CN102105020A - Making method for printed-circuit boards and palladium removing device for printed-circuit boards - Google Patents
Making method for printed-circuit boards and palladium removing device for printed-circuit boards Download PDFInfo
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- CN102105020A CN102105020A CN2009102419540A CN200910241954A CN102105020A CN 102105020 A CN102105020 A CN 102105020A CN 2009102419540 A CN2009102419540 A CN 2009102419540A CN 200910241954 A CN200910241954 A CN 200910241954A CN 102105020 A CN102105020 A CN 102105020A
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- palladium
- circuit board
- solution
- printed circuit
- hydrochloric acid
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Abstract
The invention discloses a making method for printed-circuit boards, comprising the following steps of: removing a copper layer outside a circuit graphic region on a substrate, wherein the substrate is provided with a non-through hole which is internally attached with palladium; and removing palladium in the non-through hole. The invention further discloses a palladium removing device for the printed-circuit boards; during removing palladium, a palladium-removing agent is a mixed solution of a hydrochloric acid solution and a thiocarbamide solution. The invention can be used for making the printed-circuit boards.
Description
Technical field
The present invention relates to circuit board, relate in particular to a kind of manufacture method and the palladium method of removing that is used for printed circuit board of printed circuit board.
Background technology
At high density interconnect plate (High density interconnection, be called for short HDI) the making field, surface treatment is based on immersion Ni/Au, owing to carrying out plated-through hole (Plated through hole, be called for short PTH) during the hole, the base material hole wall has adsorbed one deck colloid palladium, when once comprehensively pasting dry film after the copper facing, corresponding non-conduction hole (hole wall not metal lining and be used for that machinery is installed or the hole of mechanical fixing-assembly) is also all covered by dry film together, so after the copper facing second time and etching for the second time, though each non-conduction hole (None plated through hole, abbreviation NPTH) copper in can not be removed but change the palladium that is adsorbed on the hole wall base material before the copper, when carrying out immersion Ni/Au by whole eating aways, cause the heavy upward nickel gold in non-conduction hole, thereby influence the unfailing performance of HDI plate.
Summary of the invention
The technical problem that the present invention will solve provides a kind of manufacture method of printed circuit board, makes printed circuit board with this method, can improve the performance of HDI plate.
In order to solve the problems of the technologies described above, the present invention by the following technical solutions:
A kind of manufacture method of printed circuit board comprises:
Remove the copper layer outside the circuit-line figure zone on the substrate; Wherein, described substrate is provided with non-conduction hole, has palladium in described non-conduction hole;
Remove the palladium in the described non-conduction hole.
Compare with traditional technology, the manufacture method of printed circuit board of the present invention outside the circuit-line figure of removing on the substrate with layer after increased and removed palladium technology, removed palladium in the non-conduction hole with the mixed liquor of hydrochloric acid solution and thiourea solution, cause the problem of nickel gold on non-conduction inner hole deposition by displacement reaction when effectively having avoided in subsequent technique, sinking the nickel gold, thereby improved the performance of HDI plate.
Another technical problem that the present invention will solve provides a kind of palladium method of removing that is used to make printed circuit board, by this method printed circuit board is removed palladium, can improve the performance of circuit board.
In order to solve the problems of the technologies described above, the present invention by the following technical solutions:
A kind of palladium method of removing that is used to make printed circuit board, described used when removing palladium to remove the palladium agent be the mixed solution of hydrochloric acid solution and thiourea solution.
In the thiocarbamide molecule owing to have lone pair electrons on sulphur atom and the nitrogen-atoms, can form complex with multiple metal ion, especially the free 3d track of the thiocarbamide atom in the thiocarbamide molecule, the 3d electronics of acceptant palladium forms coordinate bond, therefore, sulphur atom in the thiocarbamide molecule has special affinity to Metal Palladium, can form stable complex.Therefore, the palladium in the non-conduction hole can form stable compound and dissolving with thiocarbamide.Therefore, described mixed solution can effectively be removed the palladium of non-conduction Kong Zhonggan in the printed circuit board, thereby improves the performance of printed circuit board.
Description of drawings
Fig. 1 is the flow chart of the manufacture method of printed circuit board of the present invention.
Embodiment
The object of the present invention is to provide a kind of manufacture method of printed circuit board.This method can improve the performance of printed circuit board.
Below in conjunction with embodiment the manufacture method of printed circuit board is done detailed explanation.
Embodiment 1
Present embodiment provides a kind of manufacture method of printed circuit board.As shown in Figure 1, a kind of manufacture method of printed circuit board comprises:
S10: remove the copper layer outside the circuit-line figure zone on the substrate; Wherein, described substrate is provided with non-conduction hole, has palladium in described non-conduction hole;
S20: remove the palladium in the non-conduction hole.
Wherein, the copper layer of removing outside the circuit-line figure zone on the substrate is specially: by etch process, remove the copper layer outside the circuit-line figure zone.Present embodiment utilizes the ammonium chloride etching solution to carry out etching by horizontal alkaline etching machine.Wherein, the time etching section upward pressure of horizontal alkaline etching machine is 2.0～3.0Kgf, and etching section downforce is 1.1～1.5Kgf, and chlorine ion concentration is controlled at 4.6～5.2mol/L, and pH value is controlled at 8.0～8.8.
The palladium of removing in the described non-conduction hole is specially: utilize the mixed solution of hydrochloric acid solution and thiourea solution to remove palladium in the non-conduction hole.In the present embodiment, remove palladium and undertaken by removing the palladium machine, the transfer rate of removing the palladium machine is 1.5～2.0m/min.Wherein, the concentration of hydrochloric acid solution is hydrochloric acid 16～20g/L of 37% for the quality percentage composition, and the concentration of thiourea solution is 60～80g/L, and the working temperature of mixed solution is 20～40 ℃, and in the mixed liquor, the mass ratio of hydrochloric acid solution and described thiourea solution is 1: 3.8.
Before step S10, also comprise:
S00: copper facing on substrate forms anti-protective film coating on this copper surface; With in subsequent etch technology, the required not etched liquid of copper conductor of protective circuit circuit is stung erosion.
S01: the diaphragm that removes the circuit-line figure zone on the substrate;
S02: the circuit-line figure zone copper facing on substrate; Copper layer with thickening circuit-line figure zone provides the favorable conductive matrix;
S03: at the copper electroplating surfaces with tin; With protection copper surface, make the anticorrosion protection layer in the subsequent etch technology.
S04: remove remaining diaphragm.
Wherein, copper facing on substrate forms anti-protective film coating on this copper surface and is specially:
By depositing operation, at the substrate surface deposited copper, again by depositing operation at the anti-protective film coating of copper surface deposition.
The described diaphragm that removes the circuit-line figure zone on the substrate is specially: described diaphragm is exposed with ultraviolet light by egative film; Wherein,, remove not by the diaphragm of sensitization again by developing process not by sensitization in circuit-line figure zone.
Circuit-line figure zone copper facing on substrate is specially: by depositing operation, to the circuit-line figure area deposition copper on the substrate.
Be specially at the copper electroplating surfaces with tin: by depositing operation, at copper surface deposition tin.
Removing remaining diaphragm is specially: under the striping machine; utilize the NaOH solution removal to cover diaphragm outside the circuit-line figure zone, wherein, the mass concentration of NaOH is 8%～12%; the operating pressure of striping machine is 23～36PSI, and transfer rate is 2～3m/min.
The manufacture method of printed circuit board of the present invention also comprises behind step S20:
S30: remove process of tin, remove the tin layer outside the circuit-line figure zone on the substrate.
Should be specially except that process of tin: the tin layer with the circuit-line figure zone on the salpeter solution removal substrate, remove process of tin and undertaken by the detin machine.Wherein, the concentration of salpeter solution is 3.7～5.0mol/L, and temperature is 25～35 ℃, and detin machine operating pressure is 20～30PSI, and transfer rate is 2.5～3.0m/min.Repeat above-mentioned steps when making multilayer circuit board.
The manufacture method of printed circuit board of the present invention has increased removes palladium technology together, removed palladium in the non-conduction hole with the mixed liquor of hydrochloric acid solution and thiourea solution, cause the problem of nickel gold on non-conduction inner hole deposition by displacement reaction when effectively having avoided in subsequent technique, sinking the nickel gold, thereby improved the performance of HDI plate.
Embodiment 2
Present embodiment provides a kind of palladium method of removing that is used to make printed circuit board, and this method can be removed the palladium in the non-conduction hole of circuit board, can improve the performance of circuit board.
In order to solve the problems of the technologies described above, the present invention by the following technical solutions:
A kind of palladium method of removing that is used to make printed circuit board, used when removing palladium to remove the palladium agent be the mixed solution of hydrochloric acid solution and thiourea solution.Wherein, the hydrochloric acid solution in the mixed solution is hydrochloric acid 16～20g/L of 37% for the quality percentage composition, and the concentration of thiourea solution is 60～80g/L.
Further, in the mixed liquor, the mass ratio of hydrochloric acid solution and thiourea solution is 1: 3.8.
Further, the working temperature of mixed solution is 20～40 ℃.
The present invention removes used removing in the palladium agent in the palladium method, in the thiocarbamide molecule owing to have lone pair electrons on sulphur atom and the nitrogen-atoms, can form complex with multiple metal ion, especially the free 3d track of the thiocarbamide atom in the thiocarbamide molecule, the 3d electronics of acceptant palladium forms coordinate bond, therefore, the sulphur atom in the thiocarbamide molecule has special affinity to Metal Palladium, can form stable complex.Therefore, the palladium in the non-conduction hole can form stable compound and dissolving with thiocarbamide.Therefore, mixed solution can effectively be removed the palladium in the non-conduction hole in the printed circuit board, thereby improves the performance of printed circuit board.
Those skilled in the art can carry out various changes and modification to the present invention and not break away from aim of the present invention and scope.If these are changed and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. the manufacture method of a printed circuit board is characterized in that: comprising:
Remove the copper layer outside the circuit-line figure zone on the substrate; Wherein, described substrate is provided with non-conduction hole, has palladium in described non-conduction hole;
Remove the palladium in the described non-conduction hole.
2. the manufacture method of printed circuit board according to claim 1 is characterized in that: used during palladium in the described non-conduction hole of described removal to remove the palladium agent be the mixed solution of hydrochloric acid solution and thiourea solution.
3. the manufacture method of printed circuit board according to claim 2 is characterized in that: the concentration of described hydrochloric acid solution is hydrochloric acid 16～20g/L of 37% for the quality percentage composition, and the concentration of described thiourea solution is 60～80g/L.
4. the manufacture method of printed circuit board according to claim 3, it is characterized in that: in the described mixed liquor, the mass ratio of described hydrochloric acid solution and described thiourea solution is 1: 3.8.
5. according to the manufacture method of each described printed circuit board of claim 2 to 4, it is characterized in that: the working temperature of described mixed solution is 20～40 ℃.
6. the manufacture method of printed circuit board according to claim 1 is characterized in that: the described palladium that removes is undertaken by removing the palladium machine, and the described transfer rate of removing the palladium machine is 1.5～2.0m/min.
7. palladium method of removing that is used to make printed circuit board is characterized in that: described used when removing palladium to remove the palladium agent be the mixed solution of hydrochloric acid solution and thiourea solution.
8. the palladium method of removing according to claim 7 is characterized in that: the concentration of described hydrochloric acid solution is hydrochloric acid 16～20g/L of 37% for the quality percentage composition, and the concentration of described thiourea solution is 60～80g/L.
9. the method for removing palladium according to claim 8, it is characterized in that: in the described mixed liquor, the mass ratio of described hydrochloric acid solution and described thiourea solution is 1: 3.8.
10. according to each described palladium method of removing of claim 7 to 9, it is characterized in that: the working temperature of described mixed solution is 20～40 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102419540A CN102105020A (en) | 2009-12-16 | 2009-12-16 | Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102419540A CN102105020A (en) | 2009-12-16 | 2009-12-16 | Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102105020A true CN102105020A (en) | 2011-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009102419540A Pending CN102105020A (en) | 2009-12-16 | 2009-12-16 | Making method for printed-circuit boards and palladium removing device for printed-circuit boards |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103249254A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Method of removing palladium in NPTHs of PCB |
| CN103945654A (en) * | 2013-01-18 | 2014-07-23 | 北大方正集团有限公司 | Method for leaving palladium ions in non-metallized holes of passivation circuit board and circuit board manufactured through same |
| CN105472896A (en) * | 2015-11-23 | 2016-04-06 | 深圳市深联电路有限公司 | Method for removing nickel layer from nickel-plated copper foil surface |
| CN106350787A (en) * | 2015-07-13 | 2017-01-25 | 东莞市斯坦得电子材料有限公司 | Palladium inactivation process for electroless nickel-gold plating |
| CN110344033A (en) * | 2014-07-10 | 2019-10-18 | 奥野制药工业株式会社 | The management method of resin method for plating and resin plating application etch bath |
| CN111328208A (en) * | 2020-03-19 | 2020-06-23 | 大连崇达电路有限公司 | Solution for electroless plating of gold on electroless nickel-gold plate |
-
2009
- 2009-12-16 CN CN2009102419540A patent/CN102105020A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103945654A (en) * | 2013-01-18 | 2014-07-23 | 北大方正集团有限公司 | Method for leaving palladium ions in non-metallized holes of passivation circuit board and circuit board manufactured through same |
| CN103249254A (en) * | 2013-04-22 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Method of removing palladium in NPTHs of PCB |
| CN110344033A (en) * | 2014-07-10 | 2019-10-18 | 奥野制药工业株式会社 | The management method of resin method for plating and resin plating application etch bath |
| US11047052B2 (en) | 2014-07-10 | 2021-06-29 | Okuno Chemical Industries Co., Ltd. | Resin plating method |
| CN106350787A (en) * | 2015-07-13 | 2017-01-25 | 东莞市斯坦得电子材料有限公司 | Palladium inactivation process for electroless nickel-gold plating |
| CN105472896A (en) * | 2015-11-23 | 2016-04-06 | 深圳市深联电路有限公司 | Method for removing nickel layer from nickel-plated copper foil surface |
| CN111328208A (en) * | 2020-03-19 | 2020-06-23 | 大连崇达电路有限公司 | Solution for electroless plating of gold on electroless nickel-gold plate |
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Application publication date: 20110622 |