CN102185085A - High-power LED (Light Emitting Diode) encapsulating bracket - Google Patents
High-power LED (Light Emitting Diode) encapsulating bracket Download PDFInfo
- Publication number
- CN102185085A CN102185085A CN2011101127059A CN201110112705A CN102185085A CN 102185085 A CN102185085 A CN 102185085A CN 2011101127059 A CN2011101127059 A CN 2011101127059A CN 201110112705 A CN201110112705 A CN 201110112705A CN 102185085 A CN102185085 A CN 102185085A
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- substrate
- insulating panel
- base
- encapsulating
- external electrodes
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Abstract
The invention discloses a high-power LED (Light Emitting Diode) encapsulating bracket which comprises a base, wherein a positioning frame for forming an LED chip encapsulating region is fixed on the base and consists of a lower layer substrate and an upper layer insulating panel; the substrate is made of a printed circuit board; the surface of the substrate is provided with circuits for forming internal and external electrodes and connecting the internal and external electrodes; and the insulating panel covers a substrate surface except a region where the internal and the external electrodes are formed. The substrate and the insulating panel are convenient to manufacture, the size and the appearance of the encapsulating bracket can be adjusted as required without any special mold, high generality is achieved, and the manufacturing cost can be lowered. Moreover, a uniform-temperature plate can be taken as the base, so that high heat conducting capability is achieved.
Description
Technical field
The present invention relates to a kind of high-capacity LED package support.
Background technology
When LED industrial prospect a slice was good, high-power LED light source became the focus of everybody concern at present.Its encapsulation process roughly is divided into following a few step: Gu crystalline substance, bonding wire, dot fluorescent powder, covering.Therefore as the main element in the light source manufacturing process, package support plays crucial effects, and in order to guarantee carrying out smoothly of above-mentioned several procedures, it must possess following function: 1. the base as supporting role is arranged; 2. contain the functional areas that chip attach and welding position are provided; And there is certain indent degree of depth functional areas, and the interface that combines with glue is provided; 3. support integral body can be born the above high temperature of 150 degree at least; 4. can provide electric pathway smoothly, guarantee that light source is connected with circuit external; 5. thermoelectric the separation.The package support that generally uses in the market, base big more options copper base or ceramic base, with copper base package support is example, it comprises the silver-plated substrate in bottom, the location frame of being made by the PPA plastics, as the parts such as metal clips of electrode, substrate surface has several through holes, form location frame by through hole injection PPA material and at substrate surface with certain altitude and shape, as the metal clips of electrode by in the pre-buried location frame that is embedded in moulding.The package support advantage of this structure is that operability is good, and shortcoming is the package support complex manufacturing technology, and versatility is poor, and location size of frame and shape are subjected to the injection mold restriction and unadjustable.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art part, a kind of high-capacity LED package support is provided, have and make simply, the characteristics that the size of location frame and shape are easily regulated.
For achieving the above object, the present invention has adopted following technical scheme: it comprises base, be fixed with the location frame that is used for packaging LED chips on the base, the location frame is provided with the interior electrode that is electrically connected with led chip, the external electrode that is electrically connected with external circuit, described location frame is by laminar substrate and upper strata insulating panel are formed down, described substrate is made by printed circuit board, substrate surface has and is used for the circuit that forms inside and outside electrode and connect inside and outside electrode, and insulating panel covers and removes the substrate surface that forms inside and outside electrode zone.Substrate and insulating panel can be fixed on the base by bonding or gum or pressing mode, and substrate and insulating panel are easy to make, and its size and shape can be adjusted as required, do not need particular manufacturing craft, and versatility is good, can reduce manufacturing cost.
The base material of described substrate and insulating panel can be glass mat, or other substrate for printed circuit board.
Described base can adopt temperature-uniforming plate.Special capillary structure is contained in its inside, and the capacity of heat transmission is better than copper base and ceramic substrate greatly, and the temperature-uniforming plate moderate cost, does not increase product cost.
As shown from the above technical solution, substrate of the present invention and insulating panel can be fixed on the base by bonding or gum or pressing mode, and substrate and insulating panel are easy to make, its size and shape can be adjusted as required, do not need particular manufacturing craft, versatility is good, can reduce manufacturing cost.And can adopt temperature-uniforming plate as base, the capacity of heat transmission is good, with 100W integrated optical source is example, 4000h bad light under the normal temperature, continue to light the 1000h light decay below 2% under 45 ℃, 85%RH environment, and traditional copper substrate 100WLED integrated optical source before, the down aging 1000h light decay of normal temperature is about 10%.
Description of drawings
Fig. 1 is a vertical view of the present invention;
Fig. 2 is the A-A line cut-away view of Fig. 1;
Fig. 3 is the printed circuit board (PCB) vertical view;
Fig. 4 is the insulating panel vertical view.
Embodiment
As shown in Figure 1 and Figure 2, the present invention is made up of the location frame that is used to form the led chip packaging area on base 1 and the firm banking, the location frame is by laminar substrate 3 and upper strata insulating panel 2 are formed down, all have square opening 35,21 in the middle of substrate 3 and the insulating panel 2, the zone that substrate 3 square openings 35 are surrounded on base 1 is the led chip packaging area, can encapsulate a plurality of led chips.Insulating panel 2 adopts glass mat or other substrate for printed circuit board, such as the flexible circuit plate substrate.Substrate 3 is a printed circuit board, there is the circuit 36,37 that is formed by copper film that is used for forming inside and outside electrode and connects inside and outside electrode on substrate 3 square openings, 35 both sides and surface, top, the insulating panel top has the through hole 22 that forms external electrode, square opening 21 width in the middle of the insulating panel 2 are greater than the width of square opening 35 in the middle of the substrate 3, when insulating panel 2 covers substrate 3 surfaces, electrode 33,34 in the exposed copper film in insulating panel 2 square openings 21 both sides forms, the exposed copper film in insulating panel 2 top through holes 22 places forms external electrode 31,32 and forms.Insulating panel 2 through holes 22 both sides also are provided with the symbol 23,24 that shows the positive and negative attribute of electrode.
Claims (3)
1. high-capacity LED package support, comprise base (1), be fixed with the location frame that is used to form the led chip packaging area on the base (1), the location frame is provided with the interior electrode (33 that is electrically connected with led chip, 34), the external electrode (31 that is electrically connected with external circuit, 32), it is characterized in that: described location frame is by laminar substrate (3) and upper strata insulating panel (2) are formed down, described substrate (3) is made by printed circuit board, in substrate (3) surface is used for forming, in external electrode and the connection, the circuit (36 of external electrode, 37), insulating panel (2) covers and removes in the formation, the substrate in external electrode zone (3) surface.
2. high-capacity LED package support according to claim 1 is characterized in that: the base material of described substrate (3) and insulating panel (2) are glass mat.
3. high-capacity LED package support according to claim 1 and 2 is characterized in that: described base (1) is a temperature-uniforming plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101127059A CN102185085A (en) | 2011-05-03 | 2011-05-03 | High-power LED (Light Emitting Diode) encapsulating bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101127059A CN102185085A (en) | 2011-05-03 | 2011-05-03 | High-power LED (Light Emitting Diode) encapsulating bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102185085A true CN102185085A (en) | 2011-09-14 |
Family
ID=44571216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101127059A Pending CN102185085A (en) | 2011-05-03 | 2011-05-03 | High-power LED (Light Emitting Diode) encapsulating bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102185085A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543983A (en) * | 2011-12-09 | 2012-07-04 | 安徽莱德光电技术有限公司 | LED integrated light source |
| CN102738320A (en) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | Packaging framework |
| CN102734698A (en) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | LED (light-emitting diode) street lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6686218B2 (en) * | 2001-03-15 | 2004-02-03 | Opto Tech Corporation | Method for packaging a high efficiency electro-optics device |
| CN1534355A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Assembly for lighting device, lighting device, back side lighting device and display |
| CN1697204A (en) * | 2005-05-31 | 2005-11-16 | 李锋 | Support of light emitting diode and preparation method |
| CN201428999Y (en) * | 2009-07-06 | 2010-03-24 | 杨振行 | Big power LED road lamp |
| JP2010080464A (en) * | 2008-09-24 | 2010-04-08 | C I Kasei Co Ltd | Plastic package, method of manufacturing the same, and light-emitting device |
| CN202013884U (en) * | 2011-05-03 | 2011-10-19 | 安徽莱德光电技术有限公司 | High power light-emitting diode (LED) packing support |
-
2011
- 2011-05-03 CN CN2011101127059A patent/CN102185085A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6686218B2 (en) * | 2001-03-15 | 2004-02-03 | Opto Tech Corporation | Method for packaging a high efficiency electro-optics device |
| CN1534355A (en) * | 2003-04-01 | 2004-10-06 | ������������ʽ���� | Assembly for lighting device, lighting device, back side lighting device and display |
| CN1697204A (en) * | 2005-05-31 | 2005-11-16 | 李锋 | Support of light emitting diode and preparation method |
| JP2010080464A (en) * | 2008-09-24 | 2010-04-08 | C I Kasei Co Ltd | Plastic package, method of manufacturing the same, and light-emitting device |
| CN201428999Y (en) * | 2009-07-06 | 2010-03-24 | 杨振行 | Big power LED road lamp |
| CN202013884U (en) * | 2011-05-03 | 2011-10-19 | 安徽莱德光电技术有限公司 | High power light-emitting diode (LED) packing support |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543983A (en) * | 2011-12-09 | 2012-07-04 | 安徽莱德光电技术有限公司 | LED integrated light source |
| CN102738320A (en) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | Packaging framework |
| CN102734698A (en) * | 2011-12-09 | 2012-10-17 | 安徽莱德光电技术有限公司 | LED (light-emitting diode) street lamp |
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Application publication date: 20110914 |