A kind of electroluminescent electronic device casing
Technical field
The present invention relates to a kind of electronic device casing structure, relate in particular to a kind of shell structure of electricity (field) photoluminescence electronic installation, belong to surface decoration technique field.
Background technology
Along with popularizing of electronic installation, user is more and more higher to the appearance requirement of case of electronic device.The product of electricity (field) photoluminescence appearance is more and more subject to consumer's favor, traditional electricity (field) photoluminescence case of electronic device utilizes in-mould injection method to make, and makes the structure of its On current, method be: 1. on material, leave a conductive lead wire mat and be connected with external electric energy; 2. reserved firing point on plastics.All there is defect in these two kinds of versions, the interference that the conductive lead wire staying is easily subject to external environment produces short circuit, and on plastics, reserved firing point leaves vestige in product appearance, affects exterior quality.
Summary of the invention
Technical problem to be solved by this invention is to overcome defect of the prior art, and a kind of housing of electricity (field) photoluminescence electronic installation is provided, and avoids outer and stays the conductive lead wire phenomenon that causes short circuit affected by environment, has good exterior quality.
For solving the problems of the technologies described above, the invention provides a kind of electroluminescent electronic device casing, comprise a base layer and be formed at the thin layer on base layer, described thin layer forms the extexine of this electroluminescent electronic device casing, it is characterized in that, the one side of described thin layer is provided with the conducting wire that electroluminescence coating and at least 2 layers can be communicated with conduction, and described thin layer and described base layer are by in-mould injection moulding.
Described conducting wire is provided with intercommunicating pore, in described intercommunicating pore, is filled with conductive materials.
Described conductive materials or be glue, or be ink, or be other conductive materials of easily filling.
Described electroluminescence coating and described conducting wire are located between described thin layer and described base layer.
After in-mould injection moulding, described conducting wire is coated by described base layer, and described base layer is provided with can be by the transmission hole of described conducting wire and outside electric connection.
Described base layer is plastics.
The beneficial effect that the present invention reaches: the shell structure of electricity of the present invention (field) photoluminescence electronic installation is simple, and bulk material conductiving point is not affected by external environment, is difficult for damaging, and increases the life-span, appearance looks elegant, and quality is good.
Accompanying drawing explanation
Fig. 1 is electroluminescent electronic device casing one embodiment schematic diagram of the present invention;
Fig. 2 is electroluminescent electronic device casing conductive structure schematic diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.Following examples are only for technical scheme of the present invention is more clearly described, and can not limit the scope of the invention with this.
As depicted in figs. 1 and 2, a kind of electroluminescent electronic device casing of the present invention comprises base layer 7, thin layer 1, the one side of thin layer 1 is provided with electroluminescence coating 2 or 2 and 2 layers of conducting wire 3,4 of electroluminescence coating, on 2 layers of conducting wire 3,4, same position place is provided with intercommunicating pore 5, in intercommunicating pore 5, be filled with conductive materials 6, can be by 2 layers of conducting wire, 3,4 electric connections.Electroluminescence coating 2 and conducting wire 3,4 are located between thin layer 1 and base layer 7.Base layer is plastic material, by in-mould injection method, in injection moulding die cavity, the thin layer 1 with electricity (field) photoluminescence coating 2, conducting wire 4 and plastics is imbedded to ejaculation and makes electricity (field) photoluminescence case of electronic device.After in-mould injection moulding, conducting wire 3,4, can be by conducting wire 3,4 and outside electric connection by the transmission hole 8 of establishing on plastics by plastic overmold.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the technology of the present invention principle; can also make some improvement and distortion, these improvement and distortion also should be considered as protection scope of the present invention.