CN101957168A - Method for detecting deformation quantity of object through capacitance - Google Patents
Method for detecting deformation quantity of object through capacitance Download PDFInfo
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- CN101957168A CN101957168A CN 201010291247 CN201010291247A CN101957168A CN 101957168 A CN101957168 A CN 101957168A CN 201010291247 CN201010291247 CN 201010291247 CN 201010291247 A CN201010291247 A CN 201010291247A CN 101957168 A CN101957168 A CN 101957168A
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Abstract
The invention relates to a method for detecting the deformation quantity of an object through capacitance, comprising a detected object and a conductor. The method comprises the following steps of: firstly detecting the capacitance value of the detected object under the condition without external force; secondly detecting the capacitance value of the detected object under the action of the external force; and finally determining the deformation quantity of the detected object under the action of the external force according to the difference value of the two capacitance values. The method for detecting the deformation quantity of the object is not only simple and convenient, but also obviously enhances the detection accuracy because even if tiny deformation quantity is generated under the action of the external force, the tiny deformation quantity can be detected through the method for the detected object.
Description
Technical field
The present invention relates to a kind of method of inspected object deformation quantity, refer in particular to the method for capacitance detecting object deformation quantity.
Background technology
Because measured object is known from experience and is deformed under certain external force effect, and to different objects under external force situation in different size, deflection also has a great difference very much.The deflection people that some object takes place under the effect of external force just can observe directly by naked eyes, so than being easier to measure its deformation quantity; And the other object is less owing to the deformation quantity that takes place under the effect of external force, and naked eyes are difficult to directly differentiate come out, so need detect by means of miscellaneous equipment.
At present, the physical quantity that people are used for inspected object is to realize by sensor mostly, the size of the mechanical deformation amount of the sensor arrangement body that it produces when being added to physical quantity on the sensor arrangement is as the index of indication deformation quantity size, change this mechanical deformation quantitative change the mechanical deformation quantity detection sensor of electric signal into, finally reach the purpose of inspected object physical quantity.But when utilizing sensor to come inspected object, because the precision of sensor is subject to external interference, and the price of sensor own is higher, so incompatibility is promoted the use of.
Therefore need solve above problem for users provide a kind of easier method.
Summary of the invention
The actual technical matters to be solved of the present invention is how a kind of capacitance detecting testee method of deformation quantity under external force of utilizing is provided.
In order to realize above-mentioned purpose of the present invention, the invention provides a kind of method of capacitance detecting object deformation quantity, it comprises a testee and a conductor, this detection comprises the steps: at first, the capacitance of detecting testee under no external force situation; Secondly, detecting testee capacitance under external force; At last, determine the deformation quantity of testee under external force according to the difference of above-mentioned two capacitances.
The method of inspected object deformation quantity of the present invention, not only method is easy, and for testee, also can detect by this method even small deformation quantity has taken place under the effect of external force, so accuracy of detection obviously improves.
Description of drawings
Fig. 1 is a connection diagram of inspected object deformation quantity method of the present invention.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples.
Ultimate principle of the present invention is to utilize the variation of testee capacitance under the effect of certain external force further to detect the deformation quantity of described testee, the Young modulus Y of inspected object just, so-called Young modulus is to be characterized in material tension or measuring body physical quantity in the elastic limit, and it is an elastic modulus longitudinally.So existing is that the PCB substrate is that example specifies with testee, please refer to shown in the accompanying drawing 1, because the side on the PCB substrate 1 is provided with the center that an electrode 10 and this electrode 10 are positioned at PCB substrate 1, so we are connected to an end of above-mentioned electrode 10 on the chip 3; And have a distance to be provided with a conductor 2 apart from this PCB substrate 1, so since, just formed certain electric capacity between described substrate 1 and the conductor 2.Because the present invention is the deformation quantity that is used to detect testee, therefore described conductor preferably adopts pure flat conductor, to reach the purpose of accurate measurement deformation quantity.
For the accurate deformation quantity of testee under external force F effect of measuring, we just at first need to determine the capacitance of described PCB substrate 1 top electrode 10 under the situation that does not have external force effect PCB substrate 1 so.Because the area of described electrode 10 is certain, so when an end of the electrode 10 on the described PCB substrate 1 all is connected on the respective pins of described chip 3, electrode 10 just and between the planar conductor 2 has formed electric capacity at this moment, thereby just can detect the capacitance C1 that produce this moment, (wherein ξ represents a constant according to capacitance equation C=ξ S/4 π d again, S represents area, and d represents distance), thus just can calculate this moment PCB substrate 1 arrive planar conductor 2 apart from d1.
And after an external force F acts on this PCB substrate 1, continue the capacitance C2 that detecting this electrode 10 and planar conductor 2 on described PCB substrate 1 under the external force F effect are produced this moment, owing to there is the effect of external force F, so the capacitance C2 that this moment, PCB substrate 1 the above electrode 10 and planar conductor 2 were produced just and capacitance C1 difference is arranged, establishing its difference is Δ C; At this moment the PCB substrate 1 that calculates according to capacitance equation again arrives the also just no longer identical with d1 apart from d2 of planar conductor 2, and establishing its difference is Δ d, and promptly the displacement of testee under external force F effect also just has been determined out.At this moment, we are again according to the computing formula of Young modulus:
(wherein, Y represents the deformation quantity of testee, and d represents the length of testee, and F represents the size of external force, and a represents the thickness of testee, and b represents the width of testee, the displacement that on behalf of testee, Δ Z produce under external force).Because length d, external force F, thickness a, the width b of testee can measure, simultaneously according to above-mentioned argumentation, Δ d is identical with Δ Z in the present invention as can be known for we, be Δ d=Δ Z, so in the computing formula with above-mentioned data substitution Young modulus, thereby just can draw testee deformation quantity under external force.
Method of coming the inspected object deformation quantity of the present invention by the variation of capacitance before and after the detecting testee, not only method is easy, and abandoned tradition and utilized Hall element to come the method for inspected object deformation quantity, even method of the present invention also can accurately be detected the very little situation of deformation quantity, so precision obviously improves and is with low cost, so be worthy of popularization.
Claims (9)
1. the method for a capacitance detecting object deformation quantity, it comprises a testee and a conductor,
This detection comprises the steps:
At first, the capacitance of detecting testee under no external force situation;
Secondly, detecting testee capacitance under external force;
At last, determine the deformation quantity of testee under external force according to the difference of above-mentioned two capacitances.
2. the method for claim 1, it is characterized in that: a side of described testee is provided with an electrode.
3. method as claimed in claim 2 is characterized in that: described electrode is positioned at the center of testee.
4. as any described method of claim 1 to 3, it is characterized in that: an end of described electrode is connected on the chip.
5. as any described method of claim 1 to 3, it is characterized in that: the distance of described testee and described planar conductor is calculated according to the capacitance of its generation.
6. the method for claim 1, it is characterized in that: described conductor is meant planar conductor.
7. the method for claim 1, it is characterized in that: described testee can be a pcb board.
8. the method for claim 1 is characterized in that: according to described under external force with no external force effect under the difference of electric capacity just can calculate the displacement of testee under external force, finally calculate the deformation quantity of its generation.
9. method as claimed in claim 8 is characterized in that: after calculating the displacement of testee, thereby calculate deformation quantity according to the Young modulus formula.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010291247 CN101957168A (en) | 2010-09-26 | 2010-09-26 | Method for detecting deformation quantity of object through capacitance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010291247 CN101957168A (en) | 2010-09-26 | 2010-09-26 | Method for detecting deformation quantity of object through capacitance |
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| Publication Number | Publication Date |
|---|---|
| CN101957168A true CN101957168A (en) | 2011-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN 201010291247 Pending CN101957168A (en) | 2010-09-26 | 2010-09-26 | Method for detecting deformation quantity of object through capacitance |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980508A (en) * | 2012-11-21 | 2013-03-20 | 昆山北极光电子科技有限公司 | Auto-balancing mechanical deformation measuring method |
| CN104034251A (en) * | 2013-03-06 | 2014-09-10 | 中国科学院合肥物质科学研究院 | Micron-scale material strain detection device and detection method thereof |
| CN104849138A (en) * | 2015-03-23 | 2015-08-19 | 同济大学 | Apparatus for measuring film compression modulus |
| CN107962579A (en) * | 2017-11-20 | 2018-04-27 | 西安交通大学 | A kind of robot delicate and material detection identifying system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19831622A1 (en) * | 1998-07-15 | 2000-02-24 | Univ Dresden Tech | Characterization of mechanical strain conditions in planar materials; involves using capacitive measuring system comprising substrate plate and baseplate with one or more electrodes |
| CN1484749A (en) * | 2001-01-10 | 2004-03-24 | 米其林技术公司 | Method and device for evaluating deformations and forces |
| CN1697960A (en) * | 2003-02-17 | 2005-11-16 | 日本电信电话株式会社 | Surface shape recognition sensor and method of producing the same |
| CN101416021A (en) * | 2006-04-03 | 2009-04-22 | 北极星传感器公司 | Multi-zone capacitive force sensing device and method |
-
2010
- 2010-09-26 CN CN 201010291247 patent/CN101957168A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19831622A1 (en) * | 1998-07-15 | 2000-02-24 | Univ Dresden Tech | Characterization of mechanical strain conditions in planar materials; involves using capacitive measuring system comprising substrate plate and baseplate with one or more electrodes |
| CN1484749A (en) * | 2001-01-10 | 2004-03-24 | 米其林技术公司 | Method and device for evaluating deformations and forces |
| CN1697960A (en) * | 2003-02-17 | 2005-11-16 | 日本电信电话株式会社 | Surface shape recognition sensor and method of producing the same |
| CN101416021A (en) * | 2006-04-03 | 2009-04-22 | 北极星传感器公司 | Multi-zone capacitive force sensing device and method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980508A (en) * | 2012-11-21 | 2013-03-20 | 昆山北极光电子科技有限公司 | Auto-balancing mechanical deformation measuring method |
| CN104034251A (en) * | 2013-03-06 | 2014-09-10 | 中国科学院合肥物质科学研究院 | Micron-scale material strain detection device and detection method thereof |
| CN104849138A (en) * | 2015-03-23 | 2015-08-19 | 同济大学 | Apparatus for measuring film compression modulus |
| CN104849138B (en) * | 2015-03-23 | 2018-10-26 | 同济大学 | A kind of device measuring film compression modulus |
| CN107962579A (en) * | 2017-11-20 | 2018-04-27 | 西安交通大学 | A kind of robot delicate and material detection identifying system |
| CN107962579B (en) * | 2017-11-20 | 2019-10-11 | 西安交通大学 | A kind of robot delicate and material detection identifying system |
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Application publication date: 20110126 |