CN102385254A - Photo-sensitivity resin composition - Google Patents
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- CN102385254A CN102385254A CN2010102711601A CN201010271160A CN102385254A CN 102385254 A CN102385254 A CN 102385254A CN 2010102711601 A CN2010102711601 A CN 2010102711601A CN 201010271160 A CN201010271160 A CN 201010271160A CN 102385254 A CN102385254 A CN 102385254A
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Abstract
The invention provides a photo-sensitivity resin composition which comprises: (A) a polymer with more than three common blocks, (B) a monomer with at least one ethylenic unsaturated double bond, (C) a polyurethane resin oligomer with at least one reactive acrylic functional group, (D) an inorganic additive modified through the surface of organic silane, (E) organic acid anhydride, (F) a photoinitiator, (G) a functional silane coupling agent, and (H) an organic solvent, wherein each of the common blocks comprises: (A-1) an ethylenic unsaturated monomer containing an acid group, and (A-2) ethylenic unsaturated monomers except (A-1). On the basis of total weight of the photo-sensitivity resin composition, the content of (C) is between 1 weight percent and 20 weight percent.
Description
Technical field
The present invention relates to a kind of photosensitive resin composition (photo-sensitivity resin composition), relate in particular to a kind of photosensitive resin composition with good metal adhesion and high rigidity.
Background technology
More lightly changes and more humane purpose in order to reach more convenient, volume, the input mode of many information products changes into and uses touch-control device as the mode of importing by devices such as traditional keyboard or mouses.Touch-control device can be assembled on the flat-panel screens of many kinds, so that flat-panel screens has the function of display frame and input operation information concurrently.With regard at present common touch-control device, capacitance type touch-control panel and electric resistance touch-control panel are the most universal.
In general contact panel processing procedure, understand the protective seam that usability photopolymer resin composition (photoresistance) is used as the dielectric layer between the metal electrode or covers metal electrode usually.Therefore, above-mentioned photosensitive resin composition must possess good metal tack and high rigidity, to avoid in processing procedure, producing scratch and the problem of peeling off.Yet generally the photosensitive resin composition as dielectric layer or protective seam does not have the good metal tack, and in processing procedure, often produces scratch because of hardness is not enough yet, thereby causes the problem of low yield.
Summary of the invention
The present invention provides a kind of photosensitive resin composition, and it has good metal tack and high rigidity.
The present invention proposes a kind of photosensitive resin composition, and it comprises that (A) has the polymkeric substance of the common block (block) more than three, and these common blocks comprise that (A-1) contains the ethylene unsaturated monomer of acidic group and (A-2) ethylene unsaturated monomer except that (A-1); (B) has the monomer of at least one ethene property unsaturated double-bond; (C) has at least one reactive acroleic acid functional group's urethane resin oligomer; (D) through the inorganic additive of organosilane surfaction; (E) organic acid anhydride; (F) light initiator; (G) functional silanes coupling agent; (H) organic solvent.With total restatement of this photosensitive resin composition, content (C) is between between the 1wt% to 20wt%.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (A) is for example between between the 10wt% to 15wt%.
According to the described photosensitive resin composition of the embodiment of the invention, be 100 weight portions wherein in (A-1) and summation (A-2), the content of above-mentioned (A-1) is for example between 10 weight portion to 90 weight portions.
According to the described photosensitive resin composition of the embodiment of the invention, be 100 weight portions wherein in (A-1) and summation (A-2), the content of above-mentioned (A-2) is for example between 10 weight portion to 90 weight portions.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (B) is for example between between the 5wt% to 15wt%.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (C) is for example between between the 1wt% to 20wt%.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (D) is for example less than 5wt%.
According to the described photosensitive resin composition of the embodiment of the invention, be 100 weight portions wherein in (A), the content of above-mentioned (E) is for example between 0.1 weight portion to 100 weight portion.
According to the described photosensitive resin composition of the embodiment of the invention, be 100 weight portions wherein in (A), the content of above-mentioned (F) is for example between 0.1 weight portion to 100 weight portion.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (G) is for example between between the 0.01wt% to 5wt%.
According to the described photosensitive resin composition of the embodiment of the invention, wherein with total restatement of photosensitive resin composition, the content of above-mentioned (H) is for example between between the 60wt% to 80wt%.
According to the described photosensitive resin composition of the embodiment of the invention, above-mentioned photosensitive resin composition can be applicable to the dielectric layer between the metal electrode in the contact panel or covers the protective seam of metal electrode.
Based on above-mentioned; Have good tack between photosensitive resin composition of the present invention and the metal, and have high rigidity, therefore in contact panel; Can be used as the dielectric layer between metal electrode; With the phenomenon of avoiding dielectric layer and metal electrode to peel off, perhaps can be used as the protective seam that covers metal electrode, cause the problem of low yield to avoid protective seam to receive scratch.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates.
Embodiment
The present invention provides a kind of photosensitive resin composition, and it has good tack for metal, and has high rigidity.Therefore; Photosensitive resin composition of the present invention can be applicable in the contact panel processing procedure, after exposure and developing, forms the dielectric layer between metal electrode; To improve the tack between dielectric layer and the metal electrode; The phenomenon of avoiding dielectric layer and metal electrode to peel off perhaps forms the protective seam that covers metal electrode, causes the problem of low yield to avoid protective seam in processing procedure, to receive scratch.
Photosensitive resin composition of the present invention comprises that (A) has the polymkeric substance of the common block more than three, (B) and have the monomer of at least one ethene property unsaturated double-bond, urethane resin oligomer that (C) has at least one reactive acroleic acid functional group, (D) inorganic additive, (E) organic acid anhydride, (F) light initiator, (G) functional silanes coupling agent, (H) organic solvent through the organosilane surfaction.
Have in the polymkeric substance of the common block more than three at (A), these common blocks comprise that (A-1) contains the ethylene unsaturated monomer of acidic group and (A-2) ethylene unsaturated monomer except that (A-1).That is to say, (A) be at least by (A-1) with (A-2) be polymerized.Certainly, (A) also can be to form with other monomer polymerizations by (A-1), (A-2).With total restatement of photosensitive resin composition, content (A) is for example between between the 10wt% to 15wt%.
(A-1) ethylene unsaturated monomer that contains acidic group can be unsaturated monobasic acids, for example (methyl) acrylic acid, butenoic acid (crotonic acid), α-chlorine (methyl) acrylic acid, (ethyl) acrylic acid, cinnamic acid (cinnamic acid) etc.; Unsaturated dibasic acid/anhydrides, for example maleic acid, maleic anhydride (maleic anhydride), fumaric acid (fumaric acid), Yi Kang acid (itaconic acid), Yi Kang acid anhydrides (itaconic anhydride), citraconic acid (citraconic acid), citraconic anhydride (citraconic anhydride), mesaconic acid (mesaconic acid), mesaconic acid acid anhydride (mesaconic anhydride) etc.; Or the above unsaturated polybasic acids/anhydrides of trivalent.In (A-1) and summation (A-2) is 100 weight portions, and content (A-1) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-1) can use or mix several uses separately.When photosensitive resin composition of the present invention as the dielectric layer between the metal electrode or when covering the protective seam of metal electrode, (A-1) can make photosensitive resin composition of the present invention have good tack for metallic diaphragm.
(A-2) ethylene unsaturated monomer except that (A-1) can be the vinyl compound that contains propenyl (allyl group), for example allyl methacrylate (allyl (meth) acrylate) etc.; The vinyl compound that contains two acrylics; For example ethylene glycol dimethacrylate (ethylene glycol di (meth) acrylate), two cyclopentene dimethylacrylates (dicyclopentenyl di (meth) acrylate), propylene glycol dimethylacrylate (propylene glycol di (meth) acrylate), 2; 2-dimethyl-1; Ammediol dimethylacrylate (2; 2-dimethyl-1,3-propylene glycol di (meth) acrylate), triethylene glycol dimethylacrylate (triethylene glycol di (meth) acrylate), tetraethylene glycol dimethacrylate (tetraethylene glycol di (meth) acrylate), three (2-hydroxyethyl) isocyanic acid methacrylate (tri (2-hydroxyethyl) isocyanate di (meth) acrylate) etc.; Nitrilation vinyl compound, for example (methyl) vinyl cyanide ((meth) acrylonitrile), α-chlorine (methyl) vinyl cyanide (α-chloro (meth) acrylonitrile) etc.; Aromatic ethenyl compound, for example styrene (styrene), methyl styrene, methoxy styrene etc.; Other vinyl compounds, the for example cyclic alkyl of C6 to C12 (methyl) acrylic acid etc.(A-2) be preferably methacrylic acid dicyclo pentyl ester (dicyclopentanylmethacrylate), styrene, Isooctyl acrylate monomer (iso-octylacrylate), propenyl (methyl acryl) (allylmethacrylate), methacrylonitrile (methacrylonitrile), 2; 2-dimethyl-1; The two acryl (2 of ammediol; 2-dimethyl-1,3-propylene glycoldiacrylate).When (A-2) is styrene, can improve the thermotolerance and the endurance of photosensitive resin composition of the present invention further.In (A-1) and summation (A-2) is 100 weight portions, and content (A-2) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-2) can use or mix several uses separately.
The weight average molecular weight (Mw) that the polystyrene conversion that (A) measured with gel permeation chromatography obtains is preferable between 2 * 10
3To 1 * 10
5Between, better for 5 * 10
3To 5 * 10
4Between.When the weight average molecular weight of (A) is lower than 2 * 10
3The time; Can produce the coarse problem of pattern by formed dielectric layer of photosensitive resin composition of the present invention or protective seam; And this dielectric layer or protective seam are through producing the problem of thickness attenuation after the high temperature process, meaning is that deterioration can take place pattern form, the thermotolerance of dielectric layer or protective seam.When the weight average molecular weight of (A) is higher than 1 * 10
5The time, photosensitive resin composition of the present invention can produce the problem that light sensitivity reduces, and also can reduce the degree of accuracy of dielectric layer or protective seam pattern.
(B) monomer that has at least one ethene property unsaturated double-bond can be ethylene glycol dimethacrylate (ethylene glycol di (meth) acrylate); Polyethylene glycol dimethacrylate (polyethylene glycol di (meth) acrylate) with 2 to 14 Oxyranyles (ethyleneoxide group); Trihydroxymethyl propane dimethylacrylate (trimethylol propane di (meth) acrylate); Trihydroxymethyl propane trimethyl acrylic ester (trimethylol propane tri (meth) acrylate); Isoamyl tetrol trimethyl acrylic ester (pentaerythritol tri (meth) acrylate); Isoamyl tetrol tetramethyl acrylic ester (pentaerythritol tetra (meth) acrylate); Propylene glycol dimethylacrylate (propyleneglycol di (meth) acrylate) with 2 to 14 epoxypropane bases (propyleneoxide group); Dipentaerythritol pentamethyl acrylic ester (dipentaerythritol penta (meth) acrylate); Dipentaerythritol hexamethyl acrylic ester (dipentaerythritol hexa (meth) acrylate, DPHA); Trihydroxymethylpropanyltri diglycidyl ether acrylic acid adjuvant (trimethylolpropanetriglycidylether acrylic acid additives); Bisphenol A diglycidyl ether acrylic acid adjuvant (bisphenol A diglycidylether acrylic acid additives); (methyl) senecioate-hydroxyl ethyl ester of phthalate esters (phthalate diesters of β-hydroxyethyl (meth) acrylate); Toluene two different hydrogen acid ether (hydrogen acid ester) adjuvants (toluene diisocyanate additives) ((methyl) senecioate-hydroxyl ethyl ester (β-hydroxyethyl (meth) acrylate) for example; Monomer with ethene property unsaturated link, therein ethylene property unsaturated link be selected from by two trihydroxy methyl propane tetraacrylate (ditrimethylol propanetetraacrylate), the different hydracid triacrylate of ethoxylation trimerization (tris (2-acryloxyethyl) isocyanurate), contain ethoxy season pentitol tetraacrylate (ethoxylated pentaerylthritoltetraacrylate) (EO 4mol), season pentitol tetraacrylate (pentaerythritoltetraacrylate) (EO 35mol), contain ethoxy trimethylolpropane triacrylate (ethoxylated trimethylolpropanetriacrylate) (EO 9mol), contain ethoxy trimethylolpropane triacrylate (EO 3mol), contain propoxyl group trimethylolpropane triacrylate (propxylated pentaerythritoltetraacrylate) (PO 4mol), nine glycol diacrylates (nonaethylene glycol diacrylate), with the double pentaerythritol methacrylate (dipentaerythritolhexaacrylate-modified caprolactone) of caprolactone upgrading, the group that trimethylolpropane propoxyl group triacrylate (trimethylolpropanepropoxylate triacrylate) is formed.In addition, (B) also can be the general merchandise product, for example KAYARAD DPHA-40H (Japanese chemical drug (strain) is sold); U-4HA, U-6HA, U-6LPA, U-15HA, UA-32P, U-324A, U-4H, U-6H (Xin Zhong village chemical industry (strain) manufacturing); UN-9000H, UN-3320HA, UN-3320HB, UN-3320HC, UN-901, UN-1200TPK, UN-904 (industry (strain) is made on the root).With total restatement of photosensitive resin composition, content (B) is for example between between the 5wt% to 15wt%, and is preferable between 10wt% to 13wt%.Above-mentioned (B) can use or mix several uses separately.
(C) have at least one reactive acroleic acid functional group's urethane resin oligomer, its acid value (mgKOH/g) can be between 0 to 100.The urethane resin segment of this urethane resin oligomer is to be polymerized by isocyanate and hydroxyl compound.Isocyanate can be fragrant diisocyanate, for example 2, and 4-toluene di isocyanate (2,4-tolylene diisocyanate), 2; 6-toluene di isocyanate (2,6-tolylene diisocyanate), xylene-1, and the 4-diisocyanate (xylene-1,4-diisocyanate), xylene-1; The 3-diisocyanate (xylene-1,3-diisocyanate), 4,4 '-diphenylmethane diisocyanate salt (4,4 '-diphenylmethane diisocyanate; 2,4 MDI), '-diphenylmethane diisocyanate salt (2,4 '-diphenylmethane diisocyanate), 4,4 '-diphenyl ether diisocyanate (4; 4 '-diphenyl ether diisocyanate), 2-nitrogen oxygen diphenyl-4,4 '-diisocyanate (2-nitrodiphenyl-4,4 '-diisocyanate), 2; 2 '-phenyl-propane-4,4 '-diisocyanate (2,2 '-diphenylpropane-4; 4 '-diisocyanate), 3,3 '-dimethyl dipropyl methyl-4,4 '-diisocyanate (3; 3 '-dimethyldiphenylmethane-4,4 '-diisocyanate), 4,4 '-dimethylpropane diisocyanate (4; 4 '-diphenylpropane diisocyanate) ,-benzene diisocyanate (m-phenylene diisocyanate), face-the benzene diisocyanate (p-phenylene diisocyanate), naphthalene-1, the 4-diisocyanate (naphthylene-1,4-diisocyanate), naphthalene-1; The 5-diisocyanate (naphthylene-1,5-diisocyanate), 3,3 '-dimethoxy xylene-4; 4 '-diisocyanate (3,3 '-dimethoxydiphenyl-4,4 '-diisocyanate); Aliphatics diisocyanate (aliphatic diisocyanates); For example tetramethylene diisocyanate (tetramethylene diisocyanate), cyclohexane diisocyanate (hexamethylene diisocyanate, HDI), lysine di-isocyanate (lysine diisocyanate); Alicyclic ring diisocyanate (alicyclic diisocyanates), the xylene diisocyanate (hydrogenated xylene diisocyanate) of the for example toluene di isocyanate of isophorone diisocyanate (isophorone diisocyanate), hydrogenation (hydrogenated tolylene diisocyanate), hydrogenation, the diphenylmethane diisocyanate salt (hydrogenated diphenylmethane diisocyanate) of hydrogenation, tetramethyl xylene diisocyanate (tetramethylxylene diisocyanate).Above-mentioned isocyanate only is used for explanation, but is not limited thereto, and can be one or more mixing uses in order to the isocyanate of polymerization urethane resin segment.Hydroxyl compound in order to polymerization urethane resin segment can be a glycol, for example monoethylene glycol (ethylene glycol), propylene glycol (propylene glycol), tetramethylene vinyl alcohol (tetramethylene glycol), 1,5-pentanediol (1; 5-pentanediol), 1, the 6-butylene glycol (1,6-hexanediol), 1; 10-certain herbaceous plants with big flowers glycol (1; 10-decanediol), 1,4-two cyclohexenols (1,4-dihydroxycyclohexane), 1; 4-two cyclohexene methylols (1,4-dihydroxymethylcyclohexane), divinyl alcohol (diethylene glycol), trivinyl alcohol (triethylene glycol); Amino alcohol; Polymer polyol.Above-mentioned hydroxyl compound only is used for explanation, but is not limited thereto, and also can be one or more mixing uses in order to the hydroxyl compound of polymerization urethane resin segment.With total restatement of photosensitive resin composition, content (C) is between between the 1wt% to 20wt%, and is preferable between between the 3wt% to 15wt%, better between the 5wt% to 10wt%.Above-mentioned (C) can use or mix several uses separately.When photosensitive resin composition of the present invention as the dielectric layer between the metal electrode or when covering the protective seam of metal electrode, (C) can make photosensitive resin composition of the present invention have high rigidity, and have good tack for metallic diaphragm.
(D) can be through the prepared organic and inorganic colloidal sol of sol gel reaction by organosilane and inorganic oxide through the inorganic additive of organosilane surfaction.This sol gel reaction can be carried out through adding acid catalyst, and employed acid catalyst can be to be selected from the group that is made up of acetic acid (acetic acid), phosphoric acid (phosphoric acid), sulfuric acid (sulfuric acid), chloric acid (chloric acid), nitric acid (nitric acid), chlorosulfonic acid (chlorosulfonic acid), p-toluenesulfonic acid (p-toluene sulfonic acid), trichloroacetic acid (trichloroacetic acid), polyphosphoric acid (polyphosphoric acid), acid iodide (iodic acid), iodic anhydride (iodic anhydride) and mistake chloric acid (perchloric acid).Above-mentioned acid catalyst can separately or mix several uses.Through the prepared organic and inorganic colloidal sol of sol gel reaction thus, its character receive organosilane kind, acid catalyst kind and concentration, acidity (pH value), temperature, water content, influence as the kind of the alcohols of hydrolysising solvent use and the kind and the concentration of concentration and salt.Particularly, therefore prepared organic and inorganic colloidal sol have the effect that improves hardness and wear resistance because of containing inorganic oxide.The inorganic oxide that is used for sol gel reaction can be selected from the group that is made up of titania, silicon dioxide, zirconia, tin ash, cerium sesquioxide, barium titanate, aluminium oxide and yttria.The organosilane that is used for sol gel reaction can be selected from by MTMS (methyl trimethoxy silane); MTES (methyl triethoxy silane); Vinyltrimethoxy silane (vinyl trimethoxy silane); VTES (vinyl triethoxy silane); Dimethyldimethoxysil,ne (dimethyl dimethoxy silane); Dimethyldiethoxysilane (dimethyl diethoxy silane); Vinyl methyl dimethoxysilane (vinyl methyl dimethoxy silane); Butyl trimethoxy silane (butyl trimethoxy silane); Diphenyl ethoxy ethylene base silane (diphenyl ethoxy vinyl silane); Methyl three isopropoxy silane (methyl triisopropoxy silane); Methyl triacetoxysilane (methyl triacetoxy silane); Tetraphenoxy-silicane alkane (tetraphenoxy silane); The group that tetrapropoxysilane (tetrapropoxy silane) and vinyl silane triisopropoxide (vinyl triisopropoxy silane) are formed.Except with the synthetic organic and inorganic colloidal sol of said method, also can be the general merchandise product through the inorganic additive of organosilane surfaction, for example the 601A-35 of Changxing chemical industry, 601B-35,601C-35,601H-35,601Q-35; BYK-UV3500, BYK-UV3510, BYK-UV333, the BYK-UV3650 of BYK series; MEK-ST, the MEK-AC-2101 of daily output chemical industry.With total restatement of photosensitive resin composition, content (D) is for example less than 5wt%.
(E) organic acid anhydride can be maleic anhydride (maleic anhydride, MA), Yi Kang acid anhydrides (itaconic anhydride), tetrahydrochysene acid phthalic anhydride (tetrahydrophthalic anhydride), citraconic anhydride (citraconic anhydride), mesaconic acid acid anhydride (mesaconic anhydride) etc.In (A) is 100 weight portions, and content (E) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned (E) can use or mix several uses separately.
(F) the light initiator can be phosphine oxide (phosphine oxide) based compound, carbonyl (carbonyl) based compound, amine carbonyl (aminocarbonyl) based compound, triazine (triazine) based compound, oxime (oxime) based compound, amine (amine) based compound, alkoxy a pair of horses going side by side anthracene (alkoxyantharcene) based compound, thioxanthene (thioxanthone) based compound.In (A) is 100 weight portions, and content (F) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned (F) can use or mix several uses separately.
The phosphine oxide based compound for example is fragrant phosphine oxide (arylphosphine oxide), acyl phosphine (acylphosphine oxide), two acyl phosphine (bisacylphosphine oxide), 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide (2,4; 6-trimethylbenzoyldiphenylphosphine oxide, TPO), 2,6-diethylbenzene formoxyl-diphenyl phosphine oxide (2,6-diethylbenzoyldiphenylphosphine oxide), 2; 6-dimethylbenzoyl-diphenyl phosphine oxide (2,6-dimethoxybenzoyldiphenylphosphine oxide), 2,6-dichloro-benzoyl base-diphenyl phosphine oxide (2,6-dichlorobenzoyldiphenylphosphine oxide), 2; 3,5,6-tetramethylbenzene formoxyl-diphenyl phosphine oxide (2,3; 5,6-tetramethylbenzoyldiphenylphosphine oxide), benzoyl two (2, the 6-xylyl) phosphonic acids (benzoyldi (2,6-dimethylphenyl) phosphonate), 2; 4,6-trimethylbenzoyl phenyl-phosphonic acid ethyl ester (2,4; 6-trimethylbenzoylethoxyphenylphosphine oxide), two (2,4, the 6-trimethylbenzoyl) phenyl phosphine oxide) (bis (2; 4,6-trimethylbenzoyl) phenylphosphine, I-819), two (2; 6-anisoyl base)-2,4, (bis (2 for 4-trimethylphenyl phosphine oxide; 6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide)) etc.
Carbonyl compounds, amine carbonyl compound, a triazine-based compound, oxime-based compounds such as acetophenone (acetophenone), benzophenone (benzophenone), diphenyl ketone (biphenylketone), 1 - hydroxy-1 - cyclohexyl phenyl yl methyl ketone (1-hydroxy-1-benzoylcyclohexane, I-184), benzyl acetone, 2,2 - dimethoxy-1 ,2 - diphenyl ethane-1 - one (benzyldimethylketal? 2,2-dimethoxy- 1,2-diphenylethane-1-one, I-651), 1 - benzyl-1 - dimethyl amine -1 - (4 - morpholino - benzoyl) propane (1-benzyl-1-dimethylamino- 1 - (4-morpholino-benzoyl) propane, I-369), 2 - morpholin-2 - (4 - methylthio) benzoyl propane (2-morpholyl-2-(4-methylmercapto) benzoylpropane, I- 907), ethyl anthraquinone (ethylantraquinone), 4 - benzoyl-4 - methyl-diphenyl sulfide (4-benzoyl-4-methyldiphenylsulfide), benzoyl benzyl alcohol ether (benzoinbutylether), 2 - hydroxy - 2 - benzoyl propane (2-hydroxy-2-benzoylpropane), 2 - hydroxy-2 - (4 - iso-yl) benzoyl propane (2-hydroxy-2-(4-isopropyl) benzoylpropane), 4 - butyl-benzoyl chloroform (4-butylbenzoyltrichloromethane), 4 - phenoxy-benzoyl methylene chloride (4-phenoxybenzoyldichloromethane), benzoyl methyl (benzoylmethylformate), 1,7 - bis (9 - acridine piperidinyl) heptane (1,7-bis (9-acridinyl) heptane) ,9-n-butyl-3, 6 - bis (2 - morpholino - isobutyryl) carbazole (9-n-butyl- 3,6-bis (2-morpholino-isobutyloyl) carbazole), 10 - butyl-2 - triphenyl-one (10-butyl-2-chloroacridone), 2 - [2 - (4 - methoxy - phenyl ) - vinyl] -4,6 - double - trichloromethyl - [1,3,5] triazine-(2 - [2 - (4-methoxy-phenyl)-vinyl] -4,6-bis-trichloromethyl - [1,3,5] triazine), 2 - (4 - methoxy - naphthalen-1 - yl) -4,6 - bis - trichloromethyl - [1,3,5] triazine-(2 - (4-methoxy-naphthalen-1-yl) -4,6-bis-trichloromethyl-[1,3,5] triazine), 2 - Toluene [1,3] dioxol-5 --4 , 6 - bis - trichloromethyl - [1,3,5] triazine (2-benzo [1,3] dioxol-5-yl-4 ,6-bis-trichloromethyl-[1,3,5] triazine ), 2 - methyl -4,6 - bis (trichloromethyl)-s-triazine (2-methyl-4 ,6-bis (trichloromethyl)-s-triazine), 2 - phenyl-4 ,6 - bis (trichloromethyl)-s-triazine (2-phenyl-4 ,6-bis (trichloromethyl)-s-triazine), 2 - naphthyl -4,6 - bis (trichloromethyl)-s - triazine (2-naphthyl-4 ,6-bis (trichloromethyl)-s-triazine), 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - bicyclo heptyl methane -1 - one oxime-O-acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - bicyclo hept-1 - one oxime-O-acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - adamantyl methane -1 - one oxime-O-benzoate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - adamantyl methane -1 - one oxime-O-acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - tetrahydrofuranyl Methane -1 - one oxime-O-benzoate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - tetrahydrofuran methane - 1 - one oxime-O-acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - thiophene methane -1 - oxime-O-benzoate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - thiophene methane -1 - one oxime-O-acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - code thienyl methane -1 - one oxime - O-benzoate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - code thienyl methane -1 - one oxime-O - acetate, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - ethane-1 - one oxime-O-Ring D alkyl ester, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - ethane-1 - one oxime-O-alkyl tricyclic Gyu ester, 1 - [9 - ethyl-6 - (2 - methyl-benzoyl)-9.H-carbazol-3 - yl] - ethane-1 - one oxime-O-adamantane esters, 1,2 - octanedione -1 - [4 - (phenylthio) phenyl] -2 - (O-benzoyl oxime), 1,2 - butanedione -1 - [4 - (phenylthio ) phenyl] -2 - (O-benzoyl oxime), 1,2 - butanedione -1 - [4 - (phenylthio) phenyl] -2 - (O-acetyl oxime), 1, 2 - octanedione -1 - [4 - (methylthio) phenyl] -2 - (O-benzoyl oxime), 1,2 - octanedione -1 - [4 - (phenylthio) benzene yl] -2 - (O-methyl-benzoyl oxime).
Amine compound for example is triethanolamine (triethanolamine), methyldiethanolamine (methyldiethanolamine), triisopropanolamine (triisopropylamine), 4-dimethylaminomethyl ethyl benzoate (4-dimethylaminomethyl benzoate), 4-dimethyl aminoethyl ethyl benzoate (4-dimethylaminoethyl benzoate), 4-dimethylamino isoamyl benzene ethyl formate (4-methylaminoisoamyl benzoate), 2-methylamino ethylamino benzonitrile acetoacetic ester (2-methylaminoethyl benzoate), 4-dimethylamino-2-ethylhexyl ethyl benzoate (4-dimethylamino-2-ethylhexyl benzoate), N; N-methyl para-totuidine (N; N-methylparatoluidine), 4; 4 '-two (dimethylamino) benzophenone (4; 4 '-bis (dimethylamino) benzophenone), 4; 4 '-two (diethylamino) benzophenone (4; 4 '-bis (diethylamino) benzophenone), 4; 4 '-two (ethylmethylamino) benzophenone (4,4 '-bis (ethylmethylamino) benzophenone).
Alkoxy a pair of horses going side by side anthracene based compound for example is 9, and 10-dimethoxy anthracene (9,10-dimethoxyanthracene), 9; 10-diethoxy anthracene (9; 10-diethoxyanthracene), 2-ethyl-9,10-dimethoxy anthracene (2-ethyl-9,10-dimethoxyanthracene), 2-ethyl-9; 10-diethoxy anthracene (2-ethyl-9,10-diethoxyanthracene).
The thioxanthene based compound for example is 2-isopropyl thioxanthone (2-isopropyl thioxanthone), 4-isopropyl thioxanthone (4-isopropylthioxanthone; IPTX), 2; The 4-diethyl thioxanthone (2,4-diethylthioxanthone, DETX), 2; 4-three chloro thioxanthones (2,4-trichlorothioxanthone), 1-chloro-4-propyl group thioxanthones (1-chloro-4-propoxythioxanthone).
(G) the functional silanes coupling agent can be the siloxanyl monomers of tool siloyl group acryl monomer, tool epoxide functional groups, and it for example is γ-glycidoxy trimethoxy silane etc.(G) can make between photosensitive resin composition of the present invention and metal, metal oxide or the glass baseplate and have good tack.In addition, owing to (G) have hydrophobic property, therefore can make photosensitive resin composition of the present invention when carrying out the reliability test, have the high anti-oxidation characteristic.With total restatement of photosensitive resin composition, content (G) is for example between between the 0.01wt% to 5wt%.Above-mentioned (G) can use or mix several uses separately.
(H) organic solvent can dissolve fine acetic acid esters (methyl cellosolve acetate) for benzene (benzene), toluene (toluene), xylene (xylene), methyl alcohol (methanol), ethanol (ethanol), ethanol list propyl ether (ethylene glycol monopropyl ether), diethylene glycol dimethyl ether (diethylene glycol dimethyl ether), diethylene glycol dimethyl ether (diethylene glycol methyl ether), methoxypropionic acid methyl esters (methyl methoxypropionate), ethoxyl ethyl propionate (ethyl ethoxypropionate), ethyl lactate (ethyllactate), tetrahydrofuran (tetrahydrofuran), ethanol monomethyl ether (ethylene glycol monomethyl ether), ethanol list ether (ethylene glycol monoethyl ether), methyl, ethyl dissolves fine acetic acid esters (ethyl cellosolve acetate), diethanol monomethyl ether (diethylene glycol monomethyl ether), the single ether (diethylene glycol monoethyl ether) of diethanol, diethylene glycol monobutyl ether (diethylene glycol monobutyl ether), 1-Methoxy-2-propyl acetate (propylene glycol methyl ether acetate; PGMEA), propylene-glycol ethyl ether acetate (propylene glycol ethyl ether acetate), propylene glycol propyl ether acetate (propylene glycol propyl ether acetate), methyl isobutyl ketone (methyl isobutyl ketone), methyl ether ketone (methyl ether ketone), acetone (ketone), cyclohexanone (cyclohexanone), dimethyl formamide (dimethyl formamide; DMF), N; N-dimethyl acetamide (N; N-dimethylacetamide; DMAc), N-Methyl pyrrolidone (N-Methyl pyrrolidone, NMP), gamma-butyrolacton (γ-butyrolactone).With total restatement of photosensitive resin composition, content (H) is for example between between the 60wt% to 80wt%.Above-mentioned (H) can use or mix several uses separately.
Photosensitive resin composition of the present invention has high sensitivity, even at 400J/m
2Below exposure also can have good metal tack, high rigidity, good insulation performance characteristic, good endurance, and can be used as the dielectric layer between the metal electrode in the contact panel or cover the protective seam of metal electrode.
In sum, owing to have good tack between photosensitive resin composition of the present invention and the metal, and have high rigidity, therefore can be applicable in the processing procedure of contact panel.When photosensitive resin composition of the present invention through exposure with develop after; Can form at the dielectric layer between the metal electrode to come to improve the tack between dielectric layer and the metal electrode; With the phenomenon of avoiding dielectric layer and metal electrode to peel off; Perhaps can form the protective seam that covers metal electrode, cause the problem of low yield to avoid protective seam in processing procedure, to receive scratch.
Below will do explanation to photosensitive resin composition of the present invention with experimental example.
(A) have polymkeric substance synthetic of the common block more than three:
At first, the 3-ethoxy-propionic acid second fat (ethyl 3-ethoxypropionate) with 95.673kg adds in the agitated reactor as solvent.Then, feed nitrogen and be stirred and heated to 130 ℃.Then; The methacrylic acid (methacrylic acid) of 24.451kg, the methacrylic acid phenylester (benzyl methacrylate) of 42.614kg, the isobornyl methacrylate (isobornyl methacrylate) of 42.443kg and three grades of butyl esters of benzoyl hydroperoxide (t-butyl perbenzoate) of 2.547kg are stirred, and splash in 130 ℃ the agitated reactor (about 6 hours of the time that splashes into).Afterwards, add the 3-ethoxy-propionic acid second fat of 72.195kg, and the temperature of agitated reactor fallen be back to 50 ℃.Then, nitrogen is cut off, and added the GMA (glycidyl methacrylate) of 6.636kg, the DMAE (dimethyl amino ethanol) (catalyzer) of 0.716kg, in air, stir the reaction 4 to 6 hours of stumbling.The solids content of the resin solution product of gained (solid content) is 41.4wt.%, and viscosity is 2650cps/25 ℃, and acid value (acidity) is 88.3mgKOH/g, and weight average molecular weight (Mw) is 12000.
In the photosensitive resin composition of experimental example 1 and comparative example 1-4, other compositions except that above-mentioned (A) are shown in table one.In addition, also show in the table one about pencil hardness test and metal adhesion test result.
Table one
Can know that by table one compare with general photosensitive resin composition (comparative example 1-4), photosensitive resin composition of the present invention (experimental example 1) has good metal tack and high rigidity.
Though the present invention discloses as above with embodiment; But it is not that any those skilled in the art are not breaking away from the spirit and scope of the present invention in order to qualification the present invention; Can change arbitrarily or be equal to replacement, so protection scope of the present invention should be as the criterion with the scope that the application's claim is defined.
Claims (12)
1. photosensitive resin composition comprises:
(A) have the polymkeric substance of the common block more than three, said block altogether comprises: the ethylene unsaturated monomer that (A-1) contains acidic group; And (A-2) ethylene unsaturated monomer except that (A-1);
(B) has the monomer of at least one ethene property unsaturated double-bond;
(C) has at least one reactive acroleic acid functional group's urethane resin oligomer;
(D) through the inorganic additive of organosilane surfaction;
(E) organic acid anhydride;
(F) light initiator;
(G) functional silanes coupling agent; And
(H) organic solvent,
Wherein with total restatement of this photosensitive resin composition, content (C) is between between the 1wt% to 20wt%.
2. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (A) is between between the 10wt% to 15wt%.
3. photosensitive resin composition according to claim 1 is 100 weight portions in (A-1) and summation (A-2) wherein, and content (A-1) is between 10 weight portion to 90 weight portions.
4. photosensitive resin composition according to claim 1 is 100 weight portions in (A-1) and summation (A-2) wherein, and content (A-2) is between 10 weight portion to 90 weight portions.
5. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (B) is between between the 5wt% to 15wt%.
6. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (C) is between between the 1wt% to 20wt%.
7. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (D) is less than 5wt%.
8. photosensitive resin composition according to claim 1 is 100 weight portions in (A) wherein, and content (E) is between 0.1 weight portion to 100 weight portion.
9. photosensitive resin composition according to claim 1 is 100 weight portions in (A) wherein, and content (F) is between 0.1 weight portion to 100 weight portion.
10. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (G) is between between the 0.01wt% to 5wt%.
11. photosensitive resin composition according to claim 1, wherein with total restatement of this photosensitive resin composition, content (H) is between between the 60wt% to 80wt%.
12. photosensitive resin composition according to claim 1, wherein this photosensitive resin composition is applied to the dielectric layer between the metal electrode in the contact panel or covers the protective seam of metal electrode.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104238265A (en) * | 2013-06-10 | 2014-12-24 | 奇美实业股份有限公司 | Photosensitive resin composition and application thereof |
| CN104379621A (en) * | 2012-06-22 | 2015-02-25 | 索马龙株式会社 | Energy ray-curable resin composition, cured product and laminate |
| CN109153760A (en) * | 2016-02-23 | 2019-01-04 | 得克萨斯大学体系董事会 | Block copolymer for 10NM or less composition |
| WO2021070520A1 (en) * | 2019-10-11 | 2021-04-15 | 富士フイルム株式会社 | Composition, method for producing composition, cured film, transfer film and method for manufacturing touch panel |
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| JP2000066391A (en) * | 1998-08-17 | 2000-03-03 | Tokyo Ohka Kogyo Co Ltd | Photosensitive composition for sandblast and photosensitive film using same |
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| EP0675412A1 (en) * | 1994-03-30 | 1995-10-04 | Japan Synthetic Rubber Co., Ltd. | Photosensitive resin composition |
| JP2000066391A (en) * | 1998-08-17 | 2000-03-03 | Tokyo Ohka Kogyo Co Ltd | Photosensitive composition for sandblast and photosensitive film using same |
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| CN104379621A (en) * | 2012-06-22 | 2015-02-25 | 索马龙株式会社 | Energy ray-curable resin composition, cured product and laminate |
| CN104238265A (en) * | 2013-06-10 | 2014-12-24 | 奇美实业股份有限公司 | Photosensitive resin composition and application thereof |
| CN109153760A (en) * | 2016-02-23 | 2019-01-04 | 得克萨斯大学体系董事会 | Block copolymer for 10NM or less composition |
| CN109153760B (en) * | 2016-02-23 | 2021-10-29 | 得克萨斯大学体系董事会 | Block copolymers for patterning below 10NM |
| WO2021070520A1 (en) * | 2019-10-11 | 2021-04-15 | 富士フイルム株式会社 | Composition, method for producing composition, cured film, transfer film and method for manufacturing touch panel |
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| CN102385254B (en) | 2013-03-06 |
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