CN102528293A - Depth-adjustable femtosecond laser punching device for printing stencils - Google Patents
Depth-adjustable femtosecond laser punching device for printing stencils Download PDFInfo
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- CN102528293A CN102528293A CN2012100073060A CN201210007306A CN102528293A CN 102528293 A CN102528293 A CN 102528293A CN 2012100073060 A CN2012100073060 A CN 2012100073060A CN 201210007306 A CN201210007306 A CN 201210007306A CN 102528293 A CN102528293 A CN 102528293A
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Abstract
A depth-adjustable femtosecond laser punching device for printing stencils comprises a femtosecond laser device, a first collimating lens, a fixed diaphragm, a second collimating lens, an adjustable diaphragm, an axicon and a sample table. The first collimating lens, the fixed diaphragm, the second collimating lens, the adjustable diaphragm, the axicon and the sample table are sequentially arranged on an output light path of the femtosecond laser device, a martensite stainless steel sample to be processed is placed on the sample table, optical centers of the fixed diaphragm, the second collimating lens, the adjustable diaphragm and the axicon are coincident in a propagation direction, and a processing area of the sample table is positioned in a non-diffraction area on one side of the axicon. A combined structure consisting of the adjustable diaphragm and the axicon is adopted, laser can be refocused on the stainless steel sample to be processed, the focal depth of the laser is long, the diaphragms with adjustable aperture ranging from 0 step to 250 steps can obtain energy-adjustable laser with steps ranging from 0 to 250, and accordingly, holes with different depths can be punched on the printing stencils.
Description
Technical field
The present invention relates to femtosecond laser metalworking technology field, particularly a kind of printing stencil femtosecond laser perforating device of adjustable-depth.
Background technology
Because pulse operating time that femtosecond laser is ultrashort and the interaction mechanism unique with metal material thereof, the metal processing of femtosecond laser can overcome the defective of conventional mechanical processing method, realizes high-quality " cold " processing of metal material.More traditional Long Pulse LASER has many incomparable unique advantages aspect microfabrication: the low consumption of very little, the smooth flawless in bore edges heat-affected zone, machining energy.
Femtosecond laser printing stencil punching technology is to carry out spot scan with the femtosecond laser beam that focuses on to accomplish, and uses lens or microcobjective that light beam is focused on usually.The fixed laser focus is motionless, through the motion of programming Control sample to be processed, can prepare the micro-structural of any pattern.But when being processed with the sample that the degree of depth requires, it is powerless that traditional femtosecond laser seems usually.Therefore, when processed sample, how to keep the character advantage of femto-second laser, make the sample of processing can satisfy the different degree of depth requirement of printing stencil punching simultaneously, be the problem that this area presses for solution always.
Summary of the invention
The object of the present invention is to provide a kind of printing stencil femtosecond laser perforating device of adjustable-depth, it can satisfy the depth-adjustment requirement to the printing stencil punching.
Technical solution proposed by the invention is such:
A kind of printing stencil femtosecond laser perforating device of depth-adjustment; Comprise femto-second laser; Along being disposed with the 1st collimation lens, fixed aperture, the 2nd collimation lens, adjustable diaphragm, axle pyramid and sample stage on the output light path of said femto-second laser; Said fixed aperture, the 2nd collimation lens, adjustable diaphragm and the optical centre of axle pyramid on the direction of propagation overlap, and the said sample stage that is placed with martensitic stain less steel sample to be processed is arranged in the no diffraction region of said axle pyramid one side.
The femtosecond laser that sends from femto-second laser obtains collimation laser through the collimation lens set of being made up of the 1st collimation lens, fixed aperture, the 2nd collimation lens, and this collimation laser is through obtaining the collimation laser of different capacity scope behind the adjustable diaphragm.
From the collimation laser that collimation lens set obtains, behind adjustable diaphragm, vertically inject on the bottom surface of a pyramid, produce the diffraction light-free bundle and also focus on again on the sample to be processed on the sample stage.
Among the present invention, collimation laser obtains the laser beam of different-energy through the laser that changes adjustable diaphragm through area when the adjustable diaphragm, thus realize laser beam from 0 to maximum output power-adjustable.
Axle pyramid among the present invention can realize the aircraft laser beam that generates is focused on, and the laser of this focusing has the characteristic of long depth of focus, no diffraction.Test verified; When a branch of light beam that is Gaussian distribution passes through a collimating lens system and an axle pyramid successively; This moment, this light beam will focus on the axial direction of propagation of axle pyramid one side again; And the characteristics that present the diffraction light-free bundle promptly have long depth of focus and concentration of energy in the very little scope of axial radii.
Compared with prior art, the present invention has following remarkable result:
(1) owing to adopted adjustable diaphragm,, obtain the laser of different capacity so can change the logical light area of diaphragm, thereby, satisfied the different depth requirement of laser printing masterplate punching.
(2), can make the laser focus on very little scope and have very high energy, and this laser has the characteristics of long depth of focus, thereby realize treating the accurate printing stencil punching of processed sample owing to adopted the combining structure of laser collimation system and axle pyramid.
(3) owing to adopted the combining structure of adjustable diaphragm, laser collimation system and axle pyramid; Through changing laser through the logical light area of diaphragm; Can obtain the laser of different-energy grade, through the axle pyramid focus on again, this laser that focuses on again have the diffraction light-free bundle in the direction of propagation the profound characteristics of the part of the body cavity above the diaphragm housing the heart and lungs; Thereby make laser can not guarantee the degree of accuracy of laser printing masterplate punching because of cause energy to reduce through adjustable diaphragm.
Description of drawings
Fig. 1 is the structural representation of printing stencil femtosecond laser perforating device of a kind of adjustable-depth of one embodiment of the invention.
Fig. 2 is the structural representation that perforating device shown in Figure 1 generates no diffracted laser beam.
Fig. 3 is the light intensity sketch map of A-A lateral cross section on the no diffraction region shown in Figure 2.
The specific embodiment
Through following embodiment the present invention is done further to set forth in detail.
Referring to Fig. 1, Fig. 2, shown in Figure 3, a kind of printing stencil femtosecond laser perforating device of adjustable-depth is by femto-second laser 1, form along the 1st collimation lens of arranging successively on the output light path of this femto-second laser 12, fixed aperture the 3, the 2nd collimation lens 4, adjustable diaphragm 5, axle pyramid 6 and the sample stage 7 that is placed with martensitic stain less steel sample to be processed.The 1st collimation lens 2, fixed aperture the 3, the 2nd collimation lens 4 are formed collimation lens set.Said fixed aperture the 3, the 2nd collimation lens 4, adjustable diaphragm 5 and the optical centre of axle pyramid 6 on the direction of propagation overlap, and the sample stage 7 that is placed with martensitic stain less steel sample to be processed is arranged in the no diffraction region 8 of a pyramid 6 one sides.
So the parameter of present embodiment femto-second laser 1 is following: pulse width is＜100fs, and centre wavelength is 780-820nm, and repetition rate is 10KHZ, and range of working temperature is 23 ℃ ± 5 ℃.In order to obtain collimation laser, the laser that is produced by laser inverter passes through collimating optical system, and wherein the right focus of the left focus of the 1st collimation lens 2 and the 2nd collimation lens 4 overlaps.The collimation laser that produces, behind adjustable diaphragm 5, the bottom surface of vertically injecting a pyramid 6 also focuses on the sample to be processed again.The structural representation that produces no diffracted laser beam is as shown in Figure 2, and the light intensity that on the A-A cross section of laser beam, shows is as shown in Figure 3, and abscissa unit is μ m, and ordinate unit is mm.
In the present embodiment, adjustable diaphragm 5 is divided into 256 grades, and its aperture is maximum in the time of 0 grade, and the aperture is minimum in the time of the 255th grade, and axle pyramid angle ф is 1 ° ± 0.05 °.The femtosecond printing stencil punching effect that produces, can reach the punching maximum gauge is 10 μ m, the adjustable punching degree of depth is 0-100 μ m.
Practical operation shows: the advantage of printing stencil femtosecond laser perforating device of the present invention is; Owing to adopt the combining structure of adjustable diaphragm and axle pyramid; Not only obtained the laser of different capacity; Guaranteed that laser can not reduce because of energy takes place through adjustable diaphragm, and can focus on again on the zone to be processed that diameter is very little in the martensitic stain less steel sample to have longer depth of focus simultaneously; The adjustable aperture diaphragm of 0-250 step-lengths can obtain the laser of the adjustable energy of 0-250 step-lengths, thereby realizes the femtosecond printing stencil punching of different depth requirement is arranged.
Claims (3)
1. the printing stencil femtosecond laser perforating device of a depth-adjustment; Comprise femto-second laser; It is characterized in that: along being disposed with the 1st collimation lens, fixed aperture, the 2nd collimation lens, adjustable diaphragm, axle pyramid and sample stage on the output light path of said femto-second laser; Said fixed aperture, the 2nd collimation lens, adjustable diaphragm and the optical centre of axle pyramid on the direction of propagation overlap, and the said sample stage that is placed with martensitic stain less steel sample to be processed is arranged in the no diffraction region of said axle pyramid one side.
2. the printing stencil femtosecond laser perforating device of depth-adjustment according to claim 1; It is characterized in that: the femtosecond laser that sends from femto-second laser obtains collimation laser through the collimation lens set of being made up of the 1st collimation lens, fixed aperture, the 2nd collimation lens, and this collimation laser is through obtaining the collimation laser of different capacity scope behind the adjustable diaphragm.
3. the printing stencil femtosecond laser perforating device of depth-adjustment according to claim 1 and 2; It is characterized in that: the collimation laser that obtains from collimation lens set; Behind adjustable diaphragm; Vertically inject on the bottom surface of a pyramid, produce the diffraction light-free bundle and also focus on again on the sample to be processed on the sample stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100073060A CN102528293A (en) | 2012-01-11 | 2012-01-11 | Depth-adjustable femtosecond laser punching device for printing stencils |
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| CN2012100073060A CN102528293A (en) | 2012-01-11 | 2012-01-11 | Depth-adjustable femtosecond laser punching device for printing stencils |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105081586A (en) * | 2015-09-14 | 2015-11-25 | 郑州轻工业学院 | Laser processing method and device |
| CN105537761A (en) * | 2016-02-23 | 2016-05-04 | 大族激光科技产业集团股份有限公司 | Laser cutting auxiliary device |
| CN109570781A (en) * | 2017-09-28 | 2019-04-05 | 上海微电子装备（集团）股份有限公司 | A kind of microwell array processing unit (plant) and method |
| CN111151873A (en) * | 2018-11-06 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Laser cutting device and method for brittle material |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081586A (en) * | 2015-09-14 | 2015-11-25 | 郑州轻工业学院 | Laser processing method and device |
| CN105537761A (en) * | 2016-02-23 | 2016-05-04 | 大族激光科技产业集团股份有限公司 | Laser cutting auxiliary device |
| CN109570781A (en) * | 2017-09-28 | 2019-04-05 | 上海微电子装备（集团）股份有限公司 | A kind of microwell array processing unit (plant) and method |
| CN111151873A (en) * | 2018-11-06 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Laser cutting device and method for brittle material |
| CN113369719A (en) * | 2021-05-14 | 2021-09-10 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
| CN113369719B (en) * | 2021-05-14 | 2023-01-31 | 惠州中京电子科技有限公司 | Laser drilling method for LED carrier plate |
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Application publication date: 20120704 |