CN102569669A - Organic electroluminescent device - Google Patents
Organic electroluminescent device Download PDFInfo
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- CN102569669A CN102569669A CN2012100636427A CN201210063642A CN102569669A CN 102569669 A CN102569669 A CN 102569669A CN 2012100636427 A CN2012100636427 A CN 2012100636427A CN 201210063642 A CN201210063642 A CN 201210063642A CN 102569669 A CN102569669 A CN 102569669A
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- electroluminescent device
- layer
- glue material
- organnic electroluminescent
- organic
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- 239000000463 material Substances 0.000 claims abstract description 122
- 239000003292 glue Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 156
- 230000004888 barrier function Effects 0.000 claims description 41
- 230000001413 cellular effect Effects 0.000 claims description 25
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 7
- 239000012812 sealant material Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- -1 acryl Chemical group 0.000 claims description 4
- 239000004568 cement Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000004020 conductor Substances 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- RQIPKMUHKBASFK-UHFFFAOYSA-N [O-2].[Zn+2].[Ge+2].[In+3] Chemical compound [O-2].[Zn+2].[Ge+2].[In+3] RQIPKMUHKBASFK-UHFFFAOYSA-N 0.000 description 2
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
An organic electroluminescent device. The device comprises a substrate, an organic electroluminescent element layer, a first filling adhesive material, a second filling adhesive material and a cover plate. The organic electroluminescent element layer is arranged on the substrate, wherein the organic electroluminescent element layer is provided with a plurality of pixel unit areas. The first filling glue material is coated in the pixel unit area of the organic electroluminescent element layer so as to partially cover the organic electroluminescent element layer. The second filling rubber material covers the first filling rubber material. The cover plate covers the second filling rubber material and is in contact with the second filling rubber material.
Description
[technical field]
The invention relates to a kind of Organnic electroluminescent device.
[background technology]
Organnic electroluminescent device is a kind of device of self-luminosity; It has wide viewing angle, power saving, program is simple and easy, low-cost, operating temperature is extensive, the advantage of high answer speed and full-colorization or the like; Make it have great potentiality, therefore be expected to become the main flow of flat-panel screens of future generation.In general; Comprise a plurality of image element structures in the Organnic electroluminescent device, this image element structure comprises that a plurality of active members (for example: thin-film transistor) or passive device (for example: resistance, electric capacity or inductance), the anode, organic luminous layer and the negative electrode that electrically connect with active member.
Because the luminous organic material in the Organnic electroluminescent device receives influence and the deterioration of extraneous oxygen and aqueous vapor easily; Therefore generally on substrate, accomplish after the making of organic electroluminescent device; The capital utilizes cover plate and fluid sealant material (sealant) with sealing organic electroluminescent element; And drier is set between substrate and cover plate or fills glue material (filler); Wherein drier or filling glue material are covered in the surface of organic electroluminescent device in large area, invade in the organic electroluminescent device effectively to block aqueous vapor and oxygen, and this technology is commonly referred to as the material technology (Dam and Fill Technology) of filling.
Fill the Organnic electroluminescent device that the glue material blocks aqueous vapor and oxygen for using, the problem that it faced is to be that the filling glue material that large tracts of land covers is being cured program, has the risk that causes the organic electroluminescent device surface damage.In other words; Owing to fill the surface that the glue material is covered in organic electroluminescent device in large area, follow-up when being cured the program of filling the glue material, the polymerization reaction of filling the glue material is shunk its volume moment; Cause the surface tension of the contact-making surface of itself and organic electroluminescent device to increase; So be prone to make the filling glue material be full of cracks of curing and can't block aqueous vapor and oxygen effectively, and, influence device usefulness to causing damage in the surface of organic electroluminescent device.
[summary of the invention]
The present invention provides a kind of Organnic electroluminescent device, and it can reduce fills the risk that causes the damage on organic electroluminescent device surface after the glue material solidifies.
The present invention proposes a kind of Organnic electroluminescent device, and this device comprises substrate, organic electroluminescent device layer, the first filling glue material, second filling glue material and the cover plate.The organic electroluminescent device layer is positioned on the said substrate, and wherein said organic electroluminescent device layer has a plurality of picture element cellular zones.First fills the glue material is coated in the said picture element cellular zone of said organic electroluminescent device layer, to cover said organic electroluminescent device layer partly.Second fills the glue material covers on the said first filling glue material.Cover plate covers on the said second filling glue material and with the said second filling glue material and contacts.
Based on above-mentioned, because filling the glue material with first, the present invention is coated in the picture element cellular zone of organic electroluminescent device layer, to be coated with the organic electro luminescent element layer partly.After solidifying the first filling glue material; Just filling the glue material with second covers on the first filling glue material; After curing, chap and damage organic electroluminescent device because of large tracts of land is arranged at filling glue material between substrate and the cover plate avoiding, so that the complete seal organic electroluminescent device.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphic elaborating as follows.
[description of drawings]
Fig. 1 is the circuit diagram according to the Organnic electroluminescent device of one embodiment of the invention.
Fig. 2 is the partial cutaway schematic according to the Organnic electroluminescent device of the embodiment of the invention.
Fig. 3 is the partial cutaway schematic of a picture element cellular zone wherein in the Organnic electroluminescent device of Fig. 2.
Fig. 4 is according to the partial cutaway schematic of a picture element cellular zone wherein in the Organnic electroluminescent device of second embodiment of the invention.
[main element symbol description]
10,20: Organnic electroluminescent device
100: substrate
102: the first electrode layers
110: the pixel array layer
120: organic luminous layer
130: the second electrode lay
140: protective layer
150: the first barrier layers
160: the organic electroluminescent device layer
162: the first packing materials
164: the second packing materials
170: cover plate
180: the fluid sealant material
250: the second barrier layers
1001: the picture element cellular zone
A: channel layer
C: capacitor
C01: first opening
C03: second opening
D: drain electrode
DL1~DL3; Data wire
F: flatness layer
G: grid
I01: first dielectric layer
I03: second dielectric layer
OLED: organic illuminating element
PL1~PL3: power line
S: source electrode
SL1~SL2: scan line
T1, T2: active member
[embodiment]
First embodiment
Fig. 1 is the circuit diagram of Organnic electroluminescent device according to an embodiment of the invention.Fig. 2 is the partial cutaway schematic according to the Organnic electroluminescent device of first embodiment of the invention.Fig. 3 is the corresponding wherein partial cutaway schematic of a picture element unit in the Organnic electroluminescent device of Fig. 2.
Please with reference to Fig. 1 and Fig. 2, Organnic electroluminescent device 10 comprises that substrate 100, organic electroluminescent device layer 160, first fill glue material 162, second and fill glue material 164 and cover plate 170.According to present embodiment, Organnic electroluminescent device 10 further comprises fluid sealant material 180.
Organic electroluminescent device layer 160 is positioned on the substrate 100, and wherein organic electroluminescent device layer 160 has a plurality of picture element cellular zones 1001.According to present embodiment; Organic electroluminescent device layer 160 comprises multi-strip scanning line SL1~SL2, many data wire DL1~DL3 and many power line PL1~PL3, and comprise at least one active member T1 in each picture element cellular zone 1001 of organic electroluminescent device layer 160, T2, capacitor C and the organic illuminating element OLED that electrically connects with active member T2.Picture element cellular zone 1001 with first row, first row is an example; Active member T1 and scan line SL1 and data wire DL1 electrically connect; Active member T2 and active member T1 and power line PL1 electrically connect; Capacitor C and active member T1, T2 electrically connect, and organic illuminating element OLED and capacitor C and active member T2 electric connection.In the present embodiment, each picture element cellular zone 1001 is be that example is explained with two active members capacitors of collocation (2T1C), but is not in order to limiting the present invention, and the present invention does not limit the interior active member of each picture element cellular zone 1001 and the number of capacitor.
First fills glue material 162 is coated in the picture element cellular zone 1001 of said organic electroluminescent device layer 160, to cover said organic electroluminescent device layer 160 partly.Second fills glue material 164 covers on the said first filling glue material 162.In order to explain that clearly first of present embodiment fills glue material 162 and second and fill glue material 164 positions with respect to organic electroluminescent device layer 160, Fig. 3 further shows the corresponding wherein partial cutaway schematic of a picture element cellular zone 1001 in the Organnic electroluminescent device of Fig. 2.
Please be simultaneously with reference to Fig. 1, Fig. 2 and Fig. 3, in the present embodiment, organic electroluminescent device layer 160 comprises pixel array layer 110, organic luminous layer 120 and the second electrode lay 130.In the present embodiment, organic electroluminescent device layer 160 can further comprise first barrier layer 140 and protective layer 150.
Organic luminous layer 120 is positioned on first electrode layer 102.In one embodiment, organic luminous layer 120 can comprise the combination of red organic light emission pattern, green organic light emission pattern, blue organic light emission pattern, other color organic light emission patterns or above-mentioned luminous pattern.In addition, according to other embodiment, organic luminous layer 120 can more comprise the combination (not illustrating) of electron transfer layer, electron injecting layer, electric hole transport layer, electric hole implanted layer or above-mentioned four kinds of mould layers.Because the detailed structure of above-mentioned organic luminous layer 120 is that affiliated technical field tool is known the convention of the knowledgeable institute usually, therefore repeat no more.
The second electrode lay 130 covers organic luminous layer 120.The second electrode lay 130 can be the electrode layer of patterning or the electrode layer of patterning not, and its material can be transparent conductive material or opaque electric conducting material.Said transparent conductive material comprises metal oxide, for example is indium tin oxide, indium-zinc oxide, aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, other suitable oxides or above-mentioned both stack layers at least.Said opaque electric conducting material comprises metal.Above-mentioned first electrode layer 102, the second electrode lay 130 and organic luminous layer 120 promptly constitute organic illuminating element OLED.In general, first electrode layer 102 and the second electrode lay 130 wherein one be to be negative electrode as organic illuminating element OLED as the anode of organic illuminating element OLED and another.What deserves to be mentioned is, if above-mentioned first electrode layer 102 and the second electrode lay 130 both all adopt transparent conductive material, so formed Organnic electroluminescent device 10 is the double-side device.If first electrode layer 102 wherein one adopts transparent material with the second electrode lay 130, so formed Organnic electroluminescent device 10 can be described as bottom-emission type or top emission type light-emitting device.
In an embodiment of the present invention, organic electroluminescent device layer 160 can more comprise protective layer 140.Protective layer 140 covers the second electrode lay 130, in order to avoid the second electrode lay 130 to be damaged or to pollute.The material of protective layer 140 can comprise Inorganic Dielectric Material (for example being silica, silicon nitride, silicon oxynitride or other suitable Inorganic Dielectric Material) or organic dielectric materials.
In an embodiment of the present invention, organic electroluminescent device layer 160 more comprises first barrier layer 150.First barrier layer 150 is positioned on the pixel array layer 110, and this first barrier layer 150 has a plurality of first open C 01, and each first open C 01 exposes first electrode layer 102 in each picture element cellular zone 1001.The organic luminous layer 120 of each picture element cellular zone 1001 then is first open C 01 that is positioned at first barrier layer 150, and the second electrode lay 130 covers the organic luminous layer 120 and first barrier layer 150.In general, when organic luminescent layer 120 is when adopting the mode of ink jet printing to form, can after forming pixel array layer 110, form first barrier layer 150 usually, overflow to the ink of avoiding organic luminous layer 120 in other the picture element cellular zone 1001.
Since pixel array layer 100 top of present embodiment be formed with have first open C01 first barrier layer 150, therefore first fill glue material 162 and can be filled in first of first barrier layer 150 and open in the C01 and cover the second electrode lay 130, as shown in Figure 3.Because the first filling glue material 162 is to be filled in first of first barrier layer 150 to open C01, therefore the first filling glue material 162 is to be coated with organic electro luminescent element layer 160 partly.That is to say that first fills that glue material 162 is main to be opened the interior organic electroluminescent device layer 160 of C01 and contact with first.
Second fills glue material 164 covers on the first filling glue material 162.At this, the second filling glue material 164 is to coat first all sidedly to fill on the glue material 162, and therefore the second filling glue material 164 has also covered organic electroluminescent device layer 160 partly except covering the first filling glue material 162.
In addition, the viscosity of the first above-mentioned filling glue material 162 is lower than the viscosity of the second filling glue material 164.For instance, first fills glue material 162 can adopt many alkyl acryl resin (aerylic resin) or many alkyl epoxy resin (epoxy resin) glue material, and the second filling glue material 164 can adopt the existing filling glue material that is used for Organnic electroluminescent device.
Hold the above, the filling glue wood property matter that the first filling glue material 162 and second is filled glue material 164 has difference, and first fills glue material 162 for being coated with organic electro luminescent element layer 160 partly.Therefore, when after the first filling glue material 162 is cured program, said organic electroluminescent device layer 160 only receives the tension force effect on the surface that contacts with the first filling glue material 162.Directly cover in large area compared to convention and to fill the glue material on the organic electroluminescent device layer and the Organnic electroluminescent device that is cured; Organnic electroluminescent device 10 of the present invention can reduce the damage risk of organic illuminating element layer, and keeps preferably surface evenness.
In an embodiment of the present invention, Organnic electroluminescent device 10 more comprises fluid sealant material 180.Fluid sealant material 180 is between substrate 100 and cover plate 170, so that organic electroluminescent device layer 160, the first filling glue material 162 and second are filled glue material 164 and be sealed between said substrate 100 and the said cover plate 180.Fluid sealant material 180 can be glass cement (frit material), ultraviolet optical cement, acryl resin (acrylic resin) or epoxy resin (epoxy resin).
Based on above-mentioned, the Organnic electroluminescent device 10 of first embodiment of the invention is to fill first the opening in the C01 of first barrier layer 150 that glue material 162 covers organic electroluminescent device layer 160 partly with first.After the first filling glue material 162 was cured, ability covered the second filling glue material 164 on the first filling glue material 162 and makes its curing.Therefore; Organic electroluminescent device layer 160 in the Organnic electroluminescent device of present embodiment directly covers the Organnic electroluminescent device of filling the glue material and being cured in large area compared to convention; The Organnic electroluminescent device 10 of present embodiment can reduce the damage risk of organic illuminating element layer 160, and keeps preferably surface evenness.
Second embodiment
Fig. 4 is the wherein partial cutaway schematic of a picture element cellular zone according to a kind of Organnic electroluminescent device of second embodiment of the invention.What specify is, the Organnic electroluminescent device 10 that Organnic electroluminescent device 20 and Fig. 3 that Fig. 4 illustrates illustrates has identical member, so identical member representes with identical label, and no longer repeats in the present embodiment to give unnecessary details.Please with reference to Fig. 4, what the second embodiment of the present invention and above-mentioned first embodiment were inequality is in organic electroluminescent device layer 160 except first barrier layer 150, also comprises second barrier layer 250.At this, first barrier layer 150 is positioned on the pixel array layer 110, and first barrier layer 150 has a plurality of first and opens C01.Each first is opened C01 and exposes wherein first electrode layer 102 of a picture element unit area 1001, and organic luminous layer 120 is positioned at first of first barrier layer 150 and opens C01, and the second electrode lay 130 covers the organic luminous layer 120 and first barrier layers 150.
Second barrier layer 250 is positioned on the protective layer 140 of the second electrode lay 130 tops.Said second barrier layer 250 has a plurality of second open C 03, and exposing protective layer 140, and each second open C, 03 corresponding picture element cellular zone 1001 is provided with.Change speech, second open C 03 of second barrier layer 250 is that first open C 01 of corresponding first barrier layer 150 is provided with.At this, the size of second open C 03 of second barrier layer 250 can greater than, equal or less than the size of first open C 01 of first barrier layer 150, the present invention does not limit especially.
Particularly, first fill the interior C03 of second opening that glue material 162 is filled in said second barrier layer 250.Say that at length first to fill glue material 162 be to be filled in second open C 03 of second barrier layer 250 so that first fill glue material 162 and be coated with organic electro luminescent element layer 160 partly.That is to say that first fills glue material 162 mainly contacts with second open C, 03 interior organic electroluminescent device layer 160.In addition, the second filling glue material 164 covers on the first filling glue material 162.Similarly, the viscosity of first of the present embodiment filling glue material 162 is lower than the viscosity of the second filling glue material 164.For instance, the first filling glue material 162 is many alkyl acryl resin (acrylic resin) or many alkyl epoxy resin (epoxy resin) glue material, and the second filling glue material 164 can adopt the existing filling glue material that is used for Organnic electroluminescent device.
Based on above-mentioned, the Organnic electroluminescent device 20 of second embodiment of the invention is to fill glue material 162 with first to cover partly in second open C 03 of second barrier layer 250 of organic electroluminescent device layer 160.After the first filling glue material 162 solidifies, just fill glue material 164 and cover on the first filling glue material 162 second.Therefore the organic electroluminescent device layer 160 of the Organnic electroluminescent device 20 of present embodiment directly covers the Organnic electroluminescent device of filling the glue material and being cured in large area compared to convention; The Organnic electroluminescent device 20 of present embodiment can reduce the damage risk of organic illuminating element layer, and keeps preferably surface evenness.
In sum, Organnic electroluminescent device of the present invention has barrier layer, and the first filling glue material is filled in the interior and contact organic electroluminescent device layer of the opening of barrier layer.In addition, the viscosity of the first filling glue material is lower than the viscosity of the second filling glue material.Therefore; When the first filling glue material is cured; Said organic electroluminescent device layer only receives the tension force effect on the surface that contacts with the first filling glue material; Directly cover in large area compared to convention and to fill the glue material on the organic electroluminescent device layer and be cured the Organnic electroluminescent device of program, Organnic electroluminescent device of the present invention can reduce the damage risk of organic illuminating element layer, avoids filling the glue material and solidifies the back be full of cracks and can't block aqueous vapor and oxygen effectively and to causing damage in the surface of organic electroluminescent device; And ability complete seal organic electroluminescent device, holdout device usefulness.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Has common knowledge the knowledgeable in the technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (12)
1. Organnic electroluminescent device comprises:
One substrate;
One organic electroluminescent device layer is positioned on this substrate, and wherein this organic electroluminescent device layer has a plurality of picture element cellular zones;
One first fills the glue material, is coated in those picture element cellular zones of this organic electroluminescent device layer, to cover this organic electroluminescent device layer partly;
One second fills the glue material, covers on this first filling glue material; And
One cover plate covers this and second fills on glue material and second fill glue material and contact with this.
2. Organnic electroluminescent device according to claim 1 is characterized in that, the viscosity of this first filling glue material is lower than the viscosity of this second filling glue material.
3. Organnic electroluminescent device according to claim 2 is characterized in that, this first filling glue material is many alkyl acryl resin (acrylic resin) or many alkyl epoxy resin (epoxy resin) glue material.
4. Organnic electroluminescent device according to claim 1; It is characterized in that; More comprise a fluid sealant material, between this substrate and this cover plate, organic electroluminescent device layer, this first filling glue material and this second filling glue material are sealed between this substrate and this cover plate with this.
5. Organnic electroluminescent device according to claim 4 is characterized in that, sealing glue material can be glass cement (frit materials), ultraviolet optical cement, acryl resin (acrylic resin) or epoxy resin (epoxy resin).
6. Organnic electroluminescent device according to claim 1 is characterized in that, this organic electroluminescent device layer comprises:
One pixel array layer is positioned on this substrate, one first electrode layer that corresponding each the picture element cellular zone of this pixel array layer has at least one active member and electrically connect with this active member;
One organic luminous layer is positioned on this first electrode layer; And
One the second electrode lay covers this organic luminous layer.
7. Organnic electroluminescent device according to claim 6 is characterized in that, more comprises a protective layer, covers this second electrode lay.
8. Organnic electroluminescent device according to claim 6; It is characterized in that this organic electroluminescent device layer more comprises one first barrier layer, be positioned on this pixel array layer; This first barrier layer has a plurality of first openings; And each first opening exposes wherein this first electrode layer of a picture element cellular zone, and wherein this organic luminous layer is positioned at those first openings of this first barrier layer, and this second electrode lay covers this organic luminous layer and this first barrier layer.
9. Organnic electroluminescent device according to claim 8 is characterized in that, this first is filled glue material and be filled in those first openings of this first barrier layer and cover this second electrode lay.
10. Organnic electroluminescent device according to claim 8; It is characterized in that; More comprise one second barrier layer, be positioned on this second electrode lay that this second barrier layer has a plurality of second openings; One first opening setting of the corresponding picture element cellular zone of each second opening, wherein this first filling glue material is filled in those second openings of this second barrier layer.
11. Organnic electroluminescent device according to claim 6; It is characterized in that; More comprise a barrier layer, be positioned on this second electrode lay that this barrier layer has a plurality of openings; The corresponding picture element cellular zone of each opening is provided with, and wherein this first filling glue material is filled in those openings of this barrier layer.
12. Organnic electroluminescent device according to claim 6 is characterized in that, this Organnic electroluminescent device can be dual-side luminescent type, bottom-emission type (bottom emission type) or top emission type (top emission type).
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TW100147872A TWI462635B (en) | 2011-12-22 | 2011-12-22 | Organic electroluminescence device |
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CN104124268A (en) * | 2014-07-21 | 2014-10-29 | 京东方科技集团股份有限公司 | Organic light emitting diode (OLED) display panel and manufacture method thereof |
WO2016011709A1 (en) * | 2014-07-21 | 2016-01-28 | 京东方科技集团股份有限公司 | Organic light emitting diode display panel and manufacturing method therefor |
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CN104393187A (en) * | 2014-11-17 | 2015-03-04 | 合肥鑫晟光电科技有限公司 | Package substrate and preparation method thereof and OLED (Organic Light Emitting Diode) display device |
CN105789259A (en) * | 2016-03-29 | 2016-07-20 | 上海天马有机发光显示技术有限公司 | Organic electroluminescent display panel, manufacturing method thereof, and display device |
CN105789259B (en) * | 2016-03-29 | 2019-08-02 | 上海天马有机发光显示技术有限公司 | Organic electroluminescent display panel and preparation method thereof, display device |
CN107316951A (en) * | 2017-08-16 | 2017-11-03 | 京东方科技集团股份有限公司 | Package substrate and preparation method thereof, OLED display panel and preparation method thereof |
CN107316951B (en) * | 2017-08-16 | 2019-01-29 | 京东方科技集团股份有限公司 | Package substrate and preparation method thereof, OLED display panel and preparation method thereof |
US11171306B2 (en) | 2017-08-16 | 2021-11-09 | Boe Technology Group Co., Ltd. | Package substrate, manufacturing method thereof, OLED display panel and manufacturing method thereof |
TWI655768B (en) * | 2018-04-24 | 2019-04-01 | 友達光電股份有限公司 | Array substrate |
CN112306302A (en) * | 2020-11-04 | 2021-02-02 | 云谷(固安)科技有限公司 | Display panel and display device |
Also Published As
Publication number | Publication date |
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TW201328408A (en) | 2013-07-01 |
TWI462635B (en) | 2014-11-21 |
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