CN102092669A - Microfluidic chip packaging method by combining surface treatment and hot pressing - Google Patents
Microfluidic chip packaging method by combining surface treatment and hot pressing Download PDFInfo
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Abstract
The invention discloses a microfluidic chip packaging method by combining surface treatment and hot pressing, which is characterized by comprising the following steps of: (1) preparing a microfluidic pattern chip substrate; (2) treating the packaging surfaces of packaging materials, namely the surfaces of a cover plate and the substrate; and (3) completing chip packaging by adopting a hot pressing method. The method has the advantages that: the method is suitable for combining chips manufactured by various processing technologies and various materials, prevents deformation and blockage of microchannels and improves production efficiency and the finished product ratio.
Description
(1) technical field:
The invention belongs to MEMS and analyzing and testing field, relate in particular to the method for packing of micro-fluidic chip surface treatment in conjunction with hot pressing, utilization is carried out specific PROCESS FOR TREATMENT to the package surface of encapsulating material, make surface mass activation or make surface attachment one deck micrometre grade thin glue-line, and finish the encapsulation of chip.
(2) background technology:
Microflow control technique is one of the new and high technology that develops rapidly at present and field, multidisciplinary intersection science and technology forward position, is the important technological platform of biochemistry detection, chemical science and information science signal detection and Study on processing method.The micro-fluidic chip that the present invention relates to is based on the MEMS process technology; Driving and control law in research microfluidic channel surface property, the microfluidic system; Setting up functional units such as sample pretreatment, mixing, reaction, separation, detection is the micro-fluidic chip integrated technology of one.With this technology is the research platform of application foundation, give full play to it to receiving the navigability of upgrading or skin upgrading fluid, and be easy to that high pass quantizes and the characteristics of functionalization, study the basic law and the characteristic of microchannel, and combine with specific immune response, in order to the monitoring antigen-antibody reaction.
In recent years, incontrovertible progress and breakthrough have been obtained in fields such as MEMS (MEMS), integrated circuit (IC) technology, nanometer technology, molecular biology, materialogy, these technology are combined the powerful SOC(system on a chip) of formation, for biochemical immunoassay has been started the new breakthrough mouth, integrated microfluidic chip is just meeting this systematized characteristics.Integrated microfluidic chip is a new technology of showing up prominently in the life science field in recent years, and it can be made into the miniature chip lab of the global function with different purposes.At present, the chip lab analysis has become a very popular research field.It why extremely people pay close attention to be by its characteristics determined: (one) integration: integrated assembly of elements is more and more, and integrated scale is also increasing, and function is also more and more stronger; (2) analysis speed is exceedingly fast; (3) high flux; (4) microminiaturized portability is suitable for immediately online and field assay; (5) energy consumption is low, and material consumption is few, pollutes for a short time, thereby is dirt cheap, and safety is considered to a kind of eco-friendly analytical method and " green " technology.Therefore, chip lab research seems extremely important.For example, at biomedical sector, it can make precious biological sample and reagent consumption be reduced to microlitre even receive upgrading, and analysis speed significantly improves, and cost descends at double; Need spend analysis that a large amount of samples, reagent and a lot of time just can finish and synthetic before it can make at chemical field in a laboratory, on a little chip, spend and seldom measure sample and reagent was finished simultaneously with the very short time; In the analytical chemistry field, big analytical instrument became square centimeter analyzer of size scale before it can make, and will save manpower and the material resources and the energy greatly; At environmental area, it makes field assay and remote control environmental analysis become possibility.
The micro-fluidic chip investigative technique is one of the new and high technology that develops rapidly at present and field, multidisciplinary intersection science and technology forward position, is the important technological platform of life science, chemical science and information science signal detection and Study on processing method.The microfluidic analysis system provides very wide prospect in the advantage aspect microminiaturized, integrated and the portability for its application in the various fields such as detection of biomedical, the synthetic screening of medicine, environmental monitoring and protection, health quarantine, judicial expertise, biological warfare agent.
Center on the important problem in science in the micro-fluidic chip system research, with the microflow control technique is the research platform of application foundation, give full play to it to receiving the navigability of upgrading or skin upgrading fluid, and be easy to that high pass quantizes and the characteristics of functionalization, set up the micro-fluidic chip process technology; Driving and control law in research microfluidic channel surface property, basic law and characteristic, the microfluidic system; Research micro-nano passage, by multidisciplinary crossing research, explore the accurate ixed control of microballoon in little-Na system, setting up functional units such as sample pretreatment, mixing, reaction, separation, detection is the micro-fluidic chip integrated system of one, strengthens the source innovation ability that China's micro-current control biochemical is analyzed Research of Integrated System.Current, some theories and the applied basic research of chip lab itself, Study on manufacturing process, suitable new material exploitations etc. are also among development.For example, with chip fabrication technique, chip manufacturing is developed towards the direct etching of the inferior Ultra-Violet Laser microchannel direction of automation, numerical controlization gradually by micro electronmechanical (MEMS) technology production that is the master by hand, simultaneously other technologies as, stamping techniques (Imprint Lithography) etc. also extensive use get up; The drive source of chip lab is from developing into multiple means such as fluid dynamic, air pressure, gravity, centrifugal force, shearing force with EOF.
The processing method of existing micro-fluidic chip mainly contains: use micro fabrication, go up the protruding figure formpiston of processing at hard material (as: silicon, glass, metal etc.), copy recessed microchannel figure with silicon rubber PDMS casting again; Or be pressing mold with this hard mold, directly heating pressurization on thermoplastic realizes that figure shifts; All right, directly on such as dimethyl silicone polymer (PDMS), polymethyl methacrylate (PMMA), Merlon (PC) and other various plastics, glass, metal, silicon chip, process the micro-fluidic chip figure with the microbeam Excimer Laser Processing Equipment for Chemical Vapor Deposition.
The chip lab material therefor is by initial price comparatively expensive glass and silicon chip, and developing into cheap polymer is material, as dimethyl silicone polymer (PDMS), polymethyl methacrylate (PMMA), Merlon (PC) and other various plastics etc.
Which kind of no matter adopts shape method and material, and the encapsulation process of micro-fluidic chip all is absolutely necessary.Particularly produce in enormous quantities, take into full account yield rate and production efficiency.So the micro-fluidic chip that combination is made at diverse ways and different materials invents that the unified method for packing of a kind of economical and efficient just necessitates.
Because the passage of micro-fluidic chip is small, the width and the degree of depth are only tens microns usually, even littler, adopt common coating technique or hot press sealing process, are easy to make channel deformation and obstruction, and process conditions also are difficult to grasp.
(3) summary of the invention:
The object of the present invention is to provide the method for packing of a kind of micro-fluidic chip surface treatment, be applicable to chip and various combination of materials that various processing technologys are made, when preventing the microchannel distortion and stopping up, improve the efficient and the yield rate of producing in conjunction with hot pressing.
A kind of micro-fluidic chip surface treatment is characterized in that in conjunction with the method for packing of hot pressing it is made of following steps:
(1) the micro-fluidic graphic chips substrate of preparation;
(2) package surface to encapsulating material is that cover plate and substrate surface are handled;
(3) adopt the method for hot pressing to finish the chip encapsulation.
Micro-fluidic graphic chips substrate comprises that the micro-fluidic graphic chips substrate of thermoplastic, dimethyl silicone polymer micro flow control graphic chips substrate and glass, metal, silicon chip are the micro-fluidic chip substrate of substrate in the above-mentioned said step (1).
The preparation method of the micro-fluidic graphic chips substrate of above-mentioned said thermoplastic may further comprise the steps:
1. the making of micro-fluidic chip mould: go out the micro-fluidic chip figure with the MEMS design of Simulation, and make metal mask plate, with photoetching process figure being transferred to spin coating has on the silicon chip of PMMA; Adopt the dry etching method to make formpiston, projection figure height is greater than 15 microns;
2. the thermoplastic that dissolves solidifies in the micro-fluidic chip mould place in-situ polymerization of the projection that 1. step makes;
Perhaps place micro-fluidic chip mold heated 〉=100 ℃ of the projection that 1. step make on greater than the thermoplastic thin sheet of 0.2mm, more than the pressurization 20bar, be cooled to cold curing then, the demoulding in smooth thickness.
The preparation method of the micro-fluidic graphic chips substrate of above-mentioned said thermoplastic is: design configuration is converted into automatic processing program through the MEMS simulation software, use Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly on the thermoplastic thin sheet of smooth thickness, process microfluidic channel greater than 0.2mm.
Above-mentioned said thermoplastic is that polymethyl methacrylate is that PMMA:Polymethylenemethacrylate, polystyrene are that PS:Polystyrene, polyvinyl chloride are PVC:Polyvinylenechloride or polycarbonate PC:Polycarbonate.
The preparation method of above-mentioned said dimethyl silicone polymer micro flow control graphic chips substrate may further comprise the steps:
1. the making of micro-fluidic chip mould: go out the micro-fluidic chip figure with the MEMS design of Simulation, and make metal mask plate, with photoetching process figure being transferred to spin coating has on the silicon chip of PMMA; Adopt the dry etching method to make formpiston, projection figure height is greater than 15 microns;
2. the dimethyl silicone polymer that dissolves solidifies in the micro-fluidic chip mould place in-situ polymerization of the projection that 1. step makes.
The preparation method of above-mentioned said dimethyl silicone polymer micro flow control graphic chips substrate is: design configuration is converted into automatic processing program through the MEMS simulation software, use Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly on smooth thickness is the dimethyl silicone polymer thin plate of 0.2mm, process microfluidic channel.
Above-mentioned said glass, metal, silicon chip are that the preparation method of the micro-fluidic chip substrate of substrate is: design configuration is converted into automatic processing program through the MEMS simulation software, use Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly on smooth glass, metal, silicon chip, process microfluidic channel; Glass, metal, the silicon chip micro-fluidic chip substrate made through dry etching.
The method of cover plate and substrate surface treatment is in the above-mentioned said step (2): spin coating dimethyl silicone polymer or polymethyl methacrylate thin layer on the cover plate, and thin layer is less than 5 microns; Add diluent before the spin coating, to reduce viscosity; Said diluent is methyl phenyl ethers anisole or dimethicone.
The method of cover plate and substrate surface treatment is in the above-mentioned said step (2): when cover plate or substrate are organic material, are coated with organic solvent and make the top layer slightly soluble on the cover plate of organic material or substrate, dry; Said organic solvent is chloroform, dichloroethanes, cyclohexane, n-hexane or ethyl acetate.
The method of above-mentioned said step (3) chips encapsulation is: adopt common pneumatic hot press heating pressurization, pressure is less than 7bar, and temperature 100 ~ 170 is spent 1 ~ 10 minute time.
The method of above-mentioned said step (3) chips encapsulation is: adopt nano marking press, the soft capsule pressurization of gas-powered, bottom heating, pressure 20bar, temperature 100 ~ 180 degree, 1 ~ 10 minute time.
The material of above-mentioned said cover plate/substrate is glass/silicon, glass/glass, dimethyl silicone polymer/silicon, dimethyl silicone polymer/glass, polydimethyl siloxanes/polydimethy siloxanes, dimethyl silicone polymer/polymethyl methacrylate, polymethyl methacrylate/silicon, polymethyl methacrylate/glass or polymethyl methacrylate/polymethyl methacrylate.
Superiority of the present invention: the present invention is applicable to chip and the various combination of materials that various processing technologys are made, and when preventing the microchannel distortion and stopping up, improves the efficient and the yield rate of producing.
(4) specific embodiment:
Example 1: dimethyl silicone polymer PDMS chip and cover glass sealing-in:
Go out the micro-fluidic chip figure with Intellisute MEMS design of Simulation, and make the nickel metal mask plate that glass is substrate, with litho machine figure being transferred to spin coating has on the silicon chip of photoresist (testing the used positive glue that is).Glue is thick to be 1 micron, and the silicon chip that has been coated with photoresist is placed on preceding the baking 10 minutes in the vacuum drying chamber, and temperature is 90 ℃.The extreme ultraviolet linear light carries out photoetching, and the time for exposure is 8s, and then, the 40s that develops in concentration is 0.6% NaOH solution carries out the good silicon chip that develops to dry by the fire 15 minutes before the baking of back, and temperature is 120 ℃.With the dry silicon chip of crossing in the back of developing, place Oxford Plasmalab 80PlusRIE etching machine, the O2 flow is 50sccm, and air pressure is 40mbar, and forword power is 50w, bombards 2 minutes, removes figure concave bottom portion cull.Then, put it into vacuum coating equipment, the metal nickel that evaporation 250nm is thick; The metal level on photoresist and the photoresist is removed in the acetone ultrasonic cleaning, is kept attached to the metal level on the silicon chip.Put into Plasmalab 80Plus RIE etching machine again, etching gas SF6 flow is 40sccm, and the O2 flow is 1sccm, and air pressure is 40mbar, and forword power is 100w, etching 8 minutes.Take out, with the metal mask of dilute sulfuric acid flush away remnants, obtaining height of projection is the formpiston of 20 microns of 25 microns figure transversary width.
Sylgard 184 type PDMS (the best proportioning of recommendation is 10: 1, and solidification temperature is 50-100 ℃) are adopted in experiment, are to put into vacuum tank, the normal temperature degassing after 10: 1 liquid mixture fully stirs with PDMS performed polymer/curing agent proportioning (volume ratio); Treat liquid mixture do not have a bubble after (approximately 15min), be cast in and form 1～3mm cover layer on the silicon anode membrane, carry out the normal temperature degassing again, do not have bubble or bubble obviously reduces (approximately 15min) until cofferdam, silicon formpiston edge; The 35min that is heating and curing under 75 ℃ takes off cover plate from the silicon anode membrane then, and gets the end aperture of substrate passage with card punch, promptly makes dimethyl silicone polymer PDMS micro-fluidic chip substrate.
Getting dimethicone (Dow corning 200 Fluid) mixes in 13: 10 ratio with the dimethyl silicone polymer performed polymer PDMS that has added curing agent, the viscosity of PDMS is reduced, with CooksonSpincoater spin coated machine, rotating speed 1500 ~ 4000rpm, PDMS can be coated on the clean sheet glass equably with the method for spin coating, THICKNESS CONTROL is at 2 ~ 5 microns.Put it into the vacuum drying oven baking again to half-dried, take out, fit tightly, eliminate bubble with the dimethyl silicone polymer PDMS micro-fluidic chip substrate of making.Be put on the pneumatic hot press, pressure 6bar, temperature 170 degree 10 minutes, are promptly realized sealing-in.The method cycle is short, the continuous-running efficiency height.
Example 2: the sealing-in of thermoplastic micro-fluidic chip substrate and material cover plate of the same race:
With the silicon formpiston in the example 1 is impressing mould.The smooth polyvinylchloride plate of 1mm thickness places on the mould, the pure aluminum foil of the two-layer 0.1mm of pad below the mould, cover three layers of pure aluminum foil above the PVC plate, put into the Obducat nano marking press together, be warmed up to 180 degree, pressurization 40bar, kept 3 minutes, and be cooled to 80 degree, the release demoulding, be cooled to room temperature, make PVC micro-fluidic chip substrate.
Intercept onesize clean smooth PVC thin plate, its surface evenly is coated with minimum of chloroform, after drying, covers on the PVC micro-fluidic chip substrate of making.In using sheet glass (slide) clamping up and down, be put on the common pneumatic hot press, heating-up temperature is 120 degree again, and pressure 2.5bar kept 5 minutes, promptly finished sealing-in.
Example 3: with Intellisuite MEMS simulation software design configuration, and be translated into the automatic processing program of Excimer Laser Processing Equipment for Chemical Vapor Deposition, processing gas is KrF, gas pressure is that the 6500mbar laser energy is 15mJ, directly smooth thermoplastic thin sheet (＞process microfluidic channel on 0.2mm).
Intercept onesize clean smooth material thin plate of the same race, its surface evenly is coated with minimum of chloroform, after drying, covers on the micro-fluidic chip substrate of Laser Processing.In using sheet glass (slide) clamping up and down, be put on the common pneumatic hot press, heating-up temperature is 120 degree again, and pressure 2.5bar kept 5 minutes, and sealing-in is promptly finished in cooling.
Claims (9)
1. a micro-fluidic chip surface treatment is characterized in that in conjunction with the method for packing of hot pressing it is made of following steps:
(1) the micro-fluidic graphic chips substrate of preparation;
(2) package surface to encapsulating material is that cover plate and substrate surface are handled;
(3) adopt the method for hot pressing to finish the chip encapsulation.
2. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 1, it is characterized in that micro-fluidic graphic chips substrate comprises that the micro-fluidic graphic chips substrate of thermoplastic, dimethyl silicone polymer micro flow control graphic chips substrate and glass, metal, silicon chip are the micro-fluidic chip substrate of substrate in the said step (1) in conjunction with hot pressing.
3. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 2 in conjunction with hot pressing, the preparation method who it is characterized in that the micro-fluidic graphic chips substrate of said thermoplastic is three kinds:
First kind: may further comprise the steps:
1. the making of micro-fluidic chip mould: go out the micro-fluidic chip figure with the MEMS design of Simulation, and make metal mask plate, with photoetching process figure being transferred to spin coating has on the silicon chip of PMMA; Adopt the dry etching method to make formpiston, projection figure height is greater than 15 microns;
2. the thermoplastic that dissolves solidifies in the micro-fluidic chip mould place in-situ polymerization of the projection that 1. step makes;
Second kind: may further comprise the steps:
1. the making of micro-fluidic chip mould: go out the micro-fluidic chip figure with the MEMS design of Simulation, and make metal mask plate, with photoetching process figure being transferred to spin coating has on the silicon chip of PMMA; Adopt the dry etching method to make formpiston, projection figure height is greater than 15 microns;
2. or in smooth thickness place micro-fluidic chip mold heated 〉=100 ℃ of the projection that 1. step make on greater than the thermoplastic thin sheet of 0.2mm, more than the pressurization 20bar, be cooled to cold curing then, the demoulding;
The third: design configuration is converted into automatic processing program through the MEMS simulation software, uses Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly processes microfluidic channel on the thermoplastic thin sheet of smooth thickness greater than 0.2mm.
4. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 3, it is characterized in that said thermoplastic is that polymethyl methacrylate is that PMMA:Polymethylene methacrylate, polystyrene are that PS:Polystyrene, polyvinyl chloride are PVC:Polyvinylene chloride or polycarbonate PC:Polycarbonate in conjunction with hot pressing.
5. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 2 in conjunction with hot pressing, the preparation method who it is characterized in that said dimethyl silicone polymer micro flow control graphic chips substrate is two kinds:
First kind: may further comprise the steps:
1. the making of micro-fluidic chip mould: go out the micro-fluidic chip figure with the MEMS design of Simulation, and make metal mask plate, with photoetching process figure being transferred to spin coating has on the silicon chip of PMMA; Adopt the dry etching method to make formpiston, projection figure height is greater than 15 microns;
2. the dimethyl silicone polymer that dissolves solidifies in the micro-fluidic chip mould place in-situ polymerization of the projection that 1. step makes;
Second kind: design configuration is converted into automatic processing program through the MEMS simulation software, uses Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly processes microfluidic channel on smooth thickness is the dimethyl silicone polymer thin plate of 0.2mm.
6. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 2 in conjunction with hot pressing, it is characterized in that said glass, metal, silicon chip are that the preparation method of the micro-fluidic chip substrate of substrate is: design configuration is converted into automatic processing program through the MEMS simulation software, use Excimer Laser Processing Equipment for Chemical Vapor Deposition, directly on smooth glass, metal, silicon chip, process microfluidic channel; Glass, metal, the silicon chip micro-fluidic chip substrate made through dry etching.
7. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 1, it is characterized in that the method for middle cover plate of said step (2) and substrate surface treatment is in conjunction with hot pressing:
Spin coating dimethyl silicone polymer or polymethyl methacrylate thin layer on the cover plate, thin layer is less than 5 microns; Add diluent before the spin coating, to reduce viscosity; Said diluent is methyl phenyl ethers anisole or dimethicone;
Perhaps, when cover plate or substrate are organic material, on the cover plate of organic material or substrate, are coated with organic solvent and make the top layer slightly soluble, dry; Said organic solvent is chloroform, dichloroethanes, cyclohexane, n-hexane or ethyl acetate.
8. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 1, it is characterized in that the method for said step (3) chips encapsulation is in conjunction with hot pressing:
Adopt common pneumatic hot press heating pressurization, pressure is less than 7bar, and temperature 100 ~ 170 is spent 1 ~ 10 minute time;
Perhaps, adopt nano marking press, the soft capsule pressurization of gas-powered, bottom heating, pressure 20bar, temperature 100 ~ 180 degree, 1 ~ 10 minute time.
9. according to the method for packing of the said a kind of micro-fluidic chip surface treatment of claim 1 in conjunction with hot pressing, the material that it is characterized in that said cover plate/substrate is glass/silicon, glass/glass, dimethyl silicone polymer/silicon, dimethyl silicone polymer/glass, polydimethyl siloxanes/polydimethy siloxanes, dimethyl silicone polymer/polymethyl methacrylate, polymethyl methacrylate/silicon, polymethyl methacrylate/glass or polymethyl methacrylate/polymethyl methacrylate.
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| CN110719826A (en) * | 2018-12-10 | 2020-01-21 | 深圳大学 | Micro-structure mold core of micro-fluidic chip and manufacturing method thereof |
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Application publication date: 20110615 |