CN101967266A - Halogen-free fire-retarding epoxy resin composition - Google Patents
Halogen-free fire-retarding epoxy resin composition Download PDFInfo
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- CN101967266A CN101967266A CN 201010291883 CN201010291883A CN101967266A CN 101967266 A CN101967266 A CN 101967266A CN 201010291883 CN201010291883 CN 201010291883 CN 201010291883 A CN201010291883 A CN 201010291883A CN 101967266 A CN101967266 A CN 101967266A
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- ISOOIHCAKZTFBS-UHFFFAOYSA-N CCc(cc1)ccc1-c1ccc(C)cc1 Chemical compound CCc(cc1)ccc1-c1ccc(C)cc1 ISOOIHCAKZTFBS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Oc1ccccc1 Chemical compound Oc1ccccc1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a halogen-free fire-retarding epoxy resin composition, which is characterized by being prepared from the following raw materials in part by weight: 5 to 30 parts of epoxy resin, 5 to 20 parts of phenolic resin, 5 to 300 parts of inorganic filler, 0.1 to 10 parts of hydroxide fire retardant, 0.5 to 2.5 parts of curing accelerator, 0.5 to 4.5 parts of silicane coupling agent, 0.1 to 5 parts of coloring agent and 0.1 to 4.5 parts of mould release agent. The epoxy resin has a structural formula (I), and the phenolic resin has a general formula (ii). The epoxy resin composition does not contain the conventional fire retardant; the fire retarding performance of the epoxy resin composition meets UL-94V-0 fire retarding standards; the epoxy resin composition meets the halogen-free and stibium-free requirements of environment protection on epoxy resin compositions and requirements on high-temperature reliability of lead-free process; and the epoxy resin composition has low viscosity, low expansion coefficient and high heat conductivity and is suitable for environmentally-friendly semiconductors and integrated circuits.
Description
Technical field
The present invention relates to a kind of composition epoxy resin, particularly a kind of halogen-free flame retardant epoxy resin composition.
Background technology
Be defined in the WEEE of European Union in 2003 issue and two decrees of RoHS in the electric or electronic equipment of depleted; time limit is banned use of six kinds of hazardous materials; more strict SONY standard is carried out by Japan; China Ministry of Information Industry has has also issued and implemented " electronics and IT products pollution control management way " simultaneously; the environment protection requirement of electronic product has become a kind of irreversible trend; raising along with people's environmental consciousness; electronic waste also begins to have caused attention, changes into as the epoxy molding plastic environmental protection of electronic package material to be irreversible trend.Because epoxy molding plastic contains organic high molecular compounds such as Resins, epoxy, these compounds burn easily, are inflammable so do not add the epoxy molding plastic of fire retardant.Common epoxy molding plastic is to adopt adding halogen and antimony to make epoxy molding plastic reach burning V-0 rank.But the halogen fire retardant can produce toxic and harmful in combustion processes, to human body, all unfavorable to environment.
Summary of the invention
Technical problem to be solved by this invention is at the deficiencies in the prior art, provides a kind of no bromine not have antimony, good flame retardation effect, environmentally friendly halogen-free flame retardant epoxy resin composition.
Technical problem to be solved by this invention is to realize by following technical scheme.The present invention is a kind of halogen-free flame retardant epoxy resin composition, is characterized in: it is made up of following materials of weight proportions,
Resins, epoxy 5～30;
Resol 5～20;
Mineral filler 50～300;
Oxyhydroxide fire retardant 0.1～10;
Curing catalyst 0.5～2.5;
Silane coupling agent 0.5～4.5;
Tinting material 0.1～5;
Releasing agent 0.1～4.5;
Described Resins, epoxy is that structural formula is the Resins, epoxy of (I):
Described resol is meant that general formula is the resol of (II):
Wherein: n=1-10.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: described oxyhydroxide fire retardant is preferably magnesium hydroxide and aluminium hydroxide.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: described mineral filler can be selected disclosed any mineral filler that is applicable to composition epoxy resin in the prior art for use; Preferred following technical scheme: described mineral filler is a ball-shaped silicon micro powder, and it is made up of A part silicon powder and B part silicon powder, wherein the meta particle diameter d of A part silicon powder
50Be 10～15um, the meta particle diameter d of B part silicon powder
50Be 0.2～0.8um; A part silicon powder accounts for 70～90% of mineral filler gross weight, and B part silicon powder accounts for 10～30% of mineral filler gross weight.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: the mixture of one or more compositions of the preferred KH560 of described silane coupling agent, KBM303, KH570, KH580, KBM803 or KBM603.When using mixture, its blending ratio can be selected arbitrarily.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: described curing catalyst is preferably the mixture of one or more compositions in glyoxaline compound, tertiary amine compound or the organic phosphine compound.When using mixture, its blending ratio can be selected arbitrarily.The preferred glyoxal ethyline of described glyoxaline compound, 2,4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-methyl-4-phenylimidazole.The preferred benzyldimethylamine of described tertiary amine compound, triethylamine benzyldimethylamine or 1,8-diazabicyclo (5,4,0) undecylene-7.Described organic phosphine compound triphenylphosphine, tetraphenyl phosphine or three (p-methylphenyl) phosphine.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: described tinting material can be disclosed any tinting material that is applicable to composition epoxy resin in the prior art, preferred carbon black.
In above-described a kind of halogen-free flame retardant epoxy resin composition technical scheme: described releasing agent is preferably stearic acid and its esters releasing agent and wax class releasing agent.Described stearic acid and the preferred stearic acid of its esters releasing agent, Zinic stearas, calcium stearate, Magnesium Stearate or lithium stearate; Described wax class releasing agent is preferably montanin wax or palm wax.Also can select for use other to be applicable to the releasing agent of composition epoxy resin.
Halogen-free flame retardant epoxy resin composition of the present invention can adopt following method preparation: after earlier each component in the raw material being pressed the accurate weighing of described weight proportion, add in the mixing roll, carry out melting mixing, melting temperature is 80～130 ℃, mixing time is 2～20 minutes, to be mixed evenly after, cooling is pulverized, promptly.
Compared with prior art, the flame retardant resistance of composition epoxy resin of the present invention does not contain traditional fire retardant, and its raw material epoxy resin and resol all have certain flame retardant resistance.Composition epoxy resin of the present invention can not only reach the flame-retardant standard of UL-94V-0 level, and meet and satisfy environmental protection to the halogen-free stibium-free of composition epoxy resin and can satisfy the requirement of lead-free process high temperature reliability, it has low viscosity, low-expansion coefficient, high thermal conductivity, is applicable to green encapsulation semiconductor device and unicircuit.
Embodiment
Below further describe concrete technical scheme of the present invention,, and do not constitute restriction its right so that those skilled in the art understands the present invention further.
Embodiment 1.A kind of halogen-free flame retardant epoxy resin composition, it is made up of following materials of weight proportions,
Resins, epoxy 5;
Resol 5;
Mineral filler 50;
Oxyhydroxide fire retardant 0.1;
Curing catalyst 0.5;
Silane coupling agent 0.5;
Tinting material 0.1;
Releasing agent 0.1;
Described Resins, epoxy is that structural formula is the Resins, epoxy of (I):
Described resol is meant that general formula is the resol of (II):
Wherein: n=1-10.
Embodiment 2.A kind of halogen-free flame retardant epoxy resin composition, it is made up of following materials of weight proportions,
Resins, epoxy 30;
Resol 20;
Mineral filler 300;
Oxyhydroxide fire retardant 10;
Curing catalyst 2.5;
Silane coupling agent 4.5;
Tinting material 5;
Releasing agent 4.5;
Described Resins, epoxy is identical with embodiment 1 with resol.
Embodiment 3.A kind of halogen-free flame retardant epoxy resin composition, it is made up of following materials of weight proportions,
Resins, epoxy 20;
Resol 15;
Mineral filler 200;
Oxyhydroxide fire retardant 5;
Curing catalyst 1;
Silane coupling agent 1;
Tinting material 1;
Releasing agent 1;
Described Resins, epoxy is identical with embodiment 1 with resol.
Embodiment 4.In the embodiment 1 described halogen-free flame retardant epoxy resin composition: described oxyhydroxide fire retardant is magnesium hydroxide or aluminium hydroxide.
Embodiment 5.In embodiment 2 or the 3 described halogen-free flame retardant epoxy resin compositions: described oxyhydroxide fire retardant is the mixture that magnesium hydroxide and aluminium hydroxide are formed by any weight ratio.
Embodiment 6.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-5: described mineral filler is a ball-shaped silicon micro powder, and it is made up of A part silicon powder and B part silicon powder, wherein the meta particle diameter d of A part silicon powder
50Be 10～15um, the meta particle diameter d of B part silicon powder
50Be 0.2～0.8um; A part silicon powder accounts for 70% of mineral filler gross weight, and B part silicon powder accounts for 30% of mineral filler gross weight.
Embodiment 7.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-5: described mineral filler is a ball-shaped silicon micro powder, and it is made up of A part silicon powder and B part silicon powder, wherein the meta particle diameter d of A part silicon powder
50Be 10～15um, the meta particle diameter d of B part silicon powder
50Be 0.2～0.8um; A part silicon powder accounts for 90% of mineral filler gross weight, and B part silicon powder accounts for 10% of mineral filler gross weight.
Embodiment 8.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-5: described mineral filler is a ball-shaped silicon micro powder, and it is made up of A part silicon powder and B part silicon powder, wherein the meta particle diameter d of A part silicon powder
50Be 10～15um, the meta particle diameter d of B part silicon powder
50Be 0.2～0.8um; A part silicon powder accounts for 80% of mineral filler gross weight, and B part silicon powder accounts for 20% of mineral filler gross weight.
Embodiment 9.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-8: described silane coupling agent is selected from the mixture of one or more compositions of KH560, KBM303, KH570, KH580, KBM803 or KBM603.
Embodiment 10.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-9: described curing catalyst is the mixture of one or more compositions in glyoxaline compound, tertiary amine compound or the organic phosphine compound.
Embodiment 11.In the embodiment 10 described halogen-free flame retardant epoxy resin compositions: described glyoxaline compound is selected from glyoxal ethyline, 2,4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-methyl-4-phenylimidazole.
Embodiment 12.In the embodiment 10 described halogen-free flame retardant epoxy resin compositions: described tertiary amine compound is selected from benzyldimethylamine, triethylamine benzyldimethylamine or 1,8-diazabicyclo (5,4,0) undecylene-7.
Embodiment 13.In the embodiment 10 described halogen-free flame retardant epoxy resin compositions: described organic phosphine compound is selected from triphenylphosphine, tetraphenyl phosphine or three (p-methylphenyl) phosphine.
Embodiment 14.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-13: described tinting material is a carbon black.
Embodiment 15.In any one described halogen-free flame retardant epoxy resin composition of embodiment 1-14: described releasing agent is stearic acid and its esters releasing agent and wax class releasing agent; Described stearic acid and its esters releasing agent are selected from stearic acid, Zinic stearas, calcium stearate, Magnesium Stearate or lithium stearate; Described wax class releasing agent is montanin wax or palm wax.
Embodiment 16.Contrast experiment and result thereof.
Experimental example 1.Embodiment 1 described Resins, epoxy: 60 grams; Embodiment 1 described resol: 53 grams; Mineral filler: A part 658 grams, B part 77 grams; Aluminium hydroxide 3 grams; Curing catalyst: 1.5 grams; Coupling agent 4.5 grams; Carbon black 3 grams; Carnauba wax 3 grams.After the accurate weighing of above-mentioned starting material, on double roll mill, carry out melting mixing, melting temperature is 90 ℃, mixing time is 10 minutes, and mixing material is pressed into the thick thin slice of 1.5mm, through to be mixed evenly after, cooling is pulverized, and carries out performance test.
Experimental example 2.Embodiment 1 described Resins, epoxy: 60 grams; Embodiment 1 described resol: 57 grams; Mineral filler: A part 681 grams, B part 78 grams; Aluminium hydroxide 3 grams; Curing catalyst: 1.5 grams; Coupling agent 4.5 grams; Carbon black 3 grams; Carnauba wax 3 grams.After the accurate weighing of above-mentioned starting material, on double roll mill, carry out melting mixing, melting temperature is 100 ℃, mixing time is 10 minutes, and mixing material is pressed into the thick thin slice of 1.5mm, through to be mixed evenly after, cooling is pulverized, and carries out performance test.
Experimental example 3.Embodiment 1 described Resins, epoxy: 60 grams; Embodiment 1 described resol: 61 grams; Mineral filler: A part 704 grams, B part 80 grams; Aluminium hydroxide 3 grams; Curing catalyst: 1.5 grams; Coupling agent 4.5 grams; Carbon black 3 grams, carnauba wax 3 grams.After the accurate weighing of above-mentioned starting material, on double roll mill, carry out melting mixing, melting temperature is 80 ℃, mixing time is 10 minutes, and mixing material is pressed into the thick thin slice of 1.5mm, through to be mixed evenly after, cooling is pulverized, and carries out performance test.
Reference examples 1.Resins, epoxy o-cresol formaldehyde epoxy resin 195XL-7:60 gram; Linear phenolic resin PF-5090:53 gram; Mineral filler: A part 658 grams, B part 77 grams; Curing catalyst: 1.5 grams; Coupling agent 4. grams; Carbon black 3 grams; Carnauba wax 3 grams, fire retardant antimonous oxide: 15 grams.After the accurate weighing of above-mentioned starting material, on double roll mill, carry out melting mixing, melting temperature is 80 ℃, mixing time is 10 minutes, and mixing material is pressed into the thick thin slice of 1.5mm, through to be mixed evenly after, cooling is pulverized, and carries out performance test.
Reference examples 2.Resins, epoxy o-cresol formaldehyde epoxy resin 195XL-7:60 gram; Linear phenolic resin PF-5090:61 gram; Mineral filler: A part 704 grams, B part 80 grams; Curing catalyst: 1.5 grams; Coupling agent 4.5 grams; Carbon black 3 grams; Carnauba wax 3 grams; Fire retardant antimonous oxide: 18 grams.After the accurate weighing of above-mentioned starting material, on double roll mill, carry out melting mixing, melting temperature is 90 ℃, mixing time is 10 minutes, and mixing material is pressed into the thick thin slice of 1.5mm, through to be mixed evenly after, cooling is pulverized, and carries out performance test.
Main performance index is tested with following method among the contrast experiment:
1, flame retardant resistance: the sample piece of sample being made 1/16 inch thickness under 175 ℃/25Mpa condition, under the condition of 175 ℃/6h, carry out after fixing then, carry out flame retardant test by the vertical combustion method according to GB4609-84 at last, the batten that is shaped applies flame and be judged to be FV-O when the fiery afterfire time is not more than 10 seconds, is judged to be FV-1 when being not more than 10 seconds.
2, second-order transition temperature (Tg)
Use thermomechanical analyzer (TMA) to measure the second-order transition temperature of described composition.
2. thermal expansivity
Utilize thermomechanical analyzer (TMA) to measure the thermal linear expansion coefficient of described composition.
3, water-absorbent
Sample is made the rectangular of 80mm * 10mm * 4mm, under the condition of 175 ℃/6h, carry out after fixing, then successively: oven dry--drying---weighing m according to GB1034-86
1--boil--drying the surface---weighing m
2The calculating of water-intake rate: W
p=(m
2-m
1)/m
1* 100%
Experimental result sees the following form:
The experimental result table
Claims (10)
1. halogen-free flame retardant epoxy resin composition is characterized in that: it is former by following weight proportion
Material is formed,
Resins, epoxy 5～30;
Resol 5～20;
Mineral filler 50～300;
Oxyhydroxide fire retardant 0.1～10;
Curing catalyst 0.5～2.5;
Silane coupling agent 0.5～4.5;
Tinting material 0.1～5;
Releasing agent 0.1～4.5;
Described Resins, epoxy is that structural formula is the Resins, epoxy of (I):
Described resol is meant that general formula is the resol of (II):
Wherein: n=1-10.
2. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described oxyhydroxide fire retardant is magnesium hydroxide and aluminium hydroxide.
3. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described mineral filler is a ball-shaped silicon micro powder, and it is made up of A part silicon powder and B part silicon powder, wherein the meta particle diameter d of A part silicon powder
50Be 10～15um, the meta particle diameter d of B part silicon powder
50Be 0.2～0.8um; A part silicon powder accounts for 70～90% of mineral filler gross weight, and B part silicon powder accounts for 10～30% of mineral filler gross weight.
4. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described silane coupling agent is selected from the mixture of one or more compositions of KH560, KBM303, KH570, KH580, KBM803 or KBM603.
5. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described curing catalyst is the mixture of one or more compositions in glyoxaline compound, tertiary amine compound or the organic phosphine compound.
6. a kind of halogen-free flame retardant epoxy resin composition according to claim 5, it is characterized in that: described glyoxaline compound is selected from glyoxal ethyline, 2,4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole or 2-methyl-4-phenylimidazole.
7. a kind of halogen-free flame retardant epoxy resin composition according to claim 5 is characterized in that: described tertiary amine compound is selected from benzyldimethylamine, triethylamine benzyldimethylamine or 1,8-diazabicyclo (5,4,0) undecylene-7.
8. a kind of halogen-free flame retardant epoxy resin composition according to claim 5 is characterized in that: described organic phosphine compound is selected from triphenylphosphine, tetraphenyl phosphine or three (p-methylphenyl) phosphine.
9. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described tinting material is a carbon black.
10. a kind of halogen-free flame retardant epoxy resin composition according to claim 1 is characterized in that: described releasing agent is stearic acid and its esters releasing agent and wax class releasing agent; Described stearic acid and its esters releasing agent are selected from stearic acid, Zinic stearas, calcium stearate, Magnesium Stearate or lithium stearate; Described wax class releasing agent is montanin wax or palm wax.
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| CN 201010291883 CN101967266A (en) | 2010-09-25 | 2010-09-25 | Halogen-free fire-retarding epoxy resin composition |
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| CN 201010291883 CN101967266A (en) | 2010-09-25 | 2010-09-25 | Halogen-free fire-retarding epoxy resin composition |
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Cited By (3)
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|---|---|---|---|---|
| JP2012153829A (en) * | 2011-01-27 | 2012-08-16 | Iteq Corp | Halogen-free epoxy resin composition, prepreg and printed circuit board made using the same |
| CN105273360A (en) * | 2014-07-16 | 2016-01-27 | 合复新材料科技(无锡)有限公司 | Modified epoxy packaging material and preparation method and uses thereof |
| CN109111688A (en) * | 2017-06-26 | 2019-01-01 | 美的智慧家居科技有限公司 | Encapsulation plastics composite and its application |
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Open date: 20110209 |