CN102394414A - Electronic part - Google Patents
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- CN102394414A CN102394414A CN2011101665174A CN201110166517A CN102394414A CN 102394414 A CN102394414 A CN 102394414A CN 2011101665174 A CN2011101665174 A CN 2011101665174A CN 201110166517 A CN201110166517 A CN 201110166517A CN 102394414 A CN102394414 A CN 102394414A
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Abstract
The present invention provides an electronic part which can ensure wettability and conductivity of solder and can restrain generation of crystal whisker at a state that an external force is applied on a Sn coating. As a settlement facility, the electronic part (1) is provided with a body part (11) and a Sn coating (13). The body part (11) is made of metal material. The Sn coating (13) is formed through coating Sn or Sn alloy on a bottom coating layer (12) which is coated on the surface of the body part (11). A plurality of concave-convex parts (14) are repeatedly formed on the surface of the body part (11). The plurality of concave-convex parts (14) are formed according to a mode that an average value of maximal sizes of the concave-convex parts (14) in a surface direction of the body part (11) is larger than an average thickness size of the Sn coating (13). Additionally, the plurality of concave-convex parts (14) are formed that an average value of depth sizes of the concave-convex parts (14) is larger than the average thickness size of the Sn coating (13).
Description
Technical field
The present invention relates to a kind of electronic unit, this electronic unit is formed with the Sn coating that covers Sn (tin) or Sn alloy and constitute on the surface.
Background technology
Be based on Europe and started RoHS instruction that bans use of Pb (lead) in principle and the viewpoint that alleviates environmental pressure; In recent years; In electronic unit, use with Sn or Sn alloy lead-free, to replace containing the current material of Pb (lead) as main component as the material of coating.But, when being formed on the Sn coating of electronic unit surface coverage Sn or Sn alloy, can produce the acicular crystal that is called as whisker, there is the problem of short-circuit that causes electric aspect easily.
On the other hand, form Gold plated Layer to replace Sn coating, can avoid producing the problem of whisker through surface at electronic unit.But,, thereby have the problem that causes manufacturing cost to rise because gold is very expensive.Therefore, a kind of technology that can be suppressed at Sn coating generation whisker is developed in expectation.And, when inhibition of whiskers produces, also need guarantee solder wettability and conductivity as performance of electronic components.
Need to prove, disclose the electronic unit that a kind of surface coverage has the Sn alloy in TOHKEMY 2009-97030 communique and the TOHKEMY 2009-266499 communique.TOHKEMY 2009-97030 communique discloses a kind of electronic unit that on the no lead-coat (Sn coating) on mother metal surface, is formed with a plurality of recesses more than the dark 50 μ m.In addition, disclose a kind of electronic unit in the TOHKEMY 2009-266499 communique, its thickness t that is formed at the Sn coating of top layer part is more than the 0.2 μ m, is formed with the degree of depth in the zone with other termination contact more than or equal to 0.4t and smaller or equal to the recess of t.
The purpose of disclosed electronic unit all is the generation of inhibition of whiskers in TOHKEMY 2009-97030 communique and the TOHKEMY 2009-266499 communique.But the connector of disclosed that kind is for electronic units such as terminal in TOHKEMY 2009-266499 communique, and many miscellaneous parts with the outside use in the Sn coating slip on electronic unit surface and under to the state of Sn coating pressurization.Therefore, owing to act on the influence of the external force of Sn coating, has the tendency that easy promotion whisker produces.In addition; As TOHKEMY 2009-97030 communique or the disclosed electronic unit of TOHKEMY 2009-266499 communique; Even taked inhibition of whiskers to produce the electronic unit of countermeasure; Owing to act on the influence of the external force of Sn coating, also exist to promote the tendency that whisker produces easily, so present situation be to expect further to suppress.
Summary of the invention
The present invention In view of the foregoing, purpose is to provide a kind of electronic unit, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
The electronic unit that is used to realize the 1st scheme of above-mentioned purpose forms coated electronic unit for the surface; This electronic unit has main part and Sn coating; This main part is formed by metal material, and this Sn coating is through forming to the surface of aforementioned body portion or to prime coat covering Sn or the Sn alloy that is covered in this main part surface.And; The electronic unit of the 1st scheme is characterised in that; Repeat to be formed with a plurality of jogs on the surface of aforementioned body portion or the surface of above-mentioned prime coat; A plurality of above-mentioned jogs form the average thickness size of the maximum sized mean value of this jog on the face direction on the surface of the surperficial or above-mentioned prime coat of aforementioned body portion greater than above-mentioned Sn coating, and the mean value of the depth dimensions of this jog is greater than the average thickness size of above-mentioned Sn coating.
According to the present invention, on the surface of the main part of electronic unit or cover its surperficial prime coat and be provided with a plurality of jogs that repeat to form, and then directly or across prime coat formed Sn coating on the surface of main part.In addition, a plurality of jogs form maximum sized mean value on the face direction greater than the mean value of the average thickness size of Sn coating and the depth dimensions average thickness size greater than Sn coating.Thus,, also can disperse external force effectively and support, can effectively suppress the distortion of Sn coating at the convex portion of jog even produced outside miscellaneous part and under the situation to Sn coating external force action to states such as the surface pressurizations of Sn coating.In addition,, also external force can be disperseed and bear effectively, the distortion of Sn coating can be significantly suppressed with the sliding mode effect at the convex portion of jog even under the situation that miscellaneous part externally slides on the surface of electronic unit.In addition, each convex portion performance of a plurality of jogs constitutes the function of partition wall respectively, can suppress external force effectively and do the stress propagation in the time spent Sn coating.Through above-mentioned effect, electronic unit of the present invention can suppress the generation of whisker at the Sn coating place on surface.In addition, the present inventor has carried out demonstration test, and results verification can be guaranteed sufficient solder wettability and conductivity to electronic unit of the present invention.In addition, also confirm above-mentioned effect through demonstration test, that is, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
Therefore, according to the present invention, a kind of electronic unit can be provided, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
The electronic unit of the 2nd scheme is characterised in that in the electronic unit of the 1st scheme, a plurality of above-mentioned jogs are to form through surface or above-mentioned prime coat enforcement electrolytic treatments to aforementioned body portion.
According to the present invention, jog forms through electrolytic treatments.Therefore; At main part surface or prime coat, can easily process the maximum sized mean value that is set on the face direction greater than the mean value of the average thickness size of Sn coating and depth dimensions greater than the average thickness size of the Sn coating a plurality of jogs that complex becomes of laying equal stress on.Thus, can realize the high efficiency that following electronic unit is made, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
The electronic unit of the 3rd scheme is characterised in that in the electronic unit of the 1st scheme, a plurality of above-mentioned jogs are to form through surface or the processing of above-mentioned prime coat enforcement shot-peening to aforementioned body portion.
According to the present invention, jog forms through shot-peening processing.Therefore; At main part surface or prime coat, can easily process the maximum sized mean value that is set at the face direction greater than the mean value of the average thickness size of Sn coating and depth dimensions greater than the average thickness size of the Sn coating a plurality of jogs that complex becomes of laying equal stress on.Thus, can realize the high efficiency that following electronic unit is made, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
The electronic unit of the 4th scheme is characterised in that, in each electronic unit of the 1st scheme～the 3rd scheme, the miscellaneous part that this electronic unit contacts on the surface with above-mentioned Sn coating is to the state use down of the surface pressurization of this Sn coating.
According to the present invention,, also can suppress the generation of the whisker of Sn coating even under the surface pressurization state of contact of miscellaneous part, use under the situation of electronic unit to Sn coating.
The electronic unit of the 5th scheme is characterised in that in the electronic unit of the 4th scheme, above-mentioned miscellaneous part constitutes conductor, and the part that contacts with above-mentioned miscellaneous part of above-mentioned Sn coating constitutes the electric contact portion that is electrically connected with above-mentioned miscellaneous part.
According to the present invention, use under the situation of electronic unit even constitute in the part that adds press contacts with miscellaneous part under the mode of electric contact portion with Sn coating, also can suppress the generation of the whisker at Sn coating place.Therefore, in electronic unit, the state of affairs that can inhibition of whiskers causes electrical short produces.
The electronic unit of the 6th scheme is characterised in that; In the electronic unit of the 4th scheme; Above-mentioned miscellaneous part constitutes the case member that is formed by the insulating properties material, and through being pressed into this electronic unit with respect to above-mentioned case member, this case member slides and pressurization on the surface of above-mentioned Sn coating.
According to the present invention, though the case member that is formed by the insulating properties material is pressed into electronic unit, with sliding mode and the situation of pressurized state to Sn coating external force action under, also can suppress the generation of the whisker at Sn coating place.
The electronic unit of the 7th scheme is characterised in that, in the electronic unit of the 5th scheme, and the surface that the part of the above-mentioned electric contact of the formation of above-mentioned Sn coating portion is bent to form aforementioned body portion or the above-mentioned prime coat that is covered in this surface covered.
According to the present invention, the surperficial corresponding configuration that is bent to form of the part of the formation electric contact portion of Sn coating and main part.Therefore, in electric contact portion, the top of each convex portion that can make a plurality of jogs is with along the open laterally mode decentralized configuration of curved surface.Thus, external force can be more effectively disperseed and bear, the distortion and the stress propagation of Sn coating can be more effectively suppressed, further the generation of inhibition of whiskers.And near the electric contact portion of electronic unit, further the inhibition of whiskers state of affairs that causes electrical short produces.
According to the present invention, a kind of electronic unit can be provided, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.
Description of drawings
Fig. 1 is illustrated in the sectional view that is equipped with in the connector as the state of the terminal of the electronic unit of an embodiment of the invention.
Fig. 2 schematically amplifies the amplification schematic section that illustrates for a part of cross section to the surface of terminal shown in Figure 1.
Fig. 3 is for amplifying the figure that illustrates to the part of Fig. 2.
Fig. 4 is the figure that illustrates for the result who verifies the demonstration test that effect of the present invention is carried out, and the figure shows the result of the longest whisker length validation test.
Fig. 5 illustration goes out to have carried out the image of surperficial SEM photo of Sn coating of electric contact portion of terminal of the existing example of the longest whisker length validation test.
Fig. 6 illustration go out to have carried out the longest whisker length validation test comparative example terminal and do not carry out the image of surperficial SEM photo of Sn coating of electric contact portion of the terminal of Reflow Soldering operation.
Fig. 7 illustration go out to have carried out the longest whisker length validation test embodiment terminal and do not carry out the image of surperficial SEM photo of Sn coating of the terminal of Reflow Soldering operation.
Fig. 8 is the figure that illustrates for the result who verifies the demonstration test that effect of the present invention is carried out, and the figure shows the result of solder wettability validation test.
Fig. 9 is the figure that illustrates for the result who verifies the demonstration test that effect of the present invention is carried out, and the figure shows the result of conductivity validation test.
Figure 10 is the figure that illustrates for the result who verifies the demonstration test that effect of the present invention is carried out, and the figure shows the result of conductivity validation test.
Figure 11 is the figure that illustrates for the result who verifies the demonstration test that effect of the present invention is carried out, and the figure shows the result of conductivity validation test.
Label declaration
1 terminal (electronic unit)
11 main parts
12 prime coats
13 Sn coating
14 jogs
Embodiment
Below, with reference to accompanying drawing the mode that is used for embodiment of the present invention is described.Need to prove that in the explanation of this execution mode, the situation of the electronic unit that constitutes describes as example to apply the present invention to the terminal that uses as connector, but application of the present invention is not limited to this example.That is, the present invention can be widely used in being formed with on the surface electronic unit of the Sn coating that covers Sn or Sn alloy and constitute.
Fig. 1 is the sectional view that is illustrated in the state that the terminal 1 that the connector that constitutes as the electronic unit in this execution mode uses is installed in the connector 100.Connector 100 for example constitutes as the connector of the end that connects flat cable 101.Need to prove that Fig. 1 shows the cross section vertical with the Width of connector 100.And, in Fig. 1,, illustrate with the cross section about the case member in the connector 100 102 and rotatable parts 103 and the flat cable 101 that is electrically connected with terminal 1, about terminal 1, illustrate profile.
As shown in Figure 1, connector 100 constitutes the terminal (electronic unit) 1 with case member 102, rotatable parts 103 and this execution mode.Need to prove in connector 100, to have a plurality of terminals 1.Case member 102 is formed by the resin material that constitutes as the insulating properties material with rotatable parts 103.Terminal 1 is formed by metal material, for example, is formed by phosphor bronze.And, of the back, be formed with coating on the surface of terminal 1.
On case member 102, be formed with a plurality of insertions mouthful 102a, be used for inserting respectively a plurality of terminals 1, each inserts mouthful 102a and forms with the mode that is communicated with case member 102 inboard area of space (the open area 102b that afterwards states).Need to prove a plurality of insertions mouthful 102a arranged in series and disposing on the Width of connector 100.And, with case member 102 in a plurality of outside open and open area 102b of forming of the opposite side direction of mouthful 102a that insert, constituted the zone of the end of configuration flat cable 101.
In addition, the end that is disposed at the flat cable 101 of open area 102b is peelled off insulation-coated and is exposed conductor, to form the state that can be electrically connected with terminal 1.Need to prove that flat cable 101 for example is provided with as flexible flat cable or flexible printed wiring board etc., form through insulation-coated a plurality of conductors that are arranged in parallel integratedly.
In addition, a 1a of protrusion tab portion at terminal 1 is formed with the 1c of electric contact portion with overshooting shape, and the 1c of this electric contact portion is electrically connected with each conductor at the place, end of flat cable 101.In addition, the 1b of another protrusion tab portion at terminal 1 is formed with fastening recess 1d, this fastening recess 1d with the mode fastening of sliding freely after the periphery of each rotary shaft 103a of the rotatable parts 103 stated.
In addition, the operating portion 103b that an end side of rotatable parts 103 is used as rotating operation and forming has formed a plurality of slot part 103c in another end side with the mode of broad ways alignment arrangements.Each slot part 103c has constituted the slot part of the fore-end of the 1b of another protrusion tab portion that inserts each terminal 1.In addition, disposed each the rotary shaft 103a that forms across this slot part 103c sets up at each slot part 103c.As stated, the fastening recess 1d among the 1b of another protrusion tab portion of terminal 1 is with the mode fastening of sliding the freely periphery at this each rotary shaft 103a.Thus, rotatable parts 103 constitute, and rotate freely to be supported under the state of the fastening recess 1d of each terminal 1 in each rotary shaft 103a fastening with respect to a plurality of terminals 1.
In connector 100, insert a mouthful 102a from each case member 102 is pressed into each terminal 1.And, rotatable parts 103 are installed with the state that case member 102 is pressed into whole a plurality of terminals 1.At this moment, rotatable parts 103 with the posture of case member 102 approximate vertical at the fastening recess 1d of each rotary shaft 103a fastening at each terminal 1.At each fastening recess 1d, rotatable parts 103 are supported for respect to a plurality of terminals 1 and rotate freely thus through each rotary shaft 103a fastening.
Under the state of having assembled connector 100 as stated, the end of flat cable 101 is inserted and is disposed between a plurality of terminals 1 a pair of protrusion tab portion (1a, 1b) separately of open area 102b.At this moment, in the connector 100 under the state of rotatable parts 103 and the posture of case member 102 approximate vertical, the end of flat cable 101 is inserted between each a pair of protrusion tab portion (1a, 1b).And, after inserting the end of flat cable 101, through the 103b of operating operation portion, thereby rotatable parts 103 at each rotary shaft 103a when each fastening recess 1d slides, rotate with respect to a plurality of terminals 1.Thus, through as adding pressure surface 103d with 101 opposed of flat cables are provided with in the rotatable parts 103, each conductor of the end of flat cable 101 is extruded to the 1c of electric contact portion in each terminal 1, makes each conductor be electrically connected with each 1c of electric contact portion.In addition,, the end of flat cable 101 is remained in the connector 1, make connector 100 be connected with flat cable 101 with each conductor of the end of flat cable 101 state to the 1c of the electric contact portion pressurization of each terminal 1.
Next, the structure as the overlay coating of the terminal 1 of the electronic unit of this execution mode is elaborated.Fig. 2 is for schematically amplifying the signal amplification sectional view that illustrates to a part of cross section of terminal 1 surface.Need to prove, the signal amplification sectional view of the part that the terminal 1 that is pressed into case member 102 contacts with the conductor of flat cable 101 at the 1c of electric contact portion has been shown among Fig. 2.As shown in Figure 2, terminal 1 has the main part 11 as mother metal that formed by metal material (in this execution mode for phosphor bronze), covers the lip-deep prime coat 12 of main part 11 and cover the Sn coating 13 on the prime coat 12.
Prime coat 12 is through for example Ni (nickel) or Ni alloy form to the surface coverage of main part 11.In addition, Sn coating 13 is through forming prime coat 12 covering Sn (tin) or Sn alloy.Prime coat 12 for example forms through electroplating technology with Sn coating 13.
In addition, as shown in Figure 2, repeat to be formed with a plurality of jogs 14 on the surface of main part 11.Each jog 14 forms as convex portion 14a or as concave portion 14b.And,, repeat to have formed a plurality of jogs 14 through repeated configuration convex portion 14a and concave portion 14b.Need to prove; The a plurality of jogs 14 that repeat to form on the surface of main part 11 form with the mode in the face direction on the surface of main part 11 (being meant the direction that extend with the mode of planar expansion on the surface of main part 11, the direction of in Fig. 2, representing for double-ended arrow A) random arrangement.In addition, there are deviation in the shape of each jog 14, size, the degree of depth.Need to prove that shown in double-ended arrow B among Fig. 2, the depth direction of each jog 14 constitutes the vertical direction of face direction with the surface of main part 11.Need to prove, as shown in Figure 2, through repeat to form a plurality of jogs 14 on the surface of main part 11, also repeat to have formed a plurality of jogs corresponding on the surface of prime coat 12 with a plurality of jog 14.
In addition, a plurality of jogs 14 for example form through electrolytic treatments is implemented on the surface of main part 11.And a plurality of jogs 14 form, and the maximum sized mean value of jog 14 on the face direction on main part 11 surfaces is greater than the average thickness size of Sn coating 13.In addition, a plurality of jogs 14 form, and the mean value of the depth dimensions of jog 14 is greater than the average thickness size of Sn coating 13.Need to prove that a plurality of jogs for the surface of prime coat 12 form similarly, the maximum sized mean value of jog on the face direction on prime coat 12 surfaces is greater than the average thickness size of Sn coating 13.And a plurality of jogs of prime coat 12 surfaces form, and the mean value of the depth dimensions of these jogs is greater than the average thickness size of Sn coating 13.
Need to prove,, can select the various processing methods that constitute as electrolytic processing process such as electrobrightening as the mode of above-mentioned electrolytic treatments.In this electrolytic treatments, instrument is as negative side, and machined object (that is, form the shape of terminal 1, and do not cover the main part 11 that forms prime coat 12 and Sn coating 13) as side of the positive electrode, separates the gap instrument and machined object are set.And, also apply direct voltage simultaneously through between this instrument and machined object, flowing through electrolyte, thereby utilize electrolysis to carry out processing a plurality of jogs 14 of the complex one-tenth of laying equal stress in the surperficial random arrangement of main part 11.In addition, shape, size, the degree of depth exist the average-size of the jog of deviation to put on various conditions such as voltage conditions and/or current density condition between instrument and the machined object, electrolysis time condition, electrolyte condition through suitable setting to control.
Fig. 3 is for amplifying the figure that illustrates to the part of Fig. 2.As shown in Figure 3; The full-size of jog 14 on the face direction on main part 11 surface, as with the top of a convex portion 14a or be the center near it, be disposed on the face direction between the central part between the concave portion 14b on the adjacent position apart from maximum measuring among the size apart from size Ra (being the size that double-ended arrow Ra representes among Fig. 3).Perhaps; The full-size of jog 14 on the face direction on the surface of main part 11, as with the deep of a concave portion 14b or be the center near it, be disposed on the face direction between the central part between the convex portion 14a on the adjacent position apart from maximum measuring among the size apart from size Rb (being the size that double-ended arrow Rb representes among Fig. 3).In addition; As shown in Figure 3, the depth dimensions of jog 14 as the top of a convex portion 14a and be disposed at and this convex portion 14a adjacent position on the deep of concave portion 14b between depth direction on dimension D 1 (size of representing for double-ended arrow D1 among Fig. 3) measure.Need to prove, in this execution mode, also repeat to have formed a plurality of jogs corresponding with a plurality of jog 14 at prime coat 12.And; The full-size of jog on the face direction on prime coat 12 surfaces; As with the top corresponding with the top of a convex portion 14a or be the center near it, be disposed on the adjacent position and the central part of concave portion 14b corresponding concave part between dividing between the face direction on apart among the size maximum apart from size Ra (about the diagram of this size among Fig. 3; Owing to repeat with the shown position that is directed against under the situation of jog 14, therefore use the double-ended arrow Ra identical to represent size with the situation of jog 14) measure.Perhaps; The full-size of jog on the face direction on prime coat 12 surface as with the deep divided with a concave portion 14b corresponding concave part or be the center near it, be disposed on the adjacent position with the corresponding convex portion of convex portion 14a between central part between the face direction on apart from size among maximum apart from the size Rb (diagram of this size in about Fig. 3; Owing to repeat with the shown position that is directed against under the situation of jog 14, therefore use the double-ended arrow Rb identical to represent size with the situation of jog 14) measure.In addition, the depth dimensions conduct of the jog of prime coat 12 top corresponding with the top of a convex portion 14a, follow be disposed at and this convex portion 14a adjacent position on corresponding deep, the deep of concave portion 14b between the dimension D 2 (size of representing for two ends arrow D2 among Fig. 3) of depth direction measure.
In the terminal 1, a plurality of jogs 14 form, and the mean value of the full-size of measuring as stated (Ra, Rb) is the average thickness size greater than the mean value of the gauge Tsn (size of representing for double-ended arrow Tsn among Fig. 3) of Sn coating 13.And in the terminal 1, a plurality of jogs 14 form, and the mean value of the depth dimensions D1 of the jog of measuring as stated 14 is greater than the average thickness size of Sn coating 13.In addition, in the terminal 1, a plurality of jogs on prime coat 12 surfaces form, and the mean value of the full-size of measuring as stated (Ra, Rb) is greater than the average thickness size of Sn coating 13.In addition, a plurality of jogs on prime coat 12 surfaces form, and the mean value of the depth dimensions D2 of the jog of measuring as stated is greater than the average thickness size of Sn coating 13.Need to prove that for example (Scanning Electron Microscope: scanning electron microscope) image of photo carries out based on the surperficial SEM of Sn coating 13 in the measurement of the full-size (Ra, Rb) of jog 14 on the face direction on main part 11 surface.Likewise, the measurement of the gauge Tsn of the depth dimensions D1 of jog 14 and Sn coating 13 is also carried out based on image of the section S EM photo of the surface element office of main part 11 etc.In addition, likewise, about the measurement of the depth dimensions D2 of full-size (Ra, Rb) and the jog of jog on the face direction on prime coat 12 surface, also the image based on the section S EM photo of the image of Sn coating 13 surperficial SEM photos and prime coat 12 carries out.
In addition, as stated, in connector 100, use terminal 1.Therefore, the miscellaneous part that contacts with the surface with Sn coating 13 of terminal 1 is that the conductor of case member 102 or flat cable 101 uses down the state of the surface pressurization of Sn coating 13.
In addition, above-mentioned miscellaneous part constitutes under the situation of conductor of flat cable 101, and the part that contacts with miscellaneous part (conductor of flat cable 101) at Sn coating 13 places of terminal 1 constitutes the 1c of electric contact portion that is electrically connected with miscellaneous part.Need to prove that the part that Sn coating 13 places constitute the electric contact 1c of portion is that the prime coat 12 that covers on the surface that is bent to form at main part 11 has been carried out the part that covers.In addition, above-mentioned miscellaneous part constitutes under the situation of case member 102, constitutes through case member 102 is pressed into terminal 1, and case member 102 slides and pressurization on the surface of Sn coating 13.
Next, the result for the demonstration test of carrying out in order to verify effect of the present invention describes.In demonstration test; As embodiments of the invention; Make to constitute the terminal of the terminal 1 of above-mentioned execution mode, carried out the measurement of thickness T sn of depth dimensions D2 and Sn coating 13 of jog on depth dimensions D1, prime coat 12 surfaces of full-size (Ra or Rb), jog 14 of jog on full-size (Ra or Rb), prime coat 12 surfaces of jog 14 based on the image of SEM photo.In addition, in the making of the terminal 1 of embodiment, the main part 11 of the shape that forms terminal 1 is implemented above-mentioned electrolytic treatments,, cover and form prime coat 12, and then the covering of carrying out Sn coating 13 forms then through electroplating according to predetermined electrolytic treatments condition.Thus; With jog 14 at the maximum sized mean value on the face direction on main part 11 surface and the maximum sized mean value of jog on the face direction on prime coat 12 surfaces respectively greater than the mean value of the depth dimensions of the jog on the mean value of the depth dimensions of the average thickness size of Sn coating 13 and jog 14 and prime coat 12 surfaces respectively greater than the mode of the average thickness size of Sn coating 13, formed the surperficial jog of a plurality of jogs 14 and prime coat 12.Need to prove; In an embodiment; Made a plurality of terminals 1, for these a plurality of terminals 1, confirm based on the image of SEM photo: the average thickness of Sn coating 13 is set in the scope of 1.5～3.5 μ m; The maximum sized mean value of jog 14 is set in the scope of 15～25 μ m; The maximum sized mean value of the jog on prime coat 12 surfaces is set in the scope of 15～25 μ m, and the mean value of the depth dimensions of jog 14 is set in the scope of 15～20 μ m, and the mean value of the depth dimensions of the jog on prime coat 12 surfaces is set in the scope of 15～20 μ m.
In addition, in demonstration test,, also made the terminal (below, be called " terminal C1 ") that is formed with the comparative example of tiny jog on main part surface and prime coat surface for the terminal 1 with embodiment compares.In the making of the terminal C1 of comparative example; For the main part that forms with the same shape of shape of the terminal 1 of above-mentioned execution mode; Utilize the treatment conditions different to implement electrolytic treatments with above-mentioned electrolytic treatments condition; Form prime coat through electroplating, and then carry out the covering formation of Sn coating in its surface coverage.Thus; Made the terminal C1 that is formed with a plurality of jogs (jog on the jog on main part surface and prime coat surface); In these a plurality of jogs, jog at the maximum sized mean value on the face direction on main part surface and the maximum sized mean value of jog on the face direction on prime coat surface less than the mean value of the depth dimensions of the surperficial jog of the mean value of the depth dimensions of the jog on the average thickness size of Sn coating and main part surface and prime coat average thickness size less than Sn coating.Need to prove; In comparative example; A plurality of terminal C1 have been made; For these a plurality of terminals 1; Image based on the SEM photo is confirmed: the average thickness of Sn coating is set in the scope of 3.0～6.0 μ m, and the maximum sized mean value of the jog on the maximum sized mean value of the jog on main part surface and prime coat surface is set in the scope of 1.0～3.0 μ m, and the mean value of the depth dimensions of the jog on the mean value of the depth dimensions of the jog on main part surface and prime coat surface is set in the scope of 1.0～3.0 μ m.
In addition; In demonstration test; Of the back, carried out in result of the test shown in Fig. 4 the longest whisker length validation test, in the solder wettability validation test of result of the test shown in Fig. 8, in the conductivity validation test of result of the test shown in Fig. 9～Figure 11.Below, these result of the tests are described.
Fig. 4 illustrates the figure that the terminal C1 of the terminal of embodiment 1 and comparative example is implemented the result of the longest whisker length validation test.In the longest whisker length validation test,, suppress to have carried out demonstration test from the effect that Sn coating 13 produces whiskers under situation to Sn coating 13 external force actions of the terminal 1 of embodiment.In this test; At first; Respectively about the terminal 1 of embodiment and the terminal C1 of comparative example; Type of service identical when using with reality has been confirmed the generation situation of whisker then respectively as using with the terminal that is pressed into case member 102 and be electrically connected with the end conductor of flat cable 101.Produce in the affirmation of situation at whisker, the electric contact portion of switching on under pressurized state, contacting with the conductor of flat cable 101 utilizes SEM to observe.And, the length of the whisker (the longest whisker) that length is the longest among the whisker of having confirmed to produce when in embodiment and comparative example, having confirmed to observe Sn coating surperficial through this SEM.
In addition; In the longest above-mentioned whisker length validation test; For the terminal of the terminal of embodiment 1 and comparative example, produce sample (terminal) that has carried out the Reflow Soldering operation through reflow soldering (stove of use when on substrate, placing installation) and the sample (terminal) that does not carry out the Reflow Soldering operation through soldering paste.And in fact the sample for having carried out the Reflow Soldering operation is not installed on the substrate, and makes sample pass through reflow soldering separately.Need to prove that the terminal C1 about the terminal of embodiment 1 and comparative example makes the sample that a plurality of (24) have carried out the sample of Reflow Soldering operation and do not carried out the Reflow Soldering operation respectively, confirmed the length of long whisker.
In addition; Among Fig. 4, about the result of the test (being expressed as " Reflow Soldering is arranged ") of the sample that carried out the Reflow Soldering operation, with the shadow representation of little point-like; About the result of the test (being expressed as " no Reflow Soldering ") of not carrying out the sample of Reflow Soldering operation, represent with white background.In addition, also made and the corresponding terminal of existing example, except the terminal C1 of the terminal 1 of embodiment and comparative example, existing routine terminal (below, be called " terminal C2 ") has also been carried out the longest whisker length validation test.Need to prove that the terminal C2 of existing example forms prime coat to the surface coverage of main part and forms with Sn coating, does not utilize above-mentioned electrolytic treatments formation jog.In addition, the terminal C2 of existing example is made into the sample that does not carry out the Reflow Soldering operation, and has carried out the longest whisker length validation test.
Shown in the result of the test of the longest whisker length validation test of Fig. 4, it is the whisker of 500 μ m that the terminal C2 of existing example has produced length, and it is the above whiskers of 100 μ m that the terminal C1 that does not carry out the Reflow Soldering operation among the terminal C1 of comparative example has produced length.But, about the terminal 1 of embodiment, carried out the terminal 1 of Reflow Soldering operation and do not carry out the Reflow Soldering operation terminal 1 both all only to have produced length be the whisker about 10 μ m～20 μ m.Therefore, even the generation that the terminal 1 of confirming embodiment also can inhibition of whiskers under to the situation of Sn coating 13 external force actions.Need to prove that in this test, the length of the whisker of confirming among the terminal C2 of existing example is 500 μ m, but well-known usually be to produce the whisker about length 1～2mm with the same terminal that forms of the terminal C2 of above-mentioned existing example.
Here, describe for image as the surperficial SEM photo of the Sn coating of the electric contact portion of each terminal of said sample.Fig. 5 illustration has the image of surperficial SEM photo of Sn coating of electric contact portion of the terminal C2 of example.In addition, Fig. 6 illustration goes out the image of surperficial SEM photo of Sn coating of the electric contact portion of the terminal C1 that does not carry out the Reflow Soldering operation among the terminal C1 of comparative example.In addition, Fig. 7 illustration goes out the image of surperficial SEM photo of the Sn coating 13 of the terminal 1 that does not carry out the Reflow Soldering operation in the terminal 1 of embodiment.
Shown in the SEM image of Fig. 5, the terminal C2 of existing example has produced the long whisker that extends about length 500 μ m.In addition, shown in the SEM image of Fig. 6, it is the above whiskers of 100 μ m that the terminal C1 of comparative example has produced length.Relative therewith, shown in the SEM image of Fig. 7, the terminal C1 of embodiment is not for observe the state that whisker produces basically.
In addition, shown in the part of enclosed with dashed lines among Fig. 6, the terminal C1 of comparative example has produced concaveconvex shape and has been destroyed such distortion in the larger area scope.That is the zone that the terminal C1 that, is formed with tiny jog on the surface of main part and covers the comparative example be formed with prime coat and Sn coating has produced Sn coating continuous modification in zone greatly.Therefore, become the increase of the deflection that is accompanied by Sn coating and be easy to generate the state of whisker.
On the other hand; Shown in the part of enclosed with dashed lines among Fig. 7; In the terminal 1 of the embodiment of a plurality of jogs on a plurality of jogs that are provided with said structure 14 and prime coat 12 surfaces and Sn coating 13; Only produced the zone that concaveconvex shape is destroyed such distortion at very narrow surface area, wherein, Sn coating 13 satisfies the preset thickness condition fastening with the pass of a plurality of jogs on prime coat 12 surfaces with these a plurality of jogs 14.Therefore; Even produced outside miscellaneous part and under the situation to Sn coating 13 external force actions to states such as the surface pressurizations of Sn coating 13; Also can disperse external force effectively and support at the convex portion of the jog on the convex portion 14a of jog 14 and prime coat 12 surfaces, can suppress the distortion of Sn coating 13 effectively.In addition, each convex portion performance of a plurality of jogs on each the convex portion 14a of a plurality of jogs 14 and the surface of prime coat 12 constitutes the function of partition wall respectively, can suppress external force effectively and do the stress propagation in the time spent Sn coating 13.Confirm that thus through above-mentioned effect, the whisker that the terminal 1 of embodiment can suppress Sn coating 13 places on surface produces.
Fig. 8 illustrates the figure that the terminal C1 of the terminal of embodiment 1 and comparative example is implemented the result of solder wettability validation test.In this solder wettability validation test; For the terminal 1 of embodiment and the terminal C1 of comparative example; Use that pressure furnace tester (pressure cooker tester) (estimating the accelerated life test machine of the moisture-proof of electronic unit) is in temperature that 105 ℃, humidity are 100%, the processing time is to handle under 8 hours the condition, utilizes arc figure (meniscograph) to carry out the solder wettability validation test then.And, estimate solder wettability according to zero-crossing timing (second).
Need to prove, about zero-crossing timing, measure be impregnated into from end the soldering paste as the terminal of sample, to the power of terminal effect temporarily being the time till the moment of positive negative zero through scolding tin.Promptly; What zero-crossing timing was measured is the following time: the end as the terminal of sample is impregnated in the soldering paste; Produce the separation of the solvent of soldering paste through heating; Thereby the phenomenon that the dissolving of flux component, the buoyancy that accompanies with it produce and the phenomenon of wetting generation appear in the wetting phenomena that caused of beginning, and then the phenomenon that the dissolving of solder powder, the buoyancy that accompanies with it produce and the phenomenon of wetting generation occur; In said process, will be up to being zero-crossing timing temporarily to the power of terminal effect for the time instrumentation till the moment of positive negative zero through scolding tin.
In addition, in above-mentioned solder wettability validation test, the material of scolding tin uses Sn-3Ag-0.5Cu.And; In this solder wettability validation test; Because the degree of depth that terminal impregnated in the soldering paste is set at 0.2mm; Therefore the level that requires that can guarantee the zero-crossing timing of sufficient solder wettability is below 3 seconds, will be that dip time is set at 3 seconds from the time that terminal impregnated in the soldering paste till mention.That is, if dip time promptly 3 seconds with the interior zero-crossing timing that measures, then can guarantee sufficient solder wettability.
In addition, in above-mentioned solder wettability validation test, make a plurality of (24) samples respectively and measure zero-crossing timing,, estimate with mean value, maximum and minimum value about this measurement result for the terminal 1 of embodiment and the terminal C1 of comparative example.Need to prove that among Fig. 8, the result of mean value representes that with white background peaked result is with point shape shadow representation, the result of minimum value uses the oblique line shape shadow representation.
Shown in the solder wettability validation test result of Fig. 8, any one the zero-crossing timing of mean value, maximum and minimum value of the terminal C1 of the terminal of embodiment 1 and comparative example was below 3 seconds, confirmed to guarantee sufficient solder wettability.In addition, any one of mean value, maximum and the minimum value of the terminal 1 of embodiment compared with the terminal C1 of comparative example, all can reduce zero-crossing timing, confirms to guarantee better solder wettability.
Fig. 9～Figure 11 illustrates the figure that the terminal C1 of the terminal of embodiment 1 and comparative example is implemented the result of conductivity validation test.In result's shown in Fig. 9～Figure 11 conductivity validation test; For the terminal 1 of embodiment and the terminal C1 of comparative example; After being installed on the substrate, the predetermined test of stating after carrying out respectively, and measure through being scheduled to the resistance rising value (m Ω) that test produces.In addition; For the terminal 1 of embodiment and the terminal C1 of comparative example; Make a plurality of (24) sample corresponding (that is, each experimental condition is made 24 terminals respectively) respectively, carry out the mensuration of resistance rising value with each experimental condition; About this measurement result, using the maximum of the resistance rising value under each experimental condition is that maximum resistance rising value (m Ω) is estimated.
In result's shown in Fig. 9 conductivity validation test, repeating to implement following plug operation makes an experiment; Promptly; The end of between a pair of protrusion tab portion of the terminal under the state that is pressed into case member 102, inserting flat cable 101; After operation rotatable parts 103 were connected the conductor of the terminal and the end of flat cable 101, operation rotatable parts 103 were extracted flat cable 101.And; In the condition (plug 10 times) that repeats to implement 10 plug operations, repeat to implement the condition (plug 30 times) of 30 plug operations and repeat to implement to plug under these three conditions of condition (50 times) of operating for 50 times to make an experiment; Measure the resistance rising value in each test back, estimate above-mentioned maximum resistance rising value (m Ω).Need to prove that in Fig. 9, the result that above-mentioned plug is 10 times representes that with white background the result that above-mentioned plug is 30 times is with point shape shadow representation, the result that above-mentioned plug is 50 times uses the oblique line shape shadow representation.
Even also can guarantee the level of good electrical conductivity as repeating above-mentioned plug operation, requirement resistance rising value under the state that repeats 30 plug operations is below the 20m Ω usually.Be directed to this, shown in the Electrical conductivity tests result of Fig. 9, the terminal C1 of the terminal of embodiment 1 and comparative example is operating as in plug that the maximum resistance rising value is below the 2m Ω under arbitrary situation of 10 times, 30 times and 50 times, confirms to guarantee good horizontal.In addition, for the terminal 1 of embodiment, even more in the test under the exacting terms (plug is operating as 50 times condition), confirming also can keep good electrical conductivity than desired level (plug is operating as 30 times condition).
In result's shown in Figure 10 and Figure 11 conductivity validation test, thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test have been carried out for the terminal 1 of embodiment and the terminal C1 of comparative example.In addition, after each test (thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test), measure the resistance rising value of each sample after having carried out respectively testing respectively, estimate maximum resistance rising value (m Ω).Need to prove that in Figure 10 and Figure 11, the result of thermal shock test representes that with white background the result of humid test is with point shape shadow representation, the result of high-temperature test uses the oblique line shape shadow representation, and the result of hydrogen sulfide gas test uses latticed shadow representation.
In the thermal shock test in result's shown in Figure 10 conductivity validation test, sample is exposed in the following environment: between 500 hours, repeat to circulate in for 500 times the thermal cycle (setting 30 minutes under-55 ℃ the temperature, under 85 ℃ temperature, setting the thermal cycle of 30 minutes temperature model) of transformation temperature in-55 ℃～85 ℃ the scope.On the other hand; In the thermal shock test in result's shown in Figure 11 conductivity validation test; Utilize temperature model same as described above, sample is exposed in the following environment: between 1000 hours, repeat to circulate in for 1000 times the thermal cycle of transformation temperature in-55 ℃～85 ℃ the scope.Need to prove, usually,, set sample is exposed to the condition in the environment of the thermal cycle that between 25 hours, repeats 25 circulation said temperature scopes as the level of the thermal shock test that requires for the conductivity of confirming terminal.But, in this test, testing under the exacting terms more.
In the humid test in result's shown in Figure 10 conductivity validation test, it is that 40 ℃ ± 2 ℃, humidity are in 90%～95% the environment 500 hours that sample is exposed to temperature.On the other hand, in the humid test in result's shown in Figure 11 conductivity validation test, it is that 40 ℃ ± 2 ℃, humidity are in 90%～95% the environment 1000 hours that sample is exposed to temperature.Need to prove, usually,, set and sample is exposed in the environment of said temperature and humidity 240 hours condition as the level of the humid test that requires for the conductivity of confirming terminal.But, in this test, testing under the exacting terms more.
In the high-temperature test in result's shown in Figure 10 conductivity validation test, it is in 85 ℃ ± 2 ℃ the environment 500 hours that sample is exposed to temperature.On the other hand, in the high-temperature test in result's shown in Figure 11 conductivity validation test, it is in 85 ℃ ± 2 ℃ the environment 1000 hours that sample is exposed to temperature.Need to prove, usually,, set and sample is exposed in the environment of said temperature 250 hours condition as the level of the high-temperature test that requires for the conductivity of confirming terminal.But, in this test, testing under the exacting terms more.
In the test of hydrogen sulfide gas in result's shown in Figure 10 conductivity validation test, it is that 3ppm ± 1ppm, temperature are that 40 ℃ ± 2 ℃, humidity are in 80% ± 5% the environment 500 hours that sample is exposed to concentration of hydrogen sulfide.On the other hand, in the test of hydrogen sulfide gas in result's shown in Figure 11 conductivity validation test, it is that 3ppm ± 1ppm, temperature are that 40 ℃ ± 2 ℃, humidity are in 80% ± 5% the environment 1000 hours that sample is exposed to concentration of hydrogen sulfide.Need to prove, usually,, set and sample is exposed in the environment of said temperature 96 hours condition as the level of the hydrogen sulfide gas test that requires for the conductivity of confirming terminal.But, in this test, testing under the exacting terms more.
Even also can guarantee the level of good electrical conductivity as carrying out above-mentioned each test (thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test), usually, requiring the resistance rising value is below the 20m Ω.Be directed to this; Shown in the Electrical conductivity tests result of Figure 10; The terminal 1 of embodiment and the terminal C1 of comparative example are that the maximum resistance rising value is below the 1m Ω under 500 hours the condition in the test duration of each test (thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test), confirm to guarantee good horizontal.In addition; Shown in the Electrical conductivity tests result of Figure 11; The terminal 1 of embodiment and the terminal C1 of comparative example are that the maximum resistance rising value is below the 2m Ω under 1000 hours the condition in the test duration of each test (thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test), confirm to guarantee good horizontal.In addition, for the terminal 1 of embodiment, even in than the more test of each under the exacting terms of desired level (thermal shock test, humid test, high-temperature test, hydrogen sulfide gas test), confirm also can keep good electrical conductivity.
Terminal 1 according to this execution mode of above explanation is provided with a plurality of jogs 14 that repeat to form on the surface of main part 11, and then forms Sn coating 13 on the surface 11 of main part across prime coat 12.Need to prove, also be provided with a plurality of jogs that repeat to form on the surface of prime coat 12.In addition, a plurality of jogs 14 form greater than the mean value of the average thickness size of Sn coating 13 and the depth dimensions D1 mode greater than the average thickness size of Sn coating 13 with the mean value of the full-size on the face direction (Ra, Rb).In addition, a plurality of jogs on prime coat 12 surface form greater than the mean value of the average thickness size of Sn coating 13 and the depth dimensions D2 mode greater than the average thickness size of Sn coating 13 with the mean value of the full-size on the face direction (Ra, Rb).Thus; Even produced outside miscellaneous part and under the situation to Sn coating 13 external force actions to states such as the surface pressurizations of Sn coating 13; Also can disperse external force effectively and support at the convex portion of the jog on the surface of the convex portion 14a of jog 14 and prime coat 12, can suppress the distortion of Sn coating 13 effectively.In addition; Even miscellaneous part externally is under the situation of the surface of terminal 1 slip; Convex portion at the jog on the surface of the convex portion 14a of jog 14 and prime coat 12 also can disperse and bear the external force of effect under the sliding mode effectively, can significantly suppress the distortion of Sn coating 13.In addition, each convex portion performance of a plurality of jogs on each the convex portion 14a of a plurality of jogs 14 and the surface of prime coat 12 constitutes the function of partition wall respectively, can suppress external force effectively and do the stress propagation in the time spent Sn coating 13.Through above-mentioned effect, the terminal of this execution mode (electronic unit) 1 can suppress the generation of whisker at Sn coating 13 places on surface.In addition, as verifying in the above-mentioned demonstration test, confirm that the terminal (electronic unit) 1 through this execution mode can be guaranteed sufficient solder wettability and conductivity.In addition, also confirm above-mentioned effect through demonstration test, that is, even generation that also can inhibition of whiskers under to the situation of Sn coating 13 external force actions.
Therefore, according to this execution mode, a kind of terminal (electronic unit) 1 can be provided, this terminal 1 can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating 13 external force actions.
In addition, according to the terminal 1 of this execution mode, jog 14 forms through electrolytic treatments.Therefore; On the surface of main part 11, can easily process with the mean value of the full-size on the face direction (Ra, Rb) and set a plurality of jogs 14 that the complex of laying equal stress on becomes greater than the mode of the average thickness size of Sn coating 13 greater than the average thickness size of Sn coating 13 and the mean value of depth dimensions D1.Thus, can realize the high efficiency that terminal 1 is made, this terminal 1 can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating 13 external force actions.
In addition, according to this execution mode, even at conductor or case member 102 such miscellaneous parts of flat cable 101 the surface pressurization of Sn coating 13 is also used under the situation of terminal 1 under the state of contact, the whisker that also can suppress Sn coating 13 places produces.
In addition, according to this execution mode,, also can suppress the generation of the whisker at Sn coating 13 places even under the mode that constitutes the electric contact 1c of portion with the part that adds press contacts with miscellaneous part (conductor of flat cable 101) in the Sn coating 13, use under the situation of terminal 1.Therefore, in terminal (electronic unit) 1, can inhibition of whiskers cause the generation of the state of affairs of electrical short.And, in the terminal 1 in being arranged at the connector 100 that is connected with flat cable 101, can suppress to produce short circuit between the adjacent terminal 1.
In addition, according to this execution mode, even the case member 102 that is formed by the insulating properties material is pressed into terminal (electronic unit) 1, with sliding mode and the situation of pressurized state to Sn coating 13 external force actions under, also can suppress the generation of the whisker at Sn coating 13 places.
In addition, according to the terminal 1 of this execution mode, the surperficial corresponding configuration that is bent to form of the part of the formation electric contact 1c of portion of Sn coating 13 and main part 11.Therefore, at the 1c of electric contact portion, the top of each convex portion of a plurality of jogs on top and prime coat 12 surfaces of each convex portion 14a that can make a plurality of jogs 14 is with along the open laterally mode decentralized configuration of curved surface.Thus, external force can be more effectively disperseed and bear, the distortion and the stress propagation of Sn coating 13 can be more effectively suppressed, further the generation of inhibition of whiskers.And near the 1c of electric contact portion of terminal 1, further inhibition of whiskers causes the generation of the state of affairs of electrical short.
More than, execution mode of the present invention is illustrated, but the invention is not restricted to above-mentioned execution mode, carry out various changes in the scope that can in claims, be put down in writing.For example, can change as follows and implement.
(1) in the above-described embodiment, be applicable to that with the present invention the situation of the electronic unit that constitutes as terminal is that example is illustrated, be suitable for the present invention but can be not limited to terminal.That is,, then can extensively be suitable for the present invention so long as the surface is formed with the electronic unit of the Sn coating that covers Sn or Sn alloy and constitute.In addition,, also be not limited to the form of the terminal that illustration goes out in the above-mentioned execution mode, can carry out various changes and implement even be applicable under the situation of the electronic unit that constitutes as terminal in the present invention.For example, can the present invention be applicable to the terminal of various forms such as terminal of terminal, the receptacle-shaped of needle-like.
(2) in the above-described embodiment, be that example is illustrated with the form that forms the electronic unit of Sn coating at the surface of main part formation prime coat, on the surface of prime coat, but can be not so also.It also can be the form that does not directly form the electronic unit of Sn coating at the surface of main part formation prime coat.
(3) in the above-described embodiment; Form to repeat forming a plurality of jogs on the surface of main part and also to repeat to form a plurality of jogs corresponding with a plurality of jogs on main part surface on the surface of prime coat is that example is illustrated, but can not be so also.For example, also can be to form thicker prime coat on the surface of main part and this thicker prime coat implemented processing such as electrolytic treatments and form the form of a plurality of jogs.
(4) in the above-described embodiment, thereby being that example is illustrated through the surface of main part being implemented the form that electrolytic treatments forms a plurality of jogs, but can not be so also.For example, thus also can be through the surface of main part or prime coat being implemented the form of a plurality of jogs of shot-peening processing formation.Through the processing of such use shot-peening, on the surface of main part or prime coat can easily process with the maximum sized mean value of face direction and set a plurality of jogs that the complex of laying equal stress on becomes greater than the mode of the average thickness size of Sn coating greater than the average thickness size of Sn coating and the mean value of depth dimensions.Thus, can realize the high efficiency that following electronic unit is made, this electronic unit can be guaranteed solder wettability and conductivity, even generation that also can inhibition of whiskers under to the situation of Sn coating external force action.Need to prove,, be not limited to the processing of electrolytic treatments and shot-peening, also can make in all sorts of ways as the method that forms a plurality of jogs.For example, also can use the method for ion milling or sputter.In addition, carry out punch process through utilizing the surface to form irregular instrument, also can be directly or across lubricating oil film transfer printing concaveconvex shape, thus form a plurality of jogs.
Industrial applicibility
The present invention relates to a kind of electronic unit that is formed with the Sn coating that covers Sn or Sn alloy and constitute on the surface, this electronic unit can be widely used.
Claims (7)
1. electronic unit, its surface is formed with coating, it is characterized in that,
This electronic unit has:
Main part, it is formed by metal material; And
Sn coating, it is through covering Sn or the Sn alloy forms to the surface of aforementioned body portion or to the prime coat on the surface that is covered in this main part,
Repeat to be formed with a plurality of jogs on the surface of aforementioned body portion or the surface of above-mentioned prime coat,
A plurality of above-mentioned jogs form; The maximum sized mean value of this jog on the face direction on the surface of aforementioned body portion or the surface of above-mentioned prime coat is greater than the average thickness size of above-mentioned Sn coating, and the mean value of depth dimensions that forms this jog is greater than the average thickness size of above-mentioned Sn coating.
2. electronic unit as claimed in claim 1 is characterized in that,
A plurality of above-mentioned jogs are through forming to the surface of aforementioned body portion or to above-mentioned prime coat enforcement electrolytic treatments.
3. electronic unit as claimed in claim 1 is characterized in that,
A plurality of above-mentioned jogs are through processing forms to the surface of aforementioned body portion or to above-mentioned prime coat enforcement shot-peening.
4. like each the described electronic unit in the claim 1～3, it is characterized in that,
Use under the state that the miscellaneous part that this electronic unit contacts on the surface with above-mentioned Sn coating pressurizes to the surface of this Sn coating.
5. electronic unit as claimed in claim 4 is characterized in that,
Above-mentioned miscellaneous part constitutes conductor,
The part that contacts with above-mentioned miscellaneous part of above-mentioned Sn coating constitutes the electric contact portion that is electrically connected with above-mentioned miscellaneous part.
6. electronic unit as claimed in claim 4 is characterized in that,
Above-mentioned miscellaneous part constitutes the case member that is formed by the insulating properties material,
Through being pressed into this electronic unit with respect to above-mentioned case member, this case member slides and pressurization on the surface of above-mentioned Sn coating.
7. electronic unit as claimed in claim 5 is characterized in that,
The part that constitutes above-mentioned electric contact portion in the above-mentioned Sn coating covers to the surface that is bent to form in the aforementioned body portion or to the above-mentioned prime coat that is covered in this surface.
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| JP2010-146267 | 2010-06-28 | ||
| JP2010146267A JP2012007227A (en) | 2010-06-28 | 2010-06-28 | Electronic part |
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| CN104126033A (en) * | 2013-02-24 | 2014-10-29 | 古河电气工业株式会社 | Metal member,terminal,electric wire connection structure and method of manufacturing terminal |
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| JP3376218B2 (en) * | 1996-08-30 | 2003-02-10 | キヤノン株式会社 | Circuit board connection device |
| JP4024244B2 (en) * | 2004-12-27 | 2007-12-19 | 株式会社神戸製鋼所 | Conductive material for connecting parts and method for manufacturing the same |
| JP4284658B2 (en) * | 2004-10-29 | 2009-06-24 | 日本ビクター株式会社 | Electronic component and manufacturing method thereof |
| JP5005420B2 (en) * | 2007-05-01 | 2012-08-22 | 株式会社神戸製鋼所 | Mating connector terminal and manufacturing method thereof |
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| CN100583309C (en) * | 2004-09-10 | 2010-01-20 | 株式会社神户制钢所 | Conductive material for connecting part and method for manufacturing the conductive material |
| JP2009004113A (en) * | 2007-06-19 | 2009-01-08 | Japan Aviation Electronics Industry Ltd | Contact member and surface treatment method for the member |
| JP2009249716A (en) * | 2008-04-10 | 2009-10-29 | Sumitomo Kinzoku Kozan Shindo Kk | Tin-plated copper alloy material |
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| CN104126033A (en) * | 2013-02-24 | 2014-10-29 | 古河电气工业株式会社 | Metal member,terminal,electric wire connection structure and method of manufacturing terminal |
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Application publication date: 20120328 |