CN102412437B - Manufacturing method of antenna - Google Patents
Manufacturing method of antenna Download PDFInfo
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- CN102412437B CN102412437B CN201010287510.3A CN201010287510A CN102412437B CN 102412437 B CN102412437 B CN 102412437B CN 201010287510 A CN201010287510 A CN 201010287510A CN 102412437 B CN102412437 B CN 102412437B
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Abstract
The invention provides a manufacturing method of an antenna. The manufacturing method comprises the following steps of: firstly providing a base material, the surface of the base material is provided with an antenna area; next, utilizing a chemical plating process to form a metal medium layer so as to cover the surface of the base material; then covering the metal medium layer with an anti-plating resisting agent; furthermore, removing the anti-plating resisting agent on the antenna area; later, utilizing an electroplating process to form a metal material distributed on the antenna area so as to form an antenna main body; and finally removing the anti-plating resisting agent on the surface of the base material and removing the metal medium layer outside the antenna. In the manufacturing method, the chemical plating process and the electroplating process are effectively integrated, so that the antenna is easily formed on a shell of a communication product, further the space in the shell can be effectively saved, the solid antenna with larger volume can be replaced, the production steps can be greatly simplified, and the assembling time of members can be reduced.
Description
Technical field
The present invention relates to a kind of manufacture method, particularly relate to a kind of manufacture method of antenna.
Background technology
Due to the fast development of scientific and technological communications industry, the application of information products is also healed thereupon and is become universal, the communications electronics products such as such as mobile phone, E-book reader or notebook computer, appear at continually daily arround among.And this not only significantly promotes convenience in life, also in the time and space, caused especially compression, modern everyone no longer limited to be restricted in geographic boundary, and can make the interchange of the interactive and a large amount of message knowledge of combination more closely to each other, make pursuit reach common interests happiness optimization.Hereat, in radio communication, antenna is just like brought into play critical function between two parties, makes information transmission and exchange of knowledge more convenient, without hindrance.
But, at present general entity sheet metal antenna because of its volume larger, often must be at reserved its configuration space of casing; Comparatively speaking, the height that antenna can use is often confined to the whole height of configuration space.So, this is not only very large for compact product design tendency influence, and making especially in the design of antenna must compromise, causes radiation pattern and the reception effect that often cannot obtain optimization.
Summary of the invention
Therefore, an object of the present invention is is providing a kind of manufacture method of antenna, by conjunction with chemical plating and electroplating technique mode, dwi hastasana is formed on the housing of its product device, effectively reduces casing inner space.
The manufacture method of this antenna comprises the following steps: first, provide a base material, and this substrate surface has an antenna field; Then, utilize chemical plating process to form a metallic dielectric layer, to be covered on the surface of this base material; Secondly, cover primary antibodie plating resist on this metallic dielectric layer; Moreover, remove this anti-plating resist on this antenna field; Afterwards, utilize electroplating technology to form the metal material being distributed on this antenna field, to form an antenna body; Finally, remove this anti-plating resist of this substrate surface and remove this metallic dielectric layer outside this antenna field.
According to one embodiment of the invention, wherein antenna field has an antenna pattern.
According to one embodiment of the invention, also comprise roughening substrate surface.
According to one embodiment of the invention, also comprise and form a groove in antenna field.
According to one embodiment of the invention, wherein the material of metallic dielectric layer is palladium or macromolecular material.
According to one embodiment of the invention, wherein remove the anti-plating resist on antenna field, comprise by the anti-plating resist of removing on antenna field, to expose the metallic dielectric layer that is covered in antenna field.
According to one embodiment of the invention, wherein the anti-plating resist on antenna field utilizes the mode of dry-etching to process removal.
According to one embodiment of the invention, wherein dry-etching is the processing mode of a laser engraving.
According to one embodiment of the invention, wherein metal material is copper, nickel or gold.
From the above, method for manufacturing antenna of the present invention is effectively integrated chemical plating and electroplating technology, make antenna be easy to be formed on the shell of communication products, and then not only can effectively save the space in its casing, can replace especially the entity antenna that volume is larger, significantly simplify its production stage and reduce the assembled component time.
Accompanying drawing explanation
For above and other object of the present invention, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 illustrates the flow chart according to a kind of manufacture method of one embodiment of the invention.
Fig. 2 A-Fig. 2 G illustrates respectively the corresponding antenna assembly of each step of manufacture method in Fig. 1.
Primary clustering symbol description:
100: manufacture method 200: antenna assembly
101: step 210: base material
102: step 212: surface
103: step 214: antenna field
104: step 216: groove
105: step 220: metallic dielectric layer
106: step 230: anti-plating resist
107: step 240: antenna body
Embodiment
In order to make narration of the present invention more detailed and complete, can be with reference to appended accompanying drawing and the various embodiment of the following stated, in accompanying drawing, identical number represents same or analogous assembly.On the other hand, well-known assembly and step are not described in embodiment, with the restriction of avoiding causing the present invention unnecessary.
Please refer to Fig. 1 and Fig. 2 A to Fig. 2 F, Fig. 1 illustrates the flow chart according to the manufacture method of a kind of antenna of one embodiment of the invention; Fig. 2 A to Fig. 2 F illustrates Fig. 1 implements the schematic perspective view of the antenna assembly after each step.
As shown in Figure 1, the manufacture method 100 of antenna comprises the following steps: first, step 101 is for a base material 210 is provided, and a surface 212 of base material 210 has an antenna field 214.Then, step 102 is for utilizing chemical plating process to form a metallic dielectric layer 220, to be covered on the surface 212 of base material 210.Secondly, step 103 is for covering primary antibodie plating resist (anti-plating resist paste) 230 on metallic dielectric layer 220.Moreover step 104 is for removing the anti-plating resist 230 on antenna field 214.Afterwards, step 105 is abound with on antenna field 214 for utilizing electroplating technology to form a metal material, to form an antenna body 240.Finally, step 106 is for removing anti-plating resist 230.And step 107 item is the metallic dielectric layer 220 outside removal antenna field 214.
In step 101, manufacture method 100 provides base material 210, i.e. antenna assembly 200 as shown in step 101 as corresponding in Fig. 2 A.But base material 210 can be general mobile phone, pen electricity (notebook) or E-book reader etc. and has the housing of the electronic installation of radio communication function, and its material non-conductive material such as be plastics.In one embodiment, can further give roughening for the surface 212 of base material 210, for example: by base material 210 is soaked in strong acid or strong base solution, cause its surface 212 to carry out comprehensive roughening; Also or, by processing modes such as laser engravings, the antenna field 214 of base material 210 is carried out the roughening effect of its surface local scope.
In addition, antenna field 214 has an antenna pattern.Therefore, in one embodiment, can also form a groove 216 in antenna field 214 by dry-etching respective antenna figures such as laser engravings.Thus, can improve the skin-friction coefficient of base material 210, and then the adaptation of the metallic dielectric layer 220 that increases and form in step 102.
In step 102, manufacture method 100 utilizes chemical plating process to form a metallic dielectric layer 220, to be covered on the surface 212 of base material 210, as the counter structure in Fig. 2 B.In one embodiment, the material of metallic dielectric layer 220 can be palladium or macromolecular material.Although above-mentioned execution mode diagram corresponding to it is that just the present invention is not limited to this, and also can only be formed metallic dielectric layer 220 to the local surface areas of base material 210 by all evenly branch's metallic dielectric layer 220 of all surfaces of base material 210.
In step 103, manufacture method 100 forms primary antibodie plating resist 230 on the metallic dielectric layer 220 of base material 210, and is covered on metallic dielectric layer 220, as shown in Figure 2 C.But anti-plating resist 230 is uniformly distributed on base material 210, and then the surface 212 of effectively blocking soda acid erosion base material 210, fully reach protective effect.
In step 104, manufacture method 100 is removed the anti-plating resist 230 on antenna field 214.Therefore, as shown in Figure 2 D, antenna assembly 200 is exposed the metallic dielectric layer 220 on antenna field 214, the antenna pattern having corresponding to antenna field 214.In one embodiment, the anti-plating resist 230 on antenna field 214 utilizes the mode of dry-etching to be processed removal.But wherein dry-etching can be the processing mode of laser engraving, improve and remove its anti-plating resist 230 to appear the precision of antenna pattern of antenna field 214.
In step 105, manufacture method 100 utilizes electroplating technology on base material 210, and uniform deposition one metal material is at antenna field 214, to form an antenna body 240, as shown in Figure 2 E.More specifically, owing to being formed at the metallic dielectric layer 220 on base material 210 surfaces 212 in step 102, therefore any position of base material 210 all can be provided as contact required while plating, applied external voltage, thereby can on base material 210, directly implement electroplating technology, and promote the degree of freedom and the convenience that it is made.On the other hand, step 103 only forms anti-plating resist 230 on the surface being covered in beyond antenna field 214 with step 104, thereby the metal material that is effectively controlled is evenly covered with on the metallic dielectric layer 220 that is deposited on antenna field 214, form antenna body 240 on base material 210 in electroplating technology.In addition, in one embodiment, in electroplating technology, can be copper, nickel or gold in order to the metal material of deposition formation antenna body 240.
In step 106, manufacture method 100 is removed all anti-plating resist 230 on base material 210, forms structure as shown in Figure 2 F.As shown in the figure, the antenna body 240 on antenna field 214, the remaining surface of base material 210 is all being coated metallic dielectric layer 220.
In step 107, manufacture method 100 is removed in above-mentioned steps by chemical plating to be deposited on the metallic dielectric layer 220 outside antenna field 214, forms structure as shown in Figure 2 G.But 220 of metallic dielectric layers outside antenna field 214 can be removed by etch process mode, only retain the aerial radiation main body 240 being positioned on antenna field 214.
Thus, by the above-mentioned technological design concept of the present invention, effectively integrated chemical plating and electroplating technology, overcome process technology limit previously, antenna setting is formed on the shell of communication products, and then not only can effectively save the space in its casing, and can replace especially entity antenna, significantly simplify its production stage and reduce the assembled component time.
Although the present invention with execution mode openly as above; but it is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; should be used for a variety of modifications and variations, therefore protection scope of the present invention should be as the criterion depending on the scope person of defining of appending claims.
Claims (9)
1. a manufacture method for antenna, this manufacture method comprises:
One base material is provided, and this substrate surface has an antenna field;
Utilize chemical plating process to form a metallic dielectric layer, to be covered on the surface of this base material;
Cover primary antibodie plating resist on this metallic dielectric layer;
Remove this anti-plating resist on this antenna field;
Utilize electroplating technology to form the metal material being distributed on this antenna field, to form an antenna body;
Remove this anti-plating resist of this substrate surface; And
Remove this metallic dielectric layer outside this antenna field;
Wherein, this base material is the housing of a product device.
2. manufacture method as claimed in claim 1, wherein this antenna field has an antenna pattern.
3. manufacture method as claimed in claim 1, also comprises:
This surface of this base material of roughening.
4. manufacture method as claimed in claim 3, also comprises:
Form a groove in this antenna field.
5. manufacture method as claimed in claim 1, wherein the material of this metallic dielectric layer is palladium or macromolecular material.
6. manufacture method as claimed in claim 1, also comprises:
By this anti-plating resist of removing on this antenna field, to expose this metallic dielectric layer that is covered in this antenna field.
7. manufacture method as claimed in claim 1, wherein the anti-plating resist of this on this antenna field utilizes the mode of dry-etching to process removal.
8. manufacture method as claimed in claim 7, wherein this dry-etching is the processing mode of a laser engraving.
9. manufacture method as claimed in claim 1, wherein this metal material is copper, nickel or gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010287510.3A CN102412437B (en) | 2010-09-20 | 2010-09-20 | Manufacturing method of antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010287510.3A CN102412437B (en) | 2010-09-20 | 2010-09-20 | Manufacturing method of antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102412437A CN102412437A (en) | 2012-04-11 |
| CN102412437B true CN102412437B (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010287510.3A Active CN102412437B (en) | 2010-09-20 | 2010-09-20 | Manufacturing method of antenna |
Country Status (1)
| Country | Link |
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| CN (1) | CN102412437B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI505552B (en) | 2012-06-01 | 2015-10-21 | Wistron Neweb Corp | Method for manufacturing antenna structure |
| CN103457021B (en) * | 2012-06-04 | 2016-03-09 | 启碁科技股份有限公司 | The manufacture method of antenna structure |
| CN105522280B (en) * | 2014-12-26 | 2017-06-06 | 比亚迪股份有限公司 | A kind of preparation method of communication apparatus metal shell |
| CN108417982B (en) * | 2018-05-09 | 2024-03-08 | 盛合晶微半导体(江阴)有限公司 | Antenna packaging structure and packaging method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (en) * | 1998-07-09 | 1998-12-16 | 复旦大学 | Manufacture of curved patch antenna |
| CN1758829A (en) * | 2004-10-05 | 2006-04-12 | 三星电机株式会社 | Printed circuit board and method of fabricating same |
| CN101304635A (en) * | 2007-05-10 | 2008-11-12 | 日东电工株式会社 | Wiring circuit board |
-
2010
- 2010-09-20 CN CN201010287510.3A patent/CN102412437B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202023A (en) * | 1998-07-09 | 1998-12-16 | 复旦大学 | Manufacture of curved patch antenna |
| CN1758829A (en) * | 2004-10-05 | 2006-04-12 | 三星电机株式会社 | Printed circuit board and method of fabricating same |
| CN101304635A (en) * | 2007-05-10 | 2008-11-12 | 日东电工株式会社 | Wiring circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102412437A (en) | 2012-04-11 |
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