CN102281144A - Passive m2m embedded module - Google Patents
Passive m2m embedded module Download PDFInfo
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- CN102281144A CN102281144A CN201110170182A CN201110170182A CN102281144A CN 102281144 A CN102281144 A CN 102281144A CN 201110170182 A CN201110170182 A CN 201110170182A CN 201110170182 A CN201110170182 A CN 201110170182A CN 102281144 A CN102281144 A CN 102281144A
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Abstract
The invention provides a passive M2M (Machine to Machine) embedded module. The passive M2M embedded module comprises an antenna, a single logic chip and a package, wherein the package comprises a package main body, one end of the package main body is provided with a printed circuit board, the antenna is inlaid on the printed circuit board, the other end of the package main body is provided with an interface, and the single logic chip is respectively connected with the antenna and the interface; the single logic chip comprises a rectifying unit, a power management unit, a modulation-demodulation unit, a clock unit, a codec and logic control unit, a serial interface unit and a power supplying unit; the rectifying unit is connected with the antenna, the power management unit is connected with the rectifying unit, and the codec and logic control unit is connected with the power management unit; the power supplying unit is connected with the power management unit; the modulation-demodulation unit and the clock unit are respectively connected with the antenna, and the modulation-demodulation unit, the clock unit and the serial interface unit are respectively connected with the codec and logic control unit. The passive M2M embedded module is powered based on a radio frequency technology, so that the passive M2M embedded module is low in power consumption, needs no external power and has strong applicability.
Description
Technical field
The present invention relates to wireless communication field, relate in particular to a kind of passive M2M flush bonding module.
Background technology
M2M is the abbreviation of Machine-to-Machine/Man, is a kind of technology of communicating by letter whenever and wherever possible between machinery equipment and the machinery equipment of can realizing.It as the access means, connects into network with various machinery equipments with radio communication by at the inner wireless communication module that embeds of machinery equipment, makes machinery equipment possess communication and network capabilities.The M2M technology is with the core of machinery equipment terminal as intelligent interaction, the support and the service of networking are provided, make these machinery equipment terminals " intelligence " more, thereby create abundant application, for the client provides comprehensive informatization resolve scheme, to satisfy the information system requirement of client to aspects such as monitoring, command scheduling, data acquisition and measurements.
At present the M2M technology is widely used in fields such as traffic, logistics, medical treatment, forms Small Area Wireless Communication Networks between machinery equipment terminal and the machinery equipment terminal, this network based on agreement comprise wifi, bluetooth, Zigbee and ultra broadband etc.In these application networks, the machinery equipment terminal transmit power is big, communication distance is long, therefore, existing M2M technology power consumption is bigger, and the wireless communication module that embeds machine device end inside must rely on external power source that the operation actuating force is provided, in the occasion that can't connect external power source, existing M2M technology can't be used.
Summary of the invention
The object of the present invention is to provide a kind of passive M2M flush bonding module, utilize the radio-frequency technique power supply, low in energy consumption, applicability is strong.
To achieve the above object, the invention provides a kind of passive M2M flush bonding module, comprise antenna, single logic chip and encapsulation, described encapsulation comprises package main body, one end of described package main body is provided with printed circuit board (PCB), and described antenna is embedded on this printed circuit board (PCB), and the other end of described package main body is provided with interface, described single logic chip is arranged on the described package main body, and is connected with described interface with described antenna respectively.
Above-mentioned passive M2M flush bonding module, wherein, described single logic chip comprises rectification unit, Power Management Unit, modem module, clock unit, encoding and decoding and logic control element, serial interface unit and power supply unit; Described rectification unit is connected with described antenna, and described Power Management Unit is connected with described rectification unit, and described encoding and decoding and logic control element are connected with described Power Management Unit; Described power supply unit is connected with described Power Management Unit, and described power supply unit is used to connect external devices, is the external devices power supply; Described modem module is connected with described antenna respectively with clock unit, and described modem module, clock unit and serial interface unit are connected with described encoding and decoding and logic control element respectively, and described serial interface unit is used to connect external mechanical equipment.
Above-mentioned passive M2M flush bonding module, wherein, described single logic chip also comprises non-volatile memory cells, described non-volatile memory cells is connected with described encoding and decoding and logic control element.
Above-mentioned passive M2M flush bonding module, wherein, described interface is the metal stamp hole.
Above-mentioned passive M2M flush bonding module, wherein, described antenna is low-frequency antenna, high frequency antenna or ultra-high frequency antenna.
Above-mentioned passive M2M flush bonding module, wherein, the speed of described serial interface unit transmission signals equals the speed of described antenna transmission signal.
Passive M2M flush bonding module of the present invention utilizes antenna to obtain carrier energy that the external wireless transceiver the sends out operation actuating force as this module, therefore, passive M2M flush bonding module of the present invention does not need external power source, applicable to the occasion that can't connect external power source, make that the range of application of passive M2M flush bonding module of the present invention is more extensive; Passive M2M flush bonding module of the present invention adopts the core of short distance passive RF technology as radio communication, and when need not to communicate by letter, this module does not require the expenditure of energy fully, greatly reduces power consumption, has saved energy;
The antenna of passive M2M flush bonding module of the present invention can be low-frequency antenna, high frequency antenna or ultra-high frequency antenna, the shape of antenna, structure can design accordingly and adjust according to applied frequency difference, have strengthened the portability of passive M2M flush bonding module;
The components and parts that passive M2M flush bonding module of the present invention comprises seldom, production cost is low;
Passive M2M flush bonding module of the present invention is simple in structure, adopts the miniaturization encapsulation, and volume is small and exquisite, can save the shared space of passive M2M flush bonding module;
Passive M2M flush bonding module of the present invention adopts the metal stamp hole to be connected with external devices with external mechanical equipment when encapsulation, is convenient to the fixed installation of passive M2M flush bonding module, and helps the area of appropriate design external mechanical equipment.
Description of drawings
Passive M2M flush bonding module of the present invention is provided by following embodiment and accompanying drawing.
Fig. 1 is the schematic diagram of the passive M2M flush bonding module of the present invention.
Fig. 2 is the structural representation of single logic chip embodiment one among the present invention.
Fig. 3 is the electrical schematics of the passive M2M flush bonding module of the present invention.
Fig. 4 is the structural representation of single logic chip embodiment two among the present invention.
Embodiment
Below with reference to Fig. 1～Fig. 4 passive M2M flush bonding module of the present invention is described in further detail.
Embodiment one:
Referring to Fig. 1, the passive M2M flush bonding module of present embodiment comprises antenna 100, single logic chip 200 and encapsulation;
Described encapsulation comprises a package main body 300, one end of described package main body 300 is provided with printed circuit board (PCB), described antenna 100 is embedded on this printed circuit board (PCB), the other end of described package main body 300 is provided with interface 310, described single logic chip 200 is arranged on the described package main body 300, between described antenna 100 and described interface 310, be connected with described interface 310 with described antenna 100 respectively;
Described antenna 100 is used to receive signal and the energy that the radio frequency place of external wireless transceiver sends, the radiofrequency field of external wireless transceiver can be low frequency, high frequency or hyperfrequency, the shape of described antenna 100, structure can design accordingly and adjust according to applied frequency difference, have strengthened the portability of described passive M2M flush bonding module;
In the present embodiment, described interface 310 is the metal stamp hole, and its profile is an arc groove, adopts metal stamp hole mode to be connected with external mechanical equipment, be convenient to the fixed installation of the passive M2M flush bonding module of present embodiment, and help the area of appropriate design external mechanical equipment;
Preferably, described package main body 300 is rectangular;
The components and parts that the passive M2M flush bonding module of present embodiment comprises are (antenna and a logic chip) seldom, and production cost is low;
The passive M2M flush bonding module of present embodiment is simple in structure, adopts the miniaturization encapsulation, and volume is small and exquisite, can save the shared space of described passive M2M flush bonding module.
Fig. 2 is the structural representation of single logic chip 200 described in the present embodiment, and described single logic chip 200 comprises rectification unit 201, Power Management Unit 202, modem module 203, clock unit 204, encoding and decoding and logic control element 205, serial interface unit 206 and power supply unit 207;
Described rectification unit 201 is connected with described antenna 100, described Power Management Unit 202 is connected with described rectification unit 201, described encoding and decoding and logic control element 205 are connected with described Power Management Unit 202, described power supply unit 207 is connected with described Power Management Unit 202, and described power supply unit 207 is used for being connected with external devices;
The energy that the radio frequency place of the external wireless transceiver that described antenna 100 receives sends is for exchanging, can not directly use, need through relevant treatment, described rectification unit 201 is a direct current with AC rectification, described Power Management Unit 202 comprises voltage stabilizing circuit and protective circuit, the direct voltage of described rectification unit 201 outputs becomes behind the pressure stabilization function of described Power Management Unit 202 can direct applied voltage, is described passive M2M flush bonding module power supply;
When the electric energy that provides when described Power Management Unit 202 has surplus, described Power Management Unit 202 can also be powered for external devices, the electric energy that described Power Management Unit 202 provides is the external devices power supply by described power supply unit 207, experiment shows, described power supply unit 207 can provide a small voltage for external devices, and this makes the application of described passive M2M flush bonding module more flexible;
Described modem module 203 is connected with described antenna 100 respectively with clock unit 204, described modem module 203, clock unit 204 and serial interface unit 206 respectively with described encoding and decoding and logic control element 205, described serial interface unit 206 is used to connect external mechanical equipment;
Described modem module 203 comprises demodulation part and modulating part; Described demodulation part receives digital modulation signals (the external wireless transceiver sends out) from described antenna 100, and this digital modulation signals carried out demodulation, the output digital baseband signal, the digital baseband signal of described demodulation part output delivers to described encoding and decoding again and logic control element 205 carries out decoding processing, and the signal after described encoding and decoding and logic control element 205 decoding processing sends to external mechanical equipment by described serial interface unit 206; The signal that external mechanical equipment sends is transferred to described encoding and decoding and logic control element 205 by described serial interface unit 206, carry out encoding process by described encoding and decoding and logic control element 205, the output digitally encoded signal, the digitally encoded signal of described encoding and decoding and logic control element 205 outputs transfers to described modulating part, carry out amplitude modulation(PAM) (amplification) by described modulating part, the output modulation signal, the modulation signal of output sends to the external wireless transceiver by described antenna 100;
Described encoding and decoding and logic control element 205 adopt corresponding code encoding/decoding mode according to applied carrier wave frequency range, make it meet the desired related protocol standard of less radio-frequency end;
Described encoding and decoding and logic control element 205 are used to decode, encode and as the control hinge of whole module;
The speed of described serial interface unit 206 transmission signals equals the speed of described antenna 100 transmission signals, described serial interface unit 206 can be the communication bus standards of using always such as SPI, 12C, only needs a pair of transmission line or increase by a clock lines more just can realize two-way communication.
The passive M2M flush bonding module of present embodiment utilizes antenna to obtain carrier energy that the external wireless transceiver the sends out operation actuating force as this module, therefore, passive M2M flush bonding module of the present invention does not need external power source, applicable to the occasion that can't connect external power source, make that the range of application of passive M2M flush bonding module of the present invention is more extensive; Passive M2M flush bonding module of the present invention adopts the core of passive RF technology as radio communication, and communication distance is short, and when need not to communicate by letter, this module does not require the expenditure of energy fully, greatly reduces power consumption, has saved energy.
Figure 3 shows that the electrical schematics of the passive M2M flush bonding module of present embodiment, described single logic chip 200 is connected with described antenna 100 and described interface 310 by pin, as shown in Figure 3, described single logic chip 200 comprises a plurality of pins, wherein, first pin two 11, second pin two 12, three-prong 213, the 4th pin two 14 is connected with an interface 310 respectively with the 5th pin two 15, with described first pin two 11, second pin two 12, the interface 310 that three-prong 213 is connected with the 4th pin two 14 forms serial line interface, be used to connect external mechanical equipment, the interface 310 that is connected with described the 5th pin two 15 forms power supply interface, be used to connect external devices, the 6th pin two 16 is connected with described antenna 100 with the 7th pin two 17, and the 8th pin is an earth terminal.
The passive M2M flush bonding module of present embodiment also can connect external power source, and at this moment, described Power Management Unit 202 is connected with external power source, and whether described Power Management Unit 202 can be used for detecting external power source and exist.
Embodiment two:
Embodiment two is with the difference of embodiment one, in embodiment two, described single logic chip 200 also comprises non-volatile memory cells 208, described non-volatile memory cells 208 is connected with described encoding and decoding and logic control element 205, described non-volatile memory cells 208 is used to store data, by the data in described serial interface unit 206 and the described antenna 100 addressable described non-volatile memory cells 208.
Claims (6)
1. passive M2M flush bonding module, it is characterized in that, comprise antenna, single logic chip and encapsulation, described encapsulation comprises package main body, one end of described package main body is provided with printed circuit board (PCB), and described antenna is embedded on this printed circuit board (PCB), and the other end of described package main body is provided with interface, described single logic chip is arranged on the described package main body, and is connected with described interface with described antenna respectively.
2. passive M2M flush bonding module as claimed in claim 1, it is characterized in that described single logic chip comprises rectification unit, Power Management Unit, modem module, clock unit, encoding and decoding and logic control element, serial interface unit and power supply unit;
Described rectification unit is connected with described antenna, and described Power Management Unit is connected with described rectification unit, and described encoding and decoding and logic control element are connected with described Power Management Unit;
Described power supply unit is connected with described Power Management Unit, and described power supply unit is used to connect external devices, is the external devices power supply;
Described modem module is connected with described antenna respectively with clock unit, and described modem module, clock unit and serial interface unit are connected with described encoding and decoding and logic control element respectively, and described serial interface unit is used to connect external mechanical equipment.
3. passive M2M flush bonding module as claimed in claim 1 is characterized in that described single logic chip also comprises non-volatile memory cells, and described non-volatile memory cells is connected with described encoding and decoding and logic control element.
4. passive M2M flush bonding module as claimed in claim 1 is characterized in that described interface is the metal stamp hole.
5. passive M2M flush bonding module as claimed in claim 1 is characterized in that described antenna is low-frequency antenna, high frequency antenna or ultra-high frequency antenna.
6. passive M2M flush bonding module as claimed in claim 1 is characterized in that the speed of described serial interface unit transmission signals equals the speed of described antenna transmission signal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110170182A CN102281144A (en) | 2011-06-21 | 2011-06-21 | Passive m2m embedded module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110170182A CN102281144A (en) | 2011-06-21 | 2011-06-21 | Passive m2m embedded module |
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Citations (6)
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| CN101388238A (en) * | 2007-09-10 | 2009-03-18 | 群联电子股份有限公司 | Flash storage chip an flash array storage system |
| CN101666878A (en) * | 2009-07-09 | 2010-03-10 | 天津大学 | Passive RFID positioning method and system for improving signal to noise ratio and positioning accuracy |
| CN101834623A (en) * | 2010-05-05 | 2010-09-15 | 四川九洲电器集团有限责任公司 | M2m communication device |
| CN101833686A (en) * | 2010-04-30 | 2010-09-15 | 天津大学 | Semi-active label |
| CN202094910U (en) * | 2011-06-21 | 2011-12-28 | 上海华申智能卡应用系统有限公司 | Passive machine-to-machine (M2M) embedded module |
-
2011
- 2011-06-21 CN CN201110170182A patent/CN102281144A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060063026A (en) * | 2004-12-07 | 2006-06-12 | 이정환 | M2m prepaid payment system |
| CN101388238A (en) * | 2007-09-10 | 2009-03-18 | 群联电子股份有限公司 | Flash storage chip an flash array storage system |
| CN101666878A (en) * | 2009-07-09 | 2010-03-10 | 天津大学 | Passive RFID positioning method and system for improving signal to noise ratio and positioning accuracy |
| CN101833686A (en) * | 2010-04-30 | 2010-09-15 | 天津大学 | Semi-active label |
| CN101834623A (en) * | 2010-05-05 | 2010-09-15 | 四川九洲电器集团有限责任公司 | M2m communication device |
| CN202094910U (en) * | 2011-06-21 | 2011-12-28 | 上海华申智能卡应用系统有限公司 | Passive machine-to-machine (M2M) embedded module |
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Application publication date: 20111214 |