CN102221568B - 一种双端固支梁室温瓦斯传感器 - Google Patents
一种双端固支梁室温瓦斯传感器 Download PDFInfo
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- CN102221568B CN102221568B CN 201110077880 CN201110077880A CN102221568B CN 102221568 B CN102221568 B CN 102221568B CN 201110077880 CN201110077880 CN 201110077880 CN 201110077880 A CN201110077880 A CN 201110077880A CN 102221568 B CN102221568 B CN 102221568B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 125000006850 spacer group Chemical group 0.000 claims description 18
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 23
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000007084 catalytic combustion reaction Methods 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
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- 230000035945 sensitivity Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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CN 201110077880 CN102221568B (zh) | 2011-03-30 | 2011-03-30 | 一种双端固支梁室温瓦斯传感器 |
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CN 201110077880 CN102221568B (zh) | 2011-03-30 | 2011-03-30 | 一种双端固支梁室温瓦斯传感器 |
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CN102221568A CN102221568A (zh) | 2011-10-19 |
CN102221568B true CN102221568B (zh) | 2013-03-06 |
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CN 201110077880 Expired - Fee Related CN102221568B (zh) | 2011-03-30 | 2011-03-30 | 一种双端固支梁室温瓦斯传感器 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103472097B (zh) * | 2013-09-26 | 2015-05-13 | 中国矿业大学 | 一种可回收重复制备的微瓦斯传感器及其制备方法 |
CN104316574B (zh) * | 2014-10-31 | 2017-06-16 | 中国矿业大学 | 一种基于单个加热元件的甲烷传感器及制备方法和应用 |
CN104316576B (zh) * | 2014-10-31 | 2017-05-31 | 中国矿业大学 | 基于硅加热器的mems甲烷传感器及其制备方法与应用 |
CN109239137B (zh) * | 2018-09-17 | 2019-12-06 | 中国矿业大学 | 一种微型甲烷传感器及甲烷检测方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101034077A (zh) * | 2006-11-29 | 2007-09-12 | 电子科技大学 | 一种压电晶体气体传感器及其制备方法 |
CN101153825A (zh) * | 2006-09-25 | 2008-04-02 | 中国计量学院 | 硅微机械谐振式微压传感器芯片的结构及制造方法 |
CN101936937A (zh) * | 2010-07-06 | 2011-01-05 | 电子科技大学 | 一种微悬臂梁气体传感器及其制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2001061336A1 (de) * | 2000-02-16 | 2001-08-23 | Siemens Aktiengesellschaft | Erzeugnis umfassend ein piezoelektrisches substrat |
US7388701B2 (en) * | 2005-12-26 | 2008-06-17 | Samsung Electro-Mechanics Co., Ltd. | Optical modulator |
KR100849466B1 (ko) * | 2007-01-31 | 2008-07-30 | 포항공과대학교 산학협력단 | 미세 압전 외팔보 센서 및 이를 위한 발진회로 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101153825A (zh) * | 2006-09-25 | 2008-04-02 | 中国计量学院 | 硅微机械谐振式微压传感器芯片的结构及制造方法 |
CN101034077A (zh) * | 2006-11-29 | 2007-09-12 | 电子科技大学 | 一种压电晶体气体传感器及其制备方法 |
CN101936937A (zh) * | 2010-07-06 | 2011-01-05 | 电子科技大学 | 一种微悬臂梁气体传感器及其制作方法 |
Non-Patent Citations (3)
Title |
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江丙友等.瓦斯检测传感器概述.《山西焦煤科技》.2008,(第05期),第4-6页. * |
王锡明等.具有激振和测振的新型压电微悬臂梁设计.《复旦学报(自然科学版)》.2010,第49卷(第06期),第674-680、695页. * |
韩建强等.电热激励微谐振器及谐振式传感器.《微纳电子技术》.2002,(第08期),第31-35页. * |
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Inventor after: Ma Hongyu Inventor after: Ding Enjie Inventor after: Wang Wenjuan Inventor after: Zhao Xiaohu Inventor after: Wang Gang Inventor after: Hu Qingsong Inventor after: Cheng Tingting Inventor before: Ma Hongyu Inventor before: Ding Enjie Inventor before: Zhang Weidong |
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Free format text: CORRECT: INVENTOR; FROM: MA HONGYU DING ENJIE ZHANG WEIDONG TO: MA HONGYU DING ENJIE WANG WENJUAN ZHAO XIAOHU WANG GANG HU QINGSONG CHENG TINGTING |
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Address after: 221116 No. 1 University Road, copper mountain, Jiangsu, Xuzhou Patentee after: China University of Mining & Technology Address before: 221116 science and Technology Department, China University of Mining and Technology, Sanhuan South Road, Xuzhou, Jiangsu Patentee before: China University of Mining & Technology |
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