CN102528379B - Method for disassembling micro-electro-mechanical devices under assistance of laser impact - Google Patents
Method for disassembling micro-electro-mechanical devices under assistance of laser impact Download PDFInfo
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- CN102528379B CN102528379B CN201210064339.9A CN201210064339A CN102528379B CN 102528379 B CN102528379 B CN 102528379B CN 201210064339 A CN201210064339 A CN 201210064339A CN 102528379 B CN102528379 B CN 102528379B
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Abstract
The invention relates to a method for disassembling micro-electro-mechanical devices, in particular to separation of matched micro-electro-mechanical devices by using a mechanical effect of expansion and impact waves of plasmas produced by laser impact, and is suitable for disassembly and separation of the micro-electro-mechanical devices. The micro-electro-mechanical devices inside a micro-electro-mechanical system are disassembled through a non-contact force generated by an impact wave by utilizing the mechanical effect of the laser impact wave, so that the problems that contact scratches and damages of conventional operation to parts, and the parts are difficult to disassemble under a micro nano scale are solved; the micro-electro-mechanical devices are popped out by fully using the impact pressure of the laser impact wave in a laser radiation direction; and the method is a brand new method for disassembling the micro-electro-mechanical devices.
Description
Technical field
The present invention relates to a kind of method for dismounting of micro electro mechanical device, refer in particular to a kind of expansion of plasma and mechanics effect of shock wave that utilizes laser-impact to produce and realize the separation coordinating between micro electro mechanical device, be applicable to the dismounting of micro electro mechanical device with separated.
Background technology
MEMS has the feature of microminiaturization, variation, microelectronics technology, have advantages of that traditional Mechatronic Systems is incomparable, by appearance and size size, divide, MEMS can be divided into: the nano-machine of the micromechanics of the milli machine of 1-10mm, 1 μ m-1mm and 1nm-1 μ m; Under the yardstick that can reach at current MEMS, the basic law of macroscopic view physical world still in action, but along with constantly dwindling of device or structure, integrated level is more and more higher, the negligible disturbing factor in macroscopical aspect as the effect of manufacturing deficiency, friction will be more and more obvious; The dismounting of MEMS has its special character, and along with reducing of three-dimensional dimension, operand becomes gentlier, more high resilience, more easily damage, and the rigidity of structure is corresponding reduction also; Simultaneously chip class device has that size is small, lightweight, the feature of easy scuffing, therefore in traditional operating process, will guarantee the control of the active force of power tool to control the contact force of power tool and device.
The shock wave of induced with laser is the close (GW/cm of high power that utilizes the high-amplitude shock wave generation of induced with laser
2level), the strong laser irradiation of short pulse (tens ns) interacts to target material surface and surperficial coating material and makes the gasification of target material surface partial coating, ionizes formation plasma, the narrow and small region implode of plasma between restraint layer and target produces shock wave, the salient features such as that laser blast wave has is ultrafast, high pressure and high energy; At present, the technology such as reiforcing laser impact technology, laser impact forming is all the various engineering technology applications that utilize the shock wave of induced with laser to carry out; Utilize the auxiliary dismounting of laser-impact can realize the unloading process of contactless force, and can be by the technological parameter of regulating impulse laser, as pulse energy, spot size, pulse number etc. regulate the size of impulsive force.
Summary of the invention
The present invention is directed to the traditional operation process existing in micro electro mechanical device unloading process and easily device is caused to the problem that scratches difficult dismounting under damage and micro/nano-scale, proposed the method for the auxiliary micro electro mechanical device dismounting of a kind of laser blast wave.
In order to realize above object, the method for dismounting of the micro-electro-mechanical devices under assistance of laser impact that the present invention takes, comprises the following steps:
(1) first with alcohol or acetone, clean micro electro mechanical device surface;
(2) absorbed layer is coated onto to micro electro mechanical device surface in advance, described absorber thickness is 0.1-0.15 mm;
(3) utilize the viscosity of absorbed layer that MEMS is adhered to metal glass surface, the adhesive strength of absorbed layer is greater than the pressure that the laser-impact micro electro mechanical device back side produces, and makes by the micro electro mechanical device of laser-impact, can not come off from glass surface; Glassy metal, as the carrying carrier of micro electro mechanical device and the restraint layer of laser-impact, should have the unlikely instantaneous high pressure being produced by laser blast wave of enough intensity and break through;
(4) glassy metal that is loaded with MEMS is positioned to collection box top, and adopts stationary fixture that micro electro mechanical device and glassy metal are fixed, make in laser-impact process micro electro mechanical device partly not separated with glassy metal;
(5) laser beam is aimed to the back side of the micro electro mechanical device that needs dismounting, transmitting high energy short-pulse laser impact scribble absorbed layer the micro electro mechanical device back side, in impact process, can adopt single bundle or multiple laser to impact the micro electro mechanical device back side that will remove, the area at the micro electro mechanical device back side that shock zone is less than will remove simultaneously;
(6) high pressure that utilizes laser blast wave to produce is ejected into the micro electro mechanical device that needs dismounting in collection box, and the micro electro mechanical device that impact is unloaded is placed in acetone and soaks, and then with ultrasonic cleaning, removes the absorbed layer on micro electro mechanical device surface.
The method of described a kind of disassembling micro-electro-mechanical devices under assistance of laser impact, is characterized in that: described glassy metal is the synthetic bulk amorphous alloy of (Gd-Tb)-Co-Al multicomponent alloy; The thickness of glassy metal should make glass can bear the pressure that is not less than 500MPa.
The method of described a kind of disassembling micro-electro-mechanical devices under assistance of laser impact, it is characterized in that: the preparation method of absorbed layer is as follows: the carbon dust, ethyl acetate, the polyvinyl alcohol that using the polyvinyl alcohol as binding agent, diameter, are 4 ~ 6 microns are placed in container according to the ratio of mass ratio 6:2:1:1, coating is stirred and mixed well, then adopt mass percentage concentration be 30% sodium hydroxide solution to regulate the pH value of coated coating be 7, layer can be absorbed; Because binder content has greatly high viscosity, can firmly make MEMS be attached to metal glass surface; Absorbed layer is all vaporizations in laser irradiation process, can not remain in micro electro mechanical device surface, and micro electro mechanical device surface cleaning is pollution-free; It is neutral that the Acidity of Aikalinity of coating is, can be because its meta-acid (alkali) property produces corrosion damage to microcomponent surface; From dry solvent or diluent, adopt ethyl acetate, not containing phenyl compound, no side effects.
The method of described a kind of disassembling micro-electro-mechanical devices under assistance of laser impact, it is characterized in that: the micro electro mechanical device shape of dismantling has following requirement: along the size of bombardment with laser beams direction micro electro mechanical device, can not be and reduce trend, can guarantee that micro electro mechanical device can remove smoothly along beam direction.
The method of described a kind of disassembling micro-electro-mechanical devices under assistance of laser impact, is characterized in that: described laser pulse width is 10-20 ns, and the laser-impact time is 60-120 ns; Energy is 1-12 joule.
The innovation of the principle of the invention is to utilize laser blast wave as the power source of dismounting micro electro mechanical device, and micro electro mechanical device is launched preprepared collection box from laser emission direction; Owing to being the absorbed layer absorbing laser energy that is coated in the micro electro mechanical device back side, guaranteed the non-destructive of micro electro mechanical device.
The innovation of the auxiliary dismounting of a kind of laser-impact of the present invention micro electro mechanical device process, utilize the mechanics effect of laser blast wave, the contactless force producing by shock wave is realized the dismounting to the micro electro mechanical device of MEMS inside, avoided routine operation to difficult dismounting problem under the contact scuffing of parts and damage and micro/nano-scale, the surge that makes full use of laser blast wave is launched out micro electro mechanical device in laser emission direction, is a kind of brand-new micro electro mechanical device method for dismounting.
The present invention adopts laser blast wave as the power source of micro electro mechanical device dismounting, has following advantage:
1. the present invention is based on the blast effect of high energy short-pulse laser, by the contactless force that shock wave produces and the expansion of plasma in die cavity produces, realize the noncontact of MEMS inside micro electro mechanical device is dismantled, having avoided conventional disassembling section to the dismounting problem under contact scuffing, damage and the micro/nano-scale of parts, is a kind of brand-new micro electro mechanical device method for dismounting.
2. because the present invention's laser pulse width used is 10-20 ns, so unloading process has ultrafast feature, can realize microcomponent moment separated, and during impact force action, compole is short, is only 60-120 ns.
3. because laser of the present invention is just irradiated to absorbed layer, do not shine directly into micro element surface, at utmost point short time inner laser energy, be all absorbed by the absorption layer, form plasma, expansion generation shock wave, can not cause to micro electro mechanical device the injuries such as ablation.
4. the present invention's absorbed layer used can firmly make MEMS be attached to metal glass surface; Absorbed layer is all vaporizations in laser irradiation process, can not remain in micro electro mechanical device surface, and micro electro mechanical device surface cleaning is pollution-free.
5. the present invention also can regulate pulsed laser energy, laser beam quantity and spot size to regulate the size of impulsive force by computer control as required, is convenient to regulation and control.
In sum, the present invention is applied to micro electro mechanical device dismounting the mechanics effect of laser-impact, can avoid the damage of unloading process to microcomponent, the moment that can realize micro element separated simultaneously, the amount of force of unloading process is convenient to regulate by computer, in MEMS assembling field, has broad application prospects.
Accompanying drawing explanation
Fig. 1 is interference fit schematic diagram between the micro electro mechanical device (as micro-gear and axle, micro-bearing and axle) in MEMS schematic diagram and system;
Fig. 2 is the micro electro mechanical device surface coverage high viscosity coating schematic diagram of MEMS;
Fig. 3 is that MEMS adheres to metal glass surface schematic diagram;
Fig. 4 is disassembling micro-electro-mechanical devices under assistance of laser impact schematic diagram;
Fig. 5 is micro electro mechanical device II and the separated schematic diagram of micro electro mechanical device I;
Fig. 6 is micro electro mechanical device II schematic diagram separated with glassy metal;
1, MEMS; 2, micro electro mechanical device I; 3, micro electro mechanical device II; 4, MEMS carrier wafer; 5, absorbed layer; 6, glassy metal; 7, stationary fixture; 8, pulse laser; 9, plasma;
Fig. 7 is the schematic diagram of laser assisted micro electro mechanical device provision for disengagement
10, Computer Control Unit; 11, nanosecond laser generator; 12,45
ototal reflective mirror; 13, regulate hot spot optical mirror slip; 14, mask device; 15, substrate; 16, briquetting; 17, collection box; 18, three axle workbench; 19, monitoring device.
The specific embodiment
Below in conjunction with accompanying drawing, describe details and the working condition of the concrete device of the present invention's proposition in detail.
Micro electro mechanical device I2 is attached to MEMS carrier wafer 4, and micro electro mechanical device II3 is connected with micro electro mechanical device I2 interference, forms MEMS 1.
With alcohol or acetone, wash micro electro mechanical device I2 and micro electro mechanical device II3 surface, absorbed layer 5 is coated onto to micro electro mechanical device I2 and the micro electro mechanical device II3 back side in advance, absorbed layer 5 thickness are 0.1-0.15 mm, and have enough viscosity, and MEMS 1 can not come off from glassy metal 6 surfaces; Utilize the viscosity of absorbed layer 5 that MEMS 1 is adhered to high duty metal glass 6 surfaces, glassy metal 6 is as the carrying carrier of MEMS 1 and the restraint layer of laser-impact; The glassy metal 6 that is loaded with MEMS 1 is positioned to collection box 17 tops and compresses with briquetting 16; Utilize stationary fixture 7 that micro electro mechanical device I2 is clamped; Laser beam 8 is first aimed to the back side of micro electro mechanical device II3, transmitting high energy short-pulse laser 8 first impacts the back side of the micro electro mechanical device II3 that scribbles absorbed layer 5, in impact process, can adopt single bundle or multiple laser to impact the micro electro mechanical device II3 back side simultaneously, make shock zone be less than the area at the micro electro mechanical device II3 back side; The high pressure plasma 9 that laser radiation absorbance layer produces expands, and at the utmost point, in the short time, impacting with high pressure power is occurred micro electro mechanical device II3 to, and micro electro mechanical device II3 is ejected in collection box 17 along pulse laser 8 radiation directions; Remove stationary fixture 7, then laser beam 8 is aimed at and impacted the back side of the micro electro mechanical device I2 that scribbles absorbed layer 5, micro electro mechanical device I2 can be ejected in collection box 17 along pulse laser beam 8 radiation directions.
The micro electro mechanical device I2 that impact is unloaded and micro electro mechanical device II3 are placed in acetone and soak, and then with Ultrasonic Cleaning, remove the absorbed layer on micro electro mechanical device I2 and micro electro mechanical device II3 surface.
With the present invention, carry out disassembling micro-electro-mechanical devices under assistance of laser impact device and comprise connected successively Computer Control Unit 10, nanosecond laser generator 11,45
ototal reflective mirror 12, hot spot regulate optical mirror slip 13, mask device 14, substrate 15, glassy metal 6, briquetting 16, MEMS 1, collection box 17, three axle workbench 18, monitoring device 19.
It is the laser pulse of 10-20 nanosecond in 1-12 joule, duration that nanosecond laser generator 11 sends energy, laser beam) pattern can be the various modes such as basic mode, multimode, it is by Computer Control Unit 10 regulation and controls; The laser beam 8 being produced by nanosecond laser generator 11 is by 45
ototal reflective mirror 12 changes the direction of laser beam 8, by hot spot, regulate optical mirror slip 13 accurately to control hot spot dimensional energy distribution, the light spot shape of controlling Output of laser through mask device 14, transparent substrate 15 is used for holding hot spot and regulates optical mirror slip 13 and mask device 14; Laser beam 8 continues penetrating metal glass 6, and the energy vaporization of absorbed layer absorbing laser bundle 8, ionization form shock wave, and micro electro mechanical device is launched in collection box 17; Monitoring device 19 is used for monitoring position and the impact effect of laser beam 8 irradiation absorption layers, and Monitoring Data is returned to Computer Control Unit 10, as being used for controlling three axle workbench 18 and the foundation that regulates the technological parameter of nanosecond laser generator 11; Computer Control Unit 10 is controlled three axle workbench 18 control collection boxes 17 and is moved, and glassy metal 6 is positioned the top of collection box 17 and is fixed by briquetting 16.
Claims (4)
1. a method for disassembling micro-electro-mechanical devices under assistance of laser impact, comprises the steps:
(1) first with alcohol or acetone, clean micro electro mechanical device surface;
(2) absorbed layer is coated onto to micro electro mechanical device surface in advance, described absorber thickness is 0.1-0.15 mm;
(3) utilize the viscosity of absorbed layer that MEMS is adhered to metal glass surface, the adhesive strength of absorbed layer is greater than the pressure that the laser-impact micro electro mechanical device back side produces, and makes by the micro electro mechanical device of laser-impact, can not come off from glass surface; Glassy metal, as the carrying carrier of micro electro mechanical device and the restraint layer of laser-impact, should have the unlikely instantaneous high pressure being produced by laser blast wave of enough intensity and break through;
(4) glassy metal that is loaded with MEMS is positioned to collection box top, and adopts stationary fixture that micro electro mechanical device and glassy metal are fixed, make in laser-impact process not separated with glassy metal without the micro electro mechanical device part of dismantling;
(5) laser beam is aimed to the back side of the micro electro mechanical device that needs dismounting, transmitting high energy short-pulse laser impacts the micro electro mechanical device back side that scribbles absorbed layer, in impact process, adopt single bundle or multiple laser to impact the micro electro mechanical device back side that will remove, the area at the micro electro mechanical device back side that shock zone is less than will remove simultaneously;
(6) high pressure that utilizes laser blast wave to produce is ejected into the micro electro mechanical device that needs dismounting in collection box, and the micro electro mechanical device that impact is unloaded is placed in acetone and soaks, and then with ultrasonic cleaning, removes the absorbed layer on micro electro mechanical device surface.
2. the method for a kind of disassembling micro-electro-mechanical devices under assistance of laser impact as claimed in claim 1, is characterized in that: described glassy metal is the synthetic bulk amorphous alloy of (Gd-Tb)-Co-Al multicomponent alloy; The thickness of glassy metal should make glass can bear the pressure that is not less than 500MPa.
3. the method for a kind of disassembling micro-electro-mechanical devices under assistance of laser impact as claimed in claim 1, it is characterized in that: the micro electro mechanical device shape of dismantling has following requirement: along the size of bombardment with laser beams direction micro electro mechanical device, can not be and reduce trend, can guarantee that micro electro mechanical device can remove smoothly along beam direction.
4. the method for a kind of disassembling micro-electro-mechanical devices under assistance of laser impact as claimed in claim 1, is characterized in that: described laser pulse width is 10-20 ns, and the laser-impact time is 60-120 ns; Energy is 1-12 joule.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210064339.9A CN102528379B (en) | 2012-03-13 | 2012-03-13 | Method for disassembling micro-electro-mechanical devices under assistance of laser impact |
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| CN201210064339.9A CN102528379B (en) | 2012-03-13 | 2012-03-13 | Method for disassembling micro-electro-mechanical devices under assistance of laser impact |
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| CN102528379A CN102528379A (en) | 2012-07-04 |
| CN102528379B true CN102528379B (en) | 2014-03-12 |
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| CN102225491B (en) * | 2011-06-09 | 2014-04-02 | 安徽工业大学 | Method and device for forming metal reducer pipe based on laser shock wave technology |
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