CN102296274A - 用于阴极弧金属离子源的屏蔽装置 - Google Patents
用于阴极弧金属离子源的屏蔽装置 Download PDFInfo
- Publication number
- CN102296274A CN102296274A CN2011102369888A CN201110236988A CN102296274A CN 102296274 A CN102296274 A CN 102296274A CN 2011102369888 A CN2011102369888 A CN 2011102369888A CN 201110236988 A CN201110236988 A CN 201110236988A CN 102296274 A CN102296274 A CN 102296274A
- Authority
- CN
- China
- Prior art keywords
- target
- edge
- abschirmblech
- target material
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Physical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011102369888A CN102296274B (zh) | 2011-08-18 | 2011-08-18 | 用于阴极弧金属离子源的屏蔽装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011102369888A CN102296274B (zh) | 2011-08-18 | 2011-08-18 | 用于阴极弧金属离子源的屏蔽装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102296274A true CN102296274A (zh) | 2011-12-28 |
CN102296274B CN102296274B (zh) | 2013-11-27 |
Family
ID=45356948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011102369888A Active CN102296274B (zh) | 2011-08-18 | 2011-08-18 | 用于阴极弧金属离子源的屏蔽装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102296274B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108370655A (zh) * | 2015-12-25 | 2018-08-03 | 株式会社东金 | 电子装置以及电磁干扰抑制体的配置方法 |
CN108456862A (zh) * | 2018-03-13 | 2018-08-28 | 西华大学 | 一种金属离子源及其使用方法 |
CN113374662A (zh) * | 2021-06-29 | 2021-09-10 | 哈尔滨工业大学 | 一种改变中置阴极背景磁场的磁路结构 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1055774A (zh) * | 1991-06-01 | 1991-10-30 | 中国科学院电工研究所 | 大电流多弧斑受控真空电弧蒸发源 |
EP0516425A1 (en) * | 1991-05-29 | 1992-12-02 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Cathodic arc deposition system and a method of controlling same |
US20010035348A1 (en) * | 1998-09-14 | 2001-11-01 | Hans Braendle | Target array for an arc vapor deposition chamber including arc vapor deposition source and target plates thereof |
CN1397660A (zh) * | 2002-04-16 | 2003-02-19 | 北京科技大学 | 无磁屏蔽型铁磁性靶材溅射阴极 |
CN101126152A (zh) * | 2006-08-18 | 2008-02-20 | 深圳豪威真空光电子股份有限公司 | 柱状磁控溅射器 |
CN201158702Y (zh) * | 2008-01-11 | 2008-12-03 | 中国科学院金属研究所 | 一种改善电弧离子镀沉积工艺的动态磁控弧源装置 |
CN101519769A (zh) * | 2009-04-02 | 2009-09-02 | 电子科技大学 | 一种改善磁场分布的平面磁控溅射靶 |
CN101736300A (zh) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | 一种磁控溅射靶 |
CN102071401A (zh) * | 2009-11-25 | 2011-05-25 | 范家秋 | 一种提高利用率的平面磁控溅射靶 |
-
2011
- 2011-08-18 CN CN2011102369888A patent/CN102296274B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0516425A1 (en) * | 1991-05-29 | 1992-12-02 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Cathodic arc deposition system and a method of controlling same |
CN1055774A (zh) * | 1991-06-01 | 1991-10-30 | 中国科学院电工研究所 | 大电流多弧斑受控真空电弧蒸发源 |
US20010035348A1 (en) * | 1998-09-14 | 2001-11-01 | Hans Braendle | Target array for an arc vapor deposition chamber including arc vapor deposition source and target plates thereof |
CN1397660A (zh) * | 2002-04-16 | 2003-02-19 | 北京科技大学 | 无磁屏蔽型铁磁性靶材溅射阴极 |
CN101126152A (zh) * | 2006-08-18 | 2008-02-20 | 深圳豪威真空光电子股份有限公司 | 柱状磁控溅射器 |
CN201158702Y (zh) * | 2008-01-11 | 2008-12-03 | 中国科学院金属研究所 | 一种改善电弧离子镀沉积工艺的动态磁控弧源装置 |
CN101736300A (zh) * | 2008-11-19 | 2010-06-16 | 中国科学院沈阳科学仪器研制中心有限公司 | 一种磁控溅射靶 |
CN101519769A (zh) * | 2009-04-02 | 2009-09-02 | 电子科技大学 | 一种改善磁场分布的平面磁控溅射靶 |
CN102071401A (zh) * | 2009-11-25 | 2011-05-25 | 范家秋 | 一种提高利用率的平面磁控溅射靶 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108370655A (zh) * | 2015-12-25 | 2018-08-03 | 株式会社东金 | 电子装置以及电磁干扰抑制体的配置方法 |
CN108456862A (zh) * | 2018-03-13 | 2018-08-28 | 西华大学 | 一种金属离子源及其使用方法 |
CN113374662A (zh) * | 2021-06-29 | 2021-09-10 | 哈尔滨工业大学 | 一种改变中置阴极背景磁场的磁路结构 |
CN113374662B (zh) * | 2021-06-29 | 2022-03-04 | 哈尔滨工业大学 | 一种改变中置阴极背景磁场的磁路结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102296274B (zh) | 2013-11-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
RU2557078C2 (ru) | Устройство генерирования электронного луча | |
US4673477A (en) | Controlled vacuum arc material deposition, method and apparatus | |
KR20140143352A (ko) | 여과된 음극 아크 증착 장치 및 방법 | |
US9911576B2 (en) | Ion bombardment apparatus and method for cleaning of surface of base material using the same | |
JPH0510422B2 (zh) | ||
CN112831759A (zh) | 一种磁场辅助阴极引弧装置及镀膜方法 | |
CN102296274B (zh) | 用于阴极弧金属离子源的屏蔽装置 | |
CN102260850A (zh) | 一种少液滴电弧靶及带少液滴电弧靶的等离子涂层系统 | |
JP3315114B2 (ja) | スパッター被覆処理を実施する方法及びスパッター被覆装置 | |
EP2482303B1 (en) | Deposition apparatus and methods | |
JP2008053116A (ja) | イオンガン、及び成膜装置 | |
US20080105657A1 (en) | Macroparticle-filtered coating plasma source device | |
CN111893440B (zh) | 电弧离子镀膜装置 | |
RU2607398C2 (ru) | Способ нанесения покрытий путем плазменного напыления и устройство для его осуществления | |
JP2012164677A (ja) | イオンガン、及び成膜装置 | |
RU2699765C1 (ru) | Аксиальная электронная пушка | |
RU2740146C1 (ru) | Ионный источник (ионная пушка) | |
RU2601725C1 (ru) | Источник металлической плазмы (варианты) | |
CN214655208U (zh) | 一种磁场辅助阴极引弧装置 | |
RU2098512C1 (ru) | Вакуумно-дуговой источник плазмы | |
JP6744694B1 (ja) | 表面改質装置および表面改質方法 | |
CN109267018B (zh) | 一种快速等离子体镀膜方法及装置 | |
RU196889U1 (ru) | Управляемый разрядник | |
CN108770176B (zh) | 一种大型低压高效高束流直流空心阴极源 | |
RU2180472C2 (ru) | Вакуумно-дуговой источник плазмы |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Yang Yiwei Inventor after: Wang Qiongxian Inventor after: Ye Jun Inventor before: Yang Huisheng |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: YANG HUISHENG TO: YANG YIWEI WANG QIONGXIAN YE JUN |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
DD01 | Delivery of document by public notice |
Addressee: Beijing Applied Plasma Tech. Co.,Ltd. Document name: Notification of an Office Action |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230609 Address after: Room 326, Floor 3, Building 1, No. 8 Jinfu Road, Daxing District Economic Development Zone, Beijing 102600 Patentee after: Beijing Praseodymium Malichi Technology Co.,Ltd. Address before: Room A-409, No. 10 Xinghuo Road, Fengtai Science City, Fengtai District, Beijing 100076 Patentee before: Beijing Applied Plasma Tech. Co.,Ltd. |