CN102303200A - Alcohol and water mixed-base cleaning-free soldering flux for wire connection - Google Patents
Alcohol and water mixed-base cleaning-free soldering flux for wire connection Download PDFInfo
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- CN102303200A CN102303200A CN201110234693A CN201110234693A CN102303200A CN 102303200 A CN102303200 A CN 102303200A CN 201110234693 A CN201110234693 A CN 201110234693A CN 201110234693 A CN201110234693 A CN 201110234693A CN 102303200 A CN102303200 A CN 102303200A
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Abstract
The invention discloses an alcohol and water mixed-base cleaning-free soldering flux for wire connection, belonging to the technical field of soldering materials. The soldering flux comprises the raw materials by weight percent: 7.0-15 percent of activating agent, 0.5-2.0 percent of film-forming agent, 0.3-1.8 percent of corrosion inhibitor, 18-35 percent of cosolvent and the balance of deionized water. The soldering flux has the advantages of effectively removing oxides and dirt on the surfaces of various leads or pins and improving assembly adaptability of different components, and has the characteristics of stronger activity, high postwelding quality, full welding spots, no poor soldering or cold soldering, less corrosive residues, no need of cleaning, and long service life.
Description
Technical field
The present invention relates to a kind of scaling powder, relate in particular to a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint, belong to technical field of welding materials.
Background technology
At present, the landscape ornamental color lamp on the market, the overwhelming majority is with twining lead and Light-Emitting Diode through low temperature brazing, the pin of lead and light emitting diode is welded together, producing a kind of color lamp assembly of Len req.These color lamp assemblies can twine in the tree, hang on the wall or other place, after the energising, can send the light and the different bright patterns of formation of different color and lusters, thereby can reach the effect of decorating.
The welding that is used in the prior art between lead and the light emitting diode pin leads is to adopt the semi-automatic soldering of dipping mostly, and the scolder of employing mainly is Sn-0.7Cu or Su-Ag-Cu lead-free solder.But because existing lead-free solder is the wave-soldering welding to printed circuit board (PCB) mostly, used scaling powder also is that the welding that is directed against printed circuit board (PCB) designs; And for being easy to soldering, device leg surface mostly will be passed through zinc-plated or the process special disposal in the printed circuit board (PCB); And printed circuit board pads also need be passed through certain processing, could guarantee welding quality.On the other hand, all possibly there is bigger difference in the many-sided influences such as kind, specification, model and pin material, surface treatment mode, device storage environment and time owing to the used light emitting diode of color lamp assembly; Simultaneously, the winding lead that is mated also possibly have nothing in common with each other, and some is that employing multiply thin copper wire synthesizes one or adopts the sub-thread thin copper wire as one.Therefore, when existing scaling powder adopted the pin leads overlap joint welding of the lead dipped in the mode soldering color lamp assembly and light emitting diode, defectives such as moistening badness, rosin joint and dry joint appearred in regular meeting, make the product qualified rate reduction.
Disclose the low-solid content water-based no-clean scaling powder of a kind of non-volatility organic matter halogen like one Chinese patent application (CN:1843684A), this scaling powder comprises the weight portion of following composition: organic acid organic amine activator: 1.0～4.0; Film forming agent: 0.5～1.0; Wetting agent: 0.03～0.20; Corrosion inhibiter: 0.04～0.10; Water is an amount of.Wherein said organic acid organic amine activator is selected from one or more in malic acid, acetate, glycolic, salicylic acid, butyric acid, succinic acid, glutaric acid, succinic acid amine, monoethanolamine, diethanol amine or the triethanolamine; Described film forming agent is selected from polyethylene glycol oxide, polyacrylamide, D-sorbite or gather-in the N-vinylpyrrolidone one or more; Described corrosion inhibiter is selected from a kind of in BTA, alpha-mercapto benzothiazole or the ethylene glycol phenyl azoles; Described wetting agent is selected from any one in fluorocarbon surfactant, perfluoroalkyl amine, perfluoroalkyl quaternary ammonium salt, perfluoroalkyl betaine, the hexafluoropropene epoxy oligomer.This no-clean scaling powder has overcome use VOC material as existing harm and danger in scaling powder main body solvent and the preparation process; Replace with deionized water; And also more be applicable to the scaling powder that welds on the printed circuit board (PCB) face; But because the activity of each proportioning components in this scaling powder is lower; And specially to printed circuit board (PCB); Specific aim is more intense, the scaling powder of welding when being not suitable for being applied in the lead overlap joint.
Summary of the invention
The present invention is directed to the defective that exists in the above prior art, a kind of pure water mixed base no-clean scaling powder that is used for lead overlap joint is provided, this scaling powder has reasonable mixture ratio between active big, each component, specially to lead overlap joint and pointed strong characteristics.
The objective of the invention is to be achieved through following technical scheme, a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint, this scaling powder comprises the weight portion of following composition:
Activating agent: 7.0%～15%; Film forming agent: 0.5%～2.0%; Corrosion inhibiter: 0.3%～1.8%; Cosolvent: 18%～35%; All the other are deionized water.
Above-mentioned a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint of the present invention; Be to design when being connected the lead lap brazing to different conductor material and surface appearance, light emitting diode pin etc. after under varying environment, depositing specially; This scaling powder has stronger active ingredient; The pH value is between 2.5～3.5; Can effectively remove all kinds of pin oxide on surface and dirt; Improved adaptability, guaranteed enough wetabilitys again the assembly of different components pin.Though the activity of scaling powder of the present invention is stronger; But adopt during owing to lead that has combined color lamp and lead overlap joint and dip the formula soldering; Scolder melting pan temperature is higher; The most of volatilization of active material postwelding; So the postwelding corrosive is less; Need not to clean, can directly lap joint be carried out plastic packaging or packing, can satisfy the welding requirements between the lead and light emitting diode pin in the mini color lamp fully.The mass percent of activating agent has only 1%～4% content in the existing scaling powder, and the quality percentage composition of other component differs also very big, and the welding effect when it is used for lead and lead overlap joint is relatively poor, is unfavorable for actual use.And existing moistening badness when adopting scaling powder of the present invention to overcome available technology adopting lead-free solder wave-soldering to be used for the mode of the dipping soldering lead overlap joint welding of color lamp assembly overlap joint usefulness, be easy to occur defectives such as rosin joint and dry joint and the not high problem of product qualified rate with scaling powder.Advantage such as adopt that scaling powder of the present invention has that solder joint is full, product qualified rate is high, smog is few during welding.
As preferably, above-mentioned a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint, this scaling powder comprises the mass percent of following composition:
Activating agent: 10%～12%; Film forming agent: 0.8%～1.5%; Corrosion inhibiter: 0.5%～1.2%; Cosolvent: 21%～29%; All the other are deionized water.
Above-mentioned a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint, described activating agent comprises one or more in organic acid, organic amine or the surfactant.Adopt above-mentioned organic acid; Organic amine or surfactant have enough helping and weld active; Can effectively remove the oxide of conductive line surfaces; Need not pass through special processing; But also reduced the tension force of metal surface; Increased wetability; Other compositions in conjunction with scaling powder of the present invention; After making lead and light emitting diode pin adopt this scaling powder to dip; Just directly weld and to reach requirement; And under welding temperature; These activating agents can decompose; Distillation or volatilization make noresidue on the solder joint of lead overlap joint back; Do not have corrosion, guaranteed the qualification rate after the lead overlap joint welds.If the amount that activating agent adds is very little, then can make the overall activity of scaling powder on the low side, thereby not reach the qualification of lead overlap joint back solder joint, can produce defectives such as rosin joint or dry joint; If the amount that adds is too much, then can cause the activity of scaling powder strong excessively, increase the corrosivity of postwelding butt welding point, thereby can reduce the quality of product, reduce service life; And within the scope of the invention, both had stronger activity, and having guaranteed the performance of welding, postwelding is also less to the corrosivity of product simultaneously, places after at least 6 months, does not all have the obvious corrosion phenomenon.
As preferably, above-mentioned described organic acid is two or more in succinic acid, glutaric acid, adipic acid or the succinate.Adopt above-mentioned preferred organic acid that metal oxide is had dissolution preferably; Can more effective cleaning lead and the oxide on light emitting diode pin surface; Make and more help welding; Also more help guaranteeing the quality of postwelding product; And adopt these organic acids also to have advantages such as excitant is little; More help the healthy of guarantor, more help production application.
The composite use of above-mentioned organic acid and organic amine; More help improving the performance of scaling powder of the present invention; Because acid with amine neutralization reaction can take place, can be used for regulating the pH value of scaling powder and can reducing the corrosivity that scaling powder just makes to a certain extent through neutralization reaction.In brazing temperature range, can be decomposed into original sour and organic amine performance activity again and work as scaling powder of the present invention, more help welding at machine.As preferably, above-mentioned described organic amine is triethanolamine and/or succinamide.Adopt the interior organic amine of this preferable range to combine other compositions of scaling powder of the present invention; Can make the solder joint after the welding full; More help avoiding occurring rosin joint or dry joint phenomenon, can guarantee to be used for the quality of wire bonds, the service life that helps improving product.If the addition of organic amine is too much, the activity of scaling powder is reduced, be unfavorable for welding; If the addition of organic amine is very few, be unfavorable for equally that then the performance of scaling powder improves, wetting effect is also bad.
Above-mentioned surfactant can reduce the surface tension of molten solder, and surface tension is the principal element that can directly have influence on the infiltration of solder, and the employing surfactant can reduce the surface tension of system, improves the wettability of scaling powder.As preferably, above-mentioned surfactant is one or both among TX-100, the OP-10.Adopt the surfactant in this preferable range to combine with other components of the present invention, it is better to have effect of impregnation may, and postwelding noresidue, Heat stability is good.
Above-mentioned film forming agent can form diaphragm on the solder joint surface and coat solder joint, can prevent that braze and base material are oxidized once more, and film forming agent is general, and only just performance is active under brazing temperature, plays the diaphragm effect.Conventional film forming agent is to adopt polyethylene glycol oxide, polyacrylamide or D-sorbite etc. in the prior art; Adopting these film forming agents mainly is in order more to help the welding of printed circuit board (PCB); And the scaling powder during as color lamp lead and wire bonds, the poor effect of welding.As preferably, above-mentioned film forming agent is the averagemolecular wt amount at 200～600 polyethylene glycol.
Above-mentioned corrosion inhibiter can generate the insoluble polymer precipitation membrane with the metal reaction of plain conductor, can effectively suppress the corrosion that scaling powder produces plain conductor.As preferably, above-mentioned corrosion inhibiter is a nitrogen heterocyclic.Described nitrogen heterocyclic comprises BTA, triethylamine or ethylene glycol phenyl azoles.
As preferably, above-mentioned cosolvent is two or more in diethylene glycol (DEG), isopropyl alcohol or the diethylene glycol butyl ether.Above-mentioned solvent has stronger solvability, and higher volatility can make the active ingredient in the scaling powder dissolve fully, makes the scaling powder performance more stable, and the shelf-life prolongs.
Above-mentioned a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint of the present invention, can adopt following method to prepare:
After the weight portion of all components chosen raw material; Earlier cosolvent and part deionized water are joined in the agitated reactor; And then adding film forming agent; After being stirred to dissolving, add activating agent and corrosion inhibiter and remaining deionized water again, be stirred to all components dissolving; After making mixing of materials evenly; Leave standstill filtration, remove filter residue, gained filtrating promptly gets the pure water mixed base no-clean scaling powder that is used for the lead overlap joint of the present invention.
In sum, the present invention has the following advantages:
1. a kind of pure water mixed base no-clean scaling powder that is used for lead overlap joint of the present invention; Be to weld and custom-designed scaling powder mutually with the pin of light emitting diode to the lead-in wire material (like copper wire or thin wire) of lead specially; Can effectively remove the oxide and the dirt on all kinds of lead-in wires or pin surface; Improved adaptability to the different components assembly; Enough wetabilitys have been guaranteed; Welding back solder joint is full, does not have rosin joint or dry joint phenomenon.
2. a kind of pure water mixed base no-clean scaling powder that is used for lead overlap joint of the present invention; Compare with existing scaling powder, have stronger activity, the pH value reaches between 2.5～3.5; In conjunction with scaling powder of the present invention, well solved because of the strong strong problem of corrosivity of activity.And scaling powder postwelding active material major part of the present invention can both be volatilized, and the postwelding corrosive is less, need not to clean, and the postwelding quality is high long service life.
The specific embodiment
Through specific embodiment, further bright specifically below to technical scheme work of the present invention, but the present invention is not limited to these embodiment.
Following table 1 is the percetage by weight of pure water mixed base no-clean scaling powder composition among the embodiment 1-4.
Table 1:
Following table 2 is percetages by weight of pure water mixed base no-clean scaling powder composition among the embodiment 5-8.
Table 2:
Activating agent described in above-mentioned table 2 embodiment 5 is the mixture of organic acid and organic amine, and the mass percent of described organic acid and organic amine is 3: 1; Described organic acid is adipic acid and succinate, and both mass ratioes are 3: 1; Described organic amine is a succinamide; Described film forming agent is Macrogol 200, PEG400 and Macrogol 600, and three's mass ratio is 1: 3: 2; Described corrosion inhibiter is BTA and triethylamine, and both mass ratioes are 2: 1; Described cosolvent is diethylene glycol (DEG), isopropyl alcohol and diethylene glycol butyl ether, and three's ratio is 2: 3: 2.
Activating agent described in the embodiment 6 is adipic acid, succinate, succinamide and TX-100, and their weight ratio is 1: 3: 2: 1; Described film forming agent is Macrogol 200, Liquid Macrogol and Macrogol 600, and their weight ratio is 3: 1: 2; Described corrosion inhibiter is a BTA; Described cosolvent is diethylene glycol (DEG) and diethylene glycol butyl ether, and both weight ratios are 1: 3.
Activating agent described in the embodiment 7 is a succinamide; Described film forming agent is PEG400 and Macrogol 600, and their weight ratio is 3: 2; Described corrosion inhibiter is the ethylene glycol phenyl azoles; Described cosolvent is the diethylene glycol butyl ether.
Described activating agent described in the embodiment 8 is a succinamide; Described film forming agent is PEG400 and Liquid Macrogol, and their weight ratio is 1: 2; Described corrosion inhibiter is ethylene glycol phenyl azoles and BTA, and both weight ratios are 2: 3; Described cosolvent is diethylene glycol butyl ether and diethylene glycol (DEG), and both weight ratios are 4: 1.
After choosing raw material according to the weight portion of all components among the foregoing description 1-8; Earlier cosolvent and part deionized water are joined in the agitated reactor; And then adding film forming agent; After being stirred to dissolving, add activating agent and corrosion inhibiter and remaining deionized water again, be stirred to all components dissolving; After making mixing of materials evenly; Leave standstill filtration, remove filter residue, gained filtrating is the said pure water mixed base no-clean scaling powder that is used for the lead overlap joint of embodiment of the invention 1-8.
Comparative Examples 1
Disclose the low-solid content water-based no-clean scaling powder of a kind of non-volatility organic matter halogen according to one Chinese patent application (CN:1843684A), be prepared into scaling powder according to the weight portion of the composition of the scaling powder in this patent application.
The scaling powder of scaling powder of picked at random the foregoing description and Comparative Examples 1 adopts the Sn-0.9Cu lead-free solder, and the pin of lead and light emitting diode in the color lamp assembly is welded, and the formula soldering is dipped in the welding manner employing; Described lead adopts the multiply fine copper wire to synthesize one lead, and the material of the pin of described light emitting diode is a copper, and following table 3 is to the performance test results after welding according to the SJ/T11273-20002 standard.
Table 3:
Data from above-mentioned table 3 can find out that scaling powder postwelding non-volatile content of the present invention, physical stability and bronze mirror corrosion test all can reach requirement, and the surface insulation resistance of postwelding is all greater than 1.5 * 10
8More than, the rate of spread also is higher than 75%, and rosin joint, dry joint phenomenon do not appear in the more important postwelding that is, and adopts the phenomenon of scaling powder postwelding rosin joint in the Comparative Examples 1, dry joint more serious, thus the quality of serious phenomenon postwelding product.
Specific embodiment described in the invention only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although the present invention has been made detailed explanation and has quoted some specific embodiments as proof, to those skilled in the art, only otherwise leave that the spirit and scope of the present invention can be done various variations or correction is obvious.
Claims (9)
1. one kind is used for the pure water mixed base no-clean scaling powder that lead overlaps, and it is characterized in that: this scaling powder comprises the mass percent of following composition:
Activating agent: 7.0%～15%; Film forming agent: 0.5%～2.0%; Corrosion inhibiter: 0.3%～1.8%; Cosolvent: 18%～35%; All the other are deionized water.
2. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 1, it is characterized in that: this scaling powder comprises the mass percent of following composition:
Activating agent: 10%～12%; Film forming agent: 0.8%～1.5%; Corrosion inhibiter: 0.5%～1.2%; Cosolvent: 21%～29%; All the other are deionized water.
3. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 1 and 2 is characterized in that: described activating agent is one or more in the activating agent alive of organic acid, organic amine or surface.
4. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 3, it is characterized in that: described organic acid is two or more in succinic acid, glutaric acid, adipic acid or the succinate.
5. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 3, it is characterized in that: described organic amine is triethanolamine and/or succinamide.
6. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 3, it is characterized in that: described surfactant is one or both among TX-100, the OP-10.
7. a kind of pure water mixed base no-clean scaling powder that is used for lead overlap joint according to claim 1 and 2 is characterized in that: described film forming agent is the averagemolecular wt amount at 200～600 polyethylene glycol.
8. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 1 and 2, it is characterized in that: described corrosion inhibiter is a nitrogen heterocyclic.
9. a kind of pure water mixed base no-clean scaling powder that is used for the lead overlap joint according to claim 1 and 2, it is characterized in that: described cosolvent is two or more in diethylene glycol (DEG), isopropyl alcohol or the diethylene glycol butyl ether.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110234693A CN102303200A (en) | 2011-08-16 | 2011-08-16 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
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| CN201110234693A CN102303200A (en) | 2011-08-16 | 2011-08-16 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN106425169A (en) * | 2016-10-11 | 2017-02-22 | 常州市鼎日环保科技有限公司 | Preparation method of easy-to-store and halogen-free scaling powder |
| CN106624463A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Activating agent used for water-based soldering flux and preparing method of activating agent |
| CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
| CN109940311A (en) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | Low-temperature catalytic soldering flux |
| CN112822867A (en) * | 2020-12-31 | 2021-05-18 | 杨亚军 | False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method |
| CN113798732A (en) * | 2021-09-26 | 2021-12-17 | 上海用森电子科技有限公司 | Water-based cleaning-free soldering flux and preparation method thereof |
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
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| CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
| CN1836825A (en) * | 2006-04-21 | 2006-09-27 | 北京工业大学 | Water-soluble soldering flux dedicated for lead-free solder |
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| US5907007A (en) * | 1996-03-19 | 1999-05-25 | Denso Corporation | Soldering flux |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN106425169A (en) * | 2016-10-11 | 2017-02-22 | 常州市鼎日环保科技有限公司 | Preparation method of easy-to-store and halogen-free scaling powder |
| CN106624463A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Activating agent used for water-based soldering flux and preparing method of activating agent |
| CN109940311A (en) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | Low-temperature catalytic soldering flux |
| CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
| CN112822867A (en) * | 2020-12-31 | 2021-05-18 | 杨亚军 | False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method |
| CN113798732A (en) * | 2021-09-26 | 2021-12-17 | 上海用森电子科技有限公司 | Water-based cleaning-free soldering flux and preparation method thereof |
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN116252014B (en) * | 2023-02-11 | 2024-04-19 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
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Application publication date: 20120104 |