CN102131043B - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN102131043B CN102131043B CN2010103004171A CN201010300417A CN102131043B CN 102131043 B CN102131043 B CN 102131043B CN 2010103004171 A CN2010103004171 A CN 2010103004171A CN 201010300417 A CN201010300417 A CN 201010300417A CN 102131043 B CN102131043 B CN 102131043B
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- image sensing
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- 235000012431 wafers Nutrition 0.000 claims abstract description 42
- 238000003384 imaging method Methods 0.000 claims abstract description 29
- 238000003491 array Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
- H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Image Input (AREA)
- Studio Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides a camera module. The camera module comprises an image sensing wafer array, a lens array and a light through hole array which are arranged from the image side to the object side in sequence and a storage, a distance sensor and an image processor which are electrically connected with each other, wherein the image sensing wafer array comprises a plurality of image sensing wafers which are arranged continuously; each image sensing wafer comprises a plurality of pixels; the lens array comprises a plurality of lenses; the light through hole array comprises a plurality of light through holes; each light through hole forms an imaging unit with the corresponding lens and image sensing wafer; the predetermined object distance is stored in the storage; when the object distance during taking a photo is more than or equal to the predetermined object distance, each imaging unit can shoot the whole object to be shot; the distance sensor is used for sensing the object distance during taking a photo; the relative positions between each imaging unit and the object to be shot are different, so the imaging points of the object to be shot by the different imaging units are different; and the image processor is used for superposing the images respectively formed by the imaging units to compose an image.
Description
Technical field
The present invention relates to a kind of camera module.
Background technology
Resolution is to weigh the important indicator of the image quality of camera module, and it is used for the ability that expression camera module records the details of object, and the quantity with the vertical pixel of quantity * of the pixels across of the interior image sensor of this camera module represents usually.Such as: 640*480, just expression laterally has 640 pixels, and 480 pixels are vertically arranged.Object is comprised of numerous imaging point, and the camera module is taken the process of imaging to object, is exactly that each interior pixel of image sensing wafer is carried out imaging to an imaging point corresponding on object.Due to the limited amount of pixel in each image sensing wafer, therefore can not photograph each imaging point on object, cause object as actual be discontinuous, but the resolving ability of human eye is limited, what cause the object seen similarly is continuous.For the identical image sensor of photosensitive area, pixel is more, and the imaging point that just can photograph object is just more, and resolution is just larger.Because high-resolution image sensing wafer price comparison is expensive, therefore how to utilize the image sensing wafer of low resolution to take the emphasis that high-resolution image becomes people's research.
Summary of the invention
In view of this, be necessary the camera module that provides a kind of resolution high.
A kind of camera module, it comprises from an image sensing wafer array that is arranged in order to the thing side as side, a lens arra, a light hole array and a mutual image processor, a memory, distance sensing device that is electrically connected to.Described image sensing wafer array comprises a plurality of image sensing wafers of arranging continuously, and each image sensing wafer has included a plurality of pixels.Described lens arra comprises a plurality of and described image sensing wafer lens one to one.Described light hole array comprises and each lens a plurality of light holes one to one.Each light hole is used for making light to enter corresponding lens.Each light hole and lens corresponding with it, an image sensing wafer form an image-generating unit.Store a predetermined object distance in described memory, if the object distance of taking pictures during more than or equal to predetermined object distance, each image-generating unit can both photograph whole object.Described distance sensing device is used for the sensing object distance of taking pictures, and during more than or equal to predetermined object distance, makes the camera module begin to take in the described object distance of taking pictures.Therefore because each image-generating unit is different from the relative position of object, the imaging point of the taken object of different image-generating units is different.A plurality of images that described image processor is used for a plurality of image-generating units are formed respectively carry out point-to-point stack, synthetic piece image, therefore the quantity of the imaging point of this camera module object that can photograph is exactly the quantity sum of the taken imaging point of each image-generating unit, makes the resolution of this camera module high.
camera module of the present invention, at the focal length of taking pictures during more than or equal to predetermined focal distance, each image-generating unit all can photograph whole object, because the position of the imaging point in the captured image of each image-generating unit is different, therefore the imaging point of the taken object of each image-generating unit is different, after the formed image of each image-generating unit is carried out point-to-point stack, the quantity of the imaging point of the object that this camera module can photograph is actual is exactly the quantity sum of the taken imaging point of each image-generating unit, make the resolution of this camera module high, thereby realize making high-resolution camera module with the image sensing wafer array of low resolution.
Description of drawings
Fig. 1 is the schematic diagram of the camera module of better embodiment of the present invention;
Fig. 2 is the exploded view of the camera module of Fig. 1;
Fig. 3 is the functional block diagram of the camera module of Fig. 1;
Fig. 4 is the cutaway view of escapement of the camera module of Fig. 1.
The main element symbol description
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Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
See also Fig. 1 to Fig. 3, be a kind of camera module 100 that embodiment of the present invention provides, it comprises from an Image sensor apparatus 10 of sequentially arranging to the thing side as side, filter arrays 20, escapement 30, lens arra 40, a light transmission unit 50.Described camera module 100 also comprises a memory 60 of mutual electrical connection, a distance sensing device 70, an image processor 90.
As shown in Figure 2, described Image sensor apparatus 10 comprises a substrate 11 and is positioned at the image sensing wafer array 12 of the center of described substrate 11.Described image sensing wafer array 12 comprises a plurality of orthohexagonal image sensing wafers 121 that are cellular and arrange continuously.Each image sensing wafer 121 has included a plurality of pixels.Be appreciated that each image sensing wafer 121 for regular hexagon and be honeycomb arrangement, can make described image sensing wafer 121 arrange closelyr.
Described filter arrays 20 comprises a plurality of orthohexagonal filters 21, is used for infrared light is filtered, and prevents that infrared light from entering in described camera module 100, affects image quality.In the present embodiment, described filter 21 is regular hexagon.
As Fig. 2 and shown in Figure 4, described escapement 30 offers a plurality of and each image sensing wafer 121 through hole 31 one to one for platy structure and along the optical axis direction of described camera module 100.Each through hole 31 is used for an accommodating filter 21.Each through hole 31 comprises the first relative end face 311 and the second end face 312.Described the first end face 311 is towards described image sensing wafer array 12, the second end faces 312 towards described lens arra 40.Described the first end face 311 and the second end face 312 are regular hexagon.And the area of described the first end face 311 is greater than the area of described the second end face 312.The area of the area of each the first end face 311 and each image sensing wafer 121 is roughly the same, and the distance between the first end face 311 of adjacent through-holes 31 is almost nil, thereby the coupling part that can be between the first end face 311 of avoiding adjacent through-holes 31 impacts the optical property of each image sensing wafer 121.
Described lens arra 40 comprises the lens 41 of the corresponding setting of a plurality of and described image sensing wafer 121.Each lens 41 is the circumscribed circle of the second end face 312 of a corresponding through hole 31 towards the surface of described escapement 30, thereby makes each lens 41 can cover the second end face 312 of corresponding through hole 31.
As shown in Figure 3, store a predetermined object distance in described memory 60, if the object distance of taking pictures during more than or equal to predetermined object distance, each image-generating unit can both photograph whole object.Described distance sensing device 70 is used for the sensing object distance of taking pictures, and during more than or equal to predetermined object distance, makes camera module 100 begin to take in the described object distance of taking pictures.
Described image processor 90 is electrically connected to each image sensing wafer 121, and the image that is used for each image-generating unit is formed respectively carries out point-to-point stack, synthetic piece image.Be appreciated that, because the position of the different relative objects of image-generating unit is different, therefore when taking same object, the imaging point of the object that different image-generating units is taken is different, after the formed image of each image-generating unit is carried out point-to-point stack, the quantity of the imaging point of the object that this camera module 100 can photograph is exactly the quantity sum of the taken imaging point of each image-generating unit, makes the resolution of this camera module high.
camera module of the present invention, at the focal length of taking pictures during more than or equal to predetermined focal distance, each image-generating unit all can photograph whole object, because the position of the imaging point in the captured image of each image-generating unit is different, therefore the imaging point of the taken object of each image-generating unit is different, after each image is carried out point-to-point the stack, the quantity of the imaging point of the object that this camera module can photograph is actual is exactly the quantity sum of the taken imaging point of each image-generating unit, make the resolution of this camera module high, thereby realize making high-resolution camera module with the image sensing wafer array of low resolution.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of claim of the present invention.
Claims (5)
1. camera module, it comprises from an image sensing wafer array that is arranged in order to the thing side as side, a lens arra, a light hole array and an image processor, a memory, a distance sensing device of mutually being electrically connected to; Described image sensing wafer array comprises a plurality of image sensing wafers of arranging continuously, and each image sensing wafer comprises a plurality of pixels; Described lens arra comprises a plurality of and each image sensing wafer lens one to one; Described light hole array comprises a plurality of and each lens light hole one to one; Each light hole is used for making light to enter corresponding lens; Each light hole and lens corresponding with it, an image sensing wafer form an image-generating unit; Predetermined object distance of storage in described memory, if the object distance of taking pictures during more than or equal to predetermined object distance, each image-generating unit can both photograph whole object; Described distance sensing device is used for the sensing object distance of taking pictures, and during more than or equal to predetermined object distance, makes the camera module begin to take in the described object distance of taking pictures; Therefore because each image-generating unit is different from the relative position of object, the imaging point of the taken object of different image-generating units is different; The image that described image processor is used for a plurality of image-generating units are formed respectively carries out point-to-point stack, synthetic piece image, therefore the quantity of the imaging point of this camera module object that can photograph is exactly the quantity sum of the taken imaging point of each image-generating unit, makes the resolution of this camera module high.
2. camera module as claimed in claim 1, is characterized in that, each image sensing wafer is the regular hexagon structure.
3. camera module as claimed in claim 1, is characterized in that, each light hole is a horn-like circular hole, and it comprises relative two ends, and away from the opening diameter of lens arra one end greater than the opening diameter near an end of lens arra.
4. camera module as claimed in claim 1, it is characterized in that, described camera module also comprises an escapement, described escapement is offered a plurality of through holes along the optical axis direction of camera module, these a plurality of through holes and the corresponding setting one by one of these a plurality of image sensing wafers, each through hole comprises the first relative end face and the second end face, described the first end face is towards described image sensing wafer array, the second end face is towards described lens arra, the area of described the first end face is greater than the area of described the second end face, the area of each the first end face and the area of each image sensing wafer are roughly the same, and the distance between the first end face of adjacent through-holes is almost nil.
5. camera module as claimed in claim 4, it is characterized in that, described camera module also comprises a filter arrays, and described filter arrays comprises a plurality of filters, each filter is placed in the through hole of correspondence of described escapement, is used for infrared light is filtered.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010103004171A CN102131043B (en) | 2010-01-19 | 2010-01-19 | Camera module |
| US12/854,301 US8314848B2 (en) | 2010-01-19 | 2010-08-11 | Imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010103004171A CN102131043B (en) | 2010-01-19 | 2010-01-19 | Camera module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131043A CN102131043A (en) | 2011-07-20 |
| CN102131043B true CN102131043B (en) | 2013-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010103004171A Expired - Fee Related CN102131043B (en) | 2010-01-19 | 2010-01-19 | Camera module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8314848B2 (en) |
| CN (1) | CN102131043B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569323B (en) * | 2012-02-10 | 2014-12-03 | 格科微电子（上海）有限公司 | Image sensor and method for manufacturing the same |
| CN104301590B (en) * | 2014-09-28 | 2017-06-09 | 中国科学院长春光学精密机械与物理研究所 | Three-lens detector array video acquisition device |
| CN113661061A (en) | 2019-02-04 | 2021-11-16 | 可乐丽欧洲有限责任公司 | Hurricane-resistant sound-proof glass assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039381A (en) * | 2006-03-17 | 2007-09-19 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and method for manufacturing the same |
| CN101191885A (en) * | 2006-11-24 | 2008-06-04 | 鸿富锦精密工业（深圳）有限公司 | Array Camera Module |
| CN101551585A (en) * | 2008-04-01 | 2009-10-07 | 晶宏半导体股份有限公司 | Panorama mode image capture device |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6639625B1 (en) * | 1997-07-16 | 2003-10-28 | Minolta Co., Ltd. | Image sensing device |
| US6720997B1 (en) * | 1997-12-26 | 2004-04-13 | Minolta Co., Ltd. | Image generating apparatus |
| JP3551854B2 (en) * | 1999-09-01 | 2004-08-11 | ミノルタ株式会社 | Digital photographing apparatus, image data processing apparatus, digital photographing method, and recording medium |
| JP2003037757A (en) * | 2001-07-25 | 2003-02-07 | Fuji Photo Film Co Ltd | Imaging device |
| JP4645358B2 (en) * | 2004-08-20 | 2011-03-09 | ソニー株式会社 | Imaging apparatus and imaging method |
| WO2007014293A1 (en) * | 2005-07-25 | 2007-02-01 | The Regents Of The University Of California | Digital imaging system and method to produce mosaic images |
| US7315014B2 (en) * | 2005-08-30 | 2008-01-01 | Micron Technology, Inc. | Image sensors with optical trench |
| JP4662880B2 (en) * | 2006-04-03 | 2011-03-30 | 三星電子株式会社 | Imaging apparatus and imaging method |
| US7855752B2 (en) * | 2006-07-31 | 2010-12-21 | Hewlett-Packard Development Company, L.P. | Method and system for producing seamless composite images having non-uniform resolution from a multi-imager system |
| US20080030592A1 (en) * | 2006-08-01 | 2008-02-07 | Eastman Kodak Company | Producing digital image with different resolution portions |
| JP4864632B2 (en) * | 2006-10-12 | 2012-02-01 | 株式会社リコー | Image input device, image input method, personal authentication device, and electronic device |
| US7676146B2 (en) * | 2007-03-09 | 2010-03-09 | Eastman Kodak Company | Camera using multiple lenses and image sensors to provide improved focusing capability |
| US9118850B2 (en) * | 2007-11-27 | 2015-08-25 | Capso Vision, Inc. | Camera system with multiple pixel arrays on a chip |
| JP2009188697A (en) * | 2008-02-06 | 2009-08-20 | Fujifilm Corp | Multi-focus camera apparatus and image processing method and program used therein |
| US20100103300A1 (en) * | 2008-10-24 | 2010-04-29 | Tenebraex Corporation | Systems and methods for high resolution imaging |
-
2010
- 2010-01-19 CN CN2010103004171A patent/CN102131043B/en not_active Expired - Fee Related
- 2010-08-11 US US12/854,301 patent/US8314848B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101039381A (en) * | 2006-03-17 | 2007-09-19 | 鸿富锦精密工业（深圳）有限公司 | Image sensing module and method for manufacturing the same |
| CN101191885A (en) * | 2006-11-24 | 2008-06-04 | 鸿富锦精密工业（深圳）有限公司 | Array Camera Module |
| CN101551585A (en) * | 2008-04-01 | 2009-10-07 | 晶宏半导体股份有限公司 | Panorama mode image capture device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102131043A (en) | 2011-07-20 |
| US20110176016A1 (en) | 2011-07-21 |
| US8314848B2 (en) | 2012-11-20 |
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