CN101957389B - Test device and manufacturing method thereof - Google Patents
Test device and manufacturing method thereof Download PDFInfo
- Publication number
- CN101957389B CN101957389B CN 200910152143 CN200910152143A CN101957389B CN 101957389 B CN101957389 B CN 101957389B CN 200910152143 CN200910152143 CN 200910152143 CN 200910152143 A CN200910152143 A CN 200910152143A CN 101957389 B CN101957389 B CN 101957389B
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- Prior art keywords
- probe
- cover plate
- manufacture method
- proving installation
- contact site
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000012360 testing method Methods 0.000 title abstract description 26
- 239000000523 sample Substances 0.000 claims abstract description 119
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 26
- 230000003139 buffering effect Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009351 contact transmission Effects 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a test device and a manufacturing method thereof. The method comprises the steps of: (a) manufacturing a plurality of probe modules, two cover plates and a mould, wherein the mould is internally provided with a plurality of needle seats at intervals for inserting one end of each probe module; (b) inserting the probe modules on each needle seat; (c) filling at least one liquid resin material in the mould; and (d) demoulding the resin material after solidification for finishing a combined blank. The combined blank is provided with a buffer main body and the probe moduleswhich are arranged in the buffer main body at intervals. In this way, the manufacturing operation is simple and quick, the product is wide in application range, the operation efficiency of probe replacement can be enhanced, and the cost of the probe replacement can be reduced.
Description
Technical field
The present invention relates to a proving installation and manufacture method thereof, refer to a kind of semi-conductive proving installation and manufacture method thereof especially.
Background technology
Along with the progress of semiconductor technology, significantly improve for the requirement of Measurer precision, the test signal is to contact transmission by probe under the situation of high-frequency test.
Consult Fig. 1, existing detecting probe 1, for example the novel patent in Taiwan is M333565 number, is to be arranged in the probe aperture 101 of a test bench 100, in order to be electrically connected a test contacts 300 and a reception contact 400.This detecting probe 1 is to make with conductive material, and it comprises that one is arranged in the upper and lower contact element 11,12 of this probe aperture 21, and a compressible deformation be arranged at upper and lower contact element 11,12 elastic parts 13.Wherein, upper and lower contact element 11,12 has on one contact site 111 and contact site 121 once respectively, in order to touch with corresponding test contacts 300 and reception contact 400 respectively.
In when test, contact with test contacts 300 and reception contact 400 respectively and these test probe 11 generations are conducted by this upper and lower contact site 111,121, and then will test signal and be passed to an analytical instrument (not shown) to carry out the signal analysis.
But, increase along with testing time, on, following contact site 111,121 and test contacts 300 and reception contact 400 between for a long time mutually scraped finish, cause, following contact site 111,121 wear and tear easily or are infected with dirt, and then make that the test signal is bad, severe patient more can take place can't conducting phenomenon, just must clear up or replace with in good time this moment, following contact site 111,121, but because following contact element 12 is to be arranged in the contact element 11, so that can't change down contact element 12 separately or go up contact element 11, and must change whole group test probe 1, not only increase the complicacy of changing probe 1 thus and make maintenance cost improve, more cause test jobs to postpone because replacing test probe 1, online in the production of seizing every minute and second, the time of prolongation maintenance activity is suitable serious situation for producing the dealer, do not meet economic benefit, also will bear the risk of shipment as scheduled.
Summary of the invention
Purpose of the present invention is to provide a kind of scope of application extensive, and can improves and eliminate the operating efficiency that changes probe, and can reduce and eliminate the proving installation that changes the probe cost.
Proving installation of the present invention, comprise: a buffering body, and most probe modules of being located at interval in this buffering body, each probe module has first probe, and second probe that is positioned at the relative below of this first probe, this first probe place near to the upper end is formed with a butting section and extension from first contact site of this butting section apical margin, this second probe upper end is formed with a junction surface, one and is formed on this junction surface and can stretches the grafting space of putting for this first probe, and extension is from second contact site at this junction surface.
Another object of the present invention, then providing a kind of manufacturing operation the simple manufacture method of proving installation fast, this manufacture method comprises: (a) prepare most probe modules, first cover plate and second cover plate and moulds, be interval with most in this mould and can supply the respectively needle stand of this probe module one end plant, (b) described probe module is inserted in respectively on this needle stand, (c) at least one liquid gum material is filled out in filling in this mould, and (d) treat that this colloidal materials solidifies after, give the demoulding, just finish a combination base substrate.
Effect of the present invention is that the manufacture method operation is simply quick, and made application range of products is extensive, and as long as removal first cover plate and second cover plate, just can pull out particular probe easily, new probe can follow the embedding location of former hole, easily eliminates trade-in, not only overcomes the inconvenience of changing probe module, more improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.
Description of drawings
Fig. 1 is a partial side, cross-sectional view, and the annexation of general test probe is described;
Fig. 2 is a process flow diagram, and first preferred embodiment of the manufacture method of proving installation of the present invention is described;
Fig. 3 is a cut-open view, illustrates that most probes of this first preferred embodiment are arranged in the mould, and finishes and irritate the aspect of filling out padded coaming;
Fig. 4 is a partial side view, the aspect after key diagram 3 demouldings;
Fig. 5 is a side cutaway view, and the assembled state of first preferred embodiment of proving installation of the present invention is described;
Fig. 6 is a side cutaway view, and the aspect of the first cover plate removal of this first preferred embodiment is described;
Fig. 7 is a side cutaway view, and after explanation pulled away this buffering body with first probe in damaged condition in this first preferred embodiment, the first new probe can follow the embedding location of former pin hole; And
Fig. 8 is a side cutaway view, and the assembled state of second preferred embodiment of proving installation of the present invention is described.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.Before the present invention is described in detail, be noted that in the following description content similarly assembly is to represent with identical numbering.
Consulting Fig. 2,3, is first preferred embodiment of the manufacture method of proving installation of the present invention, includes following steps:
At first in step 800, be to prepare most probe modules 3 and a mould 4 earlier, wherein each probe module 3 has one first probe 31 and one second probe 32, each first probe 31 is formed with first contact site 312 that 311 apical margins from the butting section are extended in a butting section 311, in place near to the upper end, and a portion that stretches into 313 that 311 root edges protrude out downwards from the butting section.And each second probe 32 is formed with a junction surface 321, and is formed at grafting space 322 on the junction surface 321 in the upper end, and one extend from the junction surface 321 second contact site 323, and described grafting space 322 also can be stretched for the portion that stretches into 313 of first probe 31 and put.In addition, this mould 4 includes the patrix 42 of a counterdie 41 and closed this counterdie 41 of an energy, and counterdie 41 has die cavity 411 in, and in the interior die cavity 411 and interval is formed with most needle stands 412.And also have die cavity 421 and a material hole (not shown) in one in the patrix 42.
Then, in step 801, be that second probe 32 with described probe module 3 is inserted on each needle stand 412 of bed die 41 one by one, and 321 upper ends, junction surface of each second probe 32 also are inserted in the interior die cavity 411 of counterdie 41, each first probe 31 is then borrowed it to stretch into portion 313 and is inserted in the grafting space 322 of each second probe 32 part tightly, and is combined on second probe 32.
After treating described probe module 3 plant location, carry out step 802, be rubber-like liquid gum material 71 to be irritated fill in the interior die cavity 411 of counterdie 41 in this step, described colloidal materials 71 can be silica gel or plastics etc., is to explain with silica gel in the present embodiment.Finish irritate fill out operation after, patrix 42 is placed on the counterdie 41 to carry out mold closing, this moment each first probe, 31 upper end and stretching in the interior die cavity 421 of patrix 42.
In step 803, be through after a while, after treating that colloidal materials 71 solidifies, give the demoulding, finish combination base substrate 700 as shown in Figure 4, this combination base substrate 700 includes a buffering body 701, described probe module 3 then is shaped in the buffering body 701, first contact site 312 and local butting section 311 of first probe 31 of each probe module 3, and second contact site 323 and local engagement portion 321 of second probe 32 all are piercing in outside the buffering body 701.
In step 804, as shown in Figure 5, prepare again and be interval with most the through holes 51,61 that can run through for first and second corresponding probe 31,32 respectively on first cover plate 5 and second cover plate, 6, the first cover plates 5 and second cover plate 6 at last.Whereby first cover plate 5 and second cover plate 6 are covered respectively to put and be positioned to cushion body 701 end faces and bottom surface, first probe 31 of each probe module 3 and second probe 32 also pass via each through hole 51,61 on the first corresponding cover plate 5 and second cover plate 6, so just finish the manufacturing of proving installation.
Consult Fig. 5, the present invention utilizes the made proving installation of said method to comprise a buffering body 701, most compartment of terrains and is shaped in the probe module 3 that cushions in the body 701, and end face and first cover plate 5 on the bottom surface and second cover plate 6 of being located at buffering body 701 respectively.As first contact site 312 of first probe 31 of above-mentioned each probe module 3 and the part of butting section 311, and the part at second contact site 323 of second probe 32 and junction surface 321, all be piercing in outside the buffering body 701.And each through hole 51 on first cover plate 5 and second cover plate 6,61 have one approaches the large aperture portion 511 that cushions body 701,611, and one away from buffering body 701 and with corresponding large aperture portion 511, the 611 small-bore portions 512 that are connected, 612, and each large aperture portion 511,611 with each small-bore portion 512, all be formed with a shoulder 513 between 612,613, the butting section 311 of each first probe 31 is to be positioned at each large aperture portion 511 place and to abut against in each shoulder 513,321 at the junction surface of each second probe 32 is to be positioned at each large aperture portion 611 place and to abut against in each shoulder 613, and 323 of second contact sites of first contact site 312 of each first probe 31 and each second probe 32 run through the small-bore portion 512 of corresponding first cover plate 5 and second cover plate 6 respectively, 612.
Still consult Fig. 5, proving installation of the present invention in the use can by each first and second contact site 312,323 of each probe module 3 respectively with majority on test point 600 and most test point 601 down contact and constitute electrically conducting.That is to say, when each first and second contact site 312,323 respectively with each on test point 600 and each time test point 601 when contacting, it is made by the rubber-like colloid material utilizing buffering body 701, so buffering body 701 can produce compression set simultaneously, this moment, the portion that stretches into 313 of first probe 31 more goed deep into forming electrically conducting in the grafting space 322 of second probe 32, to transmit the test signal.
Because first and second probe 31, first and second contact site 312,323 of 32 are in test process, contact with described upper and lower test point 600,601 continually, so that cause first and second contact site 312,323 to produce wearing and tearing or dirt easily, bad when causing signal to transmit, and need to change probe.And proving installation of the present invention is when changing first probe 31, shown in Fig. 6,7, as long as unload first cover plate 5, just can the first old probe 31 will be pulled out easily, can stay hole 702 this moment at buffering body 701, the first new probe 31 ' just can follow described hole 702 and be arranged in the buffering body 701, and the portion that stretches into 313 ' of the first new probe 31 ' also can go deep in the grafting space 322 of second probe 32, so just finishes first the eliminating of probe 31 (31 ') and changes; In addition, when changing second probe 32, then as long as unload second cover plate 6 earlier, just can change as finishing second the eliminating of probe 32 as the above-mentioned replacing operation, not repeat them here.Therefore, can carry out like a cork really each first and second probe 31 (31 '), 32 eliminate trade-in, improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.
Consulting Fig. 2,8, is second preferred embodiment of the present invention, and present embodiment and first preferred embodiment are roughly the same, do not exist together only be present embodiment method in abovementioned steps 800, also comprise having prepared most elastic partss 33; In step 801, each elastic parts 33 is placed through respectively between first and second probe 31,32 of each probe module 3, and elastic parts 33 two ends reach the respectively junction surface 321 of second probe 32 in the butting section 311 of each first probe 31 of butt respectively.Can utilize the setting of described elastic parts 33 whereby and can strengthen the buffering body 701 elastic acting force.In addition, first contact site 312 ' of each first probe 31 and second contact site, the 323 ' ora terminalis of each second probe 32 can form many ratchet-like respectively, can increase whereby and upper and lower test point 600,601 contact area.
What deserves to be mentioned is at this, each first and second contact site 312 (312 '), the aspect of 323 (323 ') be not in the limitation diagram institute paint, such as cab over type, tip formula or other form all can, need look the aspect of its test point and can change to some extent.
In sum, the manufacture method of proving installation of the present invention is by the ejection formation operation, make probe module 3 one-body molded with buffering body 701, in when combination thereby as long as cover the assembling that first cover plate 5 and second cover plate 6 just can be finished proving installation again, therefore make, assemble all quite simply fast.In addition, the made proving installation scope of application is extensive, and as long as removal first cover plate 5 (or second cover plate 6), just can pull out specific first probe 31 (or second probe 32) easily, new probe can follow the embedding location of former hole, easily eliminates trade-in, not only overcomes the inconvenience of changing probe module 3, more improve maintenance and eliminate the operating efficiency that changes, and can reduce to eliminate and change the probe cost.So can reach purpose of the present invention really.
Claims (9)
1. the manufacture method of a proving installation, it is characterized in that: this manufacture method comprises step (a) and prepares most probe modules, first cover plate and second cover plate, and mould, be interval with most in this mould and supply the respectively needle stand of this probe module one end plant, each probe module has first probe, and second probe, respectively this probe module is to be inserted in respectively on this needle stand with this second probe respectively, (b) described probe module is inserted in respectively on this needle stand, (c) at least one liquid gum material is filled out in filling in this mould, and (d) treat that this colloidal materials solidifies after, give the demoulding, just finish one the combination base substrate.
2. the manufacture method of proving installation as claimed in claim 1 is characterized in that: in step (d), made combination base substrate includes a described probe module of confession and is arranged at intervals at wherein buffering body.
3. the manufacture method of proving installation as claimed in claim 2, it is characterized in that: this manufacture method also includes a step (e), be end face and the bottom surface that this first cover plate and second cover plate is positioned this combination base substrate respectively in this step, and respectively this probe module run through corresponding first cover plate and second cover plate respectively.
4. the manufacture method of proving installation as claimed in claim 1, it is characterized in that: this first probe place near to the upper end is formed with a butting section, reach an extension from first contact site of this butting section apical margin, this second probe upper end is formed with a junction surface, one and is formed on this junction surface and for this first probe and stretches the grafting space of putting, and extension is from second contact site at this junction surface.
5. the manufacture method of proving installation as claimed in claim 1, it is characterized in that: in step (a), this mould includes a counterdie, and the patrix of this counterdie of closure, and this counterdie has an interior die cavity, and described needle stand is to be located in this in die cavity.
6. the manufacture method of proving installation as claimed in claim 4, it is characterized in that: in step (e), respectively this probe module be with first contact site of this first probe respectively and respectively second contact site of this second probe run through corresponding first cover plate and second cover plate respectively.
7. the manufacture method of proving installation as claimed in claim 6, it is characterized in that: described first cover plate and second cover plate are interval with most large aperture portions respectively in this surface near this buffering body, then be interval with plurality of small holes footpath portion respectively in this surface away from this buffering body, each large aperture portion is connected with each small-bore portion, and this large aperture portion and respectively all be formed with a shoulder between this small-bore portion respectively, respectively the butting section of this first probe is to be positioned at respectively this large aperture portion place of first cover plate and to abut against respectively this shoulder in first cover plate, respectively first contact site of this first probe and respectively second contact site of this second probe and the small-bore portion of running through first cover plate and second cover plate respectively.
8. the manufacture method of proving installation as claimed in claim 4, it is characterized in that: in step (a), also comprise preparing most the elastic partss between first and second probe that is placed through this probe module respectively respectively, respectively respectively butting section and the junction surface of this second probe respectively of this first probe of butt respectively, the two ends of this elastic parts.
9. the manufacture method of proving installation as claimed in claim 4 is characterized in that: respectively first contact site of this first probe and respectively the second contact site ora terminalis of this second probe form many ratchet-like respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910152143 CN101957389B (en) | 2009-07-13 | 2009-07-13 | Test device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910152143 CN101957389B (en) | 2009-07-13 | 2009-07-13 | Test device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101957389A CN101957389A (en) | 2011-01-26 |
| CN101957389B true CN101957389B (en) | 2013-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910152143 Expired - Fee Related CN101957389B (en) | 2009-07-13 | 2009-07-13 | Test device and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN101957389B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10001509B2 (en) | 2014-10-30 | 2018-06-19 | Tongfu Microelectronics Co., Ltd. | Semiconductor testing fixture and fabrication method thereof |
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| CN104407182B (en) * | 2014-10-30 | 2018-09-21 | 通富微电子股份有限公司 | Semiconductor test jig |
| CN104407183B (en) * | 2014-10-30 | 2018-10-23 | 通富微电子股份有限公司 | Test the forming method of syringe needle and semiconductor test jig |
| CN104282596B (en) * | 2014-10-30 | 2017-12-08 | 通富微电子股份有限公司 | The forming method of semiconductor test tool |
| CN104280677B (en) * | 2014-10-30 | 2017-11-10 | 通富微电子股份有限公司 | Semiconductor test tool |
| CN104347448B (en) * | 2014-10-30 | 2018-08-10 | 通富微电子股份有限公司 | The forming method of semiconductor test jig |
| US10067164B2 (en) | 2015-08-24 | 2018-09-04 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
| CN107631835A (en) * | 2017-09-13 | 2018-01-26 | 中国电子科技集团公司第四十九研究所 | A kind of pressure test device applied to non-leaded package MEMS absolute pressure cake cores |
| CN109507457B (en) * | 2017-09-15 | 2020-10-16 | 中华精测科技股份有限公司 | Probe card device |
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| CN1159001A (en) * | 1996-02-13 | 1997-09-10 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| JP2001116791A (en) * | 1999-10-20 | 2001-04-27 | Fujitsu Ltd | Electronic component tester and electric connector |
| CN2494034Y (en) * | 2001-08-13 | 2002-05-29 | 吴志成 | Means for testing semiconductor package element |
| CN2722254Y (en) * | 2004-08-30 | 2005-08-31 | 昆翌电子（深圳）有限公司 | Testing needle structural improvement of base board detection |
| US7014499B2 (en) * | 2004-07-05 | 2006-03-21 | Yulim Hitech, Inc. | Probe card for testing semiconductor device |
| CN2775663Y (en) * | 2005-02-03 | 2006-04-26 | 芽庄科技股份有限公司 | Improved detector for real mounting board |
| CN101310375A (en) * | 2005-10-28 | 2008-11-19 | 飞而康公司 | Probe card and method of fabricating the same |
-
2009
- 2009-07-13 CN CN 200910152143 patent/CN101957389B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1159001A (en) * | 1996-02-13 | 1997-09-10 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| JP2001116791A (en) * | 1999-10-20 | 2001-04-27 | Fujitsu Ltd | Electronic component tester and electric connector |
| CN2494034Y (en) * | 2001-08-13 | 2002-05-29 | 吴志成 | Means for testing semiconductor package element |
| US7014499B2 (en) * | 2004-07-05 | 2006-03-21 | Yulim Hitech, Inc. | Probe card for testing semiconductor device |
| CN2722254Y (en) * | 2004-08-30 | 2005-08-31 | 昆翌电子（深圳）有限公司 | Testing needle structural improvement of base board detection |
| CN2775663Y (en) * | 2005-02-03 | 2006-04-26 | 芽庄科技股份有限公司 | Improved detector for real mounting board |
| CN101310375A (en) * | 2005-10-28 | 2008-11-19 | 飞而康公司 | Probe card and method of fabricating the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10001509B2 (en) | 2014-10-30 | 2018-06-19 | Tongfu Microelectronics Co., Ltd. | Semiconductor testing fixture and fabrication method thereof |
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| Publication number | Publication date |
|---|---|
| CN101957389A (en) | 2011-01-26 |
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Granted publication date: 20130904 |