive solder such as 58Bi42Sn so that mount.
Claims (5)
1. refrigeration type coaxial packaging light-emitting tube core; It is characterized in that; Comprise: a TO shell (10), a refrigerator (20), one heat sink (30), a laser instrument carrier (40) and are provided with the sealing pipe cap (50) of optical window, and said TO shell (10) comprises a shell base (11), are provided with at least 7 pins (14) around it; Comprising a RF radiofrequency signal pin, the carrier (12) of a band microstrip line (13) is installed on it; Said refrigerator (20) lower surface is that radiating surface (21) is fixing with the sticking dress in said shell base (11) top center (15) surface; Its upper surface is that chill surface (22) is fixing with the sticking dress in said heat sink (30) lower surfaces (31) surface; The front of said heat sink (30) (32) is fixing with the sticking dress of said laser instrument carrier (40) lower surface with a build-out resistor (43) and microstrip line (45); Electroabsorption Modulated Laser chip (41), a back light detector (42), a thermistor (44) and a power filtering capacitor (46) of the fixing lateral emitting of the sticking dress of this laser instrument carrier (40) top surface; One end of the microstrip line (45) on the said laser instrument carrier (40) is connected with the electroabsorption modulator of Electroabsorption Modulated Laser chip (41) is anodal; The other end is connected through conductor wire with microstrip line (13) on the said RF radiofrequency signal pin; During installation; Make the central shaft OA of radiative bright dipping optical axis and TO shell (10) of said Electroabsorption Modulated Laser chip (41) coaxial, and outwards export through the optical window of said sealing pipe cap (50).
2. refrigeration type coaxial packaging light-emitting tube core according to claim 1; It is characterized in that; Said pin (14) is 7; Connect respectively: the semiconductor laser diode LD of the positive and negative electrode of said refrigerator (20), said Electroabsorption Modulated Laser chip (41) and the positive pole of electroabsorption modulator, said back light detector (42) positive pole, said thermistor (44) be an end and ground connection GND wherein, said thermistor (44) other end and semiconductor laser diode LD and electroabsorption modulator and said back light detector (42) three's minus earth GND.
3. refrigeration type coaxial packaging light-emitting tube core according to claim 1 is characterized in that said sealing pipe cap (50) is a flat window pipe cap.
4. refrigeration type coaxial packaging light-emitting tube core according to claim 1 is characterized in that, said sealing pipe cap (50) is one to be provided with the pipe cap of globe lens.
5. refrigeration type coaxial packaging light-emitting tube core according to claim 1 is characterized in that, said sealing pipe cap (50) is one to be provided with the pipe cap of non-globe lens.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100478448A CN102650718A (en) | 2011-02-28 | 2011-02-28 | Refrigeration-type coaxial packaging light-emitting tube core |
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| CN2011100478448A CN102650718A (en) | 2011-02-28 | 2011-02-28 | Refrigeration-type coaxial packaging light-emitting tube core |
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Application publication date: 20120829 |