CN102347292A - Novel chip packaging structure - Google Patents
Novel chip packaging structure Download PDFInfo
- Publication number
- CN102347292A CN102347292A CN2011102916983A CN201110291698A CN102347292A CN 102347292 A CN102347292 A CN 102347292A CN 2011102916983 A CN2011102916983 A CN 2011102916983A CN 201110291698 A CN201110291698 A CN 201110291698A CN 102347292 A CN102347292 A CN 102347292A
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- China
- Prior art keywords
- chip
- substrate
- packaging structure
- novel
- injection molding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a novel chip packaging structure, comprising a substrate, an injection molding body and a chip. The chip packaging structure is characterized in that the chip and the substrate are packaged by the injection mold body, the chip is arranged at the upper part of the substrate, and a circuit surface of the chip faces to the substrate and is connected with a contact on the substrate by a guide line; and a series of holes are arranged at the top of the injection molding body, and a non-circuit surface of the chip is communicated with external air by the holes, thus improving the heat dispersion of the chip effectively. The novel chip packaging structure is reasonable in design, provides good heat dispersion for the chip at the same time of ensuring good connection performance between the chip and the substrate, and is simple in implementation of packaging technology, low in cost, and suitable for batch production.
Description
Technical field
The present invention relates to a kind of novel chip packaging structure, relate in particular to a kind of novel chip packaging structure of effective raising chip cooling performance, belong to the chip encapsulation technology field.
Background technology
Chip encapsulation technology wraps up chip exactly, contacts with extraneous to avoid chip, prevents a kind of technology of the infringement of outer bound pair chip.Airborne impurity and bad air, so steam all can corrode the precision circuit on the chip, and then cause electric property to descend.Different encapsulation technologies is widely different in manufacturing process and process aspect, and crucial effects is also played to the performance of memory chip self performance in the encapsulation back.Along with the develop rapidly of photoelectricity, little electric manufacturing process technology, electronic product all the time towards littler, gentlier, more cheap direction develops, so the packing forms of chip component also constantly is improved.
In the existing chip encapsulating structure, chip is wrapped in the injection molding body mostly, mainly carries out heat transmission through the metal and the external world that is connected with chip, and heat-sinking capability is limited, influences the stability of chip operation.
Summary of the invention
To the demand; The invention provides a kind of novel chip packaging structure; Be provided with hole system between the inverter circuit face of this encapsulating structure chips and the injection molding body, the heat-sinking capability of chip has effectively improved in this hole system, and does not influence the encapsulation performance and the electrical connection properties of chip.
The present invention is a kind of novel chip packaging structure; This novel chip packaging structure comprises substrate, injection molding body and chip; It is characterized in that; Described chip and substrate are encapsulated by injection molding body, and described chip is positioned at substrate top, and its circuit face is towards substrate; And link to each other with contact on the substrate through lead; Described injection molding body top is provided with hole system, and the inverter circuit face of chip communicates with ambient atmosphere through hole system, effectively improves the heat dispersion of chip.
In the present invention's one preferred embodiment, described hole is to be distributed on the inverter circuit face of chip, and its shape can be circular, also can be rectangle or polygon.
In the present invention's one preferred embodiment, described hole is the 20%-30% that the degree of depth is equivalent to chip thickness.
In the present invention's one preferred embodiment, described hole series structure also can be arranged on the injection molding body bottom, helps improving the heat dispersion of substrate.
The present invention has disclosed a kind of novel chip packaging structure, and this novel chip packaging structure is reasonable in design, when guaranteeing the good switching performance of chip and substrate; Given the chip good performance of heat dissipation; And packaging technology is easy to implement, and cost is low, can be used for producing in batches.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation:
Fig. 1 is the structural representation of embodiment of the invention novel chip packaging structure;
Fig. 2 is the vertical view of embodiment of the invention novel chip packaging structure;
The mark of each parts is following in the accompanying drawing: 1, substrate, 2, injection molding body, 3, chip, 4, lead, 5, contact, 6, hole system.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
Fig. 1 is the structural representation of embodiment of the invention novel chip packaging structure; Fig. 2 is the vertical view of embodiment of the invention novel chip packaging structure; This novel chip packaging structure comprises substrate 1, injection molding body 2 and chip 3; It is characterized in that; Described chip 3 is encapsulated by injection molding body 2 with substrate 1; Described chip 3 is positioned at substrate 1 top; Its circuit face is towards substrate 1, and links to each other with contact 5 on the substrate through lead 4, and it is 6 that described injection molding body 2 tops are provided with the hole; The inverter circuit face of chip 3 is 6 to communicate with ambient atmosphere through the hole, effectively improves the heat dispersion of chip 3.
The hole that injection molding body 2 tops are provided with in the novel chip packaging structure of mentioning among the present invention is 6 to be distributed on the inverter circuit face of chip 3, and its shape can be circular, also can be rectangle or polygon; Wherein, the hole is the 20%-30% that 6 the degree of depth is equivalent to chip 3 thickness; Simultaneously, the hole is that 6 structures also can be arranged on injection molding body 2 bottoms, helps improving the heat dispersion of substrate 1.
Chip 3 is connected with substrate 1 through suitable welding procedure, and this welding procedure can be that hot pressing welding, ultrasonic wire bonding method or thermosonic bonding connect method.
The present invention has disclosed a kind of novel chip packaging structure, is characterized in: this novel chip packaging structure is reasonable in design, when guaranteeing the good switching performance of chip and substrate; Given the chip good performance of heat dissipation; And packaging technology is easy to implement, and cost is low, can be used for producing in batches.
The above; It only is the specific embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed; Variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claims were limited.
Claims (4)
1. novel chip packaging structure; This novel chip packaging structure comprises substrate, injection molding body and chip; It is characterized in that; Described chip and substrate are encapsulated by injection molding body, and described chip is positioned at substrate top, and its circuit face is towards substrate; And link to each other with contact on the substrate through lead; Described injection molding body top is provided with hole system, and the inverter circuit face of chip communicates with ambient atmosphere through hole system, effectively improves the heat dispersion of chip.
2. novel chip packaging structure according to claim 1 is characterized in that, described hole is to be distributed on the inverter circuit face of chip, and its shape can be circular, also can be rectangle or polygon.
3. novel chip packaging structure according to claim 2 is characterized in that, described hole is the 20%-30% that the degree of depth is equivalent to chip thickness.
4. novel chip packaging structure according to claim 2 is characterized in that, described hole series structure also can be arranged on the injection molding body bottom, helps improving the heat dispersion of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102916983A CN102347292A (en) | 2011-09-30 | 2011-09-30 | Novel chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102916983A CN102347292A (en) | 2011-09-30 | 2011-09-30 | Novel chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102347292A true CN102347292A (en) | 2012-02-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102916983A Pending CN102347292A (en) | 2011-09-30 | 2011-09-30 | Novel chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102347292A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11251483A (en) * | 1998-03-06 | 1999-09-17 | Hitachi Ltd | Semiconductor device |
| GB2373924A (en) * | 1997-05-17 | 2002-10-02 | Hyundai Electronics Ind | IC device with a metal thermal conductive layer having an opening for evacuating air |
| TW200504968A (en) * | 2003-07-17 | 2005-02-01 | Advanced Semiconductor Eng | Flip chip package for measurable bond lines thickness of thermal interface materials |
| CN2904305Y (en) * | 2006-04-25 | 2007-05-23 | 敦南科技股份有限公司 | Optical motion detecting packaging structure |
| CN101232061A (en) * | 2007-01-22 | 2008-07-30 | 沈育浓 | Luminous source packaging |
-
2011
- 2011-09-30 CN CN2011102916983A patent/CN102347292A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2373924A (en) * | 1997-05-17 | 2002-10-02 | Hyundai Electronics Ind | IC device with a metal thermal conductive layer having an opening for evacuating air |
| JPH11251483A (en) * | 1998-03-06 | 1999-09-17 | Hitachi Ltd | Semiconductor device |
| TW200504968A (en) * | 2003-07-17 | 2005-02-01 | Advanced Semiconductor Eng | Flip chip package for measurable bond lines thickness of thermal interface materials |
| CN2904305Y (en) * | 2006-04-25 | 2007-05-23 | 敦南科技股份有限公司 | Optical motion detecting packaging structure |
| CN101232061A (en) * | 2007-01-22 | 2008-07-30 | 沈育浓 | Luminous source packaging |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120208 |