CN102221146A - High condition and heat dissipation light-emitting device and manufacturing method thereof - Google Patents
High condition and heat dissipation light-emitting device and manufacturing method thereof Download PDFInfo
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- CN102221146A CN102221146A CN2011100881509A CN201110088150A CN102221146A CN 102221146 A CN102221146 A CN 102221146A CN 2011100881509 A CN2011100881509 A CN 2011100881509A CN 201110088150 A CN201110088150 A CN 201110088150A CN 102221146 A CN102221146 A CN 102221146A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to a high condition and heat dissipation light-emitting device and a manufacturing method thereof. The method is characterized by coating a material with a boron nitride ingredient on the surface of a base plate of a seat body unit, thus a coating layer is formed; coating low-temperature silver on the coating layer to form a conductive layer after drying and stoving process operation; and pasting a plurality of light-emitting elements on the conductive layer. The device is simple to manufacture through the method, because damage of the light-emitting elements caused by high-temperature welding can be avoided without the welding means, further the manufacturing cost can be lowered effectively, and the manufactured light-emitting device even has high conduction and heat dissipation efficacies.
Description
Technical field
The invention relates to a kind of light-emitting device and manufacture method thereof, be meant a kind of high heat-dissipating luminous device and manufacture method thereof led especially.
Background technology
Consult Fig. 1, by the applicant was before applied for and disclosed tw Taiwan No. 201037222 " high-power LED illuminating device " patent case, described case be disclose a kind of with light-emittingdiode (LED) as the luminous radiator structure 1 of the existing street lamp of light source, the luminous radiator structure 1 of described street lamp includes the framework 11 that is U type body without exception and has an accommodation space 111, be positioned at more than one described framework 11 accommodation space 111 and with the fixed head 12 of described framework 11 Joints (because of the view angular relationship, only show one among the figure), a plurality ofly be arranged at conductive projection 13 on the described fixed head 12 (because of the view angular relationship, only show one among the figure), and a plurality of individual light-emittingdiodes 14 (, only showing among the figure) that place on each described fixed head 12 that are connected with because of the view angular relationship.Wherein, described framework 11 and described conductive projection 13 between have an adhesive-layer 131, a graphite linings 132 and a heat conduction glue-line 133 in regular turn.The central wall 112 of described framework 11 outwards convexes with a plurality of radiating fins 113 at interval.Be interval with a plurality of perforates 121 (because of the view angular relationship on each described fixed head 12, only show one among the figure), and the corresponding in twos solder joint 122 that is arranged at each perforate 121 adjacent side place, and each described fixed head 12 and electrically connect with an electric power supply apparatus (figure does not show).And each conductive projection 13 is to be embedded to place each described perforate 121 place.In addition, each light-emittingdiode 14 has two pins 141, and each light-emittingdiode 14 that the position is set is just corresponding with a conductive projection 13, the described pin 141 of each light-emittingdiode 14 also is connected with each solder joint 122 that is positioned at corresponding conductive projection 13 adjacent sides by the welding means, contacts by this each light-emittingdiode 14 and with corresponding conductive projection 13.
In the use, the described heat that waits light-emittingdiode 14 operation to be produced is to see through the described conductive projection 13 that waits to be passed to fixed head 12, framework 11, and then disperse by radiating fin 113, as everyone knows, too much conduction interface is because of interface material difference, the thermal conductivity factor difference, can cause heat radiation to be difficult for, radiating efficiency is low, though radiating fin 113 can allow area of dissipation strengthen, but heat energy can't conduct effectively, so light-emittingdiode 14 takes place often because of overheated situation of damaging.
In addition, because the composition member of the existing luminous radiator structure 1 of street lamp is more, element cost height, must be dependent on the welding means because of the fixing of light-emittingdiode 14 again, if the lacking experience of welding procedure personnel, not only manufacture process is slow, also as easy as rolling off a log because of weld interval long, cause light-emittingdiode 14 to burn because of welding high temperature for a long time, the luminous radiator structure 1 of therefore existing street lamp exists to be made and the high problem of maintenance cost.
Summary of the invention
In view of this, a purpose of the present invention promptly is to provide a kind of light-emitting device that height is led radiating efficiency that has.
Another object of the present invention then is to provide a kind of manufacture method of light-emitting device, not only make simple and direct, and because of light-emitting component needn't see through the welding means, the high temperature in the time of avoiding welding and electroluminescent element is damaged, and then can effectively reduce manufacturing cost.
So height of the present invention is led heat-dissipating luminous device and is comprised a pedestal unit, a coating layer, a conductive layer, at least one light-emitting component, and a power supply unit;
Described pedestal unit has a substrate, and a plurality of radiating fin that is arranged at intervals at the same surface of described substrate;
Described coating layer is a surface that is arranged at described substrate;
Described conductive layer is to be arranged on the described coating layer and to be formed with an electrical circuit;
Described light-emitting component is sticking being arranged on the described conductive layer, and is connected with described electrical circuit;
Described power supply unit is that the electrical circuit with described conductive layer electrically connects.
Described coating layer is to be made of the material coating with boron nitride component, and described conductive layer is to be formed by the low-temperature silver coating, and forms described electrical circuit by mode of printing.
Described light-emitting component is a light-emittingdiode, and has two pins, and described pin is that described conductive layer is fixed in adhesion.
Described power supply unit is circumscribed with at least one conductor wire that electrically connects in order to the electrical circuit with described conductive layer, and the terminal parallel connection of described conductor wire is provided with a metal brace; In addition, described substrate is provided with at least one through hole, and at least one and described through hole is positioned on the same axis and the depressed area that communicates with described through hole, described coating layer and described conductive layer do not cover described depressed area and described through hole, described brace is to be arranged on the described conductive layer also can cover described depressed area, tie depressed area and described through hole and then the lock knot location that part runs through described brace, described substrate by a lock, so that the electrical circuit of the conductor wire of described power supply unit and described conductive layer electrically connects.
Manufacture method as for light-emitting device of the present invention comprises:
(a) purchase a pedestal unit and at least one light-emitting component, described pedestal unit has a substrate, and a plurality of radiating fin that is arranged at intervals at the same surface of described substrate;
(b) on a surface of described substrate, form a coating layer with material coating with boron nitride component;
(c) carry out drying and oven dry processing operation;
(d) coating one conductive layer on described coating layer;
(e) be arranged on the described conductive layer described light-emitting component is sticking.
The thickness of described coating layer is greater than 10 μ m.
In step (c), be the pedestal unit that has coating layer to be placed under the room temperature environment carried out drying at least 2 hours, insert a baking box again, toasted at least 10 minutes down at 100 ℃ to 400 ℃.
In step (d), be coated with described conductive layer after, and further insert a baking box, 150 ℃ to 300 ℃ bakings at least 10 minutes down.
Described light-emitting component is light-emittingdiode and has two pins, in step (d), form described conductive layer after, on described conductive layer, form an electrical circuit by mode of printing again; In addition, in step (e), described light-emitting component is to be connected with described electrical circuit; In addition, described substrate is provided with at least one through hole, and at least one and described through hole is positioned on the same axis and the depressed area that communicates with described through hole, and described coating layer and described conductive layer do not cover described depressed area and described through hole.
Also comprising a step (f) after the step (e), in this step, is that the sticking pedestal unit that is provided with described light-emitting component is cured processing, so that described light-emitting component is fixedly set on the described pedestal unit.
Effect of the present invention is to reduce integral member and uses, heat conduction efficiency is good, manufacturing and assembling operation are simple and direct, and because of light-emitting component needn't see through the welding means, avoid light-emitting component to damage because of welding high temperature, thereby can effectively reduce defective products incidence and manufacturing cost, so made light-emitting device and have height and lead radiating efficiency.
Description of drawings
The present invention is further illustrated to utilize accompanying drawing below, but the embodiment in the accompanying drawing does not constitute any limitation of the invention.
Fig. 1 is the structure of tw Taiwan No. 201037222 " high-power LED illuminating device " patent case.
Fig. 2 is the flow chart of method for producing light-emitting device of the present invention.
Fig. 3 is the stereogram that height of the present invention is led first preferred embodiment of heat-dissipating luminous device.
Fig. 4 is the side view that height of the present invention is led first preferred embodiment of heat-dissipating luminous device.
Fig. 5 is the upward view that height of the present invention is led first preferred embodiment of heat-dissipating luminous device.
Fig. 6 is VI-VI hatching cutaway view of Fig. 5.
Fig. 7 is the structural representation that height of the present invention is led second preferred embodiment of heat-dissipating luminous device.
Include among Fig. 1 to Fig. 7:
2 pedestal unit, 3 light-emitting components
21 substrates, 31 pins
211 through holes, 4 power supply units
212 depressed areas, 41 road electric wires
22 fins, 42 braces
23 side plates, 6 lock knot parts
24 gaps, 7 pads
25 coating layers, 26 conductive layers.
The specific embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to two graphic preferred embodiments, can clearly present.
Seeing Fig. 2, is the preferred embodiment that height of the present invention is led the manufacture method of heat-dissipating luminous device, and described manufacture method includes step 900～905.
See Fig. 3 and Fig. 4, at first in step 900, be to purchase a pedestal unit 2 earlier to reach to a plurality of light-emitting components 3, pedestal unit 2 has a substrate 21, a plurality of radiating fin 22 that is arranged at intervals at described substrate 21 same surfaces (being the bottom surface of illustrated angle), and two side plates 23 that are located at interval at substrate 21 two opposite sides respectively and are connected with radiating fin 22.
What deserves to be mentioned is that in first preferred embodiment, the quantity that is provided with of light-emitting component 3 is a plurality of, can certainly be only to have one, should be as limit, in addition, the material of pedestal unit 2 does not limit, so long as the good material of dispelling the heat can be used.
See Fig. 6, substrate 21 is provided with at least one through hole 211, and at least one depressed area 212, through hole 211 is to do explanation with two with the quantity of depressed area 212 in the present embodiment, and each through hole 211 and each depressed area 212 are to be positioned on the same axis and to communicate with each other, through hole 211 is to do explanation to be the screw form, but not as limit.In addition, each side plate 23 defines respectively with substrate 21 two opposite sides and is formed with a gap 24.As for each light-emitting component 3 is to do explanation with light-emittingdiode in the present embodiment, but should be as limit, and each light-emitting component 3 all has two pins 31.
In step 901, be to form a coating layer 25 with material coating with boron nitride component in substrate 21 another opposed surface (being the end face of illustrated angle), the thickness of coating layer 25 is more than the 10 μ m, then can't pass through the voltage-withstand test of direct current more than 2000 volts if be lower than 10 μ m thickness.
In step 902, be the pedestal unit 2 that has coating layer 25 to be placed under the room temperature environment carried out drying at least 2 hours, insert a baking box again, toasted at least 10 minutes down at 100 ℃ to 400 ℃.
Afterwards, in step 903, the coating low-temperature silver and utilizes mode of printing to form an electrical circuit (figure does not show) on conductive layer 26 constituting a conductive layer 26 on coating layer 25 again, then inserts a baking box, descends to toast at least 10 minutes at 150 ℃ to 300 ℃.At this, it should be noted that the material of described conductive layer 26 is not exceeded with low-temperature silver, can certainly use other conductive material, should be as limit.
In step 904, light-emitting component 3 is placed on the conductive layer 26 at interval, and utilize sticker to be arranged at the predetermined position of conductive layer 26 and to be connected described pin of each of light-emitting component 3 31 is sticking with electrical circuit.Wherein, sticker is to adopt AB glue.
In step 905, the sticking pedestal unit 2 that is provided with light-emitting component 3 is cured processing at last,, so promptly finishes the manufacturing that height is led heat-dissipating luminous device so that light-emitting component 3 is fixedly set on the pedestal unit 2.At this, it should be noted that the means that curing is handled have a variety of, for example drying or the like is quickened in natural air drying or intensification, should be as limit.
Reduce by the not only required element of this manufacture method, and the overall operation flow process is more simple and direct, needn't see through the welding means because of light-emitting component 3 again, more can avoid light-emitting component 3 to damage because of welding high temperature, can effectively reduce the defective products incidence, in addition on manufacturing operation, also needn't excessively be dependent on the manpower of tool rich experiences, reduce and comprise element, required manufacturing cost such as artificial.
See Fig. 3 and Fig. 4, the present invention comprises a pedestal unit 2, a coating layer 25, a conductive layer 26, a plurality of light-emitting component 3 by first preferred embodiment by the made light-emitting device of said method, and a power supply unit 4 (seeing Fig. 5).Wherein, pedestal unit 2 has a substrate 21, and a plurality of radiating fin 22 that is arranged at intervals at substrate 21 same surfaces.Coating layer 25 is at least one surfaces of being coated substrate 21 by the material with boron nitride component.In this preferred embodiment, conductive layer 26 is to be coated on the coating layer 25 by low-temperature silver, and printing is formed with an electrical circuit (figure does not show).In addition, light-emitting component 3 is sticking at interval being located on the conductive layer 26, and is connected with electrical circuit.
It should be noted at this, in this preferred embodiment, though coating layer 25 only is arranged on the surface of substrate 21, during actual enforcement, also can be to coat on the whole pedestal unit 2, is not limited to the disclosed surface of this preferred embodiment.
See Fig. 5 and Fig. 6, power supply unit 4 is circumscribed with two conductor wires 41 that electrically connect in order to the electrical circuit with described conductive layer 25, conductor wire 41 terminal parallel connections are provided with a metal brace 42, brace 42 generally is the Y-shaped demihull shape, in combination, be that each brace 42 is placed on the conductive layer 26, and be corresponding up and down with each the described depressed area 212 on being arranged at substrate 21, and utilize two pads 7 to fill up respectively to place on each brace 42, run through corresponding pad 7 respectively with two lock knot parts 6 that are the bolt form again, brace 42, the depressed area 212 of substrate 21, and then with through hole 211 screw locks location so that the electrical circuit of the conductor wire 41 of power supply unit 4 and conductive layer 26 electrically connects.What specify is, as previously mentioned, through hole 211 does not exceed to be the screw form, also can not establish internal thread, at this moment, 6 of parts of lock knot are to include the nut that a bolt and sets mutually relatively, utilize the depressed area 212 and through hole 211 of bolt-through brace 42, substrate 21, cooperate nut to be screwed together on the bolt, can make the conductor wire 41 of power supply unit 4 be combined on the conductive layer 26 equally and constitute to electrically connect with electrical circuit by substrate 21 opposite sides.
See Fig. 4 and Fig. 5, in the use, provide TRT required electric power of when running by power supply unit 4, see through being electrically conducted of electrical circuit of conductive layer 26, make that light-emitting component 3 is shinny, can also simultaneously provide the effect of light reflection by the conductive layer 26 that low-temperature silver constituted this moment, thereby can realize the illuminating effect of high brightness.In addition, the heat that is produced in the light-emitting component 3 shinny processes also can see through conductive layer 26, coating layer 25 and then be dispersed by substrate 21, side plate 23 and radiating fin 22 such as described, provides high efficiency radiating effect by this.
See Fig. 7, lead second preferred embodiment of heat-dissipating luminous device for height of the present invention, second preferred embodiment and described first preferred embodiment are roughly the same, something in common repeats no more, different heres are, described plurality of radiating fins 22 is to be formed on the outer peripheral face of substrate 21, and be to be provided with three light-emitting components 3 on the substrate 21, also described as first preferred embodiment, the quantity of light-emitting component 3 is not as limit, and second preferred embodiment provides another height to lead the enforcement aspect of heat-dissipating luminous device.
In sum, the not only required element of black box of the present invention and manufacture method reduces, and the overall operation flow process is more simple and direct, be adhesively fixed because of light-emitting component 3 again, needn't see through the welding means, more can avoid light-emitting component 3 to damage, effectively reduce the defective products incidence because of welding high temperature, also needn't excessively be dependent on the manpower of tool rich experiences, can effectively reduce really and comprise element, required manufacturing cost such as artificial.In addition, made light-emitting device can make brightness of illumination more promote by the effect of light reflection is provided by the conductive layer 26 that low-temperature silver constituted in the use.The heat that is produced in the light-emitting component 3 shinny processes also can see through conductive layer 26, coating layer 25 and then be dispersed by substrate 21, side plate 23 and radiating fin 22, provides high efficiency radiating effect by this, so can reach the purpose of the invention described above.
The above, only be two preferred embodiments of the present invention, when not limiting scope of the invention process with this, promptly the simple equivalent of being done according to the present patent application claim and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.
Claims (10)
1. lead heat-dissipating luminous device for one kind high, comprising:
One pedestal unit has a substrate, and a plurality of radiating fin that is arranged at intervals at the same surface of described substrate;
One coating layer is coated at least one surface of described substrate;
One conductive layer is coated on the described coating layer, and is formed with an electrical circuit at described coating layer;
At least one light-emitting component, sticking being arranged on the described conductive layer, and be connected with described electrical circuit;
One power supply unit is with the electrical circuit electric connection of described conductive layer.
2. height according to claim 1 is led heat-dissipating luminous device, it is characterized in that: described coating layer is to be made of the material coating with boron nitride component, and described conductive layer is to be formed by the low-temperature silver coating, and forms described electrical circuit by mode of printing.
3. height according to claim 1 is led heat-dissipating luminous device, it is characterized in that: described light-emitting component is a light-emittingdiode, and has two pins, and described pin is that described conductive layer is fixed in adhesion.
4. height according to claim 2 is led heat-dissipating luminous device, it is characterized in that: described power supply unit is circumscribed with at least one conductor wire that electrically connects in order to the electrical circuit with described conductive layer, and the terminal parallel connection of described conductor wire is provided with a metal brace; In addition, described substrate is provided with at least one through hole, and at least one and described through hole is positioned on the same axis and the depressed area that communicates with described through hole, described coating layer and described conductive layer do not cover described depressed area and described through hole, described brace is to be arranged on the described conductive layer also can cover described depressed area, tie depressed area and described through hole and then the lock knot location that part runs through described brace, described substrate by a lock, so that the electrical circuit of the conductor wire of described power supply unit and described conductive layer electrically connects.
5. the manufacture method of a high-radiating light-emitting device comprises:
(a) purchase a pedestal unit and at least one light-emitting component, described pedestal unit has a substrate, and a plurality of radiating fin that is arranged at intervals at the same surface of described substrate;
(b) form a coating layer on a surface of described substrate with material coating with boron nitride component;
(c) carry out drying and oven dry processing operation;
(d) coating one conductive layer on described coating layer;
(e) be arranged on the described conductive layer described light-emitting component is sticking.
6. the manufacture method of high-radiating light-emitting device according to claim 5 is characterized in that: the thickness of described coating layer is greater than 10 μ m.
7. according to the manufacture method of claim 5 or 6 described high-radiating light-emitting devices, it is characterized in that: in step (c), be the pedestal unit that has coating layer to be placed under the room temperature environment carried out drying at least 2 hours, insert a baking box again, toasted at least 10 minutes down at 100 ℃ to 400 ℃.
8. the manufacture method of high-radiating light-emitting device according to claim 7 is characterized in that: in step (d), be coated with described conductive layer after, and further insert a baking box, 150 ℃ to 300 ℃ bakings at least 10 minutes down.
9. the manufacture method of high-radiating light-emitting device according to claim 8, it is characterized in that: described light-emitting component is light-emittingdiode and has two pins, in step (d), form described conductive layer after, on described conductive layer, form an electrical circuit by mode of printing again; In addition, in step (e), described light-emitting component is to be connected with described electrical circuit; In addition, described substrate is provided with at least one through hole, and at least one and described through hole is positioned on the same axis and the depressed area that communicates with described through hole, and described coating layer and described conductive layer do not cover described depressed area and described through hole.
10. the manufacture method of high-radiating light-emitting device according to claim 9, it is characterized in that: also comprise a step (f) after the step (e), in this step, be to glue the pedestal unit that is provided with described light-emitting component to be cured processing, so that described light-emitting component is fixedly set on the described pedestal unit.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100881509A CN102221146A (en) | 2011-04-08 | 2011-04-08 | High condition and heat dissipation light-emitting device and manufacturing method thereof |
| PCT/CN2011/072653 WO2012136007A1 (en) | 2011-04-08 | 2011-04-12 | Light emitting device with high conductive heat dissipation and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100881509A CN102221146A (en) | 2011-04-08 | 2011-04-08 | High condition and heat dissipation light-emitting device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102221146A true CN102221146A (en) | 2011-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100881509A Pending CN102221146A (en) | 2011-04-08 | 2011-04-08 | High condition and heat dissipation light-emitting device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102221146A (en) |
| WO (1) | WO2012136007A1 (en) |
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| CN102724805A (en) * | 2012-06-19 | 2012-10-10 | 田宝祥 | Composite ceramic substrate with characteristics of high heat radiation and high heat conduction |
| CN102724806A (en) * | 2012-06-19 | 2012-10-10 | 田宝祥 | Method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity |
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| CN107829089A (en) * | 2017-12-15 | 2018-03-23 | 福建工程学院 | A kind of coating production on diode radiating substrate surface |
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| CN201549488U (en) * | 2009-09-30 | 2010-08-11 | 广东德豪润达电气股份有限公司 | Metal substrate, radiating component and semiconductor device provided with radiating component |
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| EP2644990A3 (en) * | 2012-03-26 | 2013-11-13 | Toshiba Lighting&Technology Corporation | Lighting unit and lighting device |
| US9194568B2 (en) | 2012-03-26 | 2015-11-24 | Toshiba Lighting & Technology Corporation | Lighting unit and lighting device |
| CN102724805A (en) * | 2012-06-19 | 2012-10-10 | 田宝祥 | Composite ceramic substrate with characteristics of high heat radiation and high heat conduction |
| CN102724806A (en) * | 2012-06-19 | 2012-10-10 | 田宝祥 | Method for manufacturing circuit substrates and circuit boards with high heat dissipation and high heat conductivity |
| CN107829089A (en) * | 2017-12-15 | 2018-03-23 | 福建工程学院 | A kind of coating production on diode radiating substrate surface |
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| WO2012136007A1 (en) | 2012-10-11 |
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