CN101989596B - Thermoelectric module and optical transmission apparatus - Google Patents
Thermoelectric module and optical transmission apparatus Download PDFInfo
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- CN101989596B CN101989596B CN201010241116.6A CN201010241116A CN101989596B CN 101989596 B CN101989596 B CN 101989596B CN 201010241116 A CN201010241116 A CN 201010241116A CN 101989596 B CN101989596 B CN 101989596B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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Abstract
To provide a thermoelectric module that can be arranged in a limited space and is excellent in heat exchange capability, and to provide an optical transmitter comprising the same. A first insulating substrate (21) comprises the following components: a substrate body (21a) with a first opposite surface (21c); and a protruding part (21b) which is integrally formed with the substrate body (21a) on an opposite surface that is at the opposite side of the first opposite surface (21c) and is opposite with an area provided with an electrode. The protruding part (21b) is provided with a thermoelectric conversion element (24) and a connection part (42) connected with a cooled object. The heat generated by the cooled object is efficiently transferred from the protruding part (21b) to a second insulating substrate (22) with the thermoelectric conversion element (24).
Description
Technical field
The present invention relates to have the electrothermal module and light sending device of thermoelectric conversion elements with electrothermal module.
Background technology
Electrothermal module uses thermoelectric conversion elements (for example the amber ear pastes element) to carry out the cooling of device, known all the time various electrothermal modules.For example, the light sending device shown in the patent documentation 1 discloses a kind of electrothermal module (2) with electrothermal module, and it comprises: first insulated substrate (21) with first opposite face (21a); The second insulated substrate (22) with second opposite face (22c) relative with first opposite face; Be formed at a plurality of electrodes (23,25) of first opposite face and second opposite face respectively; Be arranged on a plurality of thermoelectric conversion elements (24) that are connected with a plurality of electrode electricity series connection or electricity between first insulated substrate and the second insulated substrate parallelly connectedly; And the turning circuit that electrode is electrically connected with external power source.
In the electrothermal module shown in the patent documentation 1, first insulated substrate is L word shape, comprising: the base main body portion (210) with first opposite face; And be connected with base main body portion and protuberance (211) that direction that edge and base main body portion intersect is extended, on protuberance, be formed with the stationary plane (21b) that the plane of the direction extension that intersects from the edge and first opposite face begins to form.
Patent documentation 1: TOHKEMY 2008-282987 communique (Fig. 1, Fig. 2)
So in patent documentation 1, thermoelectric conversion elements (24) constitutes, the second insulated substrate (22) that is fixed with laser diode (40) is absorbed heat (cooling), and dispel the heat from base main body portion (210) side of first insulated substrate (21).Further, the heat that sheds from base main body portion (210) is dispelled the heat to the outside via the plane stationary plane (21b) of the protuberance (211) that is connected with base main body portion (210) and extends.But; Because first insulated substrate (21) is L word shape; So as first opposite face (21a) that is provided with the electrode that is electrically connected with a plurality of thermoelectric conversion elements at heat absorption position with as the distance between the stationary plane (21b) of thermal component; Have IC with electrode 71,72 because of inserting in the centre, thus be provided with IC with the zone of electrode 71,72 accordingly away from.Therefore the heat that is produced by thermoelectric conversion elements is far away to the distance change of the stationary plane (21b) of heat radiation, and heat conduction is slow.In addition, (21a) compares with first opposite face, because the component specification of light sending device, the area of stationary plane (21b) is restricted, and the area of stationary plane can not be bigger.As a result, can not dispel the heat fully from stationary plane (21b).When making laser diode (40) action that is arranged on the second insulated substrate side, generation can not remain the temperature of laser diode the problem of set point of temperature accurately.
Summary of the invention
So problem of the present invention is to provide the light sending device of the excellent electrothermal module of a kind of heat-exchange capacity electrothermal module excellent with having heat-exchange capacity.
Method as solving above-mentioned problem provides a kind of electrothermal module, and it comprises: first insulated substrate, and it has first opposite face; The second insulated substrate, it has second opposite face relative with above-mentioned first opposite face; A plurality of electrodes, it is formed at above-mentioned first opposite face and above-mentioned second opposite face respectively; And a plurality of thermoelectric conversion elements; It is arranged between above-mentioned first insulated substrate and the above-mentioned the second insulated substrate, and utilizes above-mentioned a plurality of electrode electricity series connection or electricity to connect parallelly connectedly, wherein; Above-mentioned first insulated substrate has: base main body portion, and it is provided with above-mentioned first opposite face; And protuberance; It is integrally formed with the aforesaid substrate main part on the face of the opposition side of above-mentioned first opposite face that is formed with above-mentioned electrode; On this protuberance, be formed with connecting portion; This connecting portion is provided with the cooling object that utilizes above-mentioned thermoelectric conversion elements cooling, and above-mentioned cooling object is dispelled the heat via the above-mentioned the second insulated substrate bigger than aforesaid substrate main part from the heat that above-mentioned cooling object produces by a plurality of above-mentioned thermoelectric conversion elements cooling that is electrically connected with the aforesaid substrate main part.
In this case, can on above-mentioned first insulated substrate, be embedded with the turning circuit that above-mentioned cooling object is switched on, at the inner turning circuit that forms of substrate.
Above-mentioned turning circuit can have with respect to the horizontal turning circuit of above-mentioned first opposite face level formation and the vertical conducting circuit of vertical formation.
In addition, aforesaid substrate main part or raised part can be formed with the temperature measuring element.
In addition, above-mentioned cooling object preferably to the outside send the photodiode of the laser diode of light, the light accepting to send from this laser diode at least any.
A kind of light sending device is provided, and it has above-mentioned electrothermal module; Also have holding member, it has the bottom and is installed on the cap of this bottom, is fixed at above-mentioned electrothermal module that to utilize above-mentioned cap to carry out under the state of above-mentioned bottom airtight; And lead terminal, it is inserted and leads in above-mentioned bottom, to above-mentioned thermoelectric conversion elements power supply, is electrically connected with above-mentioned cooling object.
In this case, above-mentioned cooling object can be to have the optical communication element that sends the photodiode of the laser diode of light, the light accepting to send from this laser diode to the outside.
In addition, can be, above-mentioned first insulated substrate be formed by multilayer, forms the turning circuit that is connected by multilayer, and above-mentioned optical communication element is connected with above-mentioned turning circuit.
According to the present invention; First insulated substrate have base main body portion and with the protuberance of base main body portion one; Be formed with connecting portion at protuberance, this connecting portion is provided with by the cooling object of thermoelectric conversion elements cooling, therefore; Can be following formation: the cooling object be dispelled the heat via the second insulated substrate bigger than base main body portion from the heat that the cooling object produces by a plurality of above-mentioned thermoelectric conversion elements cooling that is electrically connected with base main body portion efficiently.This has utilized area to dispel the heat than the regional big the second insulated substrate of first opposite face that is provided with thermoelectric conversion elements of first insulated substrate; Therefore than prior art; Can be to join than short distance and bigger contact area; Therefore the response of the heat radiation of thermoelectric conversion elements is excellent, and the cooling that can critically cool off object is temperature control.
In this case, if bury turning circuit underground,, then can make turning circuit not be exposed to first opposite face of first insulated substrate at the inner turning circuit that forms of substrate at first insulated substrate.Thus, can make the zone that can dispose thermoelectric conversion elements in first opposite face become wide, can form the excellent electrothermal module of heat-exchange capacity.
In addition; Utilization is embedded in first insulated substrate and the turning circuit with horizontal turning circuit and vertical conducting circuit that forms, and the electrical connection between the first insulated substrate top electrode, the driving of cooling off object are carried out via horizontal turning circuit, vertical conducting circuit.Therefore, can simplify lead and engage (Wire Bonding), and can improve reliability about the electrical connection of substrate inside turning circuit.
In addition; If flatly form turning circuit with first opposite face in substrate inside; And be vertically formed turning circuit with first opposite face, then for example when utilizing ceramic first insulated substrate, the second insulated substrate, turning circuit simultaneously can be shaped in ablating work procedure; Therefore can simplify manufacturing process, realize that cost reduces.
If first insulated substrate is formed by multilayer; The turning circuit that formation is connected by multilayer; Optical communication element is connected by turning circuit; Then the time by ceramic first insulated substrate, in ablating work procedure can by multilayer from the upper strata or lower floor begin to be shaped successively turning circuit, perhaps can be shaped simultaneously by multilayer.
Further, the temperature measuring element is integrally formed in base main body portion or protuberance, thus based on the driving (for example electric current and voltage control) of critically carrying out thermoelectric conversion elements from the signal of temperature measuring element.Therefore, the cooling that can critically carry out around the cooling object of thermoelectric conversion elements is temperature control.Can after in the base main body portion that the temperature measuring element is formed on first insulated substrate in utilization coating, printing etc., on the protuberance, fire first insulated substrate; And the temperature measuring element is set; Therefore can simplify manufacturing process, realize that cost reduces.
In addition, if the cooling object is laser diode, photodiode, then can carry out these coolings of cooling off objects with simple precise structure ground is temperature control.
In addition; If light sending device has electrothermal module, and have bottom and cap, also have and utilize the cap that is fixed with electrothermal module to carry out airtight holding member; With insert lead in the bottom, to the thermoelectric conversion elements power supply, with cool off the lead terminal that object is electrically connected; Then the second insulated substrate is the airtight structure of bottom, partes tegmentalis that is fixed in holding member, and the second insulated substrate joins with short distance, the contact area bigger than the second insulated substrate with holding member thus, therefore dispels the heat via the bottom; So thermal diffusivity is better than prior art, the cooling that can critically cool off object at cooling object adstante febre is temperature control.The light higher than prior art precision that therefore, can carry out blanketing frequency change, output change sends.
In this case; The cooling object is if having the optical communication element of laser diode, photodiode; Then when the driving laser diode, can utilize thermoelectric conversion elements efficiently from the second insulated substrate via the bottom of holding member to dispelling the heat by the heating of the laser diode of driving and generating.Therefore, frequency variation in the time of can suppressing the laser diode driving and output change are so can improve the accuracy of detection of the photodiode that receives this light.
Description of drawings
Fig. 1 is the key diagram that schematically shows the electrothermal module in the embodiments of the invention 1;
Fig. 2 is the sketch map when making the electrothermal module of embodiment 1;
Fig. 3 is the sketch map when making first insulated substrate with two layers;
Fig. 4 is the sketch map when in the structure of Fig. 3, thermistor being set;
Fig. 5 is the sketch map of the variation of first insulated substrate shown in Figure 1;
Fig. 6 is the sketch map with light sending device of electrothermal module; And
Fig. 7 is the sketch map of variation with light sending device of electrothermal module.
The reference numeral explanation
1,11 ... Light sending device; 2,302 ... Electrothermal module; 3 ... Holding member; 4 ... Optical communication element; 21,221,321 ... First insulated substrate; 21a, 221a, 321a ... Base main body portion; 21b, 221b, 321b ... Protuberance; 21c, 221c, 321c ... First opposite face; 22,322 ... The second insulated substrate; 22a, 322a ... Lower surface (face of opposition side); 22c, 322c ... Second opposite face; 23,223,323 ... Electrode; 24 ... Thermoelectric conversion elements; 25,325 ... Electrode; 31 ... The bottom; 40 ... Light-emitting component (cooling object); 42,242,342 ... Light-emitting component is with electrode (connecting portion, light transmitting element); 45 ... Photo detector (light transmitting element); 46,246,346 ... Photo detector is with electrode (light transmitting element); 219d, 219e, 219f, 219e ... Connecting portion; 221d, 321d ... Horizontal turning circuit; 221e, 321e ... The vertical conducting circuit; 344,345 ... Thermistor (temperature measuring element)
Embodiment
Following with reference to description of drawings electrothermal module 2 of the present invention and light sending device 1 with electrothermal module 2.
(embodiment 1)
Fig. 1 schematically shows the electrothermal module 2 of embodiments of the invention 1.Fig. 2 is the key diagram of the situation when schematically showing the electrothermal module 2 of making embodiment 1, and Fig. 5 schematically shows the light sending device 1 that is assembled with electrothermal module 2.
As shown in Figure 1, electrothermal module 2 has first insulated substrate 21, the second insulated substrate 22, a plurality of thermoelectric conversion elements with electrode (below be called electrode) 23,25 and a plurality of thermoelectric conversion elements 24.
First insulated substrate 21 is by the aluminium oxide manufacturing, and cross section as shown in Figure 1 is convex, and first insulated substrate 21 has 21a of base main body portion and protuberance 21b.The 21a of base main body portion is long strip-board shape.Protuberance 21b is connected with the central portion of the long side direction of the 21a of base main body portion, and extend with the direction (the for example thickness of slab direction of the 21a of base main body portion) of the 21a of base main body portion quadrature on the edge.The lower surface of the 21a of base main body portion be provided with have a plurality of blocks thermoelectric conversion elements with electrode (electrode 23).Electrode 23 uses copper, the lower surface of the 21a of base main body portion is carried out plating handle and form.The lower surface 21c of first insulated substrate 21 of the electrothermal module 2 of embodiment 1 is equivalent to first opposite face of electrothermal module of the present invention.In addition, electrode 23 is not limited to copper with electrode 25, also can use nickel, silver, gold etc.
On the other hand, the second insulated substrate 22 is formed by aluminium oxide, is the long strip-board shape bigger than first insulated substrate 21.The upper surface of the second insulated substrate 22 be formed with have a plurality of blocks thermoelectric conversion elements with electrode (electrode 25).Electrode 25 is formed by the copper of the material identical with electrode 23, the upper surface of the second insulated substrate 22 is carried out plating handle and form.The upper surface 22c of the second insulated substrate 22 of the electrothermal module 2 of embodiment 1 is equivalent to second opposite face of electrothermal module of the present invention.First insulated substrate 21 and the second insulated substrate 22 make the first opposite face 21c and the second opposite face 22c with between to leave the state of predetermined distance relative.Between the first opposite face 21c and the second opposite face 22c, be provided with a plurality of thermoelectric conversion elements 24.Thermoelectric conversion elements 24 uses the amber ear to paste element.Thermoelectric conversion elements 24 is electrically connected with electrode 23 at the first surface above shown in Figure 1, and the second surface of thermoelectric conversion elements 24 is electrically connected with electrode 25.Each thermoelectric conversion elements 24 is connected by electrode 23,25 electricity series connection (or parallel connection).The electrode that is connected with two thermoelectric conversion elements 24 at the two ends that are positioned at orientation (for example; The electrode of left end shown in Figure 1 as an example) 250 when being equipped on light sending device 1 shown in Figure 5, via different separately wire bonds 26 and different separately lead terminal 32 electrical connections.This wire bonds 26 constitutes the turning circuit of electrothermal module 2.
The thermoelectric conversion elements 24 of the electrothermal module 2 of embodiment 1; In structure shown in Figure 6; When utilizing not shown external power source to be energized via two terminals (+terminal ,-terminal) in the lead terminal 32, the first surface that then is positioned at the top is lowered the temperature and the second surface intensification of below.Therefore, light-emitting component 40, the photo detector 45 on first insulated substrate 21 of the conduct cooling object stated after can cooling off of thermoelectric conversion elements 24.The second insulated substrate 22 contacts and butt with 31 of bottoms, dispels the heat to the outside than the second insulated substrate 22 big bottoms 31 via area in the heat that second surface produces.
In the electrothermal module 2; The second insulated substrate 22 and this bottom 31 of bottom 31 heat radiations of the holding member 3 of the light sending device 1 that will state backward from the heat of thermoelectric inverting element 24 shown in Figure 6; Compared with prior art amass and join with short distance, large contact surface; Therefore thermal diffusivity is good, and the cooling that can carry out light-emitting component 40, photo detector 46 accurately is temperature control.
The manufacturing approach of above-mentioned electrothermal module 2 then, below is described.
Prepare the aluminium oxide composite material of pulpous state, the cross section shown in shaping Fig. 2 (a) is the middle formed products of first insulated substrate of roughly foretelling word shape (convex).Then; As Fig. 2 (b) after the middle formed products of firing first insulated substrate that is shown in; Plating form a plurality of electrodes 23 be rectangular, and the light-emitting component that is formed at protuberance 21b shown in Figure 1 with electrode 42, photo detector with electrode 46 etc., obtain first insulated substrate 21.Through identical therewith method, prepare the aluminium oxide composite material of pulpous state, the middle formed products of shaping the second insulated substrate.Then, plating forms electrode 25 after the middle formed products of firing the second insulated substrate, obtains the second insulated substrate 22.Then; Shown in Fig. 2 (c); Between the first surface that is formed on electrode 23 and thermoelectric conversion elements 24 on first insulated substrate 21, sandwich the scolder of pasty state, at the second surface of thermoelectric conversion elements 24 and be formed on the scolder that sandwiches pasty state between the electrode 25 on the second insulated substrate 22, the upper surface of the heating plate 90,90 and first insulated substrate 21 and the lower surface of the second insulated substrate 22 are joined; Make melt solder, obtain electrothermal module shown in Figure 12 through welding.
(embodiment 2)
Then, with reference to Fig. 3, explain that making first insulated substrate is two-layer electrothermal module 202.In addition, in embodiment 2, the integrated operation of first insulated substrate 21 and the second insulated substrate 22 is identical with embodiment 1 with the structure of the second insulated substrate, therefore omits explanation, only explanation first insulated substrate different with the structure of embodiment 1.
Shown in Fig. 3 (a), prepare the aluminium oxide composite material of pulpous state, be formed separately the cross section and be middle formed products 219 of first insulated substrate of roughly foretelling word shape (convex) and the middle formed products 220 of flat first insulated substrate.Afterwards; In the middle of first insulated substrate, interconnect the ground break-through on the formed products 219 horizontal turning circuit hole 219d, vertical conducting circuit hole 219e, horizontal turning circuit hole slot 219f are set; And on the formed products 220, horizontal turning circuit hole slot 220f is set in the middle of first insulated substrate below being arranged in the position break-through that overlaps with horizontal turning circuit hole slot 219f.In continuous horizontal turning circuit hole 219d, vertical conducting circuit hole 219e, horizontal turning circuit hole slot 219f, horizontal turning circuit hole slot 220f, filling copper sticks with paste after 51; The middle formed products 220 of the formed products 219 and first insulated substrate is positioned in the middle of first insulated substrate, is fired with the state that lamination is two-layer.At this moment, shown in Fig. 3 (b), horizontal turning circuit 221d, vertical conducting circuit 221e form through firing simultaneously, and light-emitting component forms when firing with electrode 243 etc. with electrode 246, wire bonds with electrode 242, photo detector simultaneously.Fire the back and form electrode 223, obtain first insulated substrate 221 at the first opposite face 221c side plating.In addition, in embodiment 2, electrode 223 uses copper, but is not limited to copper, also can use nickel, silver, gold, palladium etc.In addition, electrode 23,223,25 is not limited to plating, also can be after applying thickener by fire, vapor deposition, sputtering method form.
In embodiment 2; The part of turning circuit (242 among Fig. 3 (b), 221d, 221e, 243) (becomes in first insulated substrate 219 of Fig. 3 (a) position of the part of conducting continuously; Be 219d, 219e, 219f, 219e) be formed in first insulated substrate 221; Therefore can not be exposed to the first opposite face 221c; Form the zone (installation region of thermoelectric conversion elements 24) that is electrically connected with a plurality of thermoelectric conversion elements 24 among the first opposite face 221c and become wide, can form the excellent electrothermal module 202 of heat-exchange capacity.In addition; Be utilized in the part that is electrically connected that the horizontal turning circuit 221d, the vertical conducting circuit 221e that form simultaneously when firing carry out interelectrode electrical connection or electrode and lead terminal 32, therefore can simplify the reliability that lead engages operation and improves electrical connections.
(embodiment 3)
Then, with reference to Fig. 4, electrothermal module 302 is described.In addition; Structure shown in Figure 4 is on the structure of Fig. 3, thermistor 344 to be installed on protuberance 319b; The integrated operation of first insulated substrate and the second insulated substrate and the structure of the second insulated substrate are identical with the foregoing description 1; Therefore omit explanation, only the first different insulated substrate of explanation and embodiment 1.
Shown in Fig. 4 (a), prepare the aluminium oxide composite material of pulpous state, be formed separately the cross section and be middle formed products 319 of first insulated substrate of roughly foretelling the word shape and the middle formed products 320 of flat first insulated substrate.Afterwards; Break-through is provided with horizontal turning circuit hole 319d, vertical conducting circuit hole 319e, horizontal turning circuit hole slot 319f on the formed products 319 in the middle of first insulated substrate; In addition, break-through is provided with horizontal turning circuit hole slot 320f on the middle formed products 320 of first insulated substrate below being arranged on.In continuous horizontal turning circuit hole 319d, vertical conducting circuit hole 319e, horizontal turning circuit hole slot 319f, horizontal turning circuit hole slot 320f, fill copper and stick with paste 51 and fire.
After firing; As the acting thermistor element materials of thermistor 344 apply or the face of the level of printing to the top that is formed on protuberance 319b on after, formed products 319 in the middle of first insulated substrate is carried out lamination with first insulated substrate centre formed products 320 fires.At this moment; Horizontal turning circuit 321d, vertical conducting circuit 321e form simultaneously continuously, and the light-emitting component that forms the side that is arranged on protuberance simultaneously with electrode 342, photo detector with electrode 346, be arranged on wire bonds on the face of the position level lower with electrode 343, thermistor 344 etc. than protuberance 321b.Firing the back, obtain first insulated substrate 321 (Fig. 4 (b)) at first opposite face 321c side plating formation electrode 323.In addition,, be not limited to copper here, also can use nickel, silver, gold etc. though electrode 323 uses copper.
Fig. 4 (c) is that thermistor 345 is not formed on the variation that protuberance 321b upward is formed in the upper surface of the 321a of base main body portion, so the omission explanation identical with Fig. 4 (b) of other structure.
In embodiment 3; The inner turning circuit of substrate and the first opposite face 321c flatly form; And the state vertically to be connected with the first opposite face 321c forms; Thus, in ablating work procedure, can form turning circuit simultaneously, can simplify manufacturing process and reduce cost as first insulated substrate 321 of aluminium oxide.Further, after firing, will apply or be printed on the 321a of base main body portion or after on the protuberance 321b, fire first insulated substrate 321, and therefore, can simplify manufacturing process and reduce cost as the acting thermistor element materials of thermistor 344.
(variation)
Fig. 5 is another variation.Fig. 5 (a) make the 21a of base main body portion of first insulated substrate 21 that constitutes electrothermal module 2 shown in Figure 1 be multilayer (here; Represent to have three layers base main body portion 216～218 as an example); In each layer 216～218 through method same as the previously described embodiments; Formation has the turning circuit 48,49 of horizontal turning circuit, vertical conducting circuit, form the protuberance 21b of first insulated substrate 21 and the uppermost electrode of the 21a of base main body portion as connecting portion (for example light-emitting component with electrode 42, photo detector with electrode 46, electricity drive be arranged on light-emitting component with the light-emitting component on the electrode, be arranged on photo detector with the electrode pad 511,512 of the photo detector on the electrode etc.).
In addition, shown in Fig. 5 (b), be not only the 21a of base main body portion, also can make protuberance 21b also be two-layer (constituting), in each layer, form turning circuit 48,49 with horizontal turning circuit and vertical conducting circuit by protuberance 21b1 and 21b2.In this case; Shown in Fig. 5 (b); Can with the vertical direction of being extended at protuberance 21b2 on distinguish a pair of electrode pad 513 of conductings with electrode 46 with electrode 42, photo detector with the light-emitting component that is provided with of mode that is arranged in row; As as shown in Fig. 5 (c) of the vertical view of Fig. 5 (b), be arranged on the leading section of the turning circuit 48,49 that becomes コ word shape.Electrode pad 513 via above-mentioned lead terminal 32 drive be arranged on light-emitting component with electrode 42, photo detector with the optical communication device that is called as laser diode, photodiode of electrode 46 and control.
Then, with reference to Fig. 6 the light sending device 1 that wherein is assembled with electrothermal module 2 is described.
Light sending device 1 has optical communication element 4 at least in electrothermal module 2, be arranged in the holding member 3 as housing.At this moment, light sending device 1 preferably has the light receiving unit 5 of the light that reception sent by light transmitting element 4.
Holding member 3 has the cap that bottom tube-like is arranged 30 that is formed by metal (for example SUS etc.) and is the discoideus bottom 31 that is formed by metal (for example iron-nickel-cobalt alloy, copper-tungsten alloy, cold pressing and prolong copper coin etc.).On bottom 31, a plurality of lead terminals 32 through inserting logical bottom 31 with inserting shaping and bottom 31 quadratures.The bottom of each lead terminal 32 and not shown outer electrode (+terminal ,-terminal) or supply power are also controlled the control device that the transmission of light sending device 1 receives and are electrically connected.Also can bottom 31 with cap 30 through weldings such as ultrasonic waves and integrated, the inner space of holding member 3 is sealed and is vacuum state.At this moment; As far as lead terminal 32; On discoideus bottom 31, be respectively arranged with the patchhole suitable with the quantity of lead terminal 32, lead terminal 32 is pressed into each patchhole respectively, afterwards in order to ensure the peripheral sealing of lead terminal; At lead terminal 32 and be formed on and fill dissolving glass between 31 the patchhole of bottom, to guarantee sealing.
In addition, the lower surface 22a of the second insulated substrate 22 is fixed in the inner bottom surface 31a of the bottom 31 of holding member 3 through scolder or thermal conductive adhesive (being mixed with the epoxy resin adhesive of silver etc.) 27.
Light transmitting element 4 have light-emitting component 40, light-emitting component with electrode 42, make turning circuit (being 221d, 221e, 221d, 221e among Fig. 3 (b)) that light-emitting component is electrically connected with external power source with electrode 42 (among Fig. 3 (d) 242), photo detector 45, photo detector with electrode 46, turning circuit that photo detector is electrically connected with external power source with electrode 46.
Light-emitting component 40 for example can use laser diode.Light-emitting component is formed by copper with electrode 42, forms through plating on the side of the face that is convex vertical with the first opposite face 21c in the protuberance 21b of first insulated substrate 21.Light-emitting component 40 is electrically connected with electrode 42 with light-emitting component.Light-emitting component is electrically connected via the upper end of wire bonds 26 with a lead terminal 32 in Fig. 6 with electrode 42.In order to suppress conducting resistance, the material of this wire bonds 26 is gold thread or implements gold-plated processing, constitutes turning circuit.
As shown in Figure 5; In the light sending device that is assembled with electrothermal module 21; The face 22a of the opposition side of the second opposite face 22c of the second insulated substrate 22 is fixed on the inner bottom surface 31a of the bottom 31 of holding member 3; The second insulated substrate 22 joins with short compared with prior art distance, bigger contact area with the bottom 31 of holding member 3, therefore, improves for the thermal diffusivity of the heat that is produced by thermoelectric conversion elements 24.As a result, the cooling that can critically carry out light-emitting component 40 is temperature control, therefore is difficult to frequency of occurrences change, output change, and the light that can improve precision sends.
Then, explanation has the variation of the light sending device 11 of electrothermal module 302 in inside with reference to Fig. 7.
Light sending device 11 has electrothermal module 302, holding member 3 and light transmitting element 4.
Holding member 3 has the cap that bottom tube-like is arranged 30 that is formed by metals such as SUS and is discoideus bottom 31.On bottom 31, a plurality of lead terminals 32 lead to along orthogonal direction is slotting through inserting to be shaped.Control device of the bottom of each lead terminal 32 and not shown external power source (+terminal ,-terminal) or supply power etc. is electrically connected.Bottom 31 and cap 30 have the holding section of mutual engaging, and be integrated through the ultrasonic wave joint.
In addition, the lower surface 322a of the second insulated substrate 322 is bonding with the inner bottom surface 31a of the bottom 31 of holding member 3 through scolder or thermal conductive adhesive (being mixed with the epoxy resin adhesive of silver etc.) 27.
Light transmitting element 4 have light-emitting component 40, light-emitting component with electrode 342, make turning circuit that light-emitting component is electrically connected with external power source with electrode 342, photo detector 45, photo detector with electrode 346, turning circuit that photo detector is electrically connected with external power source with electrode 346.
Light-emitting component 40 for example can be made up of laser diode.Light-emitting component is formed by copper with electrode 342, shown in Fig. 4 (b), (c), forms on the face vertical with the first opposite face 321c in the protuberance 321b of first insulated substrate 321.Light-emitting component 40 is electrically connected with electrode 342 with light-emitting component.Light-emitting component with electrode 342 via light-emitting component with electrode 342, horizontal turning circuit 321d, vertical conducting circuit 321e etc. so that via wire bonds 26 (with reference to Fig. 7 (a) and (b)) to the outside of electrothermal module 302,303 and be electrically connected with the lead terminal 32 shown in Fig. 7 (b).This wire bonds 26, horizontal turning circuit 321d, vertical conducting circuit 321e constitute turning circuit.
In the light sending device 11 of the electrothermal module that is assembled with embodiment 3 302; The face 322a of the opposition side of the second opposite face 322c of the second insulated substrate 322 is fixed on the inner bottom surface 31a of the bottom 31 of holding member 3; The second insulated substrate 322 joins with the short distance of comparing with prior art constructions, bigger contact area with the bottom 31 of holding member 3; Therefore, improve for the thermal diffusivity of the heat that is produced by thermoelectric conversion elements 324, the cooling that can critically carry out light-emitting component 40 is temperature control; Therefore be difficult to frequency of occurrences change, output change, can carry out high-precision light and send.And; Utilization is embedded in the part that is electrically connected that horizontal turning circuit 221d, vertical conducting circuit 221a in first insulated substrate 321 carry out interelectrode electrical connection or electrode and lead terminal, therefore can simplify the reliability that lead engages operation and raising electrical connections.
Claims (8)
1. electrothermal module, it comprises:
First insulated substrate, it has first opposite face;
The second insulated substrate, it has second opposite face relative with said first opposite face;
A plurality of electrodes, it is formed at said first opposite face and said second opposite face respectively; And
A plurality of thermoelectric conversion elements, it is arranged between said first insulated substrate and the said the second insulated substrate, and utilizes said a plurality of electrode electricity series connection or electricity to connect parallelly connectedly,
Said electrothermal module is characterized in that,
Said first insulated substrate has: base main body portion, and it is provided with said first opposite face; And protuberance; It is integrally formed with said base main body portion on the face of the opposition side of said first opposite face that is formed with said electrode; On this protuberance, be formed with connecting portion; This connecting portion is provided with the cooling object that utilizes the cooling of said thermoelectric conversion elements, and said cooling object is by a plurality of said thermoelectric conversion elements cooling that is electrically connected with said base main body portion, and the heat that produces from said cooling object is via dispelling the heat than the big said the second insulated substrate of said base main body portion.
2. electrothermal module as claimed in claim 1 is characterized in that,
On said first insulated substrate, be embedded with the turning circuit that said cooling object is switched on, at the inner turning circuit that forms of substrate.
3. electrothermal module as claimed in claim 2 is characterized in that,
Said turning circuit has with respect to the horizontal turning circuit of said first opposite face level formation and the vertical conducting circuit of vertical formation.
4. like each described electrothermal module in the claim 1～3, it is characterized in that,
Said first insulated substrate is formed by multilayer, forms the turning circuit that is connected by multilayer, and optical communication element is connected with said turning circuit.
5. electrothermal module as claimed in claim 1 is characterized in that,
Said base main body portion or said protuberance are formed with the temperature measuring element.
6. electrothermal module as claimed in claim 5 is characterized in that,
Said cooling object be to the outside send the photodiode of the laser diode of light, the light accepting to send from this laser diode at least any.
7. a light sending device is characterized in that,
Have the described electrothermal module of claim 1,
Also have holding member, it has the bottom and is installed on the cap of this bottom, is fixed at said electrothermal module that to utilize said cap to carry out under the state of said bottom airtight; And
Lead terminal, it is inserted and leads in said bottom, to said thermoelectric conversion elements power supply, is electrically connected with said cooling object.
8. light sending device as claimed in claim 7 is characterized in that,
Said cooling object is to have the optical communication element that sends the photodiode of the laser diode of light, the light accepting to send from this laser diode to the outside.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2009-177805 | 2009-07-30 | ||
| JP2009177805 | 2009-07-30 | ||
| JP2010-156429 | 2010-07-09 | ||
| JP2010156429A JP2011049534A (en) | 2009-07-30 | 2010-07-09 | Thermoelectric module and optical transmission apparatus |
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| CN101989596A CN101989596A (en) | 2011-03-23 |
| CN101989596B true CN101989596B (en) | 2012-10-10 |
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| CN104426052B (en) * | 2013-09-02 | 2019-01-08 | 华为技术有限公司 | A kind of package of optical device device and optical module |
| US11659767B2 (en) * | 2017-02-15 | 2023-05-23 | Ngk Spark Plug Co., Ltd. | Package with built-in thermoelectric element |
| JP6461436B1 (en) * | 2018-02-06 | 2019-01-30 | 三菱電機株式会社 | Thermoelectric cooler built-in stem |
| CN110753486B (en) * | 2018-07-24 | 2024-02-20 | 广东美的制冷设备有限公司 | High-integration intelligent power module and air conditioner |
| JP7162499B2 (en) * | 2018-11-09 | 2022-10-28 | 株式会社Kelk | Temperature controller |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447450A (en) * | 2002-03-26 | 2003-10-08 | 雅马哈株式会社 | Thermoelectric modular |
| JP2004303872A (en) * | 2003-03-31 | 2004-10-28 | Hitachi Metals Ltd | Thermoelectric conversion module |
| JP2005057124A (en) * | 2003-08-06 | 2005-03-03 | Komatsu Electronics Inc | Module and device for thermoelectric conversion |
| CN1905218A (en) * | 2005-07-25 | 2007-01-31 | 财团法人工业技术研究院 | LED packaging structure with thermoelectric device |
| CN1969400A (en) * | 2004-06-22 | 2007-05-23 | 阿鲁策株式会社 | Thermoelectric device |
| CN101079466A (en) * | 2006-05-25 | 2007-11-28 | 爱信精机株式会社 | Thermoelectric module device |
| JP2008016598A (en) * | 2006-07-05 | 2008-01-24 | Yamaha Corp | Thermoelectric module |
| JP2008135516A (en) * | 2006-11-28 | 2008-06-12 | Yamaha Corp | Bonded structure of thermoelectric conversion module |
| CN201110527Y (en) * | 2007-11-09 | 2008-09-03 | 孙海城 | High power LED light source device |
| CN101313419A (en) * | 2005-11-17 | 2008-11-26 | 开利公司 | Multifunctional energy converter |
| JP2009094130A (en) * | 2007-10-04 | 2009-04-30 | Sony Corp | Cooling module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002232022A (en) * | 2001-01-31 | 2002-08-16 | Aisin Seiki Co Ltd | Thermoelectric module and its manufacturing method |
-
2010
- 2010-07-27 CN CN201010241116.6A patent/CN101989596B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447450A (en) * | 2002-03-26 | 2003-10-08 | 雅马哈株式会社 | Thermoelectric modular |
| JP2004303872A (en) * | 2003-03-31 | 2004-10-28 | Hitachi Metals Ltd | Thermoelectric conversion module |
| JP2005057124A (en) * | 2003-08-06 | 2005-03-03 | Komatsu Electronics Inc | Module and device for thermoelectric conversion |
| CN1969400A (en) * | 2004-06-22 | 2007-05-23 | 阿鲁策株式会社 | Thermoelectric device |
| CN1905218A (en) * | 2005-07-25 | 2007-01-31 | 财团法人工业技术研究院 | LED packaging structure with thermoelectric device |
| CN101313419A (en) * | 2005-11-17 | 2008-11-26 | 开利公司 | Multifunctional energy converter |
| CN101079466A (en) * | 2006-05-25 | 2007-11-28 | 爱信精机株式会社 | Thermoelectric module device |
| JP2008016598A (en) * | 2006-07-05 | 2008-01-24 | Yamaha Corp | Thermoelectric module |
| JP2008135516A (en) * | 2006-11-28 | 2008-06-12 | Yamaha Corp | Bonded structure of thermoelectric conversion module |
| JP2009094130A (en) * | 2007-10-04 | 2009-04-30 | Sony Corp | Cooling module |
| CN201110527Y (en) * | 2007-11-09 | 2008-09-03 | 孙海城 | High power LED light source device |
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