CN101990395B - Mounting method of electronic component and mounting device thereof - Google Patents
Mounting method of electronic component and mounting device thereof Download PDFInfo
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- CN101990395B CN101990395B CN 201010243944 CN201010243944A CN101990395B CN 101990395 B CN101990395 B CN 101990395B CN 201010243944 CN201010243944 CN 201010243944 CN 201010243944 A CN201010243944 A CN 201010243944A CN 101990395 B CN101990395 B CN 101990395B
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Abstract
The present invention provides a mounting method of an electronic component and a mounting device thereof. In the mounting method of electronic component, the electronic component which is held by a holding component that is equipped on a rotatable mounting head is shot through a component identification camera; an identification label which is adhibited on a printed circuit board through a circuit board identification camera; and the electronic component is mounted on the printed circuit board based on a result obtained after performing identification processing to the two shot images. Before the manufacturing operation of the printed circuit board, an offset value relatively to a rotation center of a mounting head in design is calculated beforehand and stored. Before the manufacturing operation of the printed circuit board, the offset value of the circuit board identification camera is calculated and stored. After the manufacturing operation of the printed circuit board, a rotation center of the mounting head is calculated and a deviation value to the offset value is stored; and after the manufacturing operation of the printed circuit board, the deviation value to the offset value of the circuit board identification camera is stored.
Description
Technical field
The present invention relates to take by being arranged on the electronic unit that the rotatable holding member of installing on the head keeps by the component identification video camera, take the identification marking that is attached on the printed circuit board (PCB) by board recognition camera, and based on the result that two images to these shootings have carried out the identification processing, electronic unit is installed to the installation method of the electronic unit on the printed circuit board (PCB) and the erecting device of electronic unit.
Background technology
The electronic component mounting method that carries out this component identification processing is for example open in patent documentation 1 grade.Identification result based on this electronic unit is installed to electronic unit on the printed circuit board (PCB) accurately.
[patent documentation 1] spy opens the 2005-159209 communique
But, follow the temperature of the electronic component mounting apparatus that causes because of the installation and operation that continues electronic component mounting apparatus to rise, close in the first-class position of installation and fasten the generation deviation.Therefore, from the beginning the deviation of the predeterminated position of pivot (design attitude) is the unit temp that deviant (fixed value) can't be tackled variation, the demonstration result that the installation accuracy instability of electronic unit, the predeterminated position of above-mentioned pivot are carried out during based on the adjustment of electronic component mounting apparatus.
Summary of the invention
Therefore, the objective of the invention is to tackle the unit temp of variation and the installation accuracy that improves electronic unit.
Therefore, the 1st invention is characterised in that, take by being arranged on the electronic unit that the rotatable holding member of installing on the head keeps by the component identification video camera, and the result who has carried out the identification processing based on the image to this shooting, electronic unit is installed in the installation method of the electronic unit on the printed circuit board (PCB), comprises:
Before the production run of described printed circuit board (PCB) begins, ask in advance with respect to described in the design install head pivot deviant and store; And
After the production run of described printed circuit board (PCB) begins, ask described and the pivot of head is installed and is stored departure with described deviant.
The invention relevant with the installation method of the 2nd electronic unit is characterised in that in the 1st invention, based on the described departure of described storage, the result that the identification of later electronic unit is handled proofreaies and correct.
The invention relevant with the erecting device of the 3rd electronic unit be characterised in that, based on the described departure of the described storage of record in the 1st invention, is installed on the printed circuit board (PCB) after the result that the identification of later electronic unit is handled proofreaies and correct.
The 4th invention is characterised in that, take by being arranged on the electronic unit that the rotatable holding member of installing on the head keeps by the component identification video camera, take the identification marking that is attached on the printed circuit board (PCB) by board recognition camera, and the result who has carried out the identification processing based on two images to these shootings, electronic unit is installed in the installation method of the electronic unit on the printed circuit board (PCB), comprises:
Before the production run of described printed circuit board (PCB) begins, ask in advance with respect to described in the design install head pivot the 1st deviant and store;
Before the production run of described printed circuit board (PCB) begins, ask the 2nd deviant of described board recognition camera and store;
After the production run of described printed circuit board (PCB) begins, ask described and the pivot of head is installed and is stored departure with described the 1st deviant; And
After the production run of described printed circuit board (PCB) begins, ask the deviant of described board recognition camera and store departure with described the 2nd deviant.
The invention relevant with the installation method of the 5th electronic unit is characterised in that, in the 4th invention, based on described storage and departure described the 1st deviant and with the departure of described the 2nd deviant, the result that the identification of later electronic unit is handled proofreaies and correct.
The invention relevant with the erecting device of the 6th electronic unit is characterised in that, based on described storage and the departure described the 1st deviant of record in the 4th invention and with the departure of described the 2nd deviant, be installed on the printed circuit board (PCB) after the result that the identification of later electronic unit is handled proofreaies and correct.
The present invention can tackle the unit temp of variation and improve the installation accuracy of electronic unit.
Description of drawings
Fig. 1 is the general view of electronic component mounting apparatus.
Fig. 2 is the summary longitudinal sectional drawing of lighting device.
Fig. 3 is the plane graph of lighting device.
Fig. 4 is the A-A profile of Fig. 3.
Fig. 5 is the controlling party block diagram.
Fig. 6 is the flow chart relevant with the demonstration of the pivot of an installation of carrying out before production at printed circuit board (PCB) begins 6.
Fig. 7 is the flow chart relevant with the demonstration of the position of the device benchmark sign of carrying out before production at printed circuit board (PCB) begins.
Fig. 8 is the figure of the expression flow chart relevant with the temperature-compensating demonstration.
Fig. 9 is the figure of the expression flow chart relevant with the timing of temperature-compensating demonstration.
Figure 10 is the key diagram of temperature-compensating demonstration.
Label declaration
1 electronic component mounting apparatus
2 conveyers
3 component supplying apparatus
3B parts feeding unit
4 arms
5 adsorption mouth
6 install head
8 board recognition camera
20 component identification video cameras
26 device reference feature
27 device benchmark signs
30 control microcomputers
31 operation microcomputers
35 images are handled microcomputer
Embodiment
Below based on Fig. 1 explanation the execution mode of the electronic component mounting apparatus 1 of electronic unit is installed at printed circuit board (PCB) P.Be provided with in the electronic component mounting apparatus 1 conveyer 2 that transports printed circuit board (PCB) P, supplies electrons parts component supplying apparatus 3, can be by y-axis motor 42 at one reverse (Y-direction) mobile a pair of arm 4A, 4B, have adsorption mouth and 5 along moving and rotatable installation 6 by X-axis motor 43 on the direction (directions X) of described each arm 4A, 4B respectively.
That is, the described installation that sets at described arm 4A, 4B 6 is called as high-speed type head is installed, install on 6 by each spring push up downwards, for example 12 holding members are that adsorption mouth 5 sets with predetermined distance on circumference.
And, adsorption mouth 5 can be by spindle motor 46 lifting via drive circuit 45 drivings up and down, and installing 6 drives via drive circuit 47 and around vertical axle rotation by θ spindle motor 48, the result, each is installed each adsorption mouth 5 of 6 and can move to directions X and Y-direction, can rotate around vertical line, and can be up and down.
Described conveyer 2 is provided in the mid portion of the front and back of electronic component mounting apparatus 1, by the circuit board supply department that receives printed circuit board (PCB) P from upstream side device (being positioned at the left of Fig. 1), for be installed in described each electronic unit that 6 adsorption mouth 5 absorption keep is installed and to from the circuit board location division of the printed circuit board (PCB) P positioning and fixing of circuit board supply department supply and receive by the printed circuit board (PCB) P of electronic unit being installed and the circuit board discharge portion that is transported to downstream device (being positioned at the right-hand of Fig. 1) constitutes in this location division.
Described component supplying apparatus 3 is provided in respectively on the front side and inboard two outsides of described Handling device 2, by the charging base on the apparatus main body that is installed in electronic component mounting apparatus 1 (feeder base) 3A, will a plurality of parallel settings on this charging base the various electronic units parts feeding unit 3B fabric that is supplied to this parts absorption extracting position one by one respectively become.
And, a pair of described arm 4A, the 4B in front and back that on directions X, grows, by the driving of y-axis motor 42, the guide rod (guide) that extends along the front and back of pair of right and left at the fixing slide block (slider) of described each arm 4A, 4B slides, thereby moves to Y-direction separately.Described y-axis motor 42 is made of linear motor, and this linear motor is made up of the rotor 42A that fixes along the bottom of the fixing a pair of stator up and down of substrate 1A, the 1B of pair of right and left, the mounting panel that arranges at the both ends of described arm 4A, 4B.
In addition, on the length direction (directions X) of described arm 4A, 4B, the described installation of moving along guide rod by X-axis motor 43 6 is separately positioned on interior survey, described X-axis motor 43 is made of linear motor, and this linear motor is by at a pair of stator in the fixing front and back of each arm 4A, 4B, between each stator and the rotor that is arranged in the described installation 6 is formed.
Thereby, each install 6 be arranged on each arm 4A, 4B the inboard and face-to-face, mobile above the parts absorption extracting position of the printed circuit board (PCB) P on the location division of described conveyer 2 or parts feeding unit 3B.
In addition, each is installed 6 and is provided with board recognition camera 8, takes the positioning mark that is attached on the oriented printed circuit board (PCB) P.Based on the position of the positioning mark of being taken by this board recognition camera 8, thus the installation site shown in the installation data of the reference position grasp electronic unit of grasp printed circuit board (PCB).And, consistent and board recognition camera 8 is provided in a front portion of 6 is installed in order to make the Y direction that a pivot of 6 and the center of board recognition camera 8 are installed, but also can be provided in the rear portion of installation 6.The 10th, electronic component mounting apparatus 1 is provided with 4 lighting unit, to the electronic unit irradiating illumination light of each adsorption mouth 5 absorption maintenance.
Below, based on Fig. 2 to Fig. 4, be described in detail described lighting unit 10.The apparatus main body 11 of lighting unit 10, its profile presents rectangular shape, and part is formed with to overlook and presents circle and along with downward and through hole 12 that diameter diminishes in the central.And, top at the inner peripheral surface of this through hole 12, when the electronic unit D that keeps when 5 absorption of described adsorption mouth is BGA (Ball Grid Array), along whole described inner peripheral surface at a plurality of row of horizontal row, for example 4 list parallel a plurality of BGA illuminating LEDs (Light Emitting Diode that arranges; Light-emitting diode) 15, this BGA illuminating LED under the state that tilts to the BGA indirect illumination lamp of electronic unit D irradiating illumination light.Namely, be on the installation portion 13A of topmost of L word shape to tilt for along with the printed circuit board (PCB) 14A that ring-type is installed near the state at center downwards in the cross section, and through a plurality of row of horizontal row, horizontal 4 of (horizontal direction) row (4 row of above-below direction) for example, be provided with a plurality of BGA illuminating LEDs 15 so that predetermined distance is parallel at this printed circuit board (PCB) 14A.
In addition, below the installation portion 13A of described topmost, form the diameter installation portion 13B littler than installation portion 13A, with the state along with the inclination of the angle about 15 degree of also will falling downwards and near the center and than described printed circuit board (PCB) 14A the printed circuit board (PCB) 14B of ring-type is being installed on this installation portion 13B, at this printed circuit board (PCB) 14B through a plurality of row of horizontal row, horizontal 3 of (horizontal direction) row (3 row of above-below direction) for example, with the parallel general indirect illumination LED16 that is provided with a plurality of general indirect illumination lamps of predetermined distance.
In addition, below described installation portion 13B, form the diameter installation portion 13C also littler than installation portion 13B, with the state along with the inclination of the angle about 15 degree of also will falling downwards and near the center and than described printed circuit board (PCB) 14B the printed circuit board (PCB) 14C of ring-type is being installed on this installation portion 13C, through a plurality of row of horizontal row, horizontal 3 of (horizontal direction) row (3 row of above-below direction) for example, be provided with a plurality of general indirect illumination LED16s so that predetermined distance is parallel at this printed circuit board (PCB) 14C.
And then, below described installation portion 13C, form the diameter installation portion 13D also littler than installation portion 13C, with the state along with the inclination of the angle about 15 degree of also will falling downwards and near the center and than described printed circuit board (PCB) 14C the printed circuit board (PCB) 14D of ring-type is being installed on this installation portion 13D, through a plurality of row of horizontal row, horizontal 3 of (horizontal direction) row (3 row of above-below direction) for example, be provided with a plurality of general indirect illumination LED16s so that predetermined distance is parallel at this printed circuit board (PCB) 14D.
The 17th, the transillumination LED that installs at printed circuit board (PCB) 14E, printed circuit board (PCB) 14E is provided in respectively in the installing space that forms on 4 corners of the apparatus main body that presents the Nogata shape 11 of foreign side of described BGA illuminating LED 15, the diffuser plate irradiates light that 18 pairs of described adsorption mouth 5 of each peristome that transillumination is offered via the end face 11A at apparatus main body 11 with LED are fixed, the electronic unit D that its reverberation keeps from 5 absorption of top irradiation adsorption mouth.
In addition, below the central portion of described lighting unit 10, be equipped with component identification video camera 20, be equipped with lens 21, pellicle mirror (half mirror) 22 and lens 23 in the top position of this component identification video camera 20, these lens 23 are configured to towards the through hole 12 of the apparatus main body 11 of lighting unit 10.And, half amount sees through and half amount reflection back rising by described pellicle mirror 22 with the light of LED25 irradiation from being installed in coaxial-illuminating on the printed circuit board (PCB) 14F, thereby shine via lens 23 on the electronic unit D of adsorption mouth 5 absorption maintenances, its reflection image is taken by component identification video camera 20 via lens 21, pellicle mirror 22 and lens 23.
In addition, the 26, the 26th, the device reference feature of the electronic component mounting apparatus 1 that forms except transparent device benchmark sign 27 the coating evaporation being become black on the glass plate is provided in the front and back of described lighting device 10 respectively.And the light of a benchmark sign illuminating LED 28 shines corresponding device reference feature 26 from the below, and the transmission picture of device benchmark sign 27 is taken by board recognition camera 8.And, before and after the electronic unit that keeps of adsorption mouth 5 absorption of the installation that arranges among any arm 4A, 4B before and after can both taking of any component identification video camera 20 6, the device benchmark sign 27 of inboard device reference feature 26 is taken by the board recognition camera 8 on the arm 4B of side in front of being arranged on, and the device benchmark of the device reference feature 26 of front side sign 27 is taken by the board recognition camera 8 that is arranged on the inboard arm 4A.
Thereby, as described later, 10 pairs of lighting units described each the electronic unit irradiating illumination light that 6 adsorption mouth 5 absorption keep is installed, take and identify processing by each component identification video camera 20, thereby grasp the position deviation for the pivot of adsorption mouth 5.
Below, based on Fig. 5 of the controlling party block diagram of controlling as the shooting of electronic unit, following explanation.At first, the 30th, the control microcomputer of the control device of the action that the unified control of conduct is relevant with the parts installation action etc. (below, be called " control microcomputer "), the parts installation action refers to that the printed circuit board (PCB) P in electronic component mounting apparatus 1 installs the action of electronic unit, the control microcomputer comprises CPU (CPU), ROM (read-only memory), RAM (random access memory), CPU carries out installing with parts the control of relevant action based on the data of storing among the RAM according to program stored in described ROM.Stored among the described RAM expression by each erection sequence electronic unit to the NC data (installation data) of the installation coordinate of printed circuit board (PCB) P, as part library (library) data of the feature of electronic unit, to have carried out optimized erection sequence data for boosting productivity based on described NC data be optimization data etc.
The 31st, operating personnel's operation microcomputer (below, be called " operation microcomputer "), comprise CPU, ROM, RAM, and aforesaid NC data, part library data, optimization data etc. have been stored, input units 33 such as the touch panel switch that has connected performance monitor 32 on this operation microcomputer 31 and in this monitor 32, shown, keyboard, mouse.
The 35th, as the image of image processing apparatus handle microcomputer (below, be called " image processing microcomputer "), comprise CPU, ROM, RAM, and stored aforesaid part library data, the position data (determining the position data of image acquisition board recognition camera 8 regularly) etc. of board recognition camera 8 when obtaining image.
In addition, described control microcomputer 30, operation microcomputer 31 and image are handled microcomputer 35 and are not necessarily wanted independent, also can realize that these control microcomputers 30, operation microcomputer 31 and image handle the function of microcomputer 35 by one or two microcomputers.
And described control microcomputer 30, operation microcomputer 31 and image are handled microcomputer 35 and are connected via LAN circuit 36 and hub 37.In addition, the X-axis servo amplifier 38 that is used for X-axis motor 43, the Y-axis servo amplifier 39 that is used for y-axis motor 42 have been connected on the described control microcomputer 30.
The 40th, comprise the position monitoring circuit of memory unit, from the described X-axis motor 43 that drives, pulse signal that y-axis motor 42 (all having encoder functionality) input is equivalent to displacement and with the position data (position data of the board recognition camera 8 when obtaining image of board recognition camera 8, being stored in image handles in the microcomputer 35) when consistent, image acquisition circuit 41 is sent the position consistency signal.The image acquisition circuit 41 of receiving the position consistency signal outputs to board recognition camera 8 and component identification video camera 20 with the image acquisition signal and makes its exposure, and light a side's of lighting unit 10 benchmark sign illuminating LED 28 and various illuminating LED with the pattern of regulation, the image that obtains (shooting) device benchmark sign 27 and 6 (electronic units) are installed.
Then, as described later, the view data of the image of being taken by board recognition camera 8, component identification video camera 20 is delivered to image and is handled microcomputer 35 via image acquisition circuit 41, identify processing, thereby grasp the position deviation for adsorption mouth 5.
Here, below based on Fig. 6 and Figure 10, explanation in the manufacturing works of the generation factory of the printed circuit board (PCB) of electronic component mounting apparatus 1 or electronic component mounting apparatus 1, the demonstration (demonstration in advance) of the pivot of the installation of carrying out during adjustment before the production of printed circuit board (PCB) begins 6.At first, job management person adjusts and makes that the optical axis of component identification video camera 20 is consistent with the optical axis of board recognition camera 8.That is, correcting unit is identified the optical axis of video camera 20 with respect to the departure from design load of the optical axis of board recognition camera 8, thereby makes the X of two optical axises, the reference position of Y-direction (origin position) unanimity.
Then, job management person's input device 33 mobile installs 6, makes that the pivot of the installation 6 in the design is consistent with the center of component identification video camera 20.Thereby, on the pivot (design load) of installation in design 6 and the center consistent location of component identification video camera 20, a position of 6 be fixed (make install 6 stop) being installed.
Install on 6 position of fixing at this, job management person operates described input unit 33, drive θ spindle motor 48 via drive circuit 47, when carrying out repeatedly that repeatedly a plurality of adsorption mouth 5 are being adsorbed the each rotation predetermined angular of the installation 6 of state of the glass fixture (jig) of having identification marking, taken the work of the identification marking of described glass fixture by component identification video camera 20, image is handled microcomputer 35 image of these shootings is identified processing, thereby based on its identification result, control microcomputer 30 is obtained and a pivot (demonstration in advance) of 6 is installed and is stored in the memory unit of self.
The pivot of this installation of obtaining and storing 6 is from the X of pivot in the horizontal plane in 6 the design, the departure of Y-direction (deviant of 6 pivot is installed) are installed.
The device benchmark that carries out when based on Fig. 7 and Figure 10 same adjustment the production of printed circuit board (PCB) begins before being described on the other hand, identifies the demonstration of 27 position.At first, based on picture displayed in the performance monitor 32, job management person adjusts, and makes that the pivot of actual installation 6 is consistent with the center of component identification video camera 20.Namely, operation based on input unit 33, operation microcomputer 31 is via control microcomputer 30 control X-axis motor 43 and y-axis motors 42, thereby mobile install 6, make the pivot of installation 6 of the reality obtained by the operation of Fig. 6 come component identification video camera 20 in the heart, adjust then and make that the pivot of actual installation 6 is consistent with the center of component identification video camera 20.
Under the pivot of the installation that makes this reality 6 state consistent with the center of component identification video camera 20, board recognition camera 8 is taken the device benchmark sign 27 that arranges in device reference feature 26, and identify 27 by the device benchmark that image is handled 35 pairs of this shootings of microcomputer and identify processing, based on its identification result, control microcomputer 30 ask device benchmark sign 27 on the shooting picture of board recognition camera 8, be the position of initial point with the picture center, and it is stored in the memory unit of self.
As the position (demonstration in advance) of the device benchmark of this identification result sign 27 become the departure that begins from the center of board recognition camera 8, namely this position deviation amount is that to install benchmark sign 27 be the deviant of the board recognition camera 8 of benchmark.
The installation and operation of electronic unit on printed circuit board (PCB) P after the demonstration more than having carried out during the adjustment of explanation before the production of printed circuit board (PCB) P begins.At first, control microcomputer 30 reads in the required NC data (installation data) of the production run of the printed circuit board (PCB) P that stores among its RAM and optimization data etc.Then, the beginning production run, if printed circuit board (PCB) P is received and is present in the circuit board supply department of conveyer 2 from upstream side device (not shown), then the printed circuit board (PCB) P in this circuit board supply department is moved to the circuit board location division, it is fixing that this printed circuit board (PCB) P is positioned the back.
Then, if printed circuit board (PCB) P is positioned, then according to NC data (installation data), for example Li Ce arm 4A is mobile in Y-direction by the driving of y-axis motor 42, and install 6 mobile at directions X by X-axis motor 43, after above the parts extracting position of the parts feeding unit 3B of the electronic unit of the step number 0001 that moves to supply NC data, reduce adsorption mouth 5 by the driving of spindle motor up and down, thereby take out electronic unit from parts feeding unit 3B.At this moment, when directions X is mobile, make its rotation by installing 6, and each adsorption mouth 5 is carried out lifting, thereby a plurality of adsorption mouth 5 can be taken out 12 electronic units at most from parts feeding unit 3B in succession.
In addition, after the adsorption mouth 5 of the installation by the inboard 6 has been taken out electronic unit, when perhaps taking out, the arm 4B of front side is mobile in Y-direction by the driving of y-axis motor 42, and the installation of front side 6 is mobile at directions X by X-axis motor 43, after above the parts extracting position that moves to corresponding components feeding unit 3B, reduce adsorption mouth 5 by the driving of spindle motor up and down, thereby can take out electronic unit from parts feeding unit 3B.
Then, after taking-up, raise two 6 adsorption mouth 5 is installed, thereby begin to obtain image by component identification video camera 20.At this moment, control microcomputer 30 is generated as that to boost productivity and carried out optimized erection sequence data based on described NC data be the optimization data.
At this moment, under the situation that the flight (fly) of taking when absorption is keeping the adsorption mouth 5 of the electronic unit that should take to move is taken, control microcomputer 30 is in order to make location matches component identification video camera 20 the position in directions X of the installation that should take 6 in directions X, thereby make this installations 6 in the directions X movement via X-axis with servo amplifier 38 control X-axis motors 43, thereby the center configuration that 6 pivot and component identification video camera 20 will be installed is on identical Y-axis line.
After this configuration, 30 pairs of images of control microcomputer are handled the microcomputer 35 outputs order relevant with image acquisition.Then, fly and take identification, component identification video camera 20 and arm 4A or 4B are designated, and the position of the installation of specified arm 4A or 4B 6 in Y-direction is monitored.
Namely, the top of the component identification video camera 20 of inboard or front side is passed through in the installation of inboard installation 6 or front side 6 by the drivings of the y-axis motor 42 of arm 4A or 4B, but before it passes through, location matches inboard or the installation of front side 6 the position in Y-direction of the board recognition camera 8 that makes this inboard or front side in Y-direction, therefore after position monitoring circuit 40 is imported the pulse signal of the distance that moves from the expression of y-axis motor 42, if it is consistent with the position data of board recognition camera 8 (position data that the position that sets of board recognition camera 8 has been added the described deviant of the board recognition camera 8 when adjusting), then image acquisition circuit 41 is sent the position consistency signal, the image acquisition signal is outputed to board recognition camera 8 and component identification video camera 20 to the image acquisition circuit 41 of receiving this position consistency signal so that its exposure, and light a side's of lighting unit 10 benchmark sign illuminating LED 28 and various illuminating LED simultaneously.
At this moment, lighting unit 10 is when a side benchmark sign illuminating LED 28 is lighted, and BGA illuminating LED 15, general indirect illumination are lighted with the light illumination mode of regulation with LED25 with LED17, coaxial-illuminating with LED16, transillumination.
Thereby, carry out the image acquisition of device benchmark sign 27 and electronic unit simultaneously, be sent to image with the image-related view data of taking from image acquisition circuit 41 and handle microcomputer 35, carry out the identification of device benchmark sign 27 and electronic unit and handle, the identification result is handled microcomputer 35 from image and is sent to control microcomputer 30.
At this moment, device benchmark sign 27 is carried out location recognition to grasp the position of device benchmark sign 27, because being installed, the fixed distance between the center of 6 pivot and board recognition camera 8 grasped, therefore by adding from departure that the pivot in 6 the design is installed (deviant of the pivot of the installation during aforesaid adjustment 6), can grasp a position of 6 is installed, and by electronic unit is identified processing, as a result of can grasp electronic unit for the position that 6 (adsorption mouth 5) are installed.
Therefore, the installation coordinate of the electronic unit of 30 pairs of NC data of control microcomputer adds the position recognition result of each electronic unit, thus adsorption mouth 5 one side correction position deviations, Yi Bian respectively electronic unit is installed on the printed circuit board (PCB) P.Namely, about X and Y-direction by y-axis motor 42, the X-axis motor 43 corresponding with each arm 4A or 4B, then pass through the θ spindle motor about setting angle, as a result of, each is installed each adsorption mouth 5 of 6 and has proofreaied and correct XY direction and setting angle, adsorption mouth 5 is the correction position deviation on one side, on one side each electronic unit is installed on the printed circuit board (PCB) P.
But, follow the temperature of the electronic component mounting apparatus 1 that causes because of the installation and operation that continues electronic component mounting apparatus 1 to rise, install 6 and linear scale (linear scale) the device each several part thermal expansion of etc.ing and fasten the generation deviation in a pass, position of installing 6 etc., the deviant of the pivot of the installation of the demonstration result that carries out during adjustment before therefore relying on production based on the printed circuit board (PCB) of electronic component mounting apparatus 1 to begin 6, can't tackle the unit temp of variation, the installation accuracy instability of electronic unit.
Therefore, in the production run of the printed circuit board (PCB) of Fig. 8 and electronic component mounting apparatus as shown in Figure 10, carry out demonstration for temperature-compensating automatically.At first, mobile install 6, the pivot of an installation that the demonstration that makes the center of component identification video camera 20 carry out when production by printed circuit board (PCB) begins preceding adjustment is obtained 6 is consistent.
Then, repeatedly carry out repeatedly driving θ spindle motor 48 via drive circuit 47, when being installed 6 each rotation predetermined angulars, this is taken the work of adsorption mouth 5 by component identification video camera 20, image is handled microcomputer 35 image of these shootings is identified processing, thereby based on its identification result, control microcomputer 30 is obtained a pivot of 6 is installed, thereby the departure (the pivot difference Δ of head is installed) of the pivot of the installation that the pivot of asking the installation obtained 6 in this temperature-compensating demonstration is obtained with respect to the demonstration of carrying out when producing the adjustment before the beginning 6, and it is stored in the memory unit of self.
In addition, under the pivot of an installation that the demonstration of carrying out during adjustment before the production that makes the printed circuit board (PCB) by electronic unit 1 begins is obtained 6 state consistent with the center of component identification video camera 20, carry out the temperature-compensating demonstration.Namely, board recognition camera 8 is taken the device benchmark sign 27 that arranges in device reference feature 26, image is handled the device benchmark sign 27 of 35 pairs of these shootings of microcomputer and is identified processing, controls to be stored in the memory unit of self microcomputer 30 is asked the position of device benchmark sign 27 based on this identification result after.
Then, control microcomputer 30 asks the position of the device benchmark sign of obtaining in this temperature-compensating demonstration 27 with respect to the departure (device benchmark sign alternate position spike Δ) of the position of the sign of the device benchmark of obtaining in the demonstration before production run begins 27, and it is stored in the memory unit of self.
Thereby, departure according to the position of the departure of the pivot of the installation of being obtained by above temperature-compensating demonstration 6 and device benchmark sign 27, it is the departure (temperature-compensating demonstration result) of pivot of the installation 6 of benchmark that control microcomputer 30 is asked optical axis with board recognition camera 8, it is stored in the memory unit of self, and the departure that will store be demonstration result apply flexibly later electronic unit installation the time component identification handle.And, carry out this temperature-compensating demonstration as required, during the component identification of carrying out during the installation of electronic unit is afterwards handled, calculate electronic unit with respect to a position deviation (for the position deviation of the position that should install) of installing 6 based on the pivot of an installation of in up-to-date temperature-compensating demonstration result, obtaining 6.Proofread and correct this identification result for after 6 position deviation is installed, being installed on the position that should install of electronic unit carried out.Therefore, suitably tackle the unit temp that changes, can improve the installation accuracy of electronic unit.
Below, based on the flow chart of Fig. 9, the timing of carrying out aforesaid temperature-compensating demonstration is described.At first, job management person's pressing operation the touch panel switch 36 that shows at monitor 35 namely move the beginning switch portion and production run when beginning, judge the demonstration condition 1 that whether satisfies for temperature-compensating by operation microcomputer 31.At this moment, the interval setting-up time that demonstration condition 1 is namely demonstrated is not being set at first as yet, if but surpass setting-up time at interval, then judge by operation microcomputer 31.
Thereby, control by operation microcomputer 31, to carry out aforesaid temperature-compensating demonstration.Departure according to the position of the departure of the pivot of the installation of being obtained by this temperature-compensating demonstration 6 and device benchmark sign 27, it is after the departure of pivot of installation 6 of benchmark it to be stored in the memory unit of self that control microcomputer 30 is asked optical axis with board recognition camera 8, and during the component identification the during installation that this demonstration result is applied flexibly later electronic unit handles.
Then judge whether satisfy demonstration condition 2 by operation microcomputer 31.That is, judge by operation microcomputer 31 demonstration condition 2 is whether production run stopped more than 5 minutes, wait for perhaps the state of the printed circuit board (PCB) P that electronic unit should be installed is whether to have passed through more than 5 minutes the stand-by period.
At this moment, for example do not stop more than 5 minutes or do not wait for printed circuit board (PCB) more than 5 minutes, then operate microcomputer 31 and control to set change 2.Namely, if the difference of the departure of the pivot of an installation of obtaining in the departure of the pivot of the installation of obtaining by up-to-date temperature-compensating demonstration 6 and last, the i.e. demonstration before production run begins 6 is not more than 50 μ m of predefined determinating reference, then do not set change especially, if and greater than 50 μ m, then removing history and the interval of will demonstrating changed to 1 minute.
Then, be controlled to be set the change 2 after, be controlled to be set the change 3.Namely, departure at the pivot that is judged to be the installation obtained by up-to-date temperature-compensating demonstration 6 by operation microcomputer 31 is historical with demonstration, namely except up-to-date temperature-compensating demonstration up-to-date past for example the difference of the mean value of the departure of the pivot of the installation in 5 times the temperature-compensating demonstration 6 greater than 20 μ m of predefined determinating reference, perhaps under the situation of historical less than 5 times, do not set change.In addition, departure at the pivot that is judged to be the installation obtained by up-to-date temperature-compensating demonstration 6 by operation microcomputer 31 is historical with demonstration, namely except up-to-date temperature-compensating demonstration up-to-date past for example the difference of the mean value of the departure of the pivot of the installation in 5 times the temperature-compensating demonstration 6 less than under 20 μ m and the situation greater than 10 μ m of predefined determinating reference, to demonstrate changed to 5 minutes at interval, vacated the interval of demonstration.And then, under the situation of difference less than 10 μ m of the mean value of the departure of the pivot of the installation in the departure of the pivot that is judged to be the installation obtained by up-to-date temperature-compensating demonstration 6 by operation microcomputer 31 and demonstration history 6, to demonstrate changed to 30 minutes at interval, further vacated the interval of demonstration.
In addition, above each determinating reference and demonstration are at interval according to the installation accuracy of desired electronic unit and difference is set after can selecting arbitrarily.
And, after the control of having carried out this setting change 3, turn back to initial.At this moment, or demonstration setting-up time setting as yet at interval, or demonstration interval setting-up time was set to 1 minute or 5 minutes or 30 minutes when removing demonstration history, therefore then do not carry out secondary temperature-compensating demonstration if set as yet, as long as do not satisfy demonstration condition 2, just carry out aforesaid setting change 2 and 3.In addition, demonstration at interval setting-up time be set under the situation of 1 minute or 5 minutes or 30 minutes, whenever carrying out the temperature-compensating demonstration during setting-up time at interval through this demonstration, as long as do not satisfy demonstration condition 2, just carry out aforesaid setting change 2 and 3.
If carry out the temperature-compensating demonstration like this, then the difference of the mean value of the departure of the pivot of the installation in the departure of the pivot of the installation of obtaining by up-to-date temperature-compensating demonstration 6 and the demonstration history 6 will diminish, and setting-up time is elongated gradually at interval in demonstration.
In addition, satisfy demonstration condition 2 if be judged to be, the parts installation and operation that is electronic component mounting apparatus 1 stopped more than 5 minutes, wait for that perhaps the time of printed circuit board (PCB) is (if fruit has printed circuit board (PCB) then can carry out the installation of electronic unit, but owing to the time that does not have printed circuit board (PCB) to wait for) through more than 5 minutes, then carry out foregoing temperature-compensating demonstration.
And after this was carried out, will demonstrating at interval when setting change 1, i.e. removing execution history, setting-up time changed to 1 minute.Thereby, outside the little situation of the difference of the mean value of the departure of the pivot of the installation in the departure of the pivot of the installation of obtaining by up-to-date temperature-compensating demonstration 6 and the demonstration history 6, under big situation, carry out the temperature-compensating demonstration continually, thereby described difference diminishes rapidly at short notice, makes demonstration interval setting-up time be changed to the long time.
As mentioned above, the present invention tackles the unit temp of variation, by carrying out the temperature-compensating demonstration, can improve the installation accuracy of electronic unit.
Embodiments of the present invention as above have been described like that, but those skilled in the art can carry out various alternatives, correction or distortion based on above-mentioned explanation, the present invention comprises aforesaid various alternative, correction or distortion in the scope that does not break away from its aim.
Claims (2)
1. the installation method of an electronic unit, take by being arranged on the electronic unit that the rotatable holding member of installing on the head keeps by the component identification video camera, take the identification marking that is attached on the printed circuit board (PCB) by board recognition camera, and the result who has carried out the identification processing based on two images to these shootings, electronic unit is installed on the printed circuit board (PCB), this installation method is characterised in that
Before the production run of described printed circuit board (PCB) begins, in advance realistic border described pivot that head is installed install with respect to described in the design head pivot the 1st deviant and store,
Before the production run of described printed circuit board (PCB) begins, under the pivot of the installation head that makes this reality state consistent with the center of component identification video camera, asking to install the benchmark sign stores as the 2nd deviant of the described board recognition camera of benchmark
After the production run of described printed circuit board (PCB) begins, the pivot of the installation head that the demonstration of carrying out when making the center of component identification video camera with adjustment before production by printed circuit board (PCB) begins is obtained is consistent, ask the described pivot that head is installed again, thereby the departure of the pivot of the installation head that the pivot of asking the installation head of obtaining in this temperature-compensating demonstration is obtained with respect to the demonstration of carrying out when producing the adjustment before the beginning is stored
After the production run of described printed circuit board (PCB) begins, under the pivot of the installation head that the demonstration of carrying out during adjustment before the production that makes the printed circuit board (PCB) by electronic unit begins the is obtained state consistent with the center of component identification video camera, the departure of the position that the position of asking the device benchmark sign of obtaining in this temperature-compensating demonstration identifies with respect to the device benchmark of obtaining in the demonstration production run begins before and storing.
2. the installation method of electronic unit as claimed in claim 1 is characterized in that,
Based on two departures of described storage, the result that the identification of later electronic unit is handled proofreaies and correct.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP178455/09 | 2009-07-30 | ||
| JP2009178455A JP5260435B2 (en) | 2009-07-30 | 2009-07-30 | Electronic component mounting method and electronic component mounting apparatus |
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| CN101990395A CN101990395A (en) | 2011-03-23 |
| CN101990395B true CN101990395B (en) | 2013-08-21 |
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| CN 201010243944 Active CN101990395B (en) | 2009-07-30 | 2010-07-30 | Mounting method of electronic component and mounting device thereof |
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| JP5781975B2 (en) * | 2012-03-30 | 2015-09-24 | ヤマハ発動機株式会社 | Electronic component mounting method and electronic component mounting apparatus |
| CN102711389B (en) * | 2012-05-31 | 2014-09-03 | 昆山市线路板厂 | Component mounting device and method for flexible circuit board |
| JP6181108B2 (en) * | 2014-06-19 | 2017-08-16 | アキム株式会社 | Assembly apparatus and assembly method |
| KR102022472B1 (en) * | 2014-07-04 | 2019-09-18 | 한화정밀기계 주식회사 | Tape adhesion apparatus |
| JP6678503B2 (en) * | 2016-04-20 | 2020-04-08 | ヤマハ発動機株式会社 | Component mounting device, component mounting method, control program for component mounting device, and recording medium |
| CN107610088B (en) * | 2017-07-03 | 2021-05-04 | 刘胜贤 | Circuit board identification method and system |
| CN111897062B (en) * | 2020-07-28 | 2022-03-08 | 武汉电信器件有限公司 | Optical path coupling method and device and storage medium |
| CN115383766B (en) * | 2022-10-27 | 2022-12-27 | 广东机电职业技术学院 | Special operation cantilever manipulator system |
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| CN101026952A (en) * | 2006-02-16 | 2007-08-29 | 重机公司 | Electronic component mounting method and device |
| CN101252827A (en) * | 2007-02-19 | 2008-08-27 | 富士机械制造株式会社 | Electronic circuit parts mounting device and precision checking unit |
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| JP2003101296A (en) * | 2001-09-20 | 2003-04-04 | Yamagata Casio Co Ltd | Component mounter |
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| JP2004186308A (en) * | 2002-12-02 | 2004-07-02 | Matsushita Electric Ind Co Ltd | Device and method for mounting component |
| JP2005159209A (en) * | 2003-11-28 | 2005-06-16 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounter |
| JP4488722B2 (en) * | 2003-11-28 | 2010-06-23 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting apparatus recognition method and recognition apparatus |
| JP2006059953A (en) * | 2004-08-19 | 2006-03-02 | Yamagata Casio Co Ltd | Apparatus and method of mounting electronic part |
| JP2007150267A (en) * | 2005-10-31 | 2007-06-14 | Juki Corp | Correction method for head position of component mounting device, and dummy nozzle |
| JP4715557B2 (en) * | 2006-03-03 | 2011-07-06 | パナソニック株式会社 | Mounting head position correction method and electronic component mounting apparatus |
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| CN101026952A (en) * | 2006-02-16 | 2007-08-29 | 重机公司 | Electronic component mounting method and device |
| CN101252827A (en) * | 2007-02-19 | 2008-08-27 | 富士机械制造株式会社 | Electronic circuit parts mounting device and precision checking unit |
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| JP5260435B2 (en) | 2013-08-14 |
| JP2011035079A (en) | 2011-02-17 |
| CN101990395A (en) | 2011-03-23 |
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