CN102568825B - Method for manufacturing ceramic electronic component, apparatus and method for position determination, and apparatus and method for marker formation - Google Patents

Abstract

The present invention relates to a method for manufacturing ceramic electronic component, an apparatus and a method for position determination, and an apparatus and a method for marker formation. When the lamination ceramic electronic component such as lamination ceramic capacitor, etc., is manufactured, and ceramic rough sheets printed with internal electrode patterns are laminated and jointed through pressing to obtain X rays radiating the ceramic rough plate, thereby obtaining the images of the internal electrode patterns. According to the images, the position to be cut, of the ceramic rough plate is determined, so as to efficiently performing cutting processing. According to the image data of the internal electrode patterns, obtained through radiating X rays (38) on the ceramic rough plate (27), the predetermined position of the maker formation is determined. A reference marker is formed on the predetermined position of the marker formation, and according to the reference marker, the cutting processing is performed on the ceramic rough plate (27), thereby shortening the time required by the cutting processing, and increasing the position accuracy of the cutting processing.

Description

The manufacture method of ceramic electronic components, position measuring device and method, mark forming apparatus and method

Technical field

The present invention relates to a kind of manufacture method of ceramic electronic components, position measuring device and position measurement method and mark forming apparatus and mark forming method.More specifically, the manufacture method of ceramic electronic components involved in the present invention is used for the cutting technique of the ceramic blank plate (ceramic green block) such as implemented when the manufacture of multilayer ceramic electronic component.

In addition, position measuring device of the present invention and method and mark forming apparatus and method can effectively utilize when the manufacture of such as multilayer ceramic electronic component.Namely, position measuring device of the present invention and position measurement method are such as measuring the position of the internal electrode pattern of ceramic blank plate inside, mark forming apparatus of the present invention and mark forming method, such as when the cutting technique of ceramic blank plate, form the reference mark marking the benchmark of cutting position.

Background technology

When manufacturing the multilayer ceramic electronic component of multi-layer ceramic capacitor etc., usually, will through following each technique, namely, multiple are printed with ceramic green sheet (ceramic green sheet) the lamination crimping of internal electrode pattern, to manufacture ceramic blank plate, and ceramic blank plate is cut into the size of regulation, to manufacture multi-disc ceramic green chip (ceramic green chip).

When ceramic cutting blanket, need the clearance portion between accuracy highland cutting internal electrode pattern, but internal electrode pattern is easily out of shape due to the cause of crimping implemented when manufacturing ceramic blank plate, and therefore, clearance portion also exists the tendency of distortion.And because the outer surface from ceramic blank plate can't see internal electrode pattern, therefore, the cutting of ceramic blank plate requires much skill.

For this reason, such as, propose following scheme in patent documentation 1, that is, the image of the internal electrode pattern obtained according to irradiating transmitted light to ceramic blank plate, obtains the cutting position of ceramic blank plate.

But, method described in patent documentation 1 has the problem of the time length needed for cutting, its reason is to carry out following operation, namely, during each cutting, cutting position data be stored in the recording medium, ceramic blank plate is transported to cutter sweep together with recording medium, cutter sweep reads cutting position data and carries out aligned in position, then ceramic cutting blanket.

In addition, in the method described in patent documentation 1, when using X ray to carry out position finding as transmitted light, produce measurement deviation by the time sometimes.Figure 17 represents the typical X ray generating mechanism 51 comprised in X-ray irradiator.In X ray generating mechanism 51, the target 55 that electronics 53 high velocity impact generated from the filament (filament) be connected with negative electrode 52 is connected with anode 54, thus, a part for the kinergety of electronics 53 becomes X ray, but remaining kinergety becomes heat and makes the temperature of target 55 increase.Due to the cause that this temperature rises, target 55 can be out of shape, and X ray generates point and can be moved.Can infer as its result: the centre coordinate of radioscopic image can move to the direction of regulation, thus causes above-mentioned measurement deviation by the time.

In view of the above problems, such as, patent documentation 2 proposes following scheme: namely configured in advance is known correction identification mark with the relative position of the camera identifying radioscopic image, position measured by correction identification mark and the relative position as the camera of correction identification mark are the difference of known position (can not be subject to the position of the impact of heat), obtain the amount of movement that X ray generates point, the position corrected as the workpiece of determination object offsets.

But, in the method described in patent documentation 2, sometimes can not measure correct position.This is because: from identification correction identification mark to identification workpiece, there is the time lag making camera movement etc., within this period, X ray generating apparatus also works on, and the temperature of target continues to rise.That is, with identify compared with the correction side-play amount in identification mark moment, identify that the side-play amount in workpiece moment can become large a little.

And in the position (coordinate) that should measure of workpiece for multiple, if after identification correction identification mark, identify each position of workpiece according to priority, then the coordinate measured afterwards, its side-play amount can become larger.In order to avoid this problem, can consider each all by camera recovery, thus redeterminate the side-play amount of correction identification mark, but in this case, determination efficiency can reduce.

Patent documentation 1:JP JP 2000-21680 publication

Patent documentation 2:JP JP 2003-254735 publication

Summary of the invention

Therefore, the object of this invention is to provide a kind of manufacture method that can solve the ceramic electronic components of above-mentioned problem.

Other objects of the present invention are to provide position measuring device in a kind of manufacture method being effectively applied to above-mentioned ceramic electronic components and position measurement method.

Another other objects of the present invention are to provide mark forming apparatus in a kind of manufacture that use above-mentioned position measuring device and position measurement method, that be effectively applied to such as multilayer ceramic electronic component and mark forming method.

First the present invention is intended for the manufacture method of multilayer ceramic electronic component.

The feature of the manufacture method of multilayer ceramic electronic component of the present invention is have:

Prepare the operation of ceramic blank plate, this ceramic blank plate has the multi-disc ceramic green sheet be stacked, and has the first interarea opposite each other and the second interarea, and has unsintered internal electrode pattern in internal configurations;

From the second interarea side direction ceramic blank plate X-ray irradiation or infrared ray such can pass through light, and carrying out image procossing by the filming apparatus being arranged on the first interarea side to can pass through light, generating the operation of the view data of internal electrode pattern;

The operation that the reference mark becoming the position of reference mark that should be formed on first of ceramic blank plate or the second interarea forms precalculated position is calculated according to view data;

Said reference mark on the first or second interarea of ceramic blank plate is formed on precalculated position, forms the operation of reference mark; With

Manufacturing procedure, according to reference mark, to the operation of the processing that ceramic blank plate specifies.

In the operation forming said reference mark, form reference mark preferably by irradiating laser.

In addition, the processing of afore mentioned rules refers to the size such as ceramic blank plate being cut into regulation along the stack direction of ceramic green sheet.

In addition, the present invention is also applicable to the position measuring device of the coordinate measuring the workpiece being arranged on body interior.

Position measuring device of the present invention has:

Microscope carrier, it is for placing main body;

X-ray irradiator, it comprises the negative electrode generating electronics and the electronics passing through to be generated by negative electrode carries out colliding and produces the target of X ray, and to microscope carrier X-ray irradiation;

Filming apparatus, its X ray to irradiating from X-ray irradiator through the main body be positioned on microscope carrier detects, and generates the X-ray image data of the workpiece of body interior; With

Arithmetic unit, it, by processing the X-ray image data of sending from filming apparatus, calculates the coordinate of the workpiece of body interior.

And, in order to solve the problems of the technologies described above, curvilinear calibration curve is stored in arithmetic unit, this calibration curve depicts elapsed time after X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by filming apparatus produced due to the distortion of target, arithmetic unit is configured to: according to calibration curve, obtain the side-play amount of the radioscopic image obtained by filming apparatus produced due to the distortion of the target in the shooting moment at workpiece, and after this side-play amount is corrected, calculate the coordinate of the workpiece of body interior.It is more than the fisrt feature of position measuring device of the present invention.

In addition, by by after depicting X-ray irradiator and starting elapsed time, with the relation of the side-play amount of the radioscopic image obtained by filming apparatus produced due to the distortion of target thus generate above-mentioned calibration curve this operate, after repeatedly repeatedly implementing in a few days, find that calibration curve has good reproducibility.

The second feature of position measuring device of the present invention is, above-mentioned microscope carrier is formed with collimating marks, and is performed as follows operation:

(1) after X-ray irradiator starts, have passed through first moment (T1) of uncertain time, filming apparatus is utilized to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the coordinate (C1) in first moment (T1) of collimating marks.

(2) in the second moment (T2) that have passed through the time determined from the first moment (T1), filming apparatus is utilized again to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the coordinate (C2) in second moment (T2) of collimating marks.

(3) in arithmetic unit, obtain the position on the calibration curve with the gradient identical with the gradient of the coordinate (C2) of the second moment (T2) with the coordinate of the first moment (T1) (C1), and the fiducial time (t3) obtained on the calibration curve corresponding to the position on calibration curve, then, according to the fiducial time (t3) on calibration curve, obtain actual fiducial time (T3).

(4) workpiece of filming apparatus the shooting body inside is utilized, by the difference of the shooting moment (Tx) of the X-ray image data of workpiece with actual fiducial time (T3), be added on the fiducial time (t3) on calibration curve mutually, obtain the shooting moment (tx) on calibration curve, then, from the side-play amount in the shooting moment (tx) calibration curve, deduct the side-play amount of the fiducial time (t3) on calibration curve.

(5) after correction offset, the coordinate of the workpiece of body interior is calculated.

In addition, the present invention is also intended for the position measurement method measuring and be configured in the coordinate of the workpiece of body interior.

Position measurement method of the present invention has: main body is placed on the operation on microscope carrier; Utilize X-ray irradiator to the operation of main body X-ray irradiation; Utilize filming apparatus detection through the X ray of main body, and generate the operation of the X-ray image data of the workpiece of body interior; And by processing X-ray image data, calculate the operation of the coordinate of the workpiece of body interior.

Above-mentioned X-ray irradiator comprises the negative electrode generating electronics and the electronics passing through to be generated by above-mentioned negative electrode carries out colliding and produces the target of X ray.

And, in order to solve above-mentioned technical task, position measurement method of the present invention also has the operation of the calibration curve of formation curve shape, this curvilinear calibration curve depicts the elapsed time after X-ray irradiator starts, the relation of the side-play amount of the radioscopic image obtained by filming apparatus produced with the distortion due to target, the operation of coordinate calculating workpiece comprises: the side-play amount of the radioscopic image obtained by filming apparatus that the distortion of target when obtaining due to workpiece shooting according to calibration curve produces, and after this side-play amount is corrected, calculate the coordinate of the workpiece of body interior.It is more than the fisrt feature of position measurement method of the present invention.

The second feature of position measurement method of the present invention is, on above-mentioned microscope carrier, shape has into collimating marks, and the operation calculating the coordinate of workpiece comprises following operation:.

(1) after X-ray irradiator starts, have passed through first moment (T1) of uncertain time, filming apparatus is utilized to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate (C1) in first moment (T1) of collimating marks.

(2) in the second moment (T2) that have passed through the time determined from the first moment (T1), filming apparatus is utilized again to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate (C2) in second moment (T2) of collimating marks.

(3) in arithmetic unit, obtain the position on the calibration curve with the gradient identical with the gradient of the coordinate (C2) of the second moment (T2) with the coordinate of the first moment (T1) (C1), and the fiducial time (t3) obtained on the calibration curve corresponding to the position on calibration curve, then, according to the fiducial time (t3) on calibration curve, obtain the operation of actual fiducial time (T3).

(4) workpiece of filming apparatus the shooting body inside is utilized, by the difference of the shooting moment (Tx) of the X-ray image data of workpiece and actual fiducial time (T3), be added on fiducial time (t3) on calibration curve mutually, obtain the shooting moment (tx) on calibration curve, then, from the side-play amount in the shooting moment (tx) calibration curve, deduct the operation of the side-play amount of the fiducial time (t3) on calibration curve.

(5) after correction offset, the operation of the coordinate of the workpiece of body interior is calculated.

In addition, the present invention is also intended for mark forming apparatus, and this device for forming reference mark on the position be associated with the coordinate of the workpiece being configured in body interior.

Mark forming apparatus of the present invention has:

Microscope carrier, it is for placing main body;

X-ray irradiator, it comprises the negative electrode generating electronics and the electronics passing through to be generated by negative electrode carries out colliding and produces the target of X ray, and to microscope carrier X-ray irradiation;

Filming apparatus, it detects the X ray from X-ray irradiator irradiation through the main body be positioned on microscope carrier, generates the X-ray image data of the workpiece of body interior;

Arithmetic unit, it, by processing the X-ray image data of sending from filming apparatus, calculates the coordinate of the workpiece of body interior, and according to the coordinate of workpiece, the reference mark that calculating becomes the position of reference mark forms precalculated position; With

Reference mark formation mechanism, its reference mark calculated by arithmetic unit in main body is formed on precalculated position, forms reference mark.

And, curvilinear calibration curve is stored in the arithmetic unit of mark forming apparatus of the present invention, this calibration curve depicts elapsed time after X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by filming apparatus produced due to the distortion of target, arithmetic unit is configured to: according to calibration curve, obtain the side-play amount of the radioscopic image obtained by filming apparatus produced due to the distortion of the target in the shooting moment at workpiece, and after this side-play amount is corrected, calculate the coordinate of the workpiece of body interior.It is more than the fisrt feature of mark forming apparatus of the present invention.

The second feature of mark forming apparatus of the present invention is, microscope carrier is formed with collimating marks, and carries out operation as described below in order to the coordinate calculating workpiece:

(1) after X-ray irradiator starts, have passed through first moment (T1) of uncertain time, filming apparatus is utilized to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the coordinate (C1) in first moment (T1) of collimating marks.

(2) in the second moment (T2) that have passed through the time determined from the first moment (T1), filming apparatus is utilized again to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the coordinate (C2) in second moment (T2) of collimating marks.

(3) in arithmetic unit, obtain the position on the calibration curve with the gradient identical with the gradient of the coordinate (C2) of the second moment (T2) with the coordinate of the first moment (T1) (C1), and the fiducial time (t3) obtained on the calibration curve corresponding to the position on calibration curve, then, according to the fiducial time (t3) on calibration curve, obtain actual fiducial time (T3).

(4) workpiece of filming apparatus the shooting body inside is utilized, by the difference of the shooting moment (Tx) of the X-ray image data of workpiece with actual fiducial time (T3), be added on the fiducial time (t3) on calibration curve mutually, obtain the shooting moment (tx) on calibration curve, then, from the side-play amount in the shooting moment (tx) calibration curve, deduct the side-play amount of the fiducial time (t3) on calibration curve.

(5) after correction offset, the coordinate of the workpiece of body interior is calculated.

What effectively can use mark forming apparatus of the present invention is following situation, that is: such as, aforementioned body is made up of the multi-disc ceramic green sheet of lamination and has the ceramic blank plate of unsintered internal electrode pattern in internal configurations, and above-mentioned workpiece is the situation of internal electrode pattern.

In mark forming apparatus of the present invention, preferred microscope carrier is configured to move between filming apparatus and reference mark formation mechanism.

In addition, in mark forming apparatus of the present invention, preferred microscope carrier, X-ray irradiator, filming apparatus and reference mark formation mechanism are incorporated in a housing.

The present invention is also applicable to the mark forming method forming reference mark on the position be associated with the coordinate of the workpiece being configured in body interior.

Mark forming method of the present invention has: main body is placed on the operation on microscope carrier; Utilize X-ray irradiator to the operation of main body X-ray irradiation; Utilize filming apparatus detection through the X ray of main body, and generate the operation of the X-ray image data of the workpiece of body interior; By processing X-ray image data, calculate the coordinate of the workpiece of body interior, and according to the coordinate of workpiece, the reference mark that calculating becomes the position of reference mark forms the operation in precalculated position; Reference mark in main body is formed on precalculated position, forms the operation of reference mark; And according to reference mark, to the operation of the processing that main body specifies.

Above-mentioned X-ray irradiator comprises the negative electrode generating electronics and the electronics generated by above-mentioned negative electrode is carried out colliding and produce the target of X ray.

And, mark forming method of the present invention also has the operation of the calibration curve of formation curve shape, this curvilinear calibration curve depicts the elapsed time after X-ray irradiator starts, the relation of the side-play amount of the radioscopic image obtained by filming apparatus produced with the distortion due to target, the operation of coordinate calculating workpiece comprises: the side-play amount of the radioscopic image obtained by filming apparatus that the distortion obtaining the target in the shooting moment due to workpiece according to calibration curve produces, and after this side-play amount is corrected, calculate the operation of the coordinate of the workpiece of body interior.It is more than the fisrt feature of mark forming method of the present invention.

The second feature of mark forming method of the present invention is, above-mentioned microscope carrier is formed with collimating marks, and the operation calculating the coordinate of workpiece comprises following operation:

(1) after X-ray irradiator starts, have passed through first moment (T1) of uncertain time, filming apparatus is utilized to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate (C1) in first moment (T1) of collimating marks.

(2) in the second moment (T2) that have passed through the time determined from the first moment (T1), filming apparatus is utilized again to take collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate (C2) in second moment (T2) of collimating marks.

(3) in arithmetic unit, obtain the position on the calibration curve with the gradient identical with the gradient of the coordinate (C2) of the second moment (T2) with the coordinate of the first moment (T1) (C1), and the fiducial time (t3) obtained on the calibration curve corresponding to the position on calibration curve, then, according to the fiducial time (t3) on calibration curve, obtain the operation of actual fiducial time (T3).

(4) workpiece of filming apparatus the shooting body inside is utilized, by the difference of the shooting moment (Tx) of the X-ray image data of workpiece with actual fiducial time (T3), be added on the fiducial time (t3) on calibration curve mutually, obtain the shooting moment (tx) on calibration curve, then, from the side-play amount in the shooting moment (tx) calibration curve, deduct the operation of the side-play amount of the fiducial time (t3) on calibration curve.

(5) after correction offset, the operation of the coordinate of the workpiece of body interior is calculated.

In mark forming method of the present invention, the processing of preferred afore mentioned rules refers to cuts main body on the position be associated with the position of workpiece.

(invention effect)

According to the manufacture method of multilayer ceramic electronic component of the present invention, owing to being the view data based on can pass through the internal electrode pattern that light obtains to ceramic blank plate irradiation, obtain reference mark and form precalculated position, formed on precalculated position in this reference mark and form reference mark, then, according to this reference mark, carry out ceramic blank plate cutting the processing waiting regulation.Therefore, it is possible to improve the position precision of the processing for regulation.

In addition, according to the manufacture method of multilayer ceramic electronic component of the present invention, owing to being be formed into the reference mark should carrying out the index of the position of the processing specified on ceramic blank plate, therefore, without the need to all reading Working position data man-hour carry out aligned in position in adding of each regulation.Therefore, it is possible to shorten the time of machining needs.

According to position measuring device of the present invention and method and mark forming apparatus and method, owing to being the calibration curve based on generating in advance, the distortion by the time of prediction target, obtains the side-play amount of radioscopic image, and corrects this side-play amount, then, calculate the coordinate of workpiece, therefore, it is possible to carry out the high position finding of accuracy, so, the high mark of position precision can be carried out and formed.

And, according to position measuring device of the present invention and method and mark forming apparatus and method, owing to being form collimating marks on microscope carrier, therefore, when position finding or mark are formed, the identification of collimating marks only to need to measure when starting and least twice after special time.Therefore, the identification of collimating marks only needs the time of least cost limit, can improve determination efficiency.

Accompanying drawing explanation

Fig. 1 is the stereogram of the outward appearance of the multi-layer ceramic capacitor 1 represented as the example utilizing multilayer ceramic electronic component of the present invention.

Fig. 2 is the cutaway view of the A-A line along Fig. 1.

Fig. 3 is the vertical view of the internal structure representing the article body 2 that the multi-layer ceramic capacitor 1 shown in Fig. 1 has.

Fig. 4 be represent the multi-layer ceramic capacitor 1 shown in shop drawings 1 and prepare, the vertical view of ceramic green sheet 21 that forms internal electrode pattern 22.

Fig. 5 is the amplification plan view of the correction mark 26 of the variation represented as correction mark 25a, the 25b shown in Fig. 4.

Fig. 6 is the front view diagrammatic while of the mark forming apparatus 31 comprising position measuring device of an embodiment of the invention and cutter sweep 37 represented.

Fig. 7 represents that the filming apparatus 34 by having by the mark forming apparatus 31 shown in Fig. 6 carries out image procossing, and by the detected image of the ceramic blank plate 27 of binarization.

Fig. 8 is to obtain the figure by the detected image of binarization, a part for the image of the ceramic blank plate 27 taken by filming apparatus 34 being amplified expression shown in Fig. 7.

Fig. 9 is the figure corresponding with Fig. 7, be if image-processing operations device 35 image recognitions of having by the mark forming apparatus 31 shown in Fig. 6, then sufficient internal electrode pattern 22 is extracted out the figure of expression.

Figure 10 represents vertical view ceramic blank plate 27 being placed on the state on the microscope carrier 32 shown in Fig. 6.

Figure 11 is the figure corresponding with Figure 10, represents the state producing rotation offset on the ceramic blank plate 27 be placed on microscope carrier 32.

Figure 12 is the figure representing the detection situation defining the state of reference mark 39 on the ceramic blank plate 27 shown in Fig. 7.

Figure 13 is for illustration of the formation precalculated position in order to calculate the reference mark 39 shown in Figure 12, and the distortion considering internal electrode pattern 22 is to obtain the figure of the method for Virtual cropping line 40.

Figure 14 is the figure of the example representing the calibration curve used in the present invention.

Figure 15 is the flow chart of an example of the action representing the mark forming apparatus 31 shown in Fig. 6.

Figure 16 is the figure of the coordinate in the first moment representing the collimating marks 29 obtained by the mark forming apparatus 31 shown in Fig. 6 and the gradient of the coordinate in the second moment.

Figure 17 is the figure representing the typical X ray generating mechanism 51 comprised in X-ray irradiator.

In figure:

1 multi-layer ceramic capacitor

2 article body

9 ceramic layers

10,11 internal electrodes

12,15 opposed portion

14,17 lead divisions

21 ceramic green sheets

22 internal electrode patterns

23,24 predetermined cuts lines

27 ceramic blank plates

29 collimating marks

31 mark forming apparatuss

32 microscope carriers

33 X-ray irradiators

34 filming apparatus

35 image-processing operations devices

36 mark formation mechanism

37 cutter sweeps

38 X ray

39 reference marks

40 Virtual cropping lines

41 cutter

42 cutting filming apparatus

Image-processing operations device is used in 43 cuttings

51 X ray generating mechanism

52 negative electrodes

53 electronics

55 targets

Embodiment

Below, the multi-layer ceramic capacitor as the example using multilayer ceramic electronic component of the present invention is described.

As shown in Fig. 1 to Fig. 3, multi-layer ceramic capacitor 1 has article body 2.Article body 2 roughly in rectangular shape, and has: 1 pair of interarea 3 and 4 opposite each other; 1 pair of side 5 and 6 opposite each other; With opposite each other 1 pair of end face 7 and 8.

As shown in Figure 2, article body 2 has laminated construction, and this laminated construction is by extending on the direction of interarea 3 and 4 and forming at the multi-layer ceramics layer 9 of the direction superimposed layer orthogonal with interarea 3 and 4 and the multipair first and second internal electrode 10 and 11 of being formed along the interface between ceramic layer 9.

As shown in Figure 3, the first internal electrode 10 has: across the opposed portion 12 that ceramic layer 9 is opposed with the second internal electrode 11; And drawn from opposed portion 12 to the first end face 7, and form the lead division 14 of bared end 13 in this end.In addition, about the flat shape of the first internal electrode 10, from the Width will connected between side 5 and 6, the width of lead division 14, compared with the width of opposed portion 12, little by little narrows.

Have too with the second internal electrode 11 shown in dotted line in figure 3: across the opposed portion 15 that ceramic layer 9 is opposed with the first internal electrode 10; And drawn from opposed portion 15 to the second end face 8, and form the lead division 17 of bared end 16 in this end.Second internal electrode 11 has the flat shape with above-mentioned first internal electrode 10 symmetry.

As mentioned above, the opposed portion 12 of the first internal electrode 10 and the opposed portion 15 of the second internal electrode 11 opposite each other across ceramic layer 9, thus, between these opposed portion 12 and 15, manifest electrical characteristics.That is, when this multi-layer ceramic capacitor 1, formed electrostatic capacitance.

And multi-layer ceramic capacitor 1 also has in the mode be electrically connected respectively with the respective bared end 13 and 16 of internal electrode 10 and 11, the outer electrode 18 and 19 that at least 1 of article body 2 right end face 7 and 8 is formed respectively.In the present embodiment, outer electrode 18 and 19 has the part around each part to interarea 3 and 4 and side 5 and 6.

As the electric conducting material for internal electrode 10 and 11, such as Ni, Cu, Ag, Pd, Ag-Pd alloy and Au etc. can be used.The respective thickness of internal electrode 10 and 11 is preferably 0.3 ~ 2.0 μm.

As the ceramic material forming ceramic layer 9, can use with such as BaTiO ₃, CaTiO ₃, SrTiO ₃, CaZrO ₃deng the dielectric ceramics for principal component.As required, in dielectric ceramics, add the accessory ingredient of Mn compound, Mg compound, Si compound, Co compound, Ni compound and rare-earth element compound etc.

In addition, being of the present inventionly not limited to multilayer ceramic electronic component although apply, when being applied to multilayer ceramic electronic component, also can being applicable in the multilayer ceramic electronic component beyond multi-layer ceramic capacitor.As the ceramic material forming ceramic layer 9, when multilayer ceramic electronic component is such as piezoelectric part, the piezoelectric ceramic of PZT system pottery etc. can be used, when thermistor, the semiconductive ceramic of spinelle system pottery etc. can be used.

Although not display in figure, outer electrode 17 and 18 is preferably made up of basalis and the electrodeposited coating that formed on the base layer.As the electric conducting material for basalis, such as Cu, Ni, Ag, Pd, Ag-Pd alloy and Au etc. can be used.Conductive paste can be coated in unsintered article body 2 and the cofiring method simultaneously sintered with article body 2 and being formed by using by basalis, also can by using in conductive paste coating article body 2 after sintering and the rear burning method of burn-back and being formed.Or basalis both can be formed by Direct Electroplating, also can be formed by making the electroconductive resin comprising thermosetting resin harden.

The thickness the thickest preferred part of basalis is 10 ~ 50 μm.

As the metal forming electrodeposited coating formed on the base layer, a kind of metal selected from such as Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi and Zn or the alloy comprising this metal can be used.Electrodeposited coating can be made up of multilayer.As mentioned above, when electrodeposited coating be made up of multilayer, the preferably double-layer structure of plating Ni and the plating Sn above it.In addition, the preferred every one deck of the thickness of electroplating film is 1 ~ 15 μm.

The conductive resin layer for relaxing stress can be formed between basalis and electrodeposited coating.

Next, the manufacture method of above-mentioned multi-layer ceramic capacitor 1 is described.

First, prepare respectively: the ceramic green sheet of ceramic layer 9 should be become, for the conductive paste of internal electrode 10 and 11 and the conductive paste for outer electrode 18 and 19.Containing binding agent and solvent in these ceramic green sheets and conductive paste, and as these binding agents and solvent, known organic binder bond and organic solvent can be used respectively.

Next, as shown in Figure 4, ceramic green sheet 21 uses silk screen print method etc. with the pattern of regulation to print conductive paste.Thereby, it is possible to obtain the ceramic green sheet 21 defining multiple internal electrode patterns 22 that should become internal electrode 10 and 11 respectively.

Fig. 4 illustrates: at the upper predetermined cuts line 23 extended of the length direction (left and right directions in Fig. 4) of internal electrode pattern 22 and the predetermined cuts line 24 above extended at the Width (above-below direction in Fig. 4) orthogonal with it.Ceramic green sheet 21 has: after the lamination procedure will mentioned later, by cutting along above-mentioned predetermined cuts line 23 and 24 and split, and can take out the size of the article body 2 for multiple multi-layer ceramic capacitor 1.Predetermined cuts line 23 and 24 shown in Fig. 4 is determined the design phase before lamination procedure, after the lamination implementing the ceramic blank plate 27 for mentioning after obtaining and crimping process, ceramic blank plate 27 also can be cut along the line of cut different from predetermined cuts line 23 and 24 sometimes.About this defining method for the Virtual cropping line of the cutting of reality, after will set forth.

In addition, due to problem during mapping, the situation of the number ratio reality of the internal electrode pattern 22 that the ceramic green sheet 21 shown in Fig. 4 is formed is few.

Correction mark 25a and 25b is formed respectively near each central portion on the limit opposite each other of ceramic green sheet 21.Correction mark 25a and 25b uses the conductive paste identical with the conductive paste forming above-mentioned internal electrode pattern 22, is formed while the printing of internal electrode pattern 22.Therefore, internal electrode pattern 22 and correction mark the position relationship of 25a and 25b is constant.Correction mark 25a and 25b finally can not stay on the multi-layer ceramic capacitor 1 as product.

In addition, in the diagram, ceramic green sheet 21 is represented in (A) and (B), in order to convenient when being described the lamination procedure will mentioned below, (A) ceramic green sheet 21 shown in except the direction shown in figure is different, is identical with the ceramic green sheet 21 shown in (B) each other.

Correction shown in Fig. 4 mark 25a and 25b, can replace with the correction mark 26 shown in Fig. 5.Correction mark 26 shown in Fig. 5 is undertaken highlighting being formed by a part for the internal electrode pattern 22 of the row by being positioned at two ends.In addition, although the internal electrode pattern 22 shown in Fig. 5 is different from internal electrode pattern 22 shape shown in Fig. 4, this is not the feature of internal.Internal electrode pattern 22 shown in Fig. 5 can be understood as shape and is simplifiedly represented.

Next, by the skin ceramic green sheet lamination not printing internal electrode pattern of regulation number, lamination has printed the ceramic green sheet 21 of the internal electrode pattern 22 shown in Fig. 4 in order in the above, lamination specifies the skin ceramic green sheet of number in the above, to manufacture ceramic blank plate 27 (with reference to Figure 10 etc.).When the ceramic green sheet 21 having printed internal electrode pattern 22 is carried out lamination, the ceramic green sheet 21 in the direction shown in Fig. 4 (A) and the ceramic green sheet 21 in the direction shown in Fig. 4 (B) are by alternative stacked.

In order to improve the operability after above-mentioned lamination procedure, preferably paste the bonding sheet of foaming stripping film etc. in advance at the lower surface of ceramic blank plate 27.

Next, the means such as isostatic pressing machine are utilized to be crimped to stack direction by ceramic blank plate 27.

The ceramic blank plate 27 obtained through above operation utilizes the mark forming apparatus 31 shown in Fig. 6 to process.Be ceramic blank plate 27 by the main body as determination object in the present invention, the internal electrode pattern 22 configured therein becomes the workpiece being configured in body interior.

Mark forming apparatus 31 has: microscope carrier 32, X-ray irradiator 33, filming apparatus 34, image-processing operations device 35 and mark formation mechanism 36.Mechanicalness absolute coordinate has been preset in mark forming apparatus 31.Mark forming apparatus 31 in, preferably to major general's microscope carrier 32, X-ray irradiator 33, filming apparatus 34 and mark formation mechanism 36 be accommodated in a housing.In addition, in figure 6, although illustrate three microscope carriers 32, this is not existence three microscope carriers 32, but represents that a microscope carrier 32 moves three positions that can obtain.In addition, although illustrate the cutter sweep 37 adjacent with marking forming apparatus 31 in figure, about the detailed content of cutter sweep 37, after will set forth.

Microscope carrier 32 is expert at and column direction (X and Y-direction) can move, and in the horizontal plane also can 90 ° of rotations.As shown in Figure 10, microscope carrier 32 is formed with collimating marks 29.Collimating marks 29 is formed with the structure such as alumina wafer being carved into cross shape.

X-ray irradiator 33 is configured in the below of the microscope carrier 32 being positioned at initial position.With reference to Figure 17, X-ray irradiator 33 has above-mentioned X ray generating mechanism 51.As shown in figure 17, X ray generating mechanism 51 comprises the negative electrode 52 generating electronics 53 and the target 55 collided from the electronics 53 of negative electrode 52 transmitted at high speed.The electronics 53 generated from negative electrode 52 collides target 55 at high speed, and thus, a part for its kinergety is irradiated to the direction of microscope carrier 32 as X ray 38.

In addition, the direction of illumination of X ray 38 also can be the direction from top to bottom contrary with illustrated direction.

Filming apparatus 34 is configured in the top of the microscope carrier 32 being positioned at initial position, to detect the X ray 38 through ceramic blank plate 27.As filming apparatus 34, area sensor type camera can be used.

Image-processing operations device 35 is connected with filming apparatus 34.Image-processing operations device 35 is made up of such as CPU and memory, and has image processing function and calculation function.First image-processing operations device 35 carries out image procossing according to its image processing function to the X ray 38 detected with filming apparatus 34.

Such as, when carrying out this image procossing, by binarization or rim detection etc., as shown in Figure 7, the view data comprising black pattern (hachure part) and white pattern is generated.More particularly, by the image obtained through the X ray 38 of ceramic blank plate 27, as shown in Figure 8, should become internal electrode pattern 22 internal electrode 10 and 11 opposed portion 12 and 15 the equitant region of part in the denseest; In the equitant region of part that should become lead division 14 and 17, be the concentration of centre; The thinnest in the region that there is not internal electrode pattern 22.In above-mentioned image procossing, the equitant region of part that should become the opposed portion 12 and 15 of the internal electrode 10 and 11 becoming the denseest as black pattern, using region in addition as white pattern, like this image data generating.

In addition, about mark 25a and 25b of the correction shown in Fig. 4, owing to there is the identical degree that overlaps, so be identified as black pattern with the part of the opposed portion 12 and 15 that should become internal electrode pattern 22.When use the correction shown in Fig. 5 with mark 26, be identified as white pattern.

In addition, internal electrode pattern 22 shown in Fig. 7 etc. and correction are with marking 25a and 25b, being mark by internal electrode pattern 22 and corrections the image that 25a and 25b obtain respectively, is not that internal electrode pattern 22 and correction mark 25a and 25b itself.But, for convenience of explanation, the image of internal electrode pattern is also used to the reference marks of " 22 ", in addition, the respective image of correction mark 25a and 25b is also used to the reference marks of " 25a " and " 25b ".

In addition, in the memory that image-processing operations device 35 has, store curvilinear calibration curve, it is for depicting: the relation of the elapsed time after X-ray irradiator 33 starts and the side-play amount of the radioscopic image obtained by filming apparatus 34 produced due to the distortion of target 55.Figure 14 represents an example of calibration curve.In addition, although as long as calibration curve is corresponding just enough with any one direction of X and Y-direction, also two calibration curves can be prepared in the mode all corresponding with both direction.

The constituted mode of image-processing operations device 35 is: the side-play amount obtaining the radioscopic image in the shooting moment of the reality of internal electrode pattern 22 according to above-mentioned calibration curve, after correcting this side-play amount, calculates the coordinate of internal electrode pattern 22.

Next, image-processing operations device 35 carries out calculation process according to its calculation function to above-mentioned view data, and by the positional information obtained by view data, namely form the relevant information in precalculated position to reference mark and send to and mark formation mechanism 36, said reference mark forms the position that precalculated position becomes the reference mark 39 (with reference to Figure 12 and Figure 13) represented the position of the cutting that ceramic blank plate 27 is implemented.

Mark formation mechanism 36 is connected with image-processing operations device 35, according to the positional information of being sent by image-processing operations device 35, namely forms the relevant information in precalculated position to reference mark, the upper main surface of ceramic blank plate 27 forms reference mark 39.

The formation of reference mark 39 can use following method: be formed into the method for the cut channel be made up of rill of reference mark 39 by irradiating laser, by knocking the method for the impact vestige being formed into reference mark 39 or using printing ink to carry out the method etc. of print fiducial marks 39.Particularly under use swashs light-struck situation, compared with print process, the area formed needed for reference mark 39 is little.Therefore, the area formed of internal electrode pattern 22 can be expanded, and the acquisition number of each ceramic blank plate can be increased.In addition, the reference mark 39 shown in Figure 12 and Figure 13 is cross shape, for be exactly by laser irradiate formed mark.

Below, with reference to Figure 15 to the operation of mark forming apparatus 31, namely with marking the position measurement method that carries out of forming apparatus 31 and mark forming method is described.

(1) as the preparatory stage, ceramic blank plate 27 is placed on the microscope carrier 32 that has of mark forming apparatus 31.

(2) X-ray irradiator 33 (the step S1 of Figure 15) being positioned at the below of microscope carrier 32 is started.Thus, from X-ray irradiator 33 to ceramic blank plate 27 X-ray irradiation 38, become the state that can be detected the X ray 38 through ceramic blank plate 27 by the filming apparatus 34 being configured in the top of microscope carrier 32.

(3) after X-ray irradiator 33 starts through first moment (T1) of uncertain time, collimating marks 29 is taken with filming apparatus 34, in image-processing operations device 35, according to obtained X-ray image data, obtain the coordinate (C1) (the step S2 of Figure 15) in first moment (T1) of collimating marks 29.This coordinate (C1) is absolute coordinate.

(4) after the first moment (T1), through second moment (T2) of time determination, again collimating marks 29 is taken with filming apparatus 34, in image operation device 35, according to obtained X-ray image data, obtain the coordinate (C2) (the step S3 of Figure 15) in second moment (T2) of collimating marks 29.This coordinate (C2) is absolute coordinate.The above-mentioned time determined such as is set to 10 ~ 40 seconds.

(5) coordinate (C1) and the coordinate in the second moment (T2) (C2) of the first moment (T1) in image-processing operations device 35, as shown in figure 16, is obtained.In figure 16, the first moment (T1) represents with Δ T with the difference in the second moment (T2), and coordinate (C1) represents with Δ C with the difference of coordinate (C2).

(6) in image-processing operations device 35, as shown in figure 14, obtain and have and the straight line of the gradient same tilt degree of the coordinate of the first moment (T1) (C1) and the coordinate in the second moment (T2) (C2), the point (C3) that connects with curvilinear calibration curve.That is, the position (C3) had with on the calibration curve of the gradient same tilt degree of coordinate (C1) and coordinate (C2) is obtained.Further, the fiducial time (t3) of the corresponding calibration curve with the position (C3) on this calibration curve is obtained.Then, according to the fiducial time (t3) of calibration curve, obtain actual fiducial time (T3).Thereby, it is possible to know that current which time-bands at calibration curve is processing.

It is important in this that: will not become the start-up time of the first moment (T1) as X-ray irradiator 33 of benchmark, and obtain the gradient of coordinate.When using the first moment (T1) as start-up time according to from this time, elapsed time tried to achieve side-play amount, if X-ray irradiator 33 do not turned off and make it cool completely, then can not correct, therefore, determination efficiency reduce.Such as, necessary standby about 30 minutes.On the other hand, according to the present embodiment, without the need to being turned off for a long time by X-ray irradiator 33, even if under the state of repeatedly carrying out opening/turning off with shorter interval, also can correct, therefore, determination efficiency is high.

And, similarly, because the time interval between the first moment (T1) and the second moment (T2) is very small, therefore, T1=T3 can be regarded as, to determine that the first moment (T1) replaces actual fiducial time (T3).

(7) correction mark 25a and 25b (step 4 of Figure 15) is detected with filming apparatus 34.In the image procossing that image-processing operations device 35 carries out, as shown in Figure 10, one is corrected with the initial point of mark 25a as relative coordinate, connect the direction of another correction mark 25b as X-axis using from this correction mark 25a, thus regulation relative coordinate (X, Y).Thereby, it is possible to correct with marking 25a as initial point, define the relative coordinate (X, Y) of each internal electrode pattern 22.In addition, as shown in figure 11, at above-mentioned relative coordinate (X, when Y) there occurs skew in a rotational direction, can know the reference axis relative to mechanicalness absolute coordinate, the X-axis rotate of relative coordinate (X, Y) has been displaced to any degree.

(8) detect internal electrode pattern 22 by filming apparatus 34, in image-processing operations device 35, generate the view data (the step S5 of Figure 15) of internal electrode pattern 22.

When carrying out above-mentioned image procossing, without the need to internal electrode pattern 22 is all identified.The internal electrode pattern 22 being positioned at edge part and central portion that the mode only seeing to embark on journey and arrange is arranged in rectangular internal electrode pattern 22 is just enough.Such as, as shown in Figure 9, only image recognition is carried out to the internal electrode pattern 22 in the part on four limits at the edge be positioned at along the region being arranged internal electrode pattern 22 and total 33 internal electrode patterns 22 of the internal electrode pattern 22 in the vertical bisecting line being positioned at each limit just enough.

Next, in image-processing operations device 35, calculate the side-play amount of radioscopic image when obtaining the X-ray image data of internal electrode pattern 22 according to calibration curve, after side-play amount is corrected, calculate the coordinate of each internal electrode pattern 22 of ceramic blank plate 27 inside.Like this, if know shooting internal electrode pattern 22 moment, then can based on calibration curve prediction drift amount.Therefore, it is possible to carry out the high position finding of accuracy.

More particularly, internal electrode pattern 22 is taken by filming apparatus 34, by the difference of the shooting moment (Tx) of internal electrode pattern 22 with actual fiducial time (T3), be added on the fiducial time (t3) of calibration curve mutually, obtain the shooting moment (tx) of calibration curve, next, from the side-play amount in the shooting moment (tx) of calibration curve, deduct the side-play amount of the fiducial time (t3) of calibration curve.Then, after this side-play amount is corrected, calculate the coordinate of each internal electrode pattern 22 of ceramic blank plate 27 inside.

Like this, first the relative coordinate of each internal electrode pattern 22 is obtained, for these coordinates, add the correction of the side-play amount of the radioscopic image based on collimating marks 29, add the correction of above-mentioned rotational offset based on correction mark 25a and 25b again, finally obtain the absolute coordinate of each internal electrode pattern 22.

Reference table 1 is also described according to the step S1 ~ S5 of concrete example to above-mentioned Figure 15.First, as shown in " mark detects (1) ", in the first moment (T1) after starting 10 seconds after X-ray irradiator 33, the coordinate (C1) of testing calibration mark calculated by 29 is " 0.010mm ".

Next, as shown in " mark detects (2) ", the coordinate (C2) calculated by the first moment (T2) testing calibration mark 29 after starting 20 seconds after X-ray irradiator 33 is " 0.020mm ".

These measurement results are substituted into following formula

T3=α/{ (C2-C1)/(T2-T1) } ... [formula 1]

Then obtain " fiducial time (t3) on calibration curve ", should " fiducial time (t3) on calibration curve " be equivalent to have and the straight line of the gradient same tilt degree of the coordinate of the first moment (T1) (C1) and the coordinate in the second moment (T2) (C2), the point (C3) that connects with curvilinear calibration curve.In this object lesson, " fiducial time (t3) on calibration curve is " 22 seconds ".

In addition, α uses

An=α [log{t3+ (T ×-T1) }-logt3] ... [formula 2]

This logarithmic curve represents inclination factor during calibration curve, and when the calibration curve shown in Figure 14, " inclination factor (α) on calibration curve " is " 0.022 ".

Next, as shown in " the shooting moment (Tx) from starting ", if carry out the mensuration of internal electrode pattern 22 after " 310 seconds ", then by Tx=310 being substituted into above-mentioned formula 2, try to achieve " 0.059mm " conduct " corrected value (An) ".

Further, if " object coordinates measured value (Xn) " is " 1.000mm ", then by " 0.059mm " of " corrected value (An) " being added with it, and " 1.059mm " is obtained as " real object coordinates ".

(9) described above, after the absolute coordinate obtaining each internal electrode pattern 22, turn off X-ray irradiator 33 (Figure 15 ... step S6).

(10) in image-processing operations device 35, the position of the Virtual cropping line 40 shown in Figure 12 is calculated according to the relative coordinate (X, Y) of internal electrode pattern 22.Now, as shown in figure 13, when producing distortion in internal electrode pattern 22, calculate this distortion, and calculate the position of the Virtual cropping line 40 can guaranteeing largest interval between internal electrode pattern 22.

The two ends of above-mentioned Virtual cropping line 40 become reference mark and form precalculated position.The relative coordinate forming precalculated position according to reference mark calculates the mechanicalness absolute coordinate that reference mark forms precalculated position.Now, the correction of rotational offset is also carried out.In addition, the displacement of microscope carrier 32 is also reflected.

(11) mobile microscope carrier 32, thus ceramic blank plate 27 is moved to the mark formation mechanism 36 shown in Fig. 6, as shown in Figure 12 and Figure 13, formed on precalculated position in reference mark and form reference mark 39 (the step S7 of Figure 15).

Reference mark 39 is formed in the outer peripheral edges in the upper main surface of ceramic blank plate 27.In the present embodiment, as mentioned above, reference mark 39 is cross shapes, is irradiated and formed by laser.

In addition, reference mark 39 can not be formed according to the coordinate of originally specifying sometimes like that.This is because: inner in mark forming apparatus 31, when there being the position of X-ray irradiator 33 to there occurs thermal expansion, can there is small change in the distance between filming apparatus 34 and mark formation mechanism 36.

In order to correct the skew that this thermal expansion causes, such as, in mark formation mechanism 36, first only a reference mark 39 is formed.And this reference mark 39 is that the position that separates in the formation precalculated position with original reference mark 39 is formed.Next, then make microscope carrier 32 get back to filming apparatus 34, utilize filming apparatus 34 to take reference mark 39, obtain the side-play amount that thermal expansion causes.Next, then make microscope carrier 32 get back to mark formation mechanism 36, the coordinate that have modified above-mentioned side-play amount is formed reference mark 39.

When carrying out this timing, the shape that reference mark 39 preferably can be taken with filming apparatus 34, the shape that namely preferably can detect with X ray.Because by jointly using filming apparatus 34, the miniaturization and the cost reduction that mark forming apparatus 31 can be realized.Such as, by controlling the degree of depth of inscribing reference mark 39, the degree that can detect with X ray can be adjusted to.

As the variation of the flow chart shown in Figure 15, collimating marks can be utilized to detect (1) step S2 and collimating marks and to detect stand-by period between (2) step S3, implement the determination step of the several internal electrode patterns 22 in a part of internal electrode pattern determination step S5, such as 33 internal electrode patterns 22.In addition, the stand-by period that correction mark detecting step S4 can utilize collimating marks detection (1) step S2 and collimating marks to detect between (2) step S3 too implements, or, implement before also can detecting (1) step S2 in collimating marks.

After forming reference mark 39 as described above by mark forming apparatus 31, to the processing that ceramic blank plate 27 specifies, more specifically, the cutter sweep 37 shown in Fig. 6 is utilized to implement cutting processing.That is, microscope carrier 32 and ceramic blank plate 27 are together transplanted on cutter sweep 37, with cutter 41 ceramic cutting blanket 27, obtain the multi-disc ceramic green chip becoming the article body 2 of multi-layer ceramic capacitor 1.

In cutter sweep 37, utilize cutting filming apparatus 42 to take reference mark 39, and its view data is sent to cutting image-processing operations device 43, calculate the position of Virtual cropping line 40.At this, because the amount of the view data that should analyze is little, therefore processing speed is very fast.

Then, the raw chip of sintered ceramic, obtains the article body 2 after sintering.Next, by article body 2 two end face coated with conductive pastes and carry out burn-back, thus formed outer electrode 18 and 19, obtain multi-layer ceramic capacitor 1.

In addition, in the above-described embodiment, although enumerated the example of cutting processing as the processing after reference mark is formed, aligned in position, through hole formation and other processing can also have been carried out.

Claims (9)

1. a position measuring device, for measuring the coordinate of the workpiece being arranged on body interior, is characterized by, having:

Microscope carrier, it is for placing aforementioned body;

X-ray irradiator, it comprises the negative electrode generating electronics and the electronics passing through to be generated by above-mentioned negative electrode carries out colliding and produces the target of X ray, and to above-mentioned microscope carrier X-ray irradiation;

Filming apparatus, it detects the X ray from above-mentioned X-ray irradiator irradiation through the aforementioned body be positioned on above-mentioned microscope carrier, generates the X-ray image data of the above-mentioned workpiece of aforementioned body inside; With

Arithmetic unit, it, by processing the above-mentioned X-ray image data of sending from above-mentioned filming apparatus, calculates the coordinate of the above-mentioned workpiece of aforementioned body inside,

Curvilinear calibration curve is stored in above-mentioned arithmetic unit, this calibration curve depicts elapsed time after above-mentioned X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of above-mentioned target

Above-mentioned arithmetic unit is configured to: according to above-mentioned calibration curve, obtain the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of the above-mentioned target in the shooting moment at above-mentioned workpiece, and after this side-play amount is corrected, calculate the coordinate of the above-mentioned workpiece of aforementioned body inside

Above-mentioned position measuring device, above-mentioned microscope carrier is formed with collimating marks, and carries out following operation:

(1) after above-mentioned X-ray irradiator starts, have passed through first moment of uncertain time, above-mentioned filming apparatus is utilized to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the coordinate in the first moment of above-mentioned collimating marks;

(2) in the second moment that have passed through the time determined from above-mentioned first moment, above-mentioned filming apparatus is utilized again to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the coordinate in the second moment of above-mentioned collimating marks;

(3) in above-mentioned arithmetic unit, obtain the position on the above-mentioned calibration curve with the gradient identical with the gradient of the coordinate in above-mentioned second moment with the coordinate in above-mentioned first moment, and the fiducial time obtained on the above-mentioned calibration curve corresponding to the position on above-mentioned calibration curve, then, according to the said reference time on above-mentioned calibration curve, obtain actual fiducial time;

(4) above-mentioned filming apparatus is utilized to take the above-mentioned workpiece of aforementioned body inside, by the difference of the shooting moment of the X-ray image data of above-mentioned workpiece and the fiducial time of above-mentioned reality, be added on the said reference time on above-mentioned calibration curve mutually, obtain the shooting moment on above-mentioned calibration curve, then, from the side-play amount in the shooting moment above-mentioned calibration curve, deduct the side-play amount of the said reference time on above-mentioned calibration curve; And

(5) after the above-mentioned side-play amount of correction, the coordinate of the above-mentioned workpiece of aforementioned body inside is calculated.

2. a position measurement method, for measuring the coordinate of the workpiece being configured in body interior, is characterized by, having:

Aforementioned body is placed on the operation on microscope carrier;

Utilize X-ray irradiator to the operation of aforementioned body X-ray irradiation;

Utilize filming apparatus detection through the X ray of aforementioned body, and generate the operation of the X-ray image data of the above-mentioned workpiece of aforementioned body inside; And

By processing above-mentioned X-ray image data, calculate the operation of the coordinate of the above-mentioned workpiece of aforementioned body inside,

Above-mentioned X-ray irradiator comprises the negative electrode generating electronics and the electronics passing through to be generated by above-mentioned negative electrode carries out colliding and produces the target of X ray,

Above-mentioned position measurement method also has the operation of the calibration curve of formation curve shape, this curvilinear calibration curve depicts elapsed time after X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of above-mentioned target

The operation calculating the coordinate of above-mentioned workpiece comprises: the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus that the distortion obtaining the above-mentioned target in the shooting moment due to above-mentioned workpiece according to above-mentioned calibration curve produces, and after this side-play amount is corrected, calculate the operation of the coordinate of the above-mentioned workpiece of aforementioned body inside

Above-mentioned microscope carrier is formed with collimating marks, and the operation calculating the coordinate of above-mentioned workpiece comprises following operation:

(1) after above-mentioned X-ray irradiator starts, have passed through first moment of uncertain time, above-mentioned filming apparatus is utilized to take above-mentioned collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate in the first moment of above-mentioned collimating marks;

(2) in the second moment that have passed through the time determined from above-mentioned first moment, above-mentioned filming apparatus is utilized again to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate in the second moment of above-mentioned collimating marks;

(3) in above-mentioned arithmetic unit, obtain the position on the above-mentioned calibration curve with the gradient identical with the gradient of the coordinate in above-mentioned second moment with the coordinate in above-mentioned first moment, and the fiducial time obtained on the above-mentioned calibration curve corresponding to the position on above-mentioned calibration curve, then, according to the said reference time on above-mentioned calibration curve, obtain the operation of actual fiducial time;

(4) above-mentioned filming apparatus is utilized to take the above-mentioned workpiece of aforementioned body inside, by the difference of the shooting moment of the X-ray image data of above-mentioned workpiece and the fiducial time of above-mentioned reality, be added on the said reference time on above-mentioned calibration curve mutually, obtain the shooting moment on above-mentioned calibration curve, then, from the side-play amount in the shooting moment above-mentioned calibration curve, deduct the operation of the side-play amount of the said reference time on above-mentioned calibration curve; And

(5) after the above-mentioned side-play amount of correction, the operation of the coordinate of the above-mentioned workpiece of aforementioned body inside is calculated.

3. mark a forming apparatus, for forming reference mark on the position be associated with the coordinate of the workpiece being configured in body interior, it is characterized by, have:

Microscope carrier, it is for placing aforementioned body;

X-ray irradiator, it comprises the negative electrode generating electronics and the electronics passing through to be generated by above-mentioned negative electrode carries out colliding and produces the target of X ray, and to above-mentioned microscope carrier X-ray irradiation;

Filming apparatus, it detects the X ray from above-mentioned X-ray irradiator irradiation through the aforementioned body be positioned on above-mentioned microscope carrier, generates the X-ray image data of the above-mentioned workpiece of aforementioned body inside;

Arithmetic unit, it is by processing the above-mentioned X-ray image data of sending from above-mentioned filming apparatus, calculate the coordinate of the above-mentioned workpiece of aforementioned body inside, and according to the coordinate of above-mentioned workpiece, the reference mark calculating the position becoming said reference mark forms precalculated position; With

Reference mark formation mechanism, its said reference calculated by above-mentioned arithmetic unit in aforementioned body mark is formed on precalculated position, forms said reference mark,

Curvilinear calibration curve is stored in above-mentioned arithmetic unit, this calibration curve depicts elapsed time after above-mentioned X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of above-mentioned target

Above-mentioned arithmetic unit is configured to: according to above-mentioned calibration curve, obtain the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of the above-mentioned target in the shooting moment at above-mentioned workpiece, and after this side-play amount is corrected, calculate the coordinate of the above-mentioned workpiece of aforementioned body inside

Above-mentioned mark forming apparatus, above-mentioned microscope carrier is formed with collimating marks, and carries out following operation in order to the coordinate calculating above-mentioned workpiece:

(1) after above-mentioned X-ray irradiator starts, have passed through first moment of uncertain time, above-mentioned filming apparatus is utilized to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the coordinate in the first moment of above-mentioned collimating marks;

(2) in the second moment that have passed through the time determined from above-mentioned first moment, above-mentioned filming apparatus is utilized again to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the coordinate in the second moment of above-mentioned collimating marks;

(3) in above-mentioned arithmetic unit, obtain the position on the above-mentioned calibration curve with the gradient identical with the gradient of the coordinate in above-mentioned second moment with the coordinate in above-mentioned first moment, and the fiducial time obtained on the above-mentioned calibration curve corresponding to the position on above-mentioned calibration curve, then, according to the said reference time on above-mentioned calibration curve, obtain actual fiducial time;

(4) above-mentioned filming apparatus is utilized to take the above-mentioned workpiece of aforementioned body inside, by the difference of the shooting moment of the X-ray image data of above-mentioned workpiece and the fiducial time of above-mentioned reality, be added on the said reference time on above-mentioned calibration curve mutually, obtain the shooting moment on above-mentioned calibration curve, then, from the side-play amount in the shooting moment above-mentioned calibration curve, deduct the side-play amount of the said reference time on above-mentioned calibration curve; And

(5) after the above-mentioned side-play amount of correction, the coordinate of the above-mentioned workpiece of aforementioned body inside is calculated.

4. mark forming apparatus according to claim 3, is characterized by,

Aforementioned body is ceramic blank plate, and this ceramic blank plate is made up of the multi-disc ceramic green sheet of lamination and has unsintered internal electrode pattern in internal configurations,

Above-mentioned workpiece is above-mentioned internal electrode pattern.

5. mark forming apparatus according to claim 3, is characterized by,

Above-mentioned microscope carrier is configured to mark between formation mechanism at above-mentioned filming apparatus and said reference and moves.

6. mark forming apparatus according to claim 4, is characterized by,

Above-mentioned microscope carrier is configured to mark between formation mechanism at above-mentioned filming apparatus and said reference and moves.

7. the mark forming apparatus according to any one of claim 3 to 6, is characterized by,

Above-mentioned microscope carrier, above-mentioned X-ray irradiator, above-mentioned filming apparatus and said reference mark formation mechanism is incorporated in a housing.

8. a mark forming method, for forming reference mark on the position be associated with the coordinate of the workpiece being configured in body interior, is characterized by, have:

Aforementioned body is placed on the operation on microscope carrier;

Utilize X-ray irradiator to the operation of aforementioned body X-ray irradiation;

Utilize filming apparatus detection through the X ray of aforementioned body, and generate the operation of the X-ray image data of the above-mentioned workpiece of aforementioned body inside;

By processing above-mentioned X-ray image data, calculate the coordinate of the above-mentioned workpiece of aforementioned body inside, and according to the coordinate of above-mentioned workpiece, the reference mark calculating the position becoming said reference mark forms the operation in precalculated position;

Formed on precalculated position at the said reference mark of aforementioned body, form the operation of said reference mark; And

According to said reference mark, to the operation of the processing that aforementioned body specifies,

Above-mentioned X-ray irradiator comprises the negative electrode generating electronics and the electronics generated by above-mentioned negative electrode is carried out colliding and produce the target of X ray,

Above-mentioned mark forming method also has the operation of the calibration curve of formation curve shape, this curvilinear calibration curve depicts elapsed time after X-ray irradiator starts, relation with the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus produced due to the distortion of above-mentioned target

The operation calculating the coordinate of above-mentioned workpiece comprises: the side-play amount of the radioscopic image obtained by above-mentioned filming apparatus that the distortion obtaining the above-mentioned target in the shooting moment due to above-mentioned workpiece according to above-mentioned calibration curve produces, and after this side-play amount is corrected, calculate the operation of the coordinate of the above-mentioned workpiece of aforementioned body inside

Above-mentioned microscope carrier is formed with collimating marks, and the operation calculating the coordinate of above-mentioned workpiece comprises following operation:

(1) after above-mentioned X-ray irradiator starts, have passed through first moment of uncertain time, above-mentioned filming apparatus is utilized to take above-mentioned collimating marks, in arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate in the first moment of above-mentioned collimating marks;

(2) in the second moment that have passed through the time determined from above-mentioned first moment, above-mentioned filming apparatus is utilized again to take above-mentioned collimating marks, in above-mentioned arithmetic unit, according to obtained X-ray image data, obtain the operation of the coordinate in the second moment of above-mentioned collimating marks;

(3) in above-mentioned arithmetic unit, obtain the position on the above-mentioned calibration curve with the gradient identical with the gradient of the coordinate in above-mentioned second moment with the coordinate in above-mentioned first moment, and the fiducial time obtained on the above-mentioned calibration curve corresponding to the position on above-mentioned calibration curve, then, according to the said reference time on above-mentioned calibration curve, obtain the operation of actual fiducial time;

(4) above-mentioned filming apparatus is utilized to take the above-mentioned workpiece of aforementioned body inside, by the difference of the shooting moment of the X-ray image data of above-mentioned workpiece and the fiducial time of above-mentioned reality, be added on the said reference time on above-mentioned calibration curve mutually, obtain the shooting moment on above-mentioned calibration curve, then, from the side-play amount in the shooting moment above-mentioned calibration curve, deduct the operation of the side-play amount of the said reference time on above-mentioned calibration curve; And

(5) after the above-mentioned side-play amount of correction, the operation of the coordinate of the above-mentioned workpiece of aforementioned body inside is calculated.

9. mark forming method according to claim 8, is characterized by,

The processing of afore mentioned rules refers to cuts aforementioned body on the position be associated with the position of above-mentioned workpiece.