CN102373029A - Preparation method of rapid curing of flexible conductive adhesive under room temperature - Google Patents
Preparation method of rapid curing of flexible conductive adhesive under room temperature Download PDFInfo
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- CN102373029A CN102373029A CN2010102654026A CN201010265402A CN102373029A CN 102373029 A CN102373029 A CN 102373029A CN 2010102654026 A CN2010102654026 A CN 2010102654026A CN 201010265402 A CN201010265402 A CN 201010265402A CN 102373029 A CN102373029 A CN 102373029A
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Abstract
The invention relates to a preparation method of a conductive adhesive, in particular to a preparation method of an epoxy conductive adhesive with low curing temperature, high curing rate, easy curing operation, high cleaness, and good flexibility, and being environmentally friendly. The method comprises the following steps: using epoxy resin, fatty amine curing agent, C4-14 alcohol ether thinner, imidazole promoter and nano-Ag to prepare a mixed solution according to a weight ratio of 100:(2-15):(1-40):(0.1-5):(10-70), fully mixing and encapsulating. When in use, the conductive adhesive can be cured through 5-10min of microwave irradiation after the spraying of the mixed solution. The conductive adhesive is particularly used for the repair and connection of the switching part of a flexible printed circuit board and an electronic encapsulating material, solves the problems of high temperature and long curing time, and is flexible, adjustable, energy-saving and environmentally-friendly.
Description
Affiliated technical field
The present invention relates to a kind of preparation method of conductive resin, it is low to relate in particular to a kind of solidification value, and curing speed is fast, solidify simple, clean environment firendly, the preparation method of the epoxy group(ing) conductive resin that snappiness is good.
Background technology
The place of electronic devices and components, particularly flexible circuit and circuit switch owing to need stand stress in bending, peeling off of damage and electro-conductive material occur the most easily.The foundation of general circuit for ease be connected, and repair, thereby adopt the spraying conductive resin to make its curing form conductive path usually.Normally used material conductive resin mainly is with silver powder, and copper powder and carbon dust be as conductive compositions, with polyester, and urethane, macromolecular materials such as epoxy resin are as the carrier tackiness agent.But because component and curing mode are different, the curing environment that can use is also different.Usually can low temperature or the material of self-vulcanizing, its set time is longer, solidifies flexibility and is difficult to regulate.Chinese patent CN101436442A; A kind of low-temperature conductive slurry is disclosed; Its solidification value is more than 120 ℃, needs time of drying 10-30min. simultaneously because the solvent composition in this powder component is mobile big; There is gaseous volatilization under the condition of cure, all can brings influence the manufacturing reparation of circuit.Chinese invention patent CN1632032 has reported a kind of single-component solidified epoxy resin flexible conductive adhesive, and the room temperature placement needs 24h to solidify, and it all is fatal that this efficient to the manufacturing reparation of circuit improves.
Summary of the invention
It is high to the present invention is directed to the solidification value that exists in the background technology; Set time is long, the manufacturing of problem that the feature of environmental protection is looked into and flexible circuit and circuit switch and the demand of reparation, and it is low to have proposed a kind of solidification value; Curing speed is fast; Solidify simply clean environment firendly, the preparation method of the epoxy group(ing) conductive resin that snappiness is good.
A kind of preparation method of room temperature fast-curing flexible conductive adhesive; Comprise following steps: with epoxy resin; The fat amine curing agent, 4-14 alcohol ethers thinner, imidazoles promotor; Nanometer silver is according to weight ratio 100: 2-15: 1-40: 0.1-5: 10-70 is mixed with mixed solution, encapsulates behind the thorough mixing.During application, after the mixed solution spraying, microwave irradiation 5-10min can realize solidifying;
A kind of preparation method of room temperature fast-curing flexible conductive adhesive; It is characterized in that epoxy resin in the conductive resin raw material, fatty amine curing agent, 4-14 alcohol ethers thinner; Imidazoles promotor, nanometer silver are according to weight ratio preferred 100: 5-10: 10-20: 0.5-2: 20-50;
A kind of preparation method of room temperature fast-curing flexible conductive adhesive, the oxirane value that it is characterized in that epoxy resin in the composition of raw materials is 0.3-0.5; The preferred polyethylene polyamine of fat amine curing agent, diethyl amino propylamine, trimethylhexamethylenediamine and polyether diamine; Imidazoles promotor preferable methyl imidazoles;
A kind of preparation method of room temperature fast-curing flexible conductive adhesive is characterized in that; Nanometer silver is coated with acid of 4-15 carbochain or pure nanometer silver for the surface in the composition of raw materials, and its particle diameter is 2-100nm;
The reparation that this method is used in particular for flexible PCB and electronic package material switching place connects
Beneficial effect of the present invention:
1, the starting material component of the present invention's employing is main with transparent viscosity material, has the adjustable characteristics of viscosity simultaneously, can require configuration different viscosity and suppleness to different flexible base, boards.
2, the present invention is the basis with the multipolarity component formula, adopts microwave curing, has realized that curing efficiency is high, and solidification value is low, and condition of cure is simple, electronic devices and components is not produced any harmful effect simultaneously.In addition, can realize effectively compatiblely based on the raw material of multipolarity curing formula, realize effective dispersion of nanometer silver with the nanometer silver of finishing.
3, preparation technology of the present invention is simple, and the raw material solidification process has no by product, environmental protection.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in the restriction scope of the present invention.Should be understood that in addition those skilled in the art can do various changes or modification to the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Embodiment 1 is with 5 parts of diethylenetriamines; 10 parts of neopentylglycol diglycidyl ethers; Methylimidazole mixes for 10 parts; Then the surface is coated 40 parts of lauric nanometer silvers (particle diameter is 20 nanometers) and add wherein, add 100 parts of oxirane values after mixing to and be in 0.4 the epoxy resin, fully mix.Inject sharp mouth tin box behind the 10min.On flexible circuit board be according to draw font according to model " U ", with its electroconductibility of test behind the microwave irradiation 10min and bending breaks.
Embodiment 2, with 6 parts of polyethylene polyamines; 1; 15 parts of 4 butanediol diglycidyl ethers, methylimidazole mixes for 20 parts, and the nanometer silver 60 parts (particle diameter is about 20nm) that then surface is coated n-caprylic acid adds wherein; Add 100 parts of oxirane values after mixing to and be in 0.4 the epoxy resin, fully mix.Inject sharp mouth tin box behind the 10min.On flexible circuit board be according to draw font according to model " U ", with its electroconductibility of test behind the microwave irradiation 15min and bending breaks.
Embodiment 3, with 10 parts of trimethylhexamethylenediamines; 15 parts of polypropylene glycol diglycidyl ethers; Methylimidazole mixes for 15 parts; The nanometer silver 50 parts (particle diameter is about 10nm) that then surface is coated n-Octanol adds wherein, adds 100 parts of oxirane values after mixing to and is in 0.3 the epoxy resin, fully mixes.Inject sharp mouth tin box behind the 10min.On flexible circuit board, drawing font according to model is " U ", with its electroconductibility of test behind the microwave irradiation 15min and bending breaks.
Comparative example 1: with 8 parts of trolamines, 15 parts of n-butyl glycidyl ethers, 15 parts of imidazoles, 50 parts of commercial nanometer silvers (particle diameter is 50nm), n-butyl glycidyl ether, behind the thorough mixing, 120 ℃ solidify 20min, test its electroconductibility and bending breaks.
Table 1: embodiment and comparative example product performance test result
| Volume resistance/Ω .cm | Bending number of times/inferior | |
| Embodiment 1 | 7.8*10-6 | 6000 |
| Embodiment 2 | 3.2*10-6 | 8000 |
| Embodiment 3 | 5.1*10-6 | 7500 |
| Comparative example 1 | 4.0*10-3 | 3000 |
Claims (4)
1. the preparation method of a room temperature fast-curing flexible conductive adhesive; Comprise following steps: with epoxy resin; The fat amine curing agent, 4-14 alcohol ethers thinner, imidazoles promotor; Nanometer silver is according to weight ratio 100: 2-15: 1-40: 0.1-5: 10-70 is mixed with mixed solution, encapsulates behind the thorough mixing.During application, after the mixed solution spraying, microwave irradiation 5-10min can realize solidifying.
2. according to the preparation method of claim item 1 described a kind of room temperature fast-curing flexible conductive adhesive; It is characterized in that epoxy resin in the conductive resin raw material; The fat amine curing agent; 4-14 alcohol ethers thinner, imidazoles promotor, nanometer silver is according to weight ratio preferred 100: 5-10: 10-20: 0.5-2: 20-50.
3. according to the preparation method of claim item 1 and 2 described a kind of room temperature fast-curing flexible conductive adhesives, the oxirane value that it is characterized in that epoxy resin in the composition of raw materials is 0.3-0.5; The preferred polyethylene polyamine of fat amine curing agent, diethyl amino propylamine, trimethylhexamethylenediamine and polyether diamine; Imidazoles promotor preferable methyl imidazoles.
4. according to the preparation method of claim item 1 described a kind of room temperature fast-curing flexible conductive adhesive, it is characterized in that; Nanometer silver is coated with acid of 4-15 carbochain or pure nanometer silver for the surface in the composition of raw materials, and its particle diameter is 2-100nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102654026A CN102373029A (en) | 2010-08-26 | 2010-08-26 | Preparation method of rapid curing of flexible conductive adhesive under room temperature |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102654026A CN102373029A (en) | 2010-08-26 | 2010-08-26 | Preparation method of rapid curing of flexible conductive adhesive under room temperature |
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| CN102373029A true CN102373029A (en) | 2012-03-14 |
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| CN2010102654026A Pending CN102373029A (en) | 2010-08-26 | 2010-08-26 | Preparation method of rapid curing of flexible conductive adhesive under room temperature |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
| CN104277753A (en) * | 2014-10-29 | 2015-01-14 | 桂林理工大学 | Preparation method of conductive adhesive capable of being solidified at room temperature |
| CN104460063A (en) * | 2014-12-15 | 2015-03-25 | 京东方科技集团股份有限公司 | Display module and manufacturing method thereof |
| CN106633649A (en) * | 2016-12-09 | 2017-05-10 | 北京化工大学 | Resin matrix applicable to microwave curing and preparation method of resin matrix |
| CN108075056A (en) * | 2016-11-10 | 2018-05-25 | 罗伯特·博世有限公司 | For manufacturing the joint method of battery and battery |
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| CN1939999A (en) * | 2005-09-27 | 2007-04-04 | 上海特视精密仪器有限公司 | Sliver-powder conducting glue and its production |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
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| CN1939999A (en) * | 2005-09-27 | 2007-04-04 | 上海特视精密仪器有限公司 | Sliver-powder conducting glue and its production |
| CN101805574A (en) * | 2010-03-11 | 2010-08-18 | 复旦大学 | Sintered type conductive adhesive adopting silver filling with surfaces subjected to activating treatment and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881611A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Normal temperature conductive adhesive and preparation method thereof |
| CN104277753A (en) * | 2014-10-29 | 2015-01-14 | 桂林理工大学 | Preparation method of conductive adhesive capable of being solidified at room temperature |
| CN104460063A (en) * | 2014-12-15 | 2015-03-25 | 京东方科技集团股份有限公司 | Display module and manufacturing method thereof |
| CN104460063B (en) * | 2014-12-15 | 2017-05-03 | 京东方科技集团股份有限公司 | display module and manufacturing method thereof |
| CN108075056A (en) * | 2016-11-10 | 2018-05-25 | 罗伯特·博世有限公司 | For manufacturing the joint method of battery and battery |
| CN106633649A (en) * | 2016-12-09 | 2017-05-10 | 北京化工大学 | Resin matrix applicable to microwave curing and preparation method of resin matrix |
| CN106633649B (en) * | 2016-12-09 | 2018-10-23 | 北京化工大学 | One kind being suitable for microwave curing resin matrix and preparation method |
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Application publication date: 20120314 |