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CN102118551A - 成像装置 - Google Patents

成像装置 Download PDF

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Publication number
CN102118551A
CN102118551A CN2009103127681A CN200910312768A CN102118551A CN 102118551 A CN102118551 A CN 102118551A CN 2009103127681 A CN2009103127681 A CN 2009103127681A CN 200910312768 A CN200910312768 A CN 200910312768A CN 102118551 A CN102118551 A CN 102118551A
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camera module
imaging device
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张仁淙
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2009103127681A priority Critical patent/CN102118551A/zh
Priority to US12/820,028 priority patent/US20110157451A1/en
Publication of CN102118551A publication Critical patent/CN102118551A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/13—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with multiple sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H04N23/843—Demosaicing, e.g. interpolating colour pixel values
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/131—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements including elements passing infrared wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/135—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on four or more different wavelength filter elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N2209/00—Details of colour television systems
    • H04N2209/04—Picture signal generators
    • H04N2209/041—Picture signal generators using solid-state devices
    • H04N2209/048—Picture signal generators using solid-state devices having several pick-up sensors
    • H04N2209/049—Picture signal generators using solid-state devices having several pick-up sensors having three pick-up sensors

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  • Spectroscopy & Molecular Physics (AREA)
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  • General Physics & Mathematics (AREA)
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Abstract

本发明提供一种成像装置，其包括一个成像处理装置、至少一个第一相机模组、至少一个第二相机模组和至少一个第三相机模组，每个第一相机模组包括一个红色滤光片，每个第二相机模组包括一个绿色滤光片，每个第三相机模组包括一个蓝色滤光片，该成像处理装置用于整合该第一、第二及第三相机模组的图像信号。本发明提供的成像装置像素高且厚度小。

Description

成像装置
技术领域
本发明涉及成像装置，尤其涉及通过多个相机模组成像的成像装置。
背景技术
传统的成像装置有相机、摄像机等，其利用镜头模组将光线传递至传感器，传感器一般由百万个感光组件组成，这些感光组件将光信号转变为电信号输出。传感器包括CCD传感器和CMOS传感器，传感器上的每个像素能够记录一种颜色信息，而一个像素点最终的成像色彩依靠采样周围像素的三种原色信号，通过大量复杂的运算最后插值得出的。
请参阅图1，相机模组1具有传感器2和滤光片3以及镜头组4。滤光片3的位于传感器2的上方和镜头组4的下方。由于所有光线通过镜头组4以及滤光片3到达传感器2，不同色光经过一个光学系统后的会聚点各有不同，而且不同色光的视场角(field of view)也不相同，为避免像差严重，所以镜头组4需要通过多片镜片补偿或矫正像差，因此镜头组4的高度变高。另一方面，传感器2的尺寸大，像素高，也要求视场角变大，视场角变大要求镜头个数多，因此总体来说，传统的相机模组的较高，这使得高像素的成像装置难以应用于薄型化电子设备。
发明内容
有鉴于此，有必要提供一种像素高且厚度小的成像装置。
一种成像装置，其包括一个成像处理装置、至少一个第一相机模组、至少一个第二相机模组和至少一个第三相机模组，每个第一相机模组包括一个红色滤光片，每个第二相机模组包括一个绿色滤光片，每个第三相机模组包括一个蓝色滤光片，该成像处理装置用于整合该第一、第二及第三相机模组的图像信号。
相较于现有技术，本发明将三种单色相机模组组合成高像素成像装置，从而保证成像细腻，又由于每种单色相机所需镜头较少使得成像装置的厚度较小，因此适用于薄型电子设备。
附图说明
图1表示现有技术提供的成像装置的结构示意图。
图2是本发明第一实施例提供的成像装置的结构示意图。
图3是本发明第一实施例提供的成像装置的视场角差产生示意图。
图4是本发明第一实施例提供的成像装置的像差产生示意图。
图5是本发明第一实施例提供的成像装置的相机模组的排列示意图。
图6是本发明第二实施例提供的成像装置的相机模组的排列示意图。
图7是本发明第三实施例提供的成像装置的相机模组的排列示意图。
图8是本发明第四实施例提供的成像装置的相机模组的排列示意图。
主要元件符号说明
    相机模组     1
    传感器     2
    滤光片     3
    镜头组     4
    成像装置     10
    相机模组层     20、  40、  50、  60
    成像处理装置     30
    第一相机模组     21、  41、  61
    红色滤光片     210
    第二相机模组     22、  42、  62
    绿色滤光片     220
    第三相机模组     23、  43、  63
    蓝色滤光片     230
    镜片     232
    传感器     231
    第四相机模组     54、  64
具体实施方式
下面将结合附图对本发明作进一步详细说明。
请参阅图2，本发明第一实施例提供的成像装置10包括一个相机模组层20和一个成像处理装置30。该相机模组层20包括多个晶圆级的相机模组(wafer level camera module)。晶圆级相机模组是指在硅晶圆上直接制造的相机模组，例如以8英寸晶圆为基板形成传感器阵列，再在相同尺寸的硅晶圆上形成整合有滤光片以及镜片的晶圆级光学元件阵列，然后将传感器阵列和晶圆级光学元件阵列封装为一个整体，再进行切割，检测，就得到数千个晶圆级相机模组。晶圆级相机模组的高度一般在3mm到11mm之间，晶圆级光学元件的尺寸在2mm× 2mm左右，传感器的尺寸略大于晶圆级光学元件的尺寸。
相机模组层20的相机模组包括至少一个第一相机模组21，至少一个第二相机模组22和至少一个第三相机模组23，其中，第一相机模组21包括一个红色滤光片210、镜片和传感器，第二相机模组22包括一个绿色滤光片220、镜片和传感器，第三相机模组23包括一个蓝色滤光片230、镜片232和传感器231。每个相机模组都成单色像。第一相机模组21的成像范围从60cm到无穷远处，第二相机模组22的成像范围从40cm到60cm，第三相机模组的成像范围从30cm到40cm。因此，整体上，成像装置10的成像范围从30cm到无穷远。
成像处理装置30与各个相机模组电性连接，用于将各个相机模组的图像进行整合，以得到一张具有高像素的图像。
由于任意一个相机模组针对其所采用的单色滤光片进行光学设计，理论上来说，较少的镜头数量即可完成单色成像，因此成像装置10的厚度理论上是现有技术提供的相机模组1的厚度的三分之一。由于成像装置10的厚度较小，所以有效焦距(effective focal length，EFL)也较短，从而在较短距离以外的物体都可视为无穷远处的物体成像，方便成像处理装置30处理影像。
由于像差会给相邻相机模组之间带来光信号的串扰，并且会对理论分辨率值造成很大的损失，而在有效焦距不变，物距不变的情况下，相机模组的间距变小可以将相互间会发生串扰的像素数目减少，从而进一步提高分辨率。因此，优选地，相机模组层20使用硅穿孔(through silicon via，TSV)技术进行封装，将引脚尺寸缩小，使得任意两个相邻的相机模组的间距小于或等于4mm，从而缩小光信号的串扰范围。具体说明参见表1、图3和图4。为说明相机模组间距与图像公式如下：
Δθ＝φ2-φ1≈d/L----------------(1)
ImgD≈EFL×Δθ-----------------(2)
N＝ImgD/1.75μm----------------(3)
其中，d代表相机模组的间距，L代表物距，L1代表第一相机模组21的视场边缘光线，L2代表第二相机模组22的视场边缘光线，L3代表第三相机模组23的视场边缘光线，L0代表成像装置10的视场边缘光线。Δθ代表整个成像装置10的视场角和任意一个相机模组(表1选用第三相机模组23)之间的视场角差，EFL代表有效焦距(effective focal length)，ImgD代表像差，此像差反映单色相机模组成像和整个相机模组层20的成像差异，N代表像素数目，1.75μm代表一般情况下传感器的像素尺寸。
在本实施例中，将第三相机模组23的传感器231的成像平面和第三相机模组23的镜片 231的光心之间的距离作为有效焦距(EFL)，并将相机模组层20视为一个独立的成像装置与第三相机模组23做比较，其有效焦距(EFL)与第三相机模组的相同。
利用公式(1)至(3)计算N，在本实施例中，EFL＝3mm；L＝300mm。
表1
Figure 2009123110003000041
从公式(1)至(3)以及表1的计算结果可以得出，在物距L相同时，任意两个相邻的相机模组之间的间距d缩小，相互间会发生光信号串扰的像素数目N就会减少，即光信号的串扰范围较小，从而有助于提高图像的分辨率。
请参阅图5，R表示具有红色滤光片的第一相机模组21，G表示具有绿色滤光片的第二相机模组22，B表示具有蓝色滤光片的第三相机模组23。
本发明第一实施例提供相机模组层20呈一条直线，即多个第一相机模组21，多个第二相机模组22和多个第三相机模组23位于一条直线。
请参阅图6，本发明第二实施例提供的成像装置包括一个相机模组层40。相机模组层40包括多个第一相机模组41，多个第二相机模组42，多个第三相机模组43。相机模组层40以拜尔形式(Bayer Pattern)排列，即第二相机模组42占据整个相机模组层40的50％的位置且分布平均，第一相机模组41和第三相机模组43分别占据相机模组层40的25％的位置。
相机模组层40还可以呈矩形或者蜂窝状。相机模组层40的各种排列方式均能实现细腻的成像效果。
请参阅图7，本发明第三实施例提供的成像装置包括一个相机模组层50，相机模组层50与相机模组层20、相机模组层40不同的是，其还包括至少一个第四相机模组54，该至少一个第四相机模组54具有红外截止滤光片，第四相机模组54用IR表示。第四相机模组54的传感器用于感测光强，在三种单色像的基础上加上光强分布信息，会进一步提高成像效果。相机模组层50呈蜂窝状排列，结构紧凑，可以在有限的面积内设置较多的相机模组，进一步提高像素。
请参阅图8，本发明第四实施例提供的成像装置包括一个相机模组层60，相机模组层60包括多个第一相机模组61，多个第二相机模组62，多个第三相机模组63和多个第四相机模组64，其中，一个第一相机模组61、一个第二相机模组62、一个第三相机模组63和一个第四相机模组64组成一个矩形单元600，该相机模组60包括至少两个矩形单元600，多个矩形单元600可以形成一个大的矩形或者呈蜂窝状。每相邻两个矩形单元600的间距D大于一个每个矩形单元600内的任意两个相机模组的间距d。
可以理解的是，本领域技术人员还可于本发明精神内做其它变化，都应包含在本发明所要求保护的范围之内。

Claims (7)

1.一种成像装置，其包括一个成像处理装置、至少一个第一相机模组、至少一个第二相机模组和至少一个第三相机模组，每个第一相机模组包括一个红色滤光片，每个第二相机模组包括一个绿色滤光片，每个第三相机模组包括一个蓝色滤光片，该成像处理装置用于整合该第一、第二及第三相机模组的图像信号。
2.如权利要求1所述的成像装置，其特征在于：该第一、第二及第三相机模组均是晶圆级的相机模组。
3.如权利要求1所述的成像装置，其特征在于：该第一、第二及第三相机模组中的任意两个相邻的相机模组的间距小于或等于4毫米。
4.如权利要求1所述的成像装置，其特征在于：该至少一个第一相机模组、该至少一个第二相机模组和该至少一个第三相机模组以下列方式中的任一种方式排列：位于同一条直线、以拜尔形式排列、呈蜂窝状排列。
5.如权利要求1所述的成像装置，其特征在于：该成像装置进一步包括至少一个第四相机模组，每个第四相机模组包括一个红外光截止滤光片。
6.如权利要求5所述的成像装置，其特征在于：该至少一个第一相机模组、该至少一个第二相机模组、该至少一个第三相机模组和该至少一个第四相机模组位于同一条直线或者呈蜂窝状排列。
7.如权利要求5所述的成像装置，其特征在于：该成像装置包括至少两个矩形单元，每个矩形单元由一个该第一相机模组、一个该第二相机模组、一个该第三相机模组和一个该第四相机模组构成，每相邻两个矩形单元的间距大于每个矩形单元内的任意两个相机模组的间距。
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